CN203948999U - Illuminator and lighting device - Google Patents

Illuminator and lighting device Download PDF

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Publication number
CN203948999U
CN203948999U CN201420390911.5U CN201420390911U CN203948999U CN 203948999 U CN203948999 U CN 203948999U CN 201420390911 U CN201420390911 U CN 201420390911U CN 203948999 U CN203948999 U CN 203948999U
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CN
China
Prior art keywords
illuminator
1led group
substrate
2led6
1led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420390911.5U
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Chinese (zh)
Inventor
浅见健一
松永启之
蒲仓贵耶
下条英明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Application granted granted Critical
Publication of CN203948999U publication Critical patent/CN203948999U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

It is a kind of without using the protecting component just can be at LED out-of-work COB type illuminator and lighting device of possessing this illuminator during in end of lifetime that the utility model provides.Illuminator (1) possesses: substrate (2); Electric conductor (3), is arranged at one side (2a) side of substrate (2); The 1LED group (5) of flip-chip type, is installed on one side (2a) side of substrate (2) to be electrically connected on the mode of electric conductor (3); Metal wire (7), can make the mode of 1LED group (5) energising be electrically connected to electric conductor (3); Translucent resin (8), is arranged to 1LED group (5) and the sealing of metal wire (7) one.

Description

Illuminator and lighting device
Technical field
The lighting device that embodiment of the present utility model relates to the illuminator of a kind of LED of use and sets this illuminator.
Background technology
In lighting device, use and have COB (chip on board) type illuminator, this COB type illuminator is set up in parallel the one side side at substrate by a plurality of LED bare chips, be provided with the frame portion that surrounds LED bare chip simultaneously, in this frame portion, fill the translucent resin that is mixed with fluorophor, by this translucent resin, bury each LED bare chip (for example, with reference to patent documentation 1) underground.This COB type illuminator is also used in LED bulb (bulb-shaped LED lamp).LED bulb-shaped becomes the distolateral installation lamp holder at basket, at another distolateral enclosure body that illuminator is set and covers the light transmission of this illuminator of basket, and in basket, has and makes to form the ignition device that the LED bare chip of COB is lighted.
As everyone knows, if the LED bare chip of the formation COB of LED bulb has arrived end of lifetime, the temperature of illuminator or ignition device rises, and power consumption increase causes further heating.And if illuminator or ignition device exceedingly generate heat, basket integral body overheats, the resin lens of the luminous intensity distribution of control LED bare chip or enclosure body etc. can melt, and there will be the situation that comes off or fall down from basket when serious.Therefore, LED bulb connects current fuse (for example, with reference to patent documentation 2) at ignition device, or in basket the temp-sensing element (for example, with reference to patent documentation 3) of set temperature fuse etc.
If along with the increase electric current of power consumption surpasses permissible value and flows through, current fuse fuses and cuts off circuit.In addition, if the temperature for example in ignition device or basket surpasses predetermined value, temp-sensing element performance is cut off to the effect of the power supply of LED.
Patent documentation 1: TOHKEMY 2011-60961 communique (the 6th page, Fig. 3)
Patent documentation 2: TOHKEMY 2012-23051 communique ([0038] section, [0006] section, 3 figure)
Patent documentation 3: TOHKEMY 2011-3311 communique ([0019], [0030], Fig. 2)
In basket, current fuse or temp-sensing element need respectively to set accordingly space, thereby the minimizing of the design freedom in basket, and have the shortcoming that is difficult to realize the miniaturization of LED bulb.In addition, LED bulb is owing to possessing current fuse or temp-sensing element, thereby has the shortcoming that is difficult to realize cost.These problems exist equally in the general illumination device with COB type illuminator.
Summary of the invention
It is a kind of without using the protecting component just can be at LED out-of-work COB type illuminator and lighting device of possessing this illuminator during in end of lifetime that the purpose of this utility model is to provide.
The illuminator of present embodiment comprises: substrate, electric conductor, 1LED group, metal wire and translucent resin.Electric conductor is arranged at the one side side of substrate.1LED group is the LED of flip-chip type, is installed on the one side side of substrate to be electrically connected on the mode of electric conductor.
Metal wire is can make the mode of 1LED group energising be electrically connected to electric conductor.Translucent resin is arranged to 1LED group and the sealing of metal wire one.
