CN204045577U - A kind of lead frame for integrated circuit - Google Patents
A kind of lead frame for integrated circuit Download PDFInfo
- Publication number
- CN204045577U CN204045577U CN201420505020.XU CN201420505020U CN204045577U CN 204045577 U CN204045577 U CN 204045577U CN 201420505020 U CN201420505020 U CN 201420505020U CN 204045577 U CN204045577 U CN 204045577U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- lead
- pin
- integrated circuit
- frame unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a kind of lead frame for integrated circuit, be made up of multiple lead frame unit, be interconnected by dowel between each lead frame unit, lead frame unit is provided with, lower two horizontal bars, on, three perpendicular muscle are provided with between lower two horizontal bars, wherein be positioned at middle perpendicular muscle stage casing and be provided with slide holder, the perpendicular muscle being positioned at both sides is respectively provided with seven groups of terminal pins of equidistant arrangement, terminal pin is divided into lead pin and outer lead pin, each lead pin is provided with louvre and pressure-sizing district, each lead foot portion extends and close slide holder, on, lower horizontal bar is provided with location hole, this lead frame can be widely used in integrated circuit, good heat dissipation effect, security performance is high.
Description
Technical field
The utility model relates to a kind of lead frame.
Background technology
Lead frame is as the chip carrier of integrated circuit, it is a kind of electrical connection realizing chip internal circuits exit and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it serves the function served as bridge be connected with outer lead, all needing in the semiconductor integrated block of the overwhelming majority to use lead frame, is basic material important in electronics and information industry.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of lead frame for integrated circuit.
In order to solve the problems of the technologies described above, the utility model provides a kind of lead frame for integrated circuit, be made up of multiple lead frame unit, be interconnected by dowel between each lead frame unit, described lead frame unit is provided with upper and lower two horizontal bars, be provided with three perpendicular muscle between upper and lower two horizontal bars, be wherein positioned at middle perpendicular muscle stage casing and be provided with slide holder, the perpendicular muscle being positioned at both sides is respectively provided with seven groups of terminal pins of equidistant arrangement.
As further improvement of the utility model, described terminal pin is divided into lead pin and outer lead pin, and each lead pin is provided with louvre and pressure-sizing district, and each lead foot portion extends and close slide holder.
As further improvement of the utility model, described upper and lower horizontal bar is provided with location hole.
Adopt said structure, its beneficial effect is: this lead frame can be widely used in integrated circuit, good heat dissipation effect, and security performance is high.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1-lead frame unit, 2-horizontal bar, 3-erects muscle, 4-slide holder, 5-terminal pin, 5-1-lead pin, 5-2-outer lead pin, 6-louvre, 7-pressure-sizing district, 8-location hole.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in more detail.
As shown in Fig. 1, a kind of lead frame for integrated circuit, be made up of multiple lead frame unit (1), be interconnected by dowel between each lead frame unit 1, described lead frame unit 1 is provided with, lower two horizontal bars 2, on, three perpendicular muscle 3 are provided with between lower two horizontal bars 2, wherein be positioned at middle perpendicular muscle 3 stage casing and be provided with slide holder 4, the perpendicular muscle 3 being positioned at both sides is respectively provided with seven groups of terminal pins 5 of equidistant arrangement, described terminal pin 5 is divided into lead pin 5-1 and outer lead pin 5-2, each lead pin 5-2 is provided with louvre 6 and pressure-sizing district 7, each lead pin 5 end extends and close slide holder 4, on described, lower horizontal bar 2 is provided with location hole 8.
This lead frame can be widely used in integrated circuit, good heat dissipation effect, and security performance is high.
Any employing and the similar lead frame designed by technical characteristic of the utility model will fall within protection range of the present utility model.
Claims (3)
1. the lead frame for integrated circuit, be made up of multiple lead frame unit (1), be interconnected by dowel between each lead frame unit (1), it is characterized in that: described lead frame unit (1) is provided with upper and lower two horizontal bars (2), three perpendicular muscle (3) are provided with between upper and lower two horizontal bars (2), wherein be positioned at middle perpendicular muscle (3) stage casing and be provided with slide holder (4), the perpendicular muscle (3) being positioned at both sides is respectively provided with seven groups of terminal pins (5) of equidistant arrangement.
2. a kind of lead frame for integrated circuit according to claim 1, it is characterized in that: described terminal pin (5) is divided into lead pin (5-1) and outer lead pin (5-2), each lead pin (5-2) is provided with louvre (6) and pressure-sizing district (7), and each lead pin (5) end extends and close slide holder (4).
3. a kind of lead frame for integrated circuit according to claim 1, is characterized in that: described upper and lower horizontal bar (2) is provided with location hole (8).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420505020.XU CN204045577U (en) | 2014-09-03 | 2014-09-03 | A kind of lead frame for integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420505020.XU CN204045577U (en) | 2014-09-03 | 2014-09-03 | A kind of lead frame for integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204045577U true CN204045577U (en) | 2014-12-24 |
Family
ID=52246214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201420505020.XU Expired - Fee Related CN204045577U (en) | 2014-09-03 | 2014-09-03 | A kind of lead frame for integrated circuit |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204045577U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116698878A (en) * | 2023-05-26 | 2023-09-05 | 广州丰江微电子有限公司 | Lead frame plating layer detection equipment and detection method thereof |
-
2014
- 2014-09-03 CN CN201420505020.XU patent/CN204045577U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116698878A (en) * | 2023-05-26 | 2023-09-05 | 广州丰江微电子有限公司 | Lead frame plating layer detection equipment and detection method thereof |
CN116698878B (en) * | 2023-05-26 | 2024-02-13 | 广州丰江微电子有限公司 | Lead frame plating layer detection equipment and detection method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN205920964U (en) | Lead frame with two kinds of chips | |
CN203850280U (en) | Double-chip plastic-sealed lead frame | |
CN204045577U (en) | A kind of lead frame for integrated circuit | |
CN203850288U (en) | Plastic-sealed lead frame with separated heat radiating fins | |
CN203617290U (en) | Lead frame with pits | |
CN203850287U (en) | Plastic-sealed lead frame in full packaging manner | |
CN204045574U (en) | A kind of lead frame for low-power device | |
CN203617282U (en) | Lead frame applied to low-power electrical appliance | |
CN203850279U (en) | Plastic-sealed lead frame suitable for high-power electrical appliances | |
CN204045572U (en) | A kind of lead frame with chiasma type slide holder | |
CN203617286U (en) | Lead frame with head being opened | |
CN204045576U (en) | A kind of lead frame | |
CN203617285U (en) | Lead frame capable of radiating heat quickly | |
CN203850290U (en) | Plastic-sealed lead frame suitable for high-temperature electrical appliances | |
CN203850283U (en) | Plastic-sealed lead frame with pressing marks | |
CN204045575U (en) | A kind of lead frame for relatively high power electrical equipment | |
CN203850285U (en) | Thickened plastic-sealed lead frame | |
CN203850286U (en) | Plastic-sealed lead frame suitable for high-temperature environment | |
CN203850289U (en) | Plastic-sealed lead frame for low-power electrical appliances | |
CN203617283U (en) | Low-power lead frame | |
CN203589013U (en) | Double-row lead frame | |
CN103943596A (en) | Fully packaged type lead frame | |
CN204130522U (en) | A kind of lead frame of local silver-plating | |
CN203850275U (en) | A plastic package lead wire framework used for electric appliances with a relatively large power | |
CN203850274U (en) | A thin plastic packaging lead wire framework |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141224 Termination date: 20150903 |
|
EXPY | Termination of patent right or utility model |