CN204009622U - Sim card heating system - Google Patents
Sim card heating system Download PDFInfo
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- CN204009622U CN204009622U CN201420430884.XU CN201420430884U CN204009622U CN 204009622 U CN204009622 U CN 204009622U CN 201420430884 U CN201420430884 U CN 201420430884U CN 204009622 U CN204009622 U CN 204009622U
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- sim card
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Abstract
The utility model provides a kind of SIM card heating system, it comprises on-off circuit and a heater circuit of one first power supply, conducting when externally the temperature of environment is less than a setting threshold, this first power supply is by this heater circuit and this on-off circuit ground connection, this heater circuit is positioned at a lower surface with the circuit board of SIM card, this SIM card be placed in the upper surface of this circuit board and this heater circuit be positioned at this SIM card under.The utility model, can heat SIM card, even if SIM card also can normally be used in very cold environment during lower than certain value automatically in the residing environment temperature of SIM card.
Description
Technical field
The utility model relates to a kind of SIM card (Subscriber Identity Module, client identification module), particularly a kind of heating system that SIM card is heated.
Background technology
In cold environment such as Harbin etc.; while carrying out radio meter register with wireless communication module in electric system; often there will be such a case: in use find that ammeter None-identified after powering on goes out SIM card; and when ammeter is placed in warm environment again, it can identify SIM card again after powering on.Given this, staff changes the SIM card in ammeter, by being placed in SIM card in room temperature, just can normally check meter on being placed on the ammeter of 1 month freezing.Can analyze thus, SIM card will cause it to use in very cold environment.
Utility model content
The technical problems to be solved in the utility model is in very cold environment, will to cause its defect that cannot use in order to overcome SIM card of the prior art, provides a kind of SIM card heating system, even if SIM card also can normally be used in very cold environment.
The utility model solves above-mentioned technical matters by following technical proposals:
The utility model provides a kind of SIM card heating system, its feature is, it comprises on-off circuit and a heater circuit of one first power supply, conducting when externally the temperature of environment is less than a setting threshold, this first power supply is by this heater circuit and this on-off circuit ground connection, this heater circuit is positioned at a lower surface with the circuit board of SIM card, this SIM card be placed in the upper surface of this circuit board and this heater circuit be positioned at this SIM card under.
In this programme, externally the temperature of environment is less than (for example-25 ℃ of setting thresholds, the normal operating range of SIM card is mostly-25 ℃-85 ℃) time, the automatic conducting of on-off circuit, at this moment heater circuit powered operation starts to produce heat, and the heat of generation is transferred to SIM card by circuit board, the temperature of SIM card self is improved, even and if then realize the function that SIM card also can normally be used in very cold environment.
Preferably, this SIM card heating system also comprises a metal skin, and this metal suitcase is established this heater circuit, and this metal skin is attached at the lower surface of this circuit board.
Preferably, this metal skin is copper sheet.
Preferably, the region being at least sticked mutually with this metal skin on this circuit board offers a plurality of through holes.Through hole be arranged so that resistance heated time, heat can be rapidly transmitted in the SIM card of upper surface of circuit board by these through holes, puies forward high-resistance usefulness utilization factor.
Preferably, the resistance that this heater circuit comprises some parallel connections, those resistance are equally distributed under this SIM card.Those resistance evenly divide and are arranged under this SIM card, can increase the heating surface area of SIM card, put forward high-resistance usefulness utilization factor, and the temperature of SIM card self can very fast getting a promotion.
Preferably, this SIM card heating system also comprises a MCU (micro-control unit), and this on-off circuit also comprises a second source, one first resistance, one second resistance, NTC resistance (negative tempperature coefficient thermistor) and a triode;
This second source is electrically connected to this heater circuit by this first resistance and this triode, and this second source is electrically connected to one end of this NTC resistance by this first resistance, the other end ground connection of this NTC resistance, this MCU is electrically connected to this triode by this second resistance;
This MCU is used for exporting one and controls signal to this triode.
In this programme, NTC resistance is negative tempperature coefficient thermistor, when ambient temperature reduces, the resistance of NTC resistance increases according to index, the first resistance and NTC resistance are to be connected in series between second source and ground, and these two resistance are worked always, the power consumption while working in order to reduce these two resistance, the type of high value when NTC resistance is generally selected room temperature, for example GM103 (type of NTC resistance).
For example, when ambient temperature is less than setting threshold (-25 ℃), the resistance of NTC resistance is greater than critical resistance, the first resistance and NTC resistance form biasing bleeder circuit, make the base voltage of triode reach forward voltage, triode is switched on, heater circuit work heat production, heat transfers in SIM card by circuit board, and this has just realized resistance Passive Control is the function of SIM card heating.
For example, when MCU detects work at present environment temperature and is less than setting threshold (-25 ℃), can automatically open certain GPIO (universal input output) mouth of MCU, the control signal that MCU generates transfers to triode by GPIO mouth and the second resistance, triode is switched on, the heater circuit heat production of starting working, heat transfers in SIM card by circuit board, and this has just realized MCU ACTIVE CONTROL is the function of SIM card heating.