According to the illuminator of present embodiment, the 1LED of illuminator group arrives end of lifetime and abnormal heating causes translucent resin to crack, and by the expansion gradually of this crackle, thereby metal wire broken string is stopped to the energising of 1LED group.
Accompanying drawing explanation
Fig. 1 mean the 1st embodiment of the present utility model illuminator by the approximate vertical view after translucent resin perspective.
Fig. 2 is the general profile chart of the A-A line direction of Fig. 1.
Fig. 3 is the general profile chart of the B part of Fig. 2.
Fig. 4 mean the 2nd embodiment of the present utility model illuminator by the approximate vertical view after translucent resin perspective.
Fig. 5 is the general profile chart of the C-C line direction of Fig. 4.
Fig. 6 means the approximate vertical view after another illuminator translucent resin is had an X-rayed.
Fig. 7 means the biopsy cavity marker devices summary side elevation of the lighting device of the 3rd embodiment of the present utility model.
In figure: 1,25,25A-illuminator, 2-substrate, 3-electric conductor, 5-1LED group, 6-2LED, 7-is as the closing line of metal wire, 8-translucent resin, 27-is as the closing line of metal wire, 31-lighting device, 32-apparatus main body, 39-ignition device.
The specific embodiment
Below, with reference to accompanying drawing, the mode of a kind of enforcement of the present utility model is described.First, the 1st embodiment of the present utility model is described.
The illuminator 1 of present embodiment is used for the lighting devices such as LED bulb as light source, and be otherwise known as light emitting module or LED module, and its structure as shown in Figure 1 to Figure 3.In Fig. 1, illuminator 1 comprises: substrate 2, electric conductor 3, the 1LED group 5 consisting of a plurality of 1LED4, metal wire 7 and the translucent resin 8 being electrically connected to 2LED6.
In present embodiment, substrate 2 forms by forming the roughly aluminium of foursquare thickness 1.0mm (Al) plate, and as shown in Figure 2, in its one side, 2a is formed with for example insulating barrier 9 of thickness 80 μ m.Insulating barrier 9 for example consists of epoxy material and inorganic filler, has high-termal conductivity.And, on the surface of insulating barrier 9, be provided with electric conductor 3.That is, electric conductor 3 is arranged at the one side 2a side of substrate 2 via insulating barrier 9.Electric conductor 3 consists of a pair of Wiring pattern 10,10 and connection pattern 11.Connect pattern 11 for be connected in series 1LED4 and 2LED6 between a pair of Wiring pattern 10,10.A pair of Wiring pattern 10,10 and connection pattern 11 are by for example at the metal level of thickness 10 μ m, and for example copper (Cu) is gone up the further conductive material formation of silver-plated (Ag) of nickel plating (Ni).
As shown in Figure 1, in the present embodiment, between a pair of Wiring pattern 10,10, be connected in series with 4 1LED4 (1LED group 5) and 1 2LED6.And the concatermer of 1LED group 5 and 2LED6 is provided with a plurality of row becoming equally spaced mode between with each concatermer between a pair of Wiring pattern 10,10, is provided with in the present embodiment 5 row.And in each row, 2LED6 is connected in series in centre and the 1LED group 5 of the 1LED group 5 being connected in series.
As shown in Figure 3,1LED4 is flip-chip type LED, and its outstanding 4a, 4b are electrically connected to the pattern 11,11 that is connected of electric conductor 3 respectively by for example not shown electric conductivity sticker.If outstanding 4a, the 4b of 1LED4 energising, from forming the luminescent layer 13 radiation blue lights of lower surface 12b side of the sapphire 12 of cuboid.Luminescent layer 13 forms the luminescent material InGaN for example with the light of radiation from ultraviolet light to region of blue light.Thus, the 1LED group 5 consisting of the 1LED4 of a plurality of flip-chip types to be to be installed on the one side 2a side of substrate 2 with the mode that pattern 11 is electrically connected to that is connected of electric conductor 3, and is arranged to 5 row between a pair of Wiring pattern 10,10 of electric conductor 3.
In addition, 2LED6 is formed with luminescent layer 15 in the upper surface 14a of the sapphire 14 of cuboid side, and is provided with electrode 6a, 6b in the upper surface 15a of this luminescent layer 15 side.Sapphire 14 is bonded in the surface of the insulating barrier 9 of the one side 2a that is formed at substrate 2 by not shown transparent silicone.Luminescent layer 15 for example forms the luminescent material InGaN for example with the light of radiation from ultraviolet light to region of blue light, by energising, radiates blue light.
Electrode 6a, the 6b of 2LED6 respectively wire-bonded in adjacent and be the connection pattern 11,11 of the electric conductor 3 of row shape.That is, electrode 6a, 6b are electrically connected on and are connected pattern 11,11 by the closing line 7,7 as metal wire.2LED6 can be connected with 5 energisings of 1LED group via being connected pattern 11,11 by the closing line 7,7 being electrically connected to its electrode 6a, 6b.And closing line 7,7 is arranged to and the 1LED group 5 one side 2a sides of comparing further from substrate 2.The gold (Au) that closing line 7,7 is for example 50 μ m following (being 30 μ m in the present embodiment) by wire diameter is made.
