CN204029799U - Octal bonded LED lamp - Google Patents
Octal bonded LED lamp Download PDFInfo
- Publication number
- CN204029799U CN204029799U CN201420467929.0U CN201420467929U CN204029799U CN 204029799 U CN204029799 U CN 204029799U CN 201420467929 U CN201420467929 U CN 201420467929U CN 204029799 U CN204029799 U CN 204029799U
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- installation pit
- led
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- pins
- octal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model belongs to lighting technical field, particularly relate to a kind of octal bonded LED lamp, comprise support, LED wafer and electrode pin, electrode pin is arranged at support, electrode pin is divided into four anode pins and four negative electrode pins, four anode pins are positioned at the side of support, four negative electrode pins are positioned at the opposite side of support, Bracket setting has installation pit, LED wafer is arranged in installation pit, and LED wafer is electrically connected with four anode pins and four negative electrode pins respectively, the second installation pit that installation pit comprises the first installation pit and is set up in parallel with the first installation pit.LED support of the present utility model can support that 4 wafers integrate, thus makes LED have wider colour gamut, and the more performance of high color saturation can send 4 kinds of primary lights, and color is abundanter, lightening effect is better.
Description
Technical field
The utility model belongs to lighting technical field, particularly relates to a kind of octal bonded LED lamp.
Background technology
In recent years, adopting surface mounted LED becomes a Hot spots for development, well solves the problems such as brightness, visual angle, evenness, consistency, is applicable to very much the application of high-resolution indoor, outdoor full color display screen and outdoor building.
At present, existing surface mount type LED support can only support that 3 wafers integrate, but day by day universal along with LED, not only more and more higher to its performance requirement, and to its display effect, more and more higher to the requirement of the display effect of display screen, there is technical bottleneck in the full-color paster LED of red-green-blue of present extensive use in high-end full-color display application.The technical bottleneck of the full-color paster LED of red-green-blue is mainly reflected in two aspects: one is ruddiness luminance shortage.Two is that colour gamut is wideless, and color saturation is inadequate.
Because existing surface mount type LED support can only support that 3 wafers integrate, and there is the technical problem that ruddiness luminance shortage, colour gamut are wideless, color saturation is inadequate in three primary colors paster LED, so, it is simple to there is structure in existing LED support, can only support that 3 wafers integrate, cause LED to there is the technical problem that ruddiness luminance shortage, colour gamut are wideless, color saturation is inadequate.
Utility model content
The purpose of this utility model is: for the deficiencies in the prior art, and a kind of octal bonded LED lamp is provided, the LED support of this LED can support that 4 wafers integrate, thus make LED have wider colour gamut, the more performance of high color saturation, can send 4 kinds of primary lights (as RGBW, RGBY), and color is abundanter, lightening effect is better.
For achieving the above object, the utility model adopts following technical scheme: octal bonded LED lamp, comprise support, LED wafer and electrode pin, described electrode pin is arranged at described support, described electrode pin is divided into four anode pins and four negative electrode pins, four described anode pins are positioned at the side of described support, four described negative electrode pins are positioned at the opposite side of described support, described Bracket setting has installation pit, described LED wafer is arranged in described installation pit, and described LED wafer is respectively with four, and described anode pin and four described negative electrode pins are electrically connected, the second installation pit that described installation pit comprises the first installation pit and is set up in parallel with described first installation pit.
One as octal bonded LED lamp described in the utility model is improved, and described first installation pit and described second installation pit are all set to square structure.
One as octal bonded LED lamp described in the utility model is improved, the step that described first installation pit and described second installation pit include inclined wall and connect as one with described inclined wall.
One as octal bonded LED lamp described in the utility model is improved, and the quantity of described LED wafer is set to four, and wherein two described LED wafer are arranged in described first installation pit, and LED wafer described in two other is arranged in described second installation pit.
