CN204031572U - Notebook computer flexible circuit board - Google Patents
Notebook computer flexible circuit board Download PDFInfo
- Publication number
- CN204031572U CN204031572U CN201420362649.3U CN201420362649U CN204031572U CN 204031572 U CN204031572 U CN 204031572U CN 201420362649 U CN201420362649 U CN 201420362649U CN 204031572 U CN204031572 U CN 204031572U
- Authority
- CN
- China
- Prior art keywords
- double
- conductive layer
- circuit board
- deck conductive
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims abstract description 26
- 230000001681 protective effect Effects 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 230000002787 reinforcement Effects 0.000 claims abstract description 4
- 238000005452 bending Methods 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 7
- 239000004698 Polyethylene Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- -1 polyethylene Polymers 0.000 abstract description 4
- 229920000573 polyethylene Polymers 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of notebook computer flexible circuit board, belong to flexible circuit board manufacture technology field.It comprises belt body, and described belt body comprises base material, double-deck conductive layer and protective film, and described base material is located between double-deck conductive layer, and described protective film is located at and is covered on double-deck conductive layer; Between described base material and double-deck conductive layer, cohere by polyethylene glue, between described protective film and double-deck conductive layer, mutually cohere, between described base material and double-deck conductive layer, be provided with blind hole, described double-deck conductive layer is provided with the pad coating of reinforcement; On described belt body, be pasted with leg-of-mutton pressure-sensitive type gum, described pressure-sensitive type gum is located at the bent area place of belt body.The utility model reasonable in design, make simple and easy, the rate of effectively reducing the number of rejects and seconds, reduce production cost, can improve the bad phenomenon of coming unglued of flexible circuit board bent area.
Description
Technical field
The utility model belongs to flexible circuit board manufacture technology field, more particularly, relates to notebook computer flexible circuit board.
Background technology
Flexible circuit board claims again " soft board ", is the printed circuit made from flexible insulating substrate.Flexible circuit provides good electrical property, can meet design needs more small-sized and more high-density installation, also contributes to reduce assembling procedure and strengthens reliability.Flexible circuit board is the only solution that meets miniaturization of electronic products and movement requirement.Can free bend, coiling, folding, can bear the dynamic bendings of millions of times and not damage wire, can require to arrange arbitrarily according to space layout, and mobile and flexible arbitrarily at three dimensions, thereby reach integrated that components and parts assembling is connected with wire; Flexible circuit board can be dwindled the volume and weight of electronic product greatly, be suitable for the needs of electronic product to high density, miniaturization, highly reliable future development, it has light, thin, short, little feature, as a kind of special interconnection technique can capable of meeting requirements on three-dimensional the requirement of assembling, be widely used in NOTEBOOK, LCD, mobile phone, digital camera, calculator, aviation electronics and Military Electronic Equipment.
Extensively be incorporated in the growth gradually of each field and demand with flexible circuit board, flexible circuit board reflexed demand is also progressively increased progressively.The main pressure-sensitive type gum that uses reflexed region to paste rectangle at present, pre-fold rear upper and lower wiring board according to reflexed angle bonding, re-using pressurization tool is pressing, cause the area thickness after bending excessive, As time goes on there will be in various degree and the bad phenomenon of coming unglued of varying number, increased percent defective.
Therefore, be necessary to design a kind of flexible circuit board of improving bending area thickness.
Utility model content
For the above-mentioned problems in the prior art, the purpose of this utility model is to provide a kind of notebook computer flexible circuit board, and it can improve the bad phenomenon of coming unglued of flexible circuit board bent area.
To achieve these goals, the technical scheme that the utility model adopts is as follows:
A kind of notebook computer flexible circuit board, comprises belt body, and described belt body comprises base material, double-deck conductive layer and protective film, and described base material is located between double-deck conductive layer, and described protective film is located at and is covered on double-deck conductive layer; Between described base material and double-deck conductive layer, cohere by polyethylene glue, between described protective film and double-deck conductive layer, mutually cohere, between described base material and double-deck conductive layer, be provided with blind hole, described double-deck conductive layer is provided with the pad coating of reinforcement; On described belt body, be pasted with leg-of-mutton pressure-sensitive type gum, described pressure-sensitive type gum is located at the bent area place of belt body.
Further, in described blind hole, be filled with electrically and thermally conductive adhesive.
Further, the thickness of described base material and protective film is identical.
Further, described pad coating adopts electronickelling and chemical gilding layer, and the thickness of described electroless nickel layer is thicker than chemical gilding layer.
Further, described bent area is the region of the vertical bending in belt body middle part.
Than prior art, the utility model notebook computer with the beneficial effect of flexible circuit board is:
Adopt the structure of circuit board in use of blind hole type, be that conductive hole is partly embedded between two-layer line layer, and in it, be filled with heat-conductivity conducting glue, two-layer line layer is realized heat conduction and conductive communication by the described through hole that is filled with heat-conductivity conducting glue, therefore be not subject to the harmful effect of extraneous factor, thereby electric conductivity is more reliable, wiring board product quality is also more reliable; Adopt leg-of-mutton gum, make the thickness that pre-folds rear upper and lower wiring board according to reflexed angle be unlikely to too thick, effectively reduced mutual elastic stress, reduced because of bad scrapping of coming unglued and cause; Its reasonable in design, make simple and easy, the rate of effectively reducing the number of rejects and seconds, reduce production cost.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model notebook computer flexible circuit board belt body;
Fig. 2 is the internal structure schematic diagram of the utility model notebook computer flexible circuit board;
Fig. 3 is the bending structure schematic diagram of the utility model notebook computer flexible circuit board belt body.