And 1LED group 5,2LED6 and closing line 7,7 are sealed by translucent resin 8.As shown in Figure 2, translucent resin 8 is filled in the frame portion 17 being arranged on insulating barrier 9.Translucent resin 8 is arranged to 1LED group 5,2LED6 and closing line 7,7 one sealings.Frame portion 17 is for example made by silicone resin, has predetermined width and height, as shown in Figure 1, in the one side 2a of substrate 2 side, to surround the mode of 1LED group 5,2LED6 and electric conductor 3, forms roughly dimetric plan view shape.As shown in Figure 2, the surperficial 8a of translucent resin 8 becomes flat condition.And translucent resin 8 is filled to the top 17a of frame portion 17 from insulating barrier 9.
And translucent resin 8 is usingd the concentration of being scheduled to and is contained the YAG fluorophor 18 as fluorophor.If from the blue light incident of 1LED group 5 and 2LED6 radiation, YAG fluorophor 18 converts this blue light wavelength to sodium yellow.That is, YAG fluorophor 18 is by a part of wavelength conversion of the radiating light of 1LED group 5 and 2LED6.Sodium yellow after the conversion of this wavelength and mix (colour mixture) and penetrate from the surperficial 8aXiang foreign side of translucent resin 8 from the blue light of 1LED group 5 and 2LED6 radiation, thereby seem from illuminator 1 radiation white light.That is, the surperficial 8a of translucent resin 8 becomes the light-emitting area of illuminator 1.
In Fig. 3, closing line 7,7 is configured to as follows in the present embodiment: from substrate 2 distal part 7a, 7a farthest, be positioned at than 1LED group 5 more by the surperficial 8a side of translucent resin 8 connecting between pattern 11 and the surperficial 8a of translucent resin 8.That is, distal part 7a, the 7a of closing line 7,7 are arranged to from the one side 2a side of substrate 2 away from the more than 1/2 (50%) of interval L connecting between pattern 11 and the surperficial 8a of translucent resin 8.
In addition, 2LED6 is as long as has for example electrode 6a of at least 1 electrode at upper surface 15a, also can have electrode 6a and have electrode 6b at the lower surface of sapphire 14 at upper surface 15a.In the latter case, electrode 6b be connected pattern 11 and be electrically connected to.That is, 2LED6 is as long as be electrically connected to 1LED group 5 by closing line 7.
And, as shown in Figure 1, on the insulating barrier 9 in the outside of frame portion 17, be provided with connector 19.This connector 19 is electrically connected to a pair of Wiring pattern 10,10 of electric conductor 3.In addition, on the insulating barrier 9 in the outside of frame portion 17, be coated with white resist 20.And, the connector 22 being connected with the output line 21 of not shown ignition device is installed at connector 19.
Secondly, the effect of the 1st embodiment of the present utility model is narrated.
With regard to illuminator 1, if the connector from ignition device to illuminator 19 is supplied with electric power, predetermined electric current flows through respectively 1LED group 5 and the 2LED6 of each row that are connected with a pair of Wiring pattern 10,10 of electric conductor 3.1LED group 5 and 2LED6 heating and radiation blue light.A part for blue light converts sodium yellow to by YAG fluorophor 18 wavelength that contain in translucent resin 8.And the white light that blue light and sodium yellow mix after (colour mixture) radiates from the surperficial 8a of translucent resin 8.White light penetrates to the front side of illuminator 1.
And 1LED group 5 and 2LED6 are along with luminous and sharply heating.This hot direct heat conducts to translucent resin 8, thereby and from insulating barrier 9 respectively heat conduct to substrate 2 and white resist 20 is emitted.And the heat that heat conducts to translucent resin 8 discharges to space outerpace from the surperficial 8a of translucent resin 8.Translucent resin 8 is because correspondingly being expanded by heat conducting heat.
And with regard to illuminator 1, if ignition device is not powered, 1LED group 5 and 2LED6 turn off the light and do not generate heat.Thus, translucent resin 8 shrinks from heat expands state.Translucent resin 8 is because of 1LED group 5 and the 2LED6 light-off of lighting a lamp all the year round, and hardening gradually, easily cracks towards inside from surperficial 8a side.Particularly the part of the translucent resin 8 of the positive upside of 2LED6 is the positive upside of the mid portion of the 1LED group 5 that is connected in series and 2LED6, the heat passing over from 1LED group 5 and 2LED6 concentrates on this, thereby easier hardening, more easily crack.
