CN203962600U - The combining structure of plate body - Google Patents
The combining structure of plate body Download PDFInfo
- Publication number
- CN203962600U CN203962600U CN201420194190.0U CN201420194190U CN203962600U CN 203962600 U CN203962600 U CN 203962600U CN 201420194190 U CN201420194190 U CN 201420194190U CN 203962600 U CN203962600 U CN 203962600U
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- plate body
- lower body
- upper plate
- combining structure
- slot
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Abstract
The utility model is a kind of combining structure of plate body, wherein combining structure includes a lower body and the upper plate body fitting up and down, lower body end face is concaved with at least one solder slot, between two plate bodys, just have living space and can hold scolder thus, after solder fusing, just can in solder slot, move and avoid from the edge of two plate bodys overflowing; In addition, scolder, except touching solder slot internal face, also upwards touches upper plate body, therefore can reach equally the effect that connects two plate bodys; The utility model reaches the creation object of avoiding scolder to overflow two plate body edges by this.
Description
Technical field
The utility model relates to a kind of combining structure of plate body, espespecially a kind of with welding manner the structure in conjunction with plate body.
Background technique
The mode of welding two plate bodys in prior art has a variety of, wherein commonly a kind ofly be, prior to the end face of a plate body wherein, be coated with a lap welding material, then another plate body is pressed on plate body and scolder, afterwards two plate bodys are heated to the fusing point of scolder and make solder fusing, after treating scolder cooled and solidified, two plate bodys are just by scolder and in conjunction with fixing.
Yet the shortcoming of this kind of welding manner is, when two plate bodys heating and during solder fusing, the face leaning due to two plate bodys is all plane, therefore can be to two side shiftings after being folded in scolder between two plate bodys and being squeezed, and may overflow from the edge of two plate bodys, and the scolder overflowing is not only not attractive in appearance, more may affect because of the increase of volume the combination of two plate bodys and other elements; In addition, what scolder was generally all coated on plate body approaches edge part, to avoid the junction of two plate bodys because of excessively far away apart from edge, and causes the edge of two plate bodys can pull open excessive angle, but so more causes scolder easily from edge, to overflow.
Model utility content
Because shortcoming and the deficiency of aforesaid prior art, the purpose of this utility model is to provide a kind of combining structure of plate body, can effectively avoiding scolder to overflow edge.
For reaching above-mentioned creation object, the technological means that the utility model adopts is the combining structure of a kind of plate body of design, wherein comprises:
One lower body, its end face is concaved with at least one solder slot;
One upper plate body, it is posted by the end face of lower body;
Scolder, it is located in the corresponding solder slot of lower body, and contact upper plate body.
The combining structure of plate body as above, wherein, the thickness of described upper plate body is between between 0.05mm to 1.5mm, and the thickness of described lower body is between between 0.05mm to 1.5mm.
The combining structure of plate body as above, wherein, the bottom surface of described upper plate body is outstanding is provided with at least one protuberance, and described in each, protuberance wears in the corresponding described solder slot of described lower body, and contacts described scolder.
The combining structure of plate body as above, wherein, described lower body has single solder slot, and described solder slot is an annular groove.
The combining structure of plate body as above, wherein, described lower body has single solder slot, and described solder slot is an annular groove; Described upper plate body has single protuberance, and described protuberance is a ring protuberance.
The combining structure of plate body as above, wherein, the solder slot of described lower body is in abutting connection with the periphery of described lower body.
The combining structure of plate body as above, wherein, the periphery of described upper plate body is extended with an invayination, and described invayination is surrounded on outside the periphery of described lower body, and suppresses the bottom surface in described lower body.
The combining structure of plate body as above, wherein, the periphery of described lower body is extended with an invayination, and described invayination is surrounded on outside the periphery of described upper plate body, and suppresses the end face in described upper plate body.
The combining structure of plate body as above, wherein, described upper plate body and described lower body sandwiched go out a channel slot, and described channel slot is an annular groove, and is positioned at the inner side of described solder slot.
The combining structure of plate body as above, wherein, the center of described upper plate body and described lower body is penetrated with a perforation all up and down.The utility model has the advantage of, by the end face at lower body, solder slot is set, between two plate bodys, just have living space and can hold scolder thus, after solder fusing, just can in solder slot, move, and avoid from the edge of two plate bodys overflowing; In addition, scolder, except touching solder slot internal face, also upwards touches upper plate body, therefore can reach equally the effect that connects two plate bodys; The utility model reaches the creation object of avoiding scolder to overflow two plate body edges by this.
Furthermore, the combining structure of described plate body, wherein the periphery of upper plate body is extended with an invayination, and invayination is surrounded on outside the periphery of lower body, and suppresses the bottom surface in lower body.Can further strengthen the combination of two plate bodys by this.
Accompanying drawing explanation
The following drawings is only intended to the utility model to schematically illustrate and explain, does not limit scope of the present utility model.Wherein,
Fig. 1 is the flow chart of associated methods of the present utility model.
Fig. 2 is the stereo appearance figures of two plate bodys of the present utility model when completing.
Fig. 3 is the side-looking generalized section after solder fusing of the present utility model.
Fig. 4 is the side-looking generalized section after lower body of the present utility model has been rolled.
Fig. 5 is the side-looking generalized section after the invayination reflexed of upper plate body of the present utility model.
Fig. 6 is another embodiment's of the present utility model two plate bodys stereo appearance figures when completing.
Fig. 7 is the side-looking generalized section after another embodiment's of the present utility model solder fusing.
Fig. 8 is an embodiment the flow chart again of associated methods of the present utility model.
Primary component label declaration:
10 lower body 11 solder slots
20 upper plate body 21 protuberances
22 invayination 30 scolders
40 channel slots
10A lower body 12A perforation
20A upper plate body 23A perforation
40A channel slot
10B lower body 11B solder slot
20B upper plate body 30B scolder
Embodiment
Below coordinate preferred embodiment graphic and of the present utility model, further setting forth the utility model is to reach the technological means that predetermined creation object is taked.
Refer to Fig. 1, the associated methods of the combining structure of plate body of the present utility model comprises following steps:
Please refer to Fig. 2 and Fig. 3, first, prepare a lower body 10 and a upper plate body 20(S1); Lower body 10 is rectangle, and its end face is concaved with a solder slot 11, solder slot 11 be one along lower body 10 periphery rings around annular groove, and in abutting connection with the periphery of lower body 10, the bottom surface of solder slot 11 protrudes from the bottom surface of lower body 10; Upper plate body 20 is similarly rectangle, but upper plate body 20 peripheries are extended with an invayination 22, so upper plate body 20 areas are greater than the area of lower body 10; The outstanding protuberance 21 that is provided with in the bottom surface of upper plate body 20, protuberance 21 be one along upper plate body 20 periphery rings around ring protuberance; In the present embodiment, solder slot 11 and protuberance 21 are all made in the mode of piercing, but not as limit; In the present embodiment, lower body 10 and upper plate body 20 are all metal material, and thickness is all between between 0.05mm to 1.5mm.
Then scolder 30 is coated in the solder slot 11 of lower body 10 (S2), scolder 30 can be tin or other materials; Then upper plate body 20 is compressed on to the end face (S3) of lower body 10, and makes the protuberance 21 of upper plate body 20 wear the solder slot 11 into lower body 10, and protuberance 21 touches the scolder 30 in solder slot 11.
Then by the corresponding scolder 30 position parts of lower body 10, or the corresponding scolder 30 position parts of upper plate body 20, or respectively at lower body 10, the corresponding scolder 30 position parts of upper plate body 20, heat, until temperature rises to the fusing point of scolder 30 so that scolder 30 fusings (S4); Just can cooled and solidified within scolder more than 30 seconds, and therefore engage lower body 10, upper plate body 20(S5); Please refer to Fig. 4, afterwards two plate bodys 10,20 are turned, make lower body 10 bottom surfaces upward, at this moment by the 11 salient point rolling levelings (S6) of the solder slot of lower body 10 bottom surfaces; Then rolling place polishing is made to its more smooth (S7); Please refer to Fig. 5, finally by the invayination of upper plate body 20 22 reflexeds (S8), invayination 22 is surrounded on outside the periphery of lower body 10, and suppresses in the bottom surface of lower body 10; To this, complete in conjunction with operation.