Meeting on the basis of this area general knowledge, above-mentioned each optimum condition, can combination in any, obtains each preferred embodiments of the utility model.
Positive progressive effect of the present utility model is:
SIM card heating system of the present utility model, when externally the temperature of environment is less than setting threshold, the automatic conducting of on-off circuit, at this moment heater circuit powered operation starts to produce heat, and the heat of generation is transferred to SIM card by circuit board, the temperature of SIM card self is improved, even and if then realize the function that SIM card also can normally be used in very cold environment.
Accompanying drawing explanation
Fig. 1 is the circuit diagram of the SIM card heating system of the utility model preferred embodiment.
Fig. 2 is the schematic diagram of the circuit board of the utility model preferred embodiment.
Fig. 3 is the schematic diagram of position relationship between the circuit board lower surface of the utility model preferred embodiment and power resistor.
Embodiment
Mode below by embodiment further illustrates the utility model, but therefore the utility model is not limited among described scope of embodiments.
As shown in Figure 1, the utility model provides a kind of SIM card heating system, and it comprises one first power supply VBAT1, an on-off circuit and a heater circuit, and this first power supply VBAT1 is by this heater circuit and this on-off circuit ground connection.
Wherein, the power resistor that this heater circuit comprises some parallel connections, this heater circuit has been shown in Fig. 1 and has comprised 9 resistance, be respectively resistance R 1-R9, certainly, those skilled in the art will appreciate that the quantity of the power resistor that this heater circuit comprises is not limited to the quantity of the power resistor shown in Fig. 1, those skilled in the art is the quantity of (as the temperature of the size of SIM card, external environment) selection power resistor according to actual needs.
This on-off circuit comprises that two branch circuits are respectively the first branch circuit and the second branch circuit, this first branch circuit comprises a second source VBAT2, one first resistance R 11, a NTC resistance R 12 and a triode Q11, this second source is electrically connected to this heater circuit by this first resistance R 11 and this triode Q11, and this second source VBAT2 is electrically connected to one end of this NTC resistance R 12 by this first resistance R 11, the other end ground connection of this NTC resistance R 12.
This second branch circuit comprises one second resistance R 21, a NTC resistance R 12 and a triode Q11, and the second resistance R 21 is by NTC resistance R 12 ground connection, and the second resistance R 21 is by triode Q11 ground connection.The second resistance R 21 is electrically connected to the MCU that this SIM card heating system comprises.
And, those power resistors R1-R9 is positioned at a lower surface 11 (seeing Fig. 3) with the circuit board of SIM card, this SIM card be placed in the upper surface of this circuit board and this heater circuit be positioned at this SIM card under, further, those resistance are equally distributed under this SIM card.Those resistance evenly divide and are arranged under this SIM card, can increase the heating surface area of SIM card, put forward high-resistance usefulness utilization factor, and the temperature of SIM card self can very fast getting a promotion.
In addition, this SIM card heating system also comprises a copper sheet, and this copper sheet bag is established this heater circuit, and this copper sheet is attached at the lower surface of this circuit board, and meanwhile, the region being at least sticked mutually with this metal skin on this circuit board 1 offers a plurality of through holes 2 (seeing Fig. 2).Through hole 2 be arranged so that resistance heated time, heat can be rapidly transmitted in the SIM card of upper surface of circuit board 1 by these through holes 2, puies forward high-resistance usefulness utilization factor.
Introduce in detail the principle of work of this first branch circuit and this second branch circuit below:
The principle of work of this first branch circuit is: for example, when ambient temperature is less than setting threshold (-25 ℃), the resistance of NTC resistance R 12 is greater than critical resistance, the first resistance R 11 and NTC resistance R 12 form biasing bleeder circuit, make the base voltage of triode Q11 reach forward voltage, triode Q11 is switched on, heater circuit work heat production, heat transfers in SIM card by circuit board, and this has just realized NTC resistance Passive Control is the function of SIM card heating.
The principle of work of this second branch circuit is: for example, when MCU detects work at present environment temperature and is less than setting threshold (-25 ℃), can automatically open certain GPIO mouth of MCU, the control signal that MCU generates transfers to triode Q11 by GPIO mouth and the second resistance R 21, triode Q11 is switched on, the heater circuit heat production of starting working, heat transfers in SIM card by circuit board, and this has just realized MCU ACTIVE CONTROL is the function of SIM card heating.
The present embodiment is realized the heating to the SIM card in cold environment by the synergy of above-mentioned each parts.Below for a concrete example, to further illustrate the utility model, to enable those skilled in the art to understand better the utility model:
Shown in figure 1, the resistance of setting power resistance R 1-R9 is 100 ohm, and the resistance of the first resistance R 11 is 330 kilo-ohms, and the resistance of NTC resistance R 12 is 10 kilo-ohms, the resistance of the second resistance R 21 is 100 Europe, and the voltage that the first power supply VBAT1 and second source VBAT2 provide is 5V.