Because 1LED group 5 and 2LED6 are respectively semiconductor elements, thereby be accompanied by energising all the year round, their PN junction constant resistance becomes large gradually.Thus, it is large that the caloric value of 1LED group 5 and 2LED6 also little by little becomes, and 1LED group 5 and 2LED6 destroy because of the temperature rising that cannot bear the increase of this caloric value and produce, thereby reach the life-span.1LED group 5 and 2LED6 produce considerable heat at end of lifetime.
If 1LED group 5 and 2LED6 have arrived end of lifetime, considerable heat is conducted to translucent resin 8 by heat.Thus, it is large that the hardness of translucent resin 8 further becomes, and as shown in Figure 3, from its surperficial 8a, towards inside, cracks 23.This crackle 23 is gradually from the in-house development of surperficial 8a side direction and expand.
Electrode 6a, the 6b of 2LED6 are arranged to than 1LED group 5 more away from the one side 2a of substrate 2 with being connected closing line 7,7 that pattern 11,11 is electrically connected to, thereby the crackle 23 that results from translucent resin 8 is easy to arrive closing line 7,7.Particularly in the present embodiment, closing line 7,7 from substrate 2 distal part 7a, 7a farthest, be positioned at the more surperficial 8a and the more than 1/2 (50%) of interval L that is connected 11, pattern by the surperficial 8a side translucent resin 8 of translucent resin 8, therefore from the crackle 23 of the surperficial 8a side direction in-house development of translucent resin 8, be easy to arrive the distal part 7a of closing line 7,7,7a.
And if crackle 23 arrives distal part 7a, the 7a of closing lines 7,7, closing line 7,7 is pulled because of the expansionary force effect that further developing of crackle 23 produces.By this, pull electrode 6a, the 6b of closing line 7,7 and 2LED6 or be connected the connection broken string of pattern 11,11.Particularly electrode 6a, the 6b of closing line 7,7 and 2LED6 easily break.In addition, distal part 7a, the 7a side of closing line 7,7 are torn and are broken because of the expansionary force of crackle 23.Thus, electric current does not flow through 1LED group 5 and the 2LED6 of the row of closing line 7,7 broken strings.1LED group 5 and the 2LED6 of end of lifetime turn off the light and do not generate heat, can be by heat damage.
Afterwards, flowing through the 1LED group 5 of remaining row and the electric current of 2LED6 increases, and as described above, the crackle 23 of expansion causes closing line 7,7 to break successively.The electric current of supplying with from ignition device cannot flow through illuminator 1.Thus, the 1LED of end of lifetime group 5 and 2LED6 can be by heat damages etc., can protect illuminator 1.
In the illuminator 1 of present embodiment; 1LED group 5 and 2LED have arrived end of lifetime and abnormal heating; cause translucent resin 8 to crack 23; and this crackle 23 expands gradually; thereby cause closing line 7,7 broken strings can stop, to 1LED group 5 and 2LED6 energising, thering is the effect that can protect 1LED group 5 and 2LED6 to avoid heat damage.
And, the one side 2a side from substrate 2 of closing line 7,7 distal part 7a, 7a is farthest positioned at than the surperficial 8a side of 1LED group 5 more close translucent resins 8, thereby the crackle 23 producing in surperficial 8a side is easy to arrive closing line 7,7, thus, there is the effect that can make in time closing line 7,7 broken strings when 1LED group 5 and 2LED have arrived end of lifetime.
In addition, the closing line 7,7 of the metal wire breaking as the end of lifetime at 1LED group 5 and 2LED6 is electrically connected to owing to holding a concurrent post with 2LED6 electrode 6a, 6b, thereby do not increase the parts number of packages in illuminator 1, there is the effect that can form at a low price illuminator 1.
In addition, because 2LED6 is connected in series in 1LED group 5 in the centre of 1LED group 5, therefore the part of the translucent resin 8 of 2LED6 side because of from 1LED, organize 5 and 2LED6 pass over heat and heat up, thereby easily crack 23, thus, there is the effect that the commitment at the end of lifetime of 1LED group 5 and 2LED6 just can make closing line 7,7 break.
Then, the 2nd embodiment of the present utility model is described.
The structure of the illuminator 25 of present embodiment as shown in FIG. 4 and 5.And, in Fig. 4 and Fig. 5, to marking identical symbol with the identical part of Fig. 1 and Fig. 2 and description thereof is omitted.
Illuminator 25 is to be connected in series a plurality of row on a pair of Wiring pattern 10,10 of the electric conductor 3 of the illuminator 1 shown in Fig. 1, is the illuminator of the 1LED group of 5 row flip-chip types in the present embodiment.Each 1LED4 of the 1LED group 5 being connected in series is connected in series by the connection pattern 11 of electric conductor 3.And the most distolateral connection pattern 11 is electrically connected to by wire-bonded with a Wiring pattern 10a.That is the 1LED group 5, being connected in series is electrically connected to a pair of Wiring pattern 10,10 by the closing line 7 as metal wire at every row.So, closing line 7 is so that 1LED group 5 modes that can switch on that are connected in series are electrically connected on Wiring pattern 10a and the connection pattern 11 of electric conductor 3.