From said process, can find out, when upper plate body 20 is compressed on lower body 10, because solder slot 11 produces a space, hold scolder 30, after scolder 30 fusings, just can in solder slot 11, move, and avoid from the edge of lower body 10, upper plate body 20 overflowing; And scolder 30 is except touching the internal face of solder slot 11, also upwards touch the protuberance 21 of upper plate body 20, therefore still can effectively be connected and fixed lower body 10, upper plate body 20, the utility model reaches the creation object of avoiding scolder 30 to overflow lower body 10, upper plate body 20 edges by this.
And by the invayination 22 of upper plate body 20, be surrounded on the periphery of lower body 10, and suppress in the bottom surface of lower body 10, more make the combination of lower body 10, upper plate body 20 more firm; In addition, invayination is extensible shaping in the periphery of lower body also, and reflexed and being surrounded on outside the periphery of upper plate body upwards, finally suppresses the end face in upper plate body, so can reach equally the object of strengthening two plate body combinations.
In addition, the utility model can be used for the plate body of various uses and kind, for example, in the present embodiment for to be used for heat conduction to avoid heat to concentrate on the temperature-uniforming plate at a place, and be further provided with a channel slot 40, channel slot 40 sandwicheds form between lower body 10 and upper plate body 20, channel slot 40 is an annular groove parallel with solder slot 11, and is positioned at the inner side of solder slot 11; Can be in the interior working fluid that arranges of channel slot 40 during use, for example water or refrigerant, working fluid is subject to after thermal evaporation in channel slot 40, along channel slot 40, flow and transferring heat be cooled to liquid, finally get back to original position to be again subject to thermal evaporation, working fluid just can come heat Transmit evenly rapidly by this; And the volume of channel slot 40 and shape are all passed through accurate calculating and design, to reaching best heat transfer efficiency, therefore the solder slot 11 of lower body 10 can effectively be avoided scolder 30 flow channel grooves 40 equally, to avoid scolder 30 to affect volume and the shape of channel slot 40.
Refer to Fig. 6, while using as temperature-uniforming plate, lower body 10A and upper plate body 20A center can further be run through a perforation 12A, 23A up and down, and make lower body 10A, upper plate body 20A all circlewise, shape, the size of two perforation 12A, 23A are all identical, and the position of two perforation 12A, 23A is also corresponding; On so using, can reach equally the effect rapidly heat Transmit evenly being come, and can avoid scolder flow channel groove 40A or overflow outside lower body 10A, upper plate body 20A edge by solder slot equally on making.
In other embodiments, refer to Fig. 7, upper plate body 20B of the present utility model also can not have protuberance, and the corresponding solder slot 11B of upper plate body 20B part is a plane, so can hold more scolder 30B, or can reduce the distance of the outstanding lower body 10B of solder slot 11B bottom surface.
In other embodiments, solder slot can not be also annular groove, and lower body can change into and include a plurality of solder slots that do not join, and each solder slot can be elongated slot or other shapes, and scolder is equally only coated in solder slot, can reach equally by this and avoid scolder to overflow the creation object outside two plate body edges.
In other embodiments, refer to Fig. 8, making method of the present utility model is solidified in solder cools after (S5), also can first carry out the reflexed (S8) of invayination, finally carries out rolling leveling (S6) and polishing (S7) again; And during for fear of rolling and the interfere in ends of invayination, can change and make invayination form in lower body, and reflexed upwards, so the end of invayination just can be positioned at the end face of upper plate body.
In other embodiments, making method of the present utility model also can optionally be omitted the reflexed of invayination, and two plate bodys all do not have invayination; Equally also visual situation and omit the polishing of rolling place, or the rolling leveling that even connects solder slot is together omitted, for example, when the degree of depth of solder slot is compared with shallow and do not protrude from the bottom surface of lower body, or the solder slot distance that protrudes from lower body bottom surface is compared with shallow and can ignore time, just without carrying out rolling leveling.
