CN203932098U - A kind of LED support and LED encapsulating structure - Google Patents
A kind of LED support and LED encapsulating structure Download PDFInfo
- Publication number
- CN203932098U CN203932098U CN201320663952.2U CN201320663952U CN203932098U CN 203932098 U CN203932098 U CN 203932098U CN 201320663952 U CN201320663952 U CN 201320663952U CN 203932098 U CN203932098 U CN 203932098U
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- Prior art keywords
- heat sink
- led
- heat
- led support
- extension
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- Expired - Lifetime
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- 230000000994 depressogenic effect Effects 0.000 claims description 6
- 238000005286 illumination Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000003292 glue Substances 0.000 description 4
- 230000001795 light effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 208000019901 Anxiety disease Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000036506 anxiety Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a kind of LED support and LED encapsulating structure, LED support comprises: fixed mount, for dispel the heat and the first heat sink of LED chip is installed, for the second heat sink of dispelling the heat and the electrical connector for being electrically connected with the electrode of LED chip, the first heat sink and the second heat sink are all fixed on described fixed mount, the first heat sink comprise base portion and be positioned at base portion top for placing the boss of LED chip, the second heat sink is positioned on described base portion and the second heat sink comprises the extension that stretches out described fixed mount.The LED support that the utility model provides and LED encapsulating structure have good heat-sinking capability, cost is lower, illumination effect good and useful life is longer.
Description
Technical field
The utility model relates to LED field, relates in particular to a kind of LED support and LED encapsulating structure.
Background technology
Tradition tungsten lamp power consumption is high, the life-span is short, and under the overall situation of global resources anxiety, it is gradually prohibited and produce by national governments, and substitute products are electricity-saving lamps thereupon, and electricity-saving lamp has the shortcomings such as pollution, and therefore electricity-saving lamp is had pollution-free and energy-conservation LED lamp and replaces.Along with the high speed development of LED technology, LED illumination becomes the only choosing of novel green illumination gradually.LED is far superior to traditional lighting product in the aspect in principle of luminosity, energy-saving and environmental protection, life-span.
Due to incandescent lamp and electronic energy-saving lamp in people's routine use still in occupation of very high ratio, LED manufacturer develops the LED illuminating product that meets existing interface and people's use habit, makes people in the situation that not needing to change former conventional lamp pedestal and circuit, just can use LED illuminating product of new generation.So LED light fixture has obtained application more and more widely.
At present, LED light fixture generally includes LED support, is fixed on the LED chip on LED support and the fin for LED chip is dispelled the heat.Be normally to dispel the heat by the fin that is independent of LED support in prior art.The heat-sinking capability of the LED light fixture of this form is poor, and then affects illumination effect and the useful life of LED light fixture.
Be understandable that, the statement of this part only provides the background information relevant to the utility model, may form or not form so-called prior art.
Summary of the invention
That technical problem to be solved in the utility model is is poor for the heat-sinking capability of LED light fixture in prior art, illumination effect and useful life undesirable defect, a kind of LED support is provided, to make LED light fixture have good heat-sinking capability, illumination effect and useful life, and its cost is lower.
The utility model solves the technical scheme that its technical problem adopts and is to provide a kind of LED support, it comprises: fixed mount, for dispel the heat and the first heat sink of LED chip is installed, for the second heat sink of dispelling the heat and the electrical connector for being electrically connected with the electrode of LED chip, the first heat sink and the second heat sink are all fixed on described fixed mount, the first heat sink comprises the boss for placing LED chip, the sidewall contact of the second heat sink and described boss, and the second heat sink comprises the extension that stretches out described fixed mount.
In above-mentioned LED support, on described extension, be provided with kink, described kink and extension have angle.
In above-mentioned LED support, described kink is vertical with described extension.
In above-mentioned LED support, described the second heat sink has two ends, and each end is provided with described extension.
In above-mentioned LED support, on each extension, be provided with at least two kinks.
In above-mentioned LED support, each kink is different from the angle of extension.
In above-mentioned LED support, on described the second heat sink, be provided with through hole, the boss on described the first heat sink is fixed on described fixed mount through after described through hole, and boss contacts with the hole wall of described through hole.
In above-mentioned LED support, on described boss, be provided with the depressed part for LED chip is installed.
In above-mentioned LED support, on described the first heat sink, be provided with the reflecting component for guiding LED chip light direction.
In order better to solve the problems of the technologies described above, the utility model also provides a kind of LED encapsulating structure, and it comprises LED support and LED chip described in above-mentioned middle any one, and described LED chip is fixed on the first heat sink of described LED support.
The LED support that the utility model provides, it directly arranges the structure with heat-sinking capability on fixed mount, be its by the second heat sink that is provided for that the first heat sink of LED chip is installed and there is extension, meanwhile, the second heat sink is positioned on described base portion and extension stretches out fixed mount.So, the LED support that the utility model provides in conjunction with the first heat sink and the second heat sink with extension after, be installed on the heat that LED chip on the first heat sink gives out when luminous and can be released to fast the external world by the first heat sink and the second heat sink, thereby can make LED support there is good heat-sinking capability, go out light effect and useful life.And it is simple in structure, cost is lower.
Brief description of the drawings
Fig. 1 is the stereogram of LED support in the embodiment that provides of the utility model;
Fig. 2 is the exploded view of LED support in the embodiment that provides of the utility model;
Fig. 3 is the structural representation of LED support in the embodiment that provides of the utility model;
Fig. 4 be in the another embodiment that provides of the utility model LED support along the cutaway view of electrode direction;
Fig. 5 is the positional structure schematic diagram of the second heat sink and electrode in the embodiment that provides of the utility model.
Embodiment
Clearer for technical problem, technical scheme and beneficial effect that the utility model is solved, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
In description of the present utility model, it will be appreciated that, term " longitudinally ", " laterally ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", orientation or the position relationship of instructions such as " outward " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, instead of device or the element of instruction or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as restriction of the present utility model.
Referring to shown in Fig. 1 to Fig. 5, the LED support that the utility model provides mainly comprises: fixed mount 10, the first heat sink 30, the second heat sink 40 and electrical connector 20.The first heat sink 30, the second heat sink 40 and electrical connector 20 are all fixed on fixed mount 10.Wherein, fixed mount 10 is in LED support, to be used for installing the fixture of fixing other parts; Electrical connector 20 is for being electrically connected (being electrically connected respectively with positive pole and the negative pole of LED chip) with the electrode of LED chip, electrical connector 20 comprises two independently electric-conductors, to be electrically connected respectively positive pole and the negative pole of LED chip; The first heat sink 30 for heat radiation and install LED chip, concrete, the first heat sink comprises: base portion 32 and be positioned at base portion 32 tops for placing the boss 31 of LED chip.The second heat sink is positioned on described base portion, and the second heat sink also comprises extension 41, and extension stretches out and stretches out outside fixed mount from a position of the second heat sink.Those skilled in the art know, for the ease of the light effect that goes out of LED chip in LED light fixture, LED chip is installed on the centre position of LED support conventionally, because the first heat sink will be used for installing LED chip, so the first heat sink is usually located at the centre position of fixed mount or near the centre position of fixed mount, or certain position of the centre position of certain position of the first heat sink in fixed mount or the first heat sink is in the centre position near fixed mount.Because the second heat sink contacts with the first heat sink and the extension of the second heat sink stretches out fixed mount, so the heat that the second heat sink can better send LED chip is delivered to the external world rapidly, simultaneously, extension 41 has increased the contact area of the second heat sink and air, and then also can improve the heat-sinking capability of LED support.So, the LED support that the utility model provides is by arranging heat sink, also be LED support in conjunction with the first heat sink 30 and the second heat sink 40 with extension 41 after, be installed on the heat that LED chip on the first heat sink 30 gives out when luminous and can be released to fast the external world, thereby the LED light fixture that can make LED support and have this LED support structure has good heat-sinking capability, goes out light effect and useful life.And it is simple in structure, cost is lower.