And, as shown in Figure 5, being arranged to than the 1LED group 5 one side 2a sides further from substrate 2 from substrate 2 distal part 7a farthest of closing line 7.That is, closing line 7 with its distal part 7a near the mode wire-bonded of the surperficial 8a of translucent resin 8 in connecting pattern 11 and Wiring pattern 10a.
With regard to illuminator 25, if 1LED group 5 has arrived end of lifetime, the crackle 23 of surperficial 8a side of translucent resin 8 that results from the positive upside of closing line 7 arrives the distal part 7a of closing lines 7.And, the expansionary force that closing line 7 further produces to substrate 2 sides development by crackle 23 and being pulled, thus break with Wiring pattern 10a or the connection that is connected pattern 11.In addition, thus the distal part 7a side of closing line 7 is torn broken string because of the expansionary force of crackle 23.By the closing line 7 of this broken string, electric current cannot flow through the 1LED group 5 of the row that are connected in series.This 1LED group 5 is turned off the light and does not generate heat.Thus, protect the 1LED group 5 that has arrived end of lifetime to avoid heat damage.
And illuminator 25 is owing to using the 1LED group 5 of flip-chip type as light source, thus with the situation with 2LED6 for example illuminator 1 compare, can increase from the light quantity of the surperficial 8a radiation of translucent resin 8, improve luminous efficiency.In addition, closing line 7 is owing to being positioned at frame portion 17 sides of illuminator 25, so the surperficial 8a of translucent resin 8 is difficult for producing brightness irregularities.
In addition, as shown in Figure 6, can also form each row of the 1LED group 5 being connected in series are connected in to another Wiring pattern 10b and common pattern 26, and pass through 1 closing line 27 as metal wire by common pattern 26 and an illuminator 25A that Wiring pattern 10a is electrically connected to.Closing line 27 is for example made by gold (Au), and its wire diameter is greater than closing line 7, for example, be 80 μ m.In addition, common pattern 26 consists of the metal level identical with Wiring pattern 10, forms width and the thickness identical with Wiring pattern 10.
With regard to illuminator 25A, by closing line 27, break, can protect whole 1LED groups 5 to avoid heat damage.In addition, also can common pattern 26 and Wiring pattern 10 be electrically connected to by a plurality of metal wires.
Then, the 3rd embodiment of the present utility model is described.
The structure of the lighting device 31 of present embodiment as shown in Figure 7.In addition, in Fig. 7, the part identical with Fig. 1 marked to identical symbol and description thereof is omitted.
Lighting device 31 is the Down lamps that are embedded in ceiling surface etc., by Liu Ding 34, circular escutcheon 33 is installed, and is equipped with light transmission cover 35 at this escutcheon 33 at the lower end side 32a of apparatus main body 32 cylindraceous roughly.Outer surface 33a at escutcheon 33 is provided with reinforced sheet 36.
And apparatus main body 32 is provided with a pair of for apparatus main body 32 being fixed on to the mounting spring 37,37 of ceiling surface etc. by Liu Ding 38 in the left and right sides.In addition, in the inside of the lower end side 32a of apparatus main body 32, in rotational symmetric mode, be equipped with for example illuminator 1 shown in 4 Fig. 1.
In addition, in the inside of the medial side 32b of apparatus main body 32, be equipped with ignition device 39.Ignition device 39 is formed AC power is converted to dc source by known structure, and supplies with constant current (electric power) to 1LED group 5 and the 2LED6 of illuminator 1.And, at the upper face side 32C of apparatus main body 32, be equipped with for connecting the terminal board 40 from the not shown power line of AC power.
The lighting device 31 of present embodiment possesses illuminator 1; thereby this illuminator 1 makes closing line 7 broken string protection 1LED groups 5 and 2LED6 avoid heat damage at the end of lifetime of 1LED group 5 and 2LED6; thereby there is following effect: can suppress because of the fire damage of illuminator 1 etc. cause abnormal, protection escutcheon 33, light transmission cover 35 and apparatus main body 32 occur because of the life-span of illuminator 1 extremely.
In addition, although lighting device 31 forms the Down lamp of baried type, be not limited to this, also can form the lamp devices such as lighting devices such as possessing the microscler baried type of illuminator 1, direct mount type, mounted model or LED bulb.
In addition, above-mentioned embodiment of the present utility model just illustrates, and does not limit the intention of the utility model scope.These new embodiments can be implemented with other variety of ways, within not departing from the scope of aim of the present utility model, can carry out various omissions, displacement, change.These embodiments and distortion thereof are included in the scope and aim of utility model, and are also contained in the invention of recording in technical scheme and in the scope being equal to.