When the residing environment temperature of SIM card is-25 ℃, the resistance of NTC resistance R 12 increases to 53 kilo-ohms, the biasing bleeder circuit that the first resistance R 11 and NTC resistance R 12 form makes the base stage of triode Q11 reach the forward voltage of 0.7V, triode Q11 is switched on, and power resistor R1-R9 works and heats to SIM card.When the residing environment temperature of SIM card is during lower than-25 ℃, the resistance of NTC resistance R 12 is greater than 53 kilo-ohms, the biasing bleeder circuit that the first resistance R 11 and NTC resistance R 12 form makes the base voltage of triode Q11 be stabilized in 0.7V, triode Q11 is in conducting state, power resistor R1-R9 works and heats to SIM card, the heat that power resistor R1-R9 produces transfers in SIM card by the through hole 2 on copper sheet, circuit board 1, and it is the function of SIM card heating that this implementation procedure has realized NTC resistance Passive Control.
When the residing environment temperature of SIM card is during higher than-25 ℃, the resistance of NTC resistance R 12 is less than 53 kilo-ohms, the biasing bleeder circuit that the first resistance R 11 and NTC resistance R 12 form makes the base voltage of triode Q11 be less than 0.7V, and triode Q11 ends i.e. not conducting, and heater circuit is not worked.
Simultaneously, temperature sensor in MCU detects the temperature of external environment, when MCU detects temperature and is less than-25 ℃, can automatically open certain GPIO mouth of MCU, the voltage signal that MCU generates transfers to triode Q11 by GPIO mouth and the second resistance R 21, because the resistance (100 Europe) of the second resistance R 21 is far smaller than the resistance (53 kilo-ohms) of NTC resistance R 12, so can fully guarantee that the base voltage of triode Q11 is 0.7V, triode Q11 is in conducting state, the power resistor R1-R9 heat production of starting working, heat passes through copper sheet, through hole 2 on circuit board 1 transfers in SIM card, it is the function of SIM card heating that this implementation procedure has realized MCU ACTIVE CONTROL.
In sum, the utility model is when externally the temperature of environment is less than setting threshold, the automatic conducting of on-off circuit, heater circuit starts to produce heat, and the heat of generation is transferred in SIM card by circuit board, the temperature of SIM card self is improved, even and if then realize the function that SIM card also can normally be used in very cold environment.
Although more than described embodiment of the present utility model, it will be understood by those of skill in the art that these only illustrate, protection domain of the present utility model is limited by appended claims.Those skilled in the art is not deviating under the prerequisite of principle of the present utility model and essence, can make various changes or modifications to these embodiments, but these changes and modification all fall into protection domain of the present utility model.
Claims (6)
1. a SIM card heating system, it is characterized in that, it comprises on-off circuit and a heater circuit of one first power supply, conducting when externally the temperature of environment is less than a setting threshold, this first power supply is by this heater circuit and this on-off circuit ground connection, this heater circuit is positioned at a lower surface with the circuit board of SIM card, this SIM card be placed in the upper surface of this circuit board and this heater circuit be positioned at this SIM card under.
2. SIM card heating system as claimed in claim 1, is characterized in that, this SIM card heating system also comprises a metal skin, and this metal suitcase is established this heater circuit, and this metal skin is attached at the lower surface of this circuit board.
3. SIM card heating system as claimed in claim 2, is characterized in that, this metal skin is copper sheet.
4. SIM card heating system as claimed in claim 2, is characterized in that, the region being at least sticked mutually with this metal skin on this circuit board offers a plurality of through holes.
5. SIM card heating system as claimed in claim 1, is characterized in that, the resistance that this heater circuit comprises some parallel connections, and those resistance are equally distributed under this SIM card.
6. SIM card heating system as claimed in claim 1, is characterized in that, this SIM card heating system also comprises a MCU, and this on-off circuit also comprises a second source, one first resistance, one second resistance, a NTC resistance and a triode;
This second source is electrically connected to this heater circuit by this first resistance and this triode, and this second source is electrically connected to one end of this NTC resistance by this first resistance, the other end ground connection of this NTC resistance, this MCU is electrically connected to this triode by this second resistance;
This MCU is used for exporting one and controls signal to this triode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420430884.XU CN204009622U (en) | 2014-07-31 | 2014-07-31 | Sim card heating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420430884.XU CN204009622U (en) | 2014-07-31 | 2014-07-31 | Sim card heating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204009622U true CN204009622U (en) | 2014-12-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420430884.XU Active CN204009622U (en) | 2014-07-31 | 2014-07-31 | Sim card heating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204009622U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110267369A (en) * | 2019-05-28 | 2019-09-20 | 华为技术有限公司 | Heater circuit |
-
2014
- 2014-07-31 CN CN201420430884.XU patent/CN204009622U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110267369A (en) * | 2019-05-28 | 2019-09-20 | 华为技术有限公司 | Heater circuit |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |