CN203887679U - Grinding head and grinding device - Google Patents
Grinding head and grinding device Download PDFInfo
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- CN203887679U CN203887679U CN201420269355.6U CN201420269355U CN203887679U CN 203887679 U CN203887679 U CN 203887679U CN 201420269355 U CN201420269355 U CN 201420269355U CN 203887679 U CN203887679 U CN 203887679U
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- spacing ring
- grinding
- grinding head
- ring
- absorbing unit
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Abstract
The utility model discloses a grinding head and a grinding device. The grinding head comprises a body, a limiting ring arranged on the body and an adsorption unit arranged in the limiting ring, the limiting ring comprises a first limiting ring body and a second limiting ring body connected with the first limiting ring body, and a heater is arranged inside the second limiting ring body. The heater is arranged inside the second limiting ring body to heat the limiting ring, and the grinding rate of the grinding head is adjusted by adjusting the temperature of the heater since the grinding rate is related to the temperature, so that the grinding rate of the grinding head is increased.
Description
Technical field
The utility model relates to technical field of semiconductors, relates in particular to a kind of grinding head and lapping device.
Background technology
Along with dimensions of semiconductor devices reduces day by day, because multilayer interconnection or the larger deposition process of depth of cracking closure have caused the excessive fluctuating of crystal column surface, cause the difficulty that photoetching process focuses on, make the control ability of live width weaken, reduced the uniformity of live width on whole wafer, therefore, industry has been introduced cmp (CMP) and has been carried out planarizing surface of wafer, in semiconductor fabrication process, enter behind sub-micron (sub-micron) field, cmp has become an indispensable Manufacturing Techniques.In chemical mechanical milling tech, chemical mechanical polishing device becomes one of equipment important in semiconductor technology.
Conventionally, the lapping device that semiconductor applications is used comprises grinding pad and is arranged at the grinding head on grinding pad.When wafer is carried out to cmp, grinding head adsorbs wafer to be ground, and the front of wafer is pressed on grinding pad, by grinding head, drives wafer to rotate relative to grinding pad, completes the planarization to wafer.
Concrete, as shown in Figure 1, the grinding head in lapping device mainly comprises: body 101, be arranged at described body 101 inside passage 12, be arranged at spacing ring 103 on described body 101, be arranged at the absorbing unit 102 in described spacing ring 103.When grinding, grinding head, by described absorbing unit 102 absorption wafers 10, is adsorbed in spacing ring 103 wafer 10; Afterwards absorption there is is the bottom surface of the grinding head of wafer 10 to be pressed on grinding pad 11, by described grinding head, drive described wafer 10 to rotate relative to described grinding pad 11.In order to optimize the grinding rate at described wafer 10 edges, on described spacing ring 103, need to exert pressure equally, therefore, spacing ring 103 on grinding head described in process of lapping is also pressed on described grinding pad 11, thereby can make 103 pairs of grinding pads 11 of spacing ring cause wearing and tearing, make the surface of grinding pad 11 become smooth, reduced grinding rate.
To sum up, need badly a kind of new grinding head and lapping device are provided, to solve the locating ring of grinding head in prior art, make the surface of grinding pad become smooth, the problem that causes grinding rate to reduce.
Utility model content
The locating ring that the purpose of this utility model is to solve grinding head in prior art becomes smooth to the surface of grinding pad, the problem that causes grinding rate to reduce.
In order to solve the problems of the technologies described above, the utility model provides a kind of grinding head, and described grinding head comprises: body, be arranged at the spacing ring on described body and be arranged at the absorbing unit in described spacing ring; Wherein,
Described spacing ring comprises: the first spacing ring and the second spacing ring being connected with described the first spacing ring; The inside of described the second spacing ring is provided with heater.
Optionally, in described grinding head, the bottom of described the first spacing ring is provided with guiding gutter.
Optionally, in described grinding head, described the first spacing ring is ceramic ring or stainless steel ring.
Optionally, in described grinding head, described the second spacing ring is stiffening ring.
Optionally, in described grinding head, described the second spacing ring is connected with described the first spacing ring with described body respectively.
Optionally, in described grinding head, the inside of described body is provided with the passage communicating with described absorbing unit.
Optionally, in described grinding head, described absorbing unit comprises an adsorbed film.
The utility model also provides a kind of lapping device, and described lapping device comprises: grinding pad and be arranged at the grinding head on described grinding pad; Wherein, described grinding head comprises: body, be arranged at the spacing ring on described body and be arranged at the absorbing unit in described spacing ring; Described spacing ring comprises: the first spacing ring and the second spacing ring being connected with described the first spacing ring; The inside of described the second spacing ring is provided with heater.
Optionally, in described lapping device, the bottom of described the first spacing ring is provided with guiding gutter.
Optionally, in described lapping device, described the first spacing ring is ceramic ring or stainless steel ring.
Optionally, in described lapping device, described the second spacing ring is stiffening ring.
Optionally, in described lapping device, described the second spacing ring is connected with described the first spacing ring with described body respectively.
Optionally, in described lapping device, the inside of described body is provided with the passage communicating with described absorbing unit.
Optionally, in described lapping device, described absorbing unit comprises an adsorbed film.
In grinding head provided by the utility model and lapping device, by heater being set in the second spacing ring inside, spacing ring is heated, because grinding rate is relevant with temperature, the grinding rate of grinding head is adjusted in utilization to the adjusting of heter temperature, thereby has improved the grinding rate of grinding head.
Accompanying drawing explanation
Fig. 1 is the structural representation of lapping device in prior art;
Fig. 2 is the structural representation of grinding head in the utility model embodiment;
Fig. 3 is the upward view of grinding head in the utility model embodiment;
Fig. 4 is the structural representation of lapping device in the utility model embodiment.
In Fig. 1:
Wafer-10; Grinding pad-11; Passage-12; Body-101; Absorbing unit-102; Spacing ring-103.
In Fig. 2-Fig. 4:
Wafer-20; Grinding pad-21; Passage-22; Body-201; Absorbing unit-202; Spacing ring-203; The first spacing ring-204; The second spacing ring-205; Guiding gutter-206; Adsorbed film-207; Heater-208.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the grinding head the utility model proposes and lapping device are described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Fig. 2 is the structural representation of grinding head in the utility model embodiment.As shown in Figure 2, described grinding head comprises: body 201, be arranged at the spacing ring 203 on described body 201 and be arranged at the absorbing unit in described spacing ring 203; Wherein, described spacing ring 203 comprises: the first spacing ring 205 and the second spacing ring 204 being connected with described the first spacing ring 205; The inside of described the second spacing ring 204 is provided with heater 208.
Concrete, by absorbing unit 202 absorption wafers 20, wafer 20 is rotated grinding with grinding head, in process of lapping, for preventing that wafer 20 from departing from grinding head, is provided with spacing ring 203 wafer 20 is fixed on wherein on grinding head.
Further, please refer to Fig. 3, it is the upward view of grinding head in the utility model embodiment.As shown in Figure 3, the bottom of described the first spacing ring 205 is provided with guiding gutter.By the bottom at the first spacing ring 205, be provided with guiding gutter 206, when being conducive to grinding head and grinding work, by the guiding gutter 206 of the first spacing ring 205 bottoms, carry lapping liquids to grinding pad 21, improved the grinding effect on wafer 20 surfaces.Meanwhile, because arranging of guiding gutter 206 reduced the wearing and tearing to grinding pad 21, be conducive to the grinding work on wafer 20 surfaces, improved grinding rate.
In the present embodiment, described the first spacing ring 205 is ceramic ring or stainless steel ring.Ceramic ring or stainless steel ring have stronger hardness, can arrange preferably the grinding pad 21 that is positioned at the first spacing ring 205 belows.
In the present embodiment, described the second spacing ring 204 is stiffening ring.Stiffening ring has good toughness; and heat conduction preferably; the heat that above-mentioned heater 208 is distributed is passed to the first spacing ring 205; contribute to the residue of lapping liquid solid particle residual in the guiding gutter 206 of the first spacing ring 205 bottoms or grinding to depart from guiding gutter 206; reduce the loss of lapping liquid, strengthened grinding effect simultaneously.
Further, described the second spacing ring 204 is connected with described the first spacing ring 205 with described body 201 respectively.
Preferably, the inside of described body 201 is provided with the passage 22 communicating with described absorbing unit 202.
Concrete, the first spacing ring 205 is mainly used in arranging grinding pad 21, at it, may wear to a certain degree, can self-changeable.The temperature of described the second spacing ring 204 is passed to the first spacing ring 205, makes the temperature of whole spacing ring increase, because grinding rate is relevant with temperature, therefore can, by regulating the heater 208 in the second spacing ring 204, regulate the grinding rate of grinding head.Heater 208 in described the second spacing ring 204 is integrated through passage 22 by circuit, is switched to the control module of board, carries out the demonstration of temperature data, the operations such as temperature controlled adjusting; Preferably setup parameter is, when the temperature setting of heater 208 is set to 40 degrees Celsius, grinding rate is now 2000 dusts; When the temperature setting of heater 208 is set to 45 degrees Celsius, grinding rate is now 2200 dusts.
Preferably, described absorbing unit 202 comprises an adsorbed film 207.Further, by described adsorbed film 207, preferably wafer 20 is adsorbed in absorbing unit 202, fixedly the position of wafer 20.
Please continue to refer to Fig. 4, it is the structural representation of lapping device in the utility model embodiment.As shown in Figure 4, described lapping device comprises: grinding pad 21 and be arranged at grinding head as above on described grinding pad.
Concrete, when lapping device grinding crystal wafer 20, grinding head, by described absorbing unit 202 absorption wafers 20, is adsorbed in spacing ring 203 wafer 20; Afterwards absorption there is is the bottom surface of the grinding head of wafer 20 to be pressed on grinding pad 21, by described grinding head, drive described wafer 20 to rotate relative to described grinding pad 21.In order to optimize the grinding rate at described wafer 20 edges, in described the second spacing ring 204, set up heater 208, because grinding rate is relevant with temperature, when the heat distributing when heater conducts to described the first spacing ring 205, improved grinding rate.In addition, because described the first spacing ring bottom is provided with guiding gutter 206, when the first spacing ring 205 is pressed on described grinding pad 21, the wearing and tearing that 203 pairs of grinding pads 21 of spacing ring cause have been reduced; Lapping liquid, by described guiding gutter 206, further improves the grinding effect of wafer 20.
To sum up, in grinding head provided by the utility model and lapping device, by heater being set in the second spacing ring inside, spacing ring is heated, because grinding rate is relevant with temperature, the grinding rate of grinding head is adjusted in utilization to the adjusting of heter temperature, thereby has improved the grinding rate of grinding head.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model utility model.Like this, if within of the present utility model these are revised and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these change and modification.
Claims (14)
1. a grinding head, is characterized in that, comprising: body, be arranged at the spacing ring on described body and be arranged at the absorbing unit in described spacing ring; Wherein,
Described spacing ring comprises: the first spacing ring and the second spacing ring being connected with described the first spacing ring; The inside of described the second spacing ring is provided with heater.
2. grinding head as claimed in claim 1, is characterized in that, the bottom of described the first spacing ring is provided with guiding gutter.
3. grinding head as claimed in claim 1, is characterized in that, described the first spacing ring is ceramic ring or stainless steel ring.
4. grinding head as claimed in claim 1, is characterized in that, described the second spacing ring is stiffening ring.
5. grinding head as claimed in claim 1, is characterized in that, described the second spacing ring is connected with described the first spacing ring with described body respectively.
6. grinding head as claimed in claim 1, is characterized in that, the inside of described body is provided with the passage communicating with described absorbing unit.
7. grinding head as claimed in claim 1, is characterized in that, described absorbing unit comprises an adsorbed film.
8. a lapping device, is characterized in that, comprising: grinding pad and be arranged at the grinding head on described grinding pad; Wherein, described grinding head comprises: body, be arranged at the spacing ring on described body and be arranged at the absorbing unit in described spacing ring; Described spacing ring comprises: the first spacing ring and the second spacing ring being connected with described the first spacing ring; The inside of described the second spacing ring is provided with heater.
9. lapping device as claimed in claim 8, is characterized in that, the bottom of described the first spacing ring is provided with guiding gutter.
10. lapping device as claimed in claim 8, is characterized in that, described the first spacing ring is ceramic ring or stainless steel ring.
11. lapping devices as claimed in claim 8, is characterized in that, described the second spacing ring is stiffening ring.
12. lapping devices as claimed in claim 8, is characterized in that, described the second spacing ring is connected with described the first spacing ring with described body respectively.
13. lapping devices as claimed in claim 8, is characterized in that, the inside of described body is provided with the passage communicating with described absorbing unit.
14. lapping devices described in claim 8-13 any one, is characterized in that, described absorbing unit comprises an adsorbed film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420269355.6U CN203887679U (en) | 2014-05-23 | 2014-05-23 | Grinding head and grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420269355.6U CN203887679U (en) | 2014-05-23 | 2014-05-23 | Grinding head and grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203887679U true CN203887679U (en) | 2014-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420269355.6U Expired - Fee Related CN203887679U (en) | 2014-05-23 | 2014-05-23 | Grinding head and grinding device |
Country Status (1)
| Country | Link |
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| CN (1) | CN203887679U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111531464A (en) * | 2020-05-08 | 2020-08-14 | 西安奕斯伟硅片技术有限公司 | Grinding head and grinding equipment |
| CN113579995A (en) * | 2021-08-09 | 2021-11-02 | 北京烁科精微电子装备有限公司 | Wafer holder and grinder |
| US11904429B2 (en) | 2020-10-13 | 2024-02-20 | Applied Materials, Inc. | Substrate polishing apparatus with contact extension or adjustable stop |
-
2014
- 2014-05-23 CN CN201420269355.6U patent/CN203887679U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111531464A (en) * | 2020-05-08 | 2020-08-14 | 西安奕斯伟硅片技术有限公司 | Grinding head and grinding equipment |
| CN111531464B (en) * | 2020-05-08 | 2022-04-08 | 西安奕斯伟材料科技有限公司 | Grinding head and grinding equipment |
| US11904429B2 (en) | 2020-10-13 | 2024-02-20 | Applied Materials, Inc. | Substrate polishing apparatus with contact extension or adjustable stop |
| CN113579995A (en) * | 2021-08-09 | 2021-11-02 | 北京烁科精微电子装备有限公司 | Wafer holder and grinder |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141022 Termination date: 20190523 |