CN203968078U - The Miniature Quartz with ground lead - Google Patents
The Miniature Quartz with ground lead Download PDFInfo
- Publication number
- CN203968078U CN203968078U CN201420308743.0U CN201420308743U CN203968078U CN 203968078 U CN203968078 U CN 203968078U CN 201420308743 U CN201420308743 U CN 201420308743U CN 203968078 U CN203968078 U CN 203968078U
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- China
- Prior art keywords
- lead
- wire
- insulator
- ground lead
- ground
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The Miniature Quartz with ground lead, relates to a kind of electronic devices and components, particularly belongs to a kind of Miniature Quartz with ground lead.Comprise substrate (5), insulator (7), lead-in wire (4), wafer (2) and shell (1), insulator is placed in on-chip insulator placement hole, lead-in wire is through the wire perforation on insulator, lead-in wire ailhead and wafer connect, substrate top is coated with shell, substrate body is also provided with ground lead (6), corresponding with earth connection or the zero line of the external circuit board.The utility model has changed the no ground situation of microminiature crystal resonator, has improved stability and the interference free performance of crystal resonator, and has good effect simple in structure, cost of manufacture is low.
Description
Technical field
The utility model relates to a kind of electronic devices and components, particularly belongs to a kind of Miniature Quartz with ground lead.
Background technology
Crystal resonator in electron trade, just towards the future development of miniaturization, microminiaturization, requires also more and more higher to its stability and interference free performance simultaneously at present.But, in the horizontal situation of existing processing technology, increasing ground connection is difficult to realize for miniaturization, microminiaturized crystal resonator, and need multiple tracks procedure of processing, drop into multiple devices and carry out processing, also brought product fraction defective compared with problems such as ground lead high and that cause because of failure welding come off simultaneously.Therefore for microminiature crystal resonator, be not all provided with at present earthing device, therefore affected to a certain extent the stability of its service behaviour.
Utility model content
The purpose of this utility model is to provide a kind of Miniature Quartz with ground lead, to reach the object of being convenient to realize the grounding connection of microminiature crystal resonator and then improving its stability and anti-interference.
The Miniature Quartz with ground lead provided by the utility model, comprise substrate, insulator, lead-in wire, wafer and shell, insulator is placed in on-chip insulator placement hole, lead-in wire is through the wire perforation on insulator, lead-in wire ailhead and wafer connect, and substrate top is coated with shell, it is characterized in that, substrate body is also provided with ground lead, corresponding with earth connection or the zero line of the external circuit board.
The Miniature Quartz with ground lead provided by the utility model, its total length is between 2.0 millimeters-7.1 millimeters, and overall width is between 1.0 millimeters-4.2 millimeters.
A kind of Miniature Quartz with ground lead provided by the utility model, owing to being provided with ground lead in substrate body, when carrying out welding circuit board, can directly be grounded, changed the no ground situation of microminiature crystal resonator, improve stability and the interference free performance of crystal resonator, and there is good effect simple in structure, cost of manufacture is low.
Accompanying drawing explanation
Accompanying drawing partly discloses specific embodiment of the utility model, wherein,
Fig. 1, the utility model embodiment mono-part section structural representation;
Fig. 2, the utility model embodiment bis-cross-sectional view;
Fig. 3, the utility model embodiment tri-cross-sectional view;
Fig. 4, the utility model ground lead arrangement one schematic diagram;
Fig. 5, the utility model ground lead arrangement two schematic diagrames;
Fig. 6, the utility model embodiment tetra-partial structurtes schematic diagrames;
Fig. 7, the utility model embodiment five partial structurtes schematic diagrames;
Fig. 8, the utility model embodiment six partial structurtes schematic diagrames.
Embodiment
As shown in Figure 1, the Miniature Quartz with ground lead provided by the utility model, comprise substrate 5, insulator 7, lead-in wire 4, wafer 2 and shell 1, two insulator placement holes are set on substrate, insulator is placed in on-chip insulator placement hole, lead-in wire, through the wire perforation on insulator, can bend along any direction, and substrate top is coated with shell.
Of the present utility model being characterised in that, substrate body is also provided with ground lead 6, corresponding with earth connection or the zero line of the external circuit board.This lead-in wire can connect to realize by welding or alternate manner.
In embodiment shown in Fig. 1, Fig. 6, the connection of lead-in wire ailhead and wafer is achieved in that lead-in wire ailhead upper end has reed 3, and reed top is provided with wafer 2.
In the embodiment as shown in Fig. 4, Fig. 7 or Fig. 5, Fig. 8, substrate earthing device of the present utility model is the ground lead 6 that substrate body below arranges.The layout of this ground lead and crystal resonator lead-in wire is depending on actual conditions, and relevant improvement all belongs to same design concept of the present utility model, all belongs to protection range of the present utility model.
In embodiment as shown in Figure 2 and Figure 3, in use, its below is provided with pad 8 to the utility model.
Claims (3)
1. a Miniature Quartz with ground lead, comprise substrate (5), insulator (7), lead-in wire (4), wafer (2) and shell (1), insulator is placed in on-chip insulator placement hole, lead-in wire is through the wire perforation on insulator, lead-in wire ailhead and wafer connect, substrate top is coated with shell, it is characterized in that, substrate body is also provided with ground lead (6).
2. the Miniature Quartz with ground lead according to claim 1, is further characterized in that, its total length is between 2.0 millimeters-7.1 millimeters, and overall width is between 1.0 millimeters-4.2 millimeters.
3. the Miniature Quartz with ground lead according to claim 1, is further characterized in that, described substrate body below is provided with pad (8).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420308743.0U CN203968078U (en) | 2014-06-11 | 2014-06-11 | The Miniature Quartz with ground lead |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420308743.0U CN203968078U (en) | 2014-06-11 | 2014-06-11 | The Miniature Quartz with ground lead |
Publications (1)
Publication Number | Publication Date |
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CN203968078U true CN203968078U (en) | 2014-11-26 |
Family
ID=51928618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201420308743.0U Expired - Fee Related CN203968078U (en) | 2014-06-11 | 2014-06-11 | The Miniature Quartz with ground lead |
Country Status (1)
Country | Link |
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CN (1) | CN203968078U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105450197A (en) * | 2016-01-09 | 2016-03-30 | 烟台晶英电子有限公司 | Surface-mounted quartz crystal resonator and processing process thereof |
-
2014
- 2014-06-11 CN CN201420308743.0U patent/CN203968078U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105450197A (en) * | 2016-01-09 | 2016-03-30 | 烟台晶英电子有限公司 | Surface-mounted quartz crystal resonator and processing process thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141126 Termination date: 20200611 |
|
CF01 | Termination of patent right due to non-payment of annual fee |