The above is only preferred embodiment of the present utility model, not the utility model is done to any pro forma restriction, although the utility model discloses as above with preferred embodiment, yet not in order to limit the utility model, under any, in technical field, have and conventionally know the knowledgeable, within not departing from the scope of technical solutions of the utility model, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solutions of the utility model, any simple modification of above embodiment being done according to technical spirit of the present utility model, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (10)
1. a combining structure for plate body, is characterized in that, the combining structure of described plate body comprises:
One lower body, its end face is concaved with at least one solder slot;
One upper plate body, it is posted by the end face of described lower body;
Scolder, it is located in the corresponding described solder slot of described lower body, and contacts described upper plate body.
2. the combining structure of plate body as claimed in claim 1, is characterized in that, the thickness of described upper plate body is between between 0.05mm to 1.5mm, and the thickness of described lower body is between between 0.05mm to 1.5mm.
3. the combining structure of plate body as claimed in claim 1 or 2, is characterized in that, the bottom surface of described upper plate body is given prominence to and is provided with at least one protuberance, and described in each, protuberance wears in the corresponding described solder slot of described lower body, and contacts described scolder.
4. the combining structure of plate body as claimed in claim 1 or 2, is characterized in that, described lower body has single solder slot, and described solder slot is an annular groove.
5. the combining structure of plate body as claimed in claim 3, is characterized in that, described lower body has single solder slot, and described solder slot is an annular groove; Described upper plate body has single protuberance, and described protuberance is a ring protuberance.
6. the combining structure of plate body as claimed in claim 1 or 2, is characterized in that, the solder slot of described lower body is in abutting connection with the periphery of described lower body.
7. the combining structure of plate body as claimed in claim 1 or 2, is characterized in that, the periphery of described upper plate body is extended with an invayination, and described invayination is surrounded on outside the periphery of described lower body, and suppresses the bottom surface in described lower body.
8. the combining structure of plate body as claimed in claim 1 or 2, is characterized in that, the periphery of described lower body is extended with an invayination, and described invayination is surrounded on outside the periphery of described upper plate body, and suppresses the end face in described upper plate body.
9. the combining structure of plate body as claimed in claim 1 or 2, is characterized in that, described upper plate body and described lower body sandwiched go out a channel slot, and described channel slot is an annular groove, and is positioned at the inner side of described solder slot.
10. the combining structure of plate body as claimed in claim 1 or 2, is characterized in that, the center of described upper plate body and described lower body is penetrated with a perforation all up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420194190.0U CN203962600U (en) | 2014-04-21 | 2014-04-21 | The combining structure of plate body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420194190.0U CN203962600U (en) | 2014-04-21 | 2014-04-21 | The combining structure of plate body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203962600U true CN203962600U (en) | 2014-11-26 |
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ID=51923191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420194190.0U Expired - Fee Related CN203962600U (en) | 2014-04-21 | 2014-04-21 | The combining structure of plate body |
Country Status (1)
| Country | Link |
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| CN (1) | CN203962600U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105020223A (en) * | 2014-04-21 | 2015-11-04 | 双鸿科技股份有限公司 | Plate body combination structure and combination method thereof |
| CN108738273A (en) * | 2017-04-14 | 2018-11-02 | 双鸿科技股份有限公司 | Temperature equalizing plate |
-
2014
- 2014-04-21 CN CN201420194190.0U patent/CN203962600U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105020223A (en) * | 2014-04-21 | 2015-11-04 | 双鸿科技股份有限公司 | Plate body combination structure and combination method thereof |
| CN108738273A (en) * | 2017-04-14 | 2018-11-02 | 双鸿科技股份有限公司 | Temperature equalizing plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160414 Address after: 215300, No. 3, No. 68 Taoyuan Road, Kunshan, Jiangsu, Suzhou Patentee after: Auras Electronic Science and Technology Industrial (Kunshan) Co., Ltd. Address before: Chinese Taiwan New Taipei City Patentee before: Shuanghong Science and Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141126 Termination date: 20190421 |