In preferred embodiment of the present utility model, on extension 41, be provided with kink 42, kink 42 has angle (being that the extension on kink and its side is not in same plane) with extension 41.Concrete, for example on extension 41, be provided with one and there is the laminated structure of angle with extension, be that kink 42 is a laminated structure, and then increase the disturbance of the second heat sink and Air Flow, air is increased the convection transfer rate of the second heat sink, thereby increased the heat-sinking capability of the second heat sink and even LED support.Refer again to preferred embodiment shown in Fig. 2 and Fig. 3.In Fig. 2, fixed mount 10 uses plastic material; The electrical connector 20 that is fixed on fixed mount 10 tops comprises two independently conducting strips (for example 221 in Fig. 5 and 222), to be electrically connected respectively positive pole and the negative pole of LED chip; The first heat sink 30 being fixed on fixed mount 10 is transmitted to the external world for the heat rapidly LED chip being produced, and meanwhile, the first heat sink 30 doubles as adhesive area, accommodating LED chip above it.The second heat sink is sheet metal, is provided with the kink of vertically folding up on the extension of the second heat sink, and kink is vertical with described extension.Sheet metal absorbs after heat, and because the conductive coefficient of metal is very high, its overall quick heating, now start to heat up near the air of metal surface, thereby the heat that LED chip is sent takes away the second heat sink.The heat convection power of the second heat sink and air mainly determines by two factors, and one is the contact area of the second heat sink and air, and another is the convection transfer rate of air and the second heat sink.A part for the second heat sink is folded up to the kink that does slabbing and increased the contact area of metal and air, also strengthened the heat convection of metal and air, the kink of vertically turning up has been strengthened the disturbance to Air Flow simultaneously, air is increased the convection transfer rate of the second heat sink, and then can strengthen greatly the heat-sinking capability of the second heat sink.In the time that kink is vertical with extension, the second heat sink has better heat-sinking capability.
Preferably, the second heat sink has two ends, and each end is provided with the extension that stretches out fixed mount., the second heat sink comprises that 41, two extensions of two extensions are positioned at respectively the two ends of the second heat sink, to increase the contact area of the second heat sink and air, and then the heat-sinking capability of increase the second heat sink; Meanwhile, the extension at two ends can make the heat on the second heat sink be distributed uniformly.For example, the second heat sink is a list structure, on two of the second heat sink ends, is provided with extension.More preferably, in the second heat sink, on each extension, be provided with at least two kinks, for example, in two extensions at the second heat sink two ends, on each extension, be provided with two or more kinks, and then the heat-sinking capability of raising the second heat sink and LED support, further preferably, each kink is different from the angle of extension, to improve the disturbance of kink to Air Flow, and then improve the heat-sinking capability of the second heat sink and LED support.
The first heat sink and the second heat sink all can adopt the various structure with heat-sinking capability well known to those skilled in the art.The first heat sink is formed by copper punching press conventionally, so the first heat sink can adopt the ready-made copper post in market, and copper post is convenient to silver-platedly thereon, and then is beneficial to the light that LED chip sends and carries out reflective.Preferably, the second heat sink is laminated structure (more preferably, its laminated structure that is metal), to increase contact area and the convection transfer rate of itself and air, and then improves the heat-sinking capability of LED support.In order to improve the heat-sinking capability of the second heat sink, the second heat sink is generally the laminated structure of aluminum.So the first heat sink and the second heat sink normally adopt different materials and adopt different processes to form.Refer again to preferred embodiment shown in Fig. 2 to Fig. 4, the boss being provided with on the second heat sink on through hole 43, the first heat sinks is fixed on described fixed mount through after described through hole 43, and the first heat sink contacts with the hole wall of described through hole.Make like this LED chip on the first heat sink and can pass and then expose to the external world from through hole for the reflector that LED chip is installed, and the first heat sink and the second heat sink all can be fixed on preferably on fixed mount and can better dispel the heat.