Embodiment
Below in conjunction with specific embodiment, the utility model is further described.
As shown in Figure 1 to Figure 3; a kind of notebook computer flexible circuit board of the utility model; comprise belt body 8; described belt body 8 comprises base material 5, double-deck conductive layer 3 and protective film 1; the polyimides that described base material 5 is insulation is made; the material of described double-deck conductive layer 3 is rolled copper foil, and calendering copper intensity is high, resistance to bending.Cathode copper intensity difference, frangibility, is generally used in the occasion of little bending.Described protective film 1 is made for pet material, and the diaphragm of 25um can make circuit board harder, but price comparison is cheap.For the larger circuit board of bending, preferably select the diaphragm of 13um; Described base material 5 is located between double-deck conductive layer 3, and described protective film 1 is located at and is covered on double-deck conductive layer 3; Between described base material 5 and double-deck conductive layer 3, cohere by polyethylene glue, between described protective film 1 and double-deck conductive layer 3, cohere by epoxy resin glue; Base material 5 and protective film 1 are all selected the thickness of 13um; Between described base material 5 and double-deck conductive layer 3, be provided with blind hole 6, in blind hole 6, be filled with electrically and thermally conductive adhesive; Described double-deck conductive layer 3 is provided with the pad coating 7 of reinforcement, and described pad coating adopts electronickelling and chemical gilding layer, and described electronickelling is 0.8um, and described chemical gilding layer is 0.06um; On described belt body 8, be pasted with leg-of-mutton pressure-sensitive type gum 9, described pressure-sensitive type gum 9 is located at 801 places, bent area of belt body 8; Described bent area 801 is the region of the vertical bending in belt body 8 middle parts.
Polyimides (POLYIMIDE)----Tong is usual to speak PI, and it has excellent resistance to elevated temperatures, and resistance to immersed solder can reach 260 DEG C, 20sec, is almost applied to all military hardware and requires in strict business machine; If need circuit board more firmly, should select the base material of 50um; Otherwise, if need circuit board softness a bit, select the base material of 13um.Poly strength ratio is lower, if wish that circuit board is soft, select polyethylene glue, base material and the transparent adhesive tape on it are thicker, circuit board is harder, if circuit board has the region that bending is larger, should select thinner base material and transparent adhesive tape to reduce the stress of copper foil surface as far as possible, Copper Foil occurs that the chance of micro-crack is smaller like this.The utility model, in the time of bending, is that broken line bends by the hypotenuse of leg-of-mutton pressure-sensitive type gum 9.
Below schematically the utility model and execution mode thereof are described, this description does not have restricted, and shown in accompanying drawing is also one of execution mode of the present utility model, and actual structure is not limited to this.So, if those of ordinary skill in the art is enlightened by it, in the situation that not departing from the utility model creation aim, without the creationary frame mode similar to this technical scheme and the embodiment of designing, all should belong to protection range of the present utility model.
Claims (5)
1. a notebook computer flexible circuit board, comprises belt body, and described belt body comprises base material, double-deck conductive layer and protective film, and described base material is located between double-deck conductive layer, and described protective film is located at and is covered on double-deck conductive layer; Between described base material and double-deck conductive layer, mutually cohere, between described protective film and double-deck conductive layer, mutually cohere, it is characterized in that: between described base material and double-deck conductive layer, be provided with blind hole, described double-deck conductive layer is provided with the pad coating of reinforcement; On described belt body, be pasted with leg-of-mutton pressure-sensitive type gum, described pressure-sensitive type gum is located at the bent area place of belt body.
2. notebook computer flexible circuit board as claimed in claim 1, is characterized in that: in described blind hole, be filled with electrically and thermally conductive adhesive.
3. notebook computer flexible circuit board as claimed in claim 1, is characterized in that: the thickness of described base material and protective film is identical.
4. notebook computer flexible circuit board as claimed in claim 1, is characterized in that: described pad coating adopts electronickelling and chemical gilding layer, and the thickness of described electroless nickel layer is thicker than chemical gilding layer.
5. notebook computer flexible circuit board as claimed in claim 1, is characterized in that: described bent area is the region of the vertical bending in belt body middle part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420362649.3U CN204031572U (en) | 2014-07-02 | 2014-07-02 | Notebook computer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420362649.3U CN204031572U (en) | 2014-07-02 | 2014-07-02 | Notebook computer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204031572U true CN204031572U (en) | 2014-12-17 |
Family
ID=52071393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420362649.3U Expired - Lifetime CN204031572U (en) | 2014-07-02 | 2014-07-02 | Notebook computer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204031572U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108260280A (en) * | 2017-12-04 | 2018-07-06 | 深圳市新宇腾跃电子有限公司 | A kind of FPC bending molding process |
-
2014
- 2014-07-02 CN CN201420362649.3U patent/CN204031572U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108260280A (en) * | 2017-12-04 | 2018-07-06 | 深圳市新宇腾跃电子有限公司 | A kind of FPC bending molding process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141217 |
|
| CX01 | Expiry of patent term |