One as octal bonded LED lamp described in the utility model is improved, and two described LED wafer in described first installation pit are respectively green light LED wafer and blue LED wafers; Two described LED wafer in described second installation pit are respectively red-light LED wafer and blue LED wafers, and the surface-coated of this blue LED wafers has yellow fluorescent powder.
One as octal bonded LED lamp described in the utility model is improved, four described anode pins and four described negative electrode pins are all set to " J " shape structure, one end of four described anode pins and four described negative electrode pins is provided with holddown groove, and the degree of depth of described holddown groove is greater than 1/3 of the thickness of described anode pin and described negative electrode pin.
One as octal bonded LED lamp described in the utility model is improved, and one jiao of described support is provided with benchmark hole.
The beneficial effects of the utility model are: the utility model comprises support, LED wafer and electrode pin, electrode pin is arranged at support, electrode pin is divided into four anode pins and four negative electrode pins, four anode pins are positioned at the side of support, four negative electrode pins are positioned at the opposite side of support, Bracket setting has installation pit, LED wafer is arranged in installation pit, and LED wafer is electrically connected with four anode pins and four negative electrode pins respectively, the second installation pit that installation pit comprises the first installation pit and is set up in parallel with the first installation pit.LED support of the present utility model can support that 4 wafers integrate, thus makes LED have wider colour gamut, the more performance of high color saturation, can send 4 kinds of primary lights (as RGBW, RGBY), and color is abundanter, lightening effect is better.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation not installing LED wafer of the present utility model.
Fig. 3 is cutaway view of the present utility model.
Fig. 4 is the A portion enlarged drawing of Fig. 3.
Embodiment
Below in conjunction with embodiment and Figure of description, the utility model is described in further detail, but execution mode of the present utility model is not limited thereto.
As shown in Fig. 1 ~ 4, octal bonded LED lamp, comprise support 1, LED wafer 2 and electrode pin 3, electrode pin 3 is arranged at support 1, electrode pin 3 is divided into four anode pins 4 and four negative electrode pins 5, four anode pins 4 are positioned at the side of support 1, four negative electrode pins 5 are positioned at the opposite side of support 1, support 1 is provided with installation pit 6, LED wafer 2 is arranged in installation pit 6, and LED wafer 2 is electrically connected with four anode pins 4 and four negative electrode pins 5 respectively, the second installation pit 8 that installation pit 6 comprises the first installation pit 7 and is set up in parallel with the first installation pit 7.First installation pit 7 and the second installation pit 8 are all set to square structure, and certainly, the first installation pit 7 and the second installation pit 8 can also be set to other shapes, and this can set according to the demand in market.The step 10 that first installation pit 7 and the second installation pit 8 include inclined wall 9 and connect as one with inclined wall 9, inclined wall 9 be arranged so that the wider of illumination, step 10 is of the present utility model for encapsulating, filling glue can be used to fill up whole installation pit 6, also can on step 10 mounted lens, make illumination effect better.
Preferably, the quantity of LED wafer 2 is set to four, and wherein two LED wafer 2 are arranged in the first installation pit 7, and two other LED wafer 2 is arranged in the second installation pit 8.Two LED wafer 2 in the first installation pit 7 are respectively green light LED wafer and blue LED wafers; Two LED wafer 2 in the second installation pit 8 are respectively red-light LED wafer and blue LED wafers, and the surface-coated of this blue LED wafers has yellow fluorescent powder, thus excite yellow fluorescent powder and output white light by blue LED wafers; The generation of white light can also utilize ultraviolet leds to add RGB three-wavelength fluorescent material to reach the effect of white light in addition, and its luminous efficiency goes up well many than blue light.Make the utility model not only achieve the conversion of red, green, blue three coloured light, can also produce white light simultaneously, achieve colour mixture of the present utility model luminous, the change, the lightening effect that have enriched color are better.In the first installation pit 7 and the second installation pit 8, be filled with filling glue, mainly for the protection of LED wafer 2 and gold thread, allow them not be exposed in air, anti-oxidation and corrosion.