Claims (6)

1. an illuminator, is characterized in that, possesses:
Substrate;
Electric conductor, is arranged at the one side side of this substrate;
The 1LED group of flip-chip type, is installed on the one side side of described substrate to be electrically connected on the mode of this electric conductor;
Metal wire, can make the mode of this 1LED group energising be electrically connected to described electric conductor;
Translucent resin, is arranged to described 1LED group and the sealing of described metal wire one.
2. illuminator according to claim 1, is characterized in that,
Described metal wire is arranged to its one side side from described substrate portion farthest farthest and is positioned at than described 1LED group more by the face side of described translucent resin.
3. illuminator according to claim 1 and 2, is characterized in that,
Described metal wire is at least to have with upper surface the closing line that the 2LED of electrode is electrically connected to.
4. illuminator according to claim 3, is characterized in that,
Described 2LED is connected in series in described 1LED group in the centre of the described 1LED group being connected in series.
5. an illuminator, is characterized in that, possesses:
A plurality of LED, are installed on the one side of substrate;
Metal wire, is connected in these LED in the mode that can switch on;
Light transmission sealing resin, has light transmission, and by described LED and the sealing of metal wire one.
6. a lighting device, is characterized in that, possesses:
Illuminator in claim 1 to 5 described in any one;
Apparatus main body, is equipped with this illuminator;
Ignition device, supplies with electric power to described illuminator.
CN201420390911.5U 2013-11-28 2014-07-15 Illuminator and lighting device Expired - Fee Related CN203948999U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-246001 2013-11-28
JP2013246001A JP2015103786A (en) 2013-11-28 2013-11-28 Luminous body and lighting device

Publications (1)

Publication Number Publication Date
CN203948999U true CN203948999U (en) 2014-11-19

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Application Number Title Priority Date Filing Date
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CN (1) CN203948999U (en)

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Publication number Priority date Publication date Assignee Title
JP6459949B2 (en) * 2015-12-21 2019-01-30 日亜化学工業株式会社 Light emitting device

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