If owing to directly LED chip being fixed on the first heat sink 30,, in a fluorescent glue operation process, the amount of fluorescent glue and thickness are difficult to control, and fluorescent glue also easily overflows from the first heat sink 30, so that affect the attractive in appearance of light fixture, and also easily cause defective products.So, in preferred embodiment of the present utility model, on the boss of the first heat sink 30, be provided with the depressed part (not shown) for LED chip is installed., in the time making LED encapsulating structure, LED chip is fixed in the depressed part of the first heat sink 30, it can solve and when a fluorescent glue carries out sealing, occur bad problem.And, the shape that can regulate according to the size model of LED light fixture depressed part, for example, the rim of a cup of difform depressed part can be installed the LED chip of different model, it also can be so that the batch production of product, and then improves yield and the production efficiency of LED light fixture.Preferably simultaneously, on the second heat sink, be provided with through hole, boss on the first heat sink is fixed on described fixed mount through after described through hole 43, and the first heat sink contacts with the hole wall of described through hole, make like this LED chip on the first heat sink and can pass and then expose to the external world from through hole for the reflector that LED chip is installed, and the first heat sink and the second heat sink all can be fixed on preferably on fixed mount and can better dispel the heat.And whole LED support is simple in structure, cost is lower.
In preferred embodiment of the present utility model, on the first heat sink 30, be provided with reflecting component (not shown in the figures meaning out), it is launched towards certain direction for the light that guides LED chip and send.Because LED chip is fixed on the first heat sink 30, can be beneficial to light that guiding lamp tool sends towards the required direction transmitting of user so reflecting component is set on the first heat sink 30, and then improve the light effect that of LED light fixture.More preferably, reflecting component is to be plated on the reflector layer on the first heat sink 30 or to be fixed on the reflection shield on the first heat sink 30.Reflector layer cost is low and be convenient to guide the uniform directive predetermined direction of light, and reflection shield can use ready-made, therefore it can save production process and even the cost of manufacture of LED light fixture.Reflector layer and reflection shield are well known to the skilled person, and do not repeat them here.
Electrical connector 20 in the LED support that the utility model provides is mainly the connection function that electrifies, it can or be plated on the conductive layer on fixed mount 10 for conducting strip, the conducting strip that conducting strip has good electric conductivity and a laminated structure also can indirectly provide the heat-sinking capability of LED support, electroplate conductive layer on fixed mount 10, connect reliably, its also there is good electric conductivity and make simple and easy, cost is lower.Refer again to Fig. 4 and Fig. 5, wherein, electrical connector 20 is for being fixed on the laminated structure (being conducting strip) on described fixed mount.And, the protruding described fixed mount of end (being position outermost in electrical connector) of electrical connector, electrical connector outwards comes out from fixed mount as we can see from the figure, beats conduction gold thread to facilitate.So, directly the both positive and negative polarity of LED chip is electrically connected with the part of stretching out fixed mount in electrical connector, can realize being electrically connected of electrical connector and LED chip, therefore be convenient to like this beat gold thread with electrical connection LED chip on electrical connector, and, the electrical connector of this structure can further increase the contact area of LED support and air, and then can improve the heat-sinking capability of LED support.What deserves to be explained is, those skilled in the art know, and in the time that the second heat sink is sheet metal, the second heat sink does not contact (separately the state in separating) with electrical connector, shown in Figure 5, to prevent occurring short circuit in LED support.
The utility model also provides a kind of LED encapsulating structure, and it comprises LED support recited above and LED chip, and LED chip is fixed on the first heat sink of described LED support.There is good heat-sinking capability so there is the LED encapsulating structure of the LED support of said structure.
In sum, the utility model has used the first heat sink and the second heat sink with extension in LED support, and then it is conducive to the heat that LED chip sends and conducts rapidly; The LED support of said structure and the LED light fixture with this structure are because heat-sinking capability is good, and it can increase the package power under same size greatly, reduce cost, and strengthen reliability and the useful life of the work of LED light fixture.
In the description of this specification, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present utility model or example in conjunction with specific features, structure, material or the feature of this embodiment or example description.In this manual, the schematic statement of above-mentioned term is not necessarily referred to identical embodiment or example.And specific features, structure, material or the feature of description can be with suitable mode combination in any one or more embodiment or example.
In description of the present utility model, unless otherwise prescribed and limit, it should be noted that, term " installation ", " being connected ", " connection " should be interpreted broadly, for example, can be mechanical connection or electrical connection, also can be the connection of two element internals, can be to be directly connected, and also can indirectly be connected by intermediary, for the ordinary skill in the art, can understand as the case may be the concrete meaning of above-mentioned term.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (10)
1. a LED support, it is characterized in that, comprise: fixed mount, for dispel the heat and the first heat sink of LED chip is installed, for the second heat sink of dispelling the heat and the electrical connector for being electrically connected with the electrode of LED chip, the first heat sink and the second heat sink are all fixed on described fixed mount, the first heat sink comprise base portion and be positioned at base portion top for placing the boss of LED chip, the second heat sink is positioned on described base portion and the second heat sink comprises the extension that stretches out described fixed mount.
2. LED support as claimed in claim 1, is characterized in that, on described extension, is provided with kink, and described kink and extension have angle.
3. LED support as claimed in claim 2, is characterized in that, described kink is vertical with described extension.
4. LED support as claimed in claim 2 or claim 3, is characterized in that, described the second heat sink has two ends, and each end is provided with described extension.
5. LED support as claimed in claim 4, is characterized in that, is provided with at least two kinks on each extension.
6. LED support as claimed in claim 5, is characterized in that, each kink is different from the angle of extension.
7. LED support as claimed in claim 1, is characterized in that, on described the second heat sink, is provided with through hole, and the boss on described the first heat sink is fixed on described fixed mount through after described through hole, and boss contacts with the hole wall of described through hole.
8. the LED support as described in claim 1 or 7, is characterized in that, is provided with the depressed part for LED chip is installed on described boss.
9. the LED support as described in claim 1 or 7, is characterized in that, on described the first heat sink, is provided with the reflecting component for guiding LED chip light direction.
10. a LED encapsulating structure, is characterized in that, comprising: the LED support in claim 1 to 9 described in any one and LED chip, described LED chip is fixed on the first heat sink of LED support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320663952.2U CN203932098U (en) | 2013-10-28 | 2013-10-28 | A kind of LED support and LED encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320663952.2U CN203932098U (en) | 2013-10-28 | 2013-10-28 | A kind of LED support and LED encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203932098U true CN203932098U (en) | 2014-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320663952.2U Expired - Lifetime CN203932098U (en) | 2013-10-28 | 2013-10-28 | A kind of LED support and LED encapsulating structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN203932098U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108922881A (en) * | 2018-06-29 | 2018-11-30 | 江苏绿色照明工程有限公司 | A kind of LED light illuminating module connection structure and its installation method |
| US10690333B2 (en) | 2015-08-27 | 2020-06-23 | Mentor Technologies Co., Ltd. | Heat dissipating frame structure and fabricating method thereof |
-
2013
- 2013-10-28 CN CN201320663952.2U patent/CN203932098U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10690333B2 (en) | 2015-08-27 | 2020-06-23 | Mentor Technologies Co., Ltd. | Heat dissipating frame structure and fabricating method thereof |
| CN108922881A (en) * | 2018-06-29 | 2018-11-30 | 江苏绿色照明工程有限公司 | A kind of LED light illuminating module connection structure and its installation method |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200103 Address after: 518119 1 Yanan Road, Kwai Chung street, Dapeng New District, Shenzhen, Guangdong Patentee after: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address before: BYD 518118 Shenzhen Road, Guangdong province Pingshan New District No. 3009 Patentee before: BYD Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: BYD Semiconductor Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141105 |
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| CX01 | Expiry of patent term |