Preferably, four anode pins 4 and four negative electrode pins 5 are all set to " J " shape structure, and the design of " J " shape structure is relatively more rational, makes the utility model compact conformation, successful.One end of four anode pins 4 and four negative electrode pins 5 is provided with holddown groove 11, when injection mo(u)lding support 1, the support material of injection moulding can be made to be added in holddown groove 11, to serve well firm effect, but also there is good sealing effect, function that anti-vibration ability is strong.Usually, the degree of depth of holddown groove 11 is greater than 1/3 of the thickness of anode pin 4 and negative electrode pin 5.Above-mentioned best results is realized within the scope of this.
Preferably, one jiao of support 1 is provided with benchmark hole 10, is convenient to better mounting bracket 1.
The utility model can make lamp bar for decorative lamp, can realize various color word and design, have better decorative effect by control circui.
The announcement of book and instruction according to the above description, the utility model those skilled in the art can also change above-mentioned execution mode and revise.Therefore, the utility model is not limited to above-mentioned embodiment, and any apparent improvement of every those skilled in the art done by basis of the present utility model, replacement or modification all belong to protection range of the present utility model.In addition, although employ some specific terms in this specification, these terms just for convenience of description, do not form any restriction to the utility model.
Claims (7)
1. octal bonded LED lamp, it is characterized in that: comprise support, LED wafer and electrode pin, described electrode pin is arranged at described support, described electrode pin is divided into four anode pins and four negative electrode pins, four described anode pins are positioned at the side of described support, four described negative electrode pins are positioned at the opposite side of described support, described Bracket setting has installation pit, described LED wafer is arranged in described installation pit, and described LED wafer is respectively with four, and described anode pin and four described negative electrode pins are electrically connected, the second installation pit that described installation pit comprises the first installation pit and is set up in parallel with described first installation pit.
2. octal bonded LED lamp according to claim 1, is characterized in that: described first installation pit and described second installation pit are all set to square structure.
3. octal bonded LED lamp according to claim 2, is characterized in that: the step that described first installation pit and described second installation pit include inclined wall and connect as one with described inclined wall.
4. octal bonded LED lamp according to claim 1, it is characterized in that: the quantity of described LED wafer is set to four, wherein two described LED wafer are arranged in described first installation pit, and LED wafer described in two other is arranged in described second installation pit.
5. octal bonded LED lamp according to claim 4, is characterized in that: two described LED wafer in described first installation pit are respectively green light LED wafer and blue LED wafers; Two described LED wafer in described second installation pit are respectively red-light LED wafer and blue LED wafers, and the surface-coated of this blue LED wafers has yellow fluorescent powder.
6. octal bonded LED lamp according to claim 1, it is characterized in that: four described anode pins and four described negative electrode pins are all set to " J " shape structure, one end of four described anode pins and four described negative electrode pins is provided with holddown groove, and the degree of depth of described holddown groove is greater than 1/3 of the thickness of described anode pin and described negative electrode pin.
7. octal bonded LED lamp according to claim 1, is characterized in that: one jiao of described support is provided with benchmark hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420467929.0U CN204029799U (en) | 2014-08-19 | 2014-08-19 | Octal bonded LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420467929.0U CN204029799U (en) | 2014-08-19 | 2014-08-19 | Octal bonded LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204029799U true CN204029799U (en) | 2014-12-17 |
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ID=52069630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420467929.0U Active CN204029799U (en) | 2014-08-19 | 2014-08-19 | Octal bonded LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204029799U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107527989A (en) * | 2017-09-12 | 2017-12-29 | 深圳市毅宁亮照明有限公司 | A kind of side-emitting LED lamp bead connector |
-
2014
- 2014-08-19 CN CN201420467929.0U patent/CN204029799U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107527989A (en) * | 2017-09-12 | 2017-12-29 | 深圳市毅宁亮照明有限公司 | A kind of side-emitting LED lamp bead connector |
| CN107527989B (en) * | 2017-09-12 | 2024-06-07 | 深圳市毅宁亮照明有限公司 | Side-emitting LED lamp bead connector |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |