CN203883271U - Novel aminated busbar - Google Patents
Novel aminated busbar Download PDFInfo
- Publication number
- CN203883271U CN203883271U CN201420264772.1U CN201420264772U CN203883271U CN 203883271 U CN203883271 U CN 203883271U CN 201420264772 U CN201420264772 U CN 201420264772U CN 203883271 U CN203883271 U CN 203883271U
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- Prior art keywords
- bus bar
- stack bus
- laminated busbar
- bar body
- strip
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- Expired - Lifetime
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- 238000003466 welding Methods 0.000 claims abstract description 48
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 230000011218 segmentation Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Abstract
A novel laminated busbar comprises a laminated busbar body composed of a plurality of conductive layers and a plurality of insulating layers, wherein a PCB is adhered to the surface of the laminated busbar body. The PCB is adhered to the surface of the laminated busbar body in a pressed manner; can be adhered to the upper surface of the laminated busbar body, and can be adhered to the lower surface of the laminated busbar body. During production and processing, insulating film with both adhesive surfaces is placed between the PCB and the laminated busbar body, and the PCB is integrally pressed with the laminated busbar body through a pressing machine. According to the novel laminated busbar, mounting holes, to be welded with elements, of the conductive layers in the laminated busbar body are configured to be long-strip-shaped, welding holes are formed in the long-strip shape, so that the elements can be welded with the laminated busbar, thereby realizing the direct welding of an IGBT chip or an MOS tube with the laminated busbar, realizes the medium-power driving circuit in the novel laminated busbar, and greatly reduces the cost of the medium-power driving circuit.
Description
Technical field
the utility model relates to a kind of mid power drive system, particularly a kind of stack bus bar of using for mid power drive systems such as electric automobile, wind power generation, power inverter, middle power inverters.
Background technology
the compound full-control type voltage driven type semiconductor device being comprised of BJT and MOS, has switching speed fast, and conduction voltage drop is low, driving power is little, and operating frequency is high, controls the features such as flexible, therefore, be widely used in the power control circuit of modern power electronics technology.Existing power driving circuit is mainly divided into the low-power drive circuit below 10KW, high-power drive circuit more than 100KW, and the middle power driving circuit between 10KW to 100KW, its main feature is as follows:
1, the low-power drive circuit below 10KW: control chip adopts igbt chip or metal-oxide-semiconductor, matrix is used pcb board, igbt chip or metal-oxide-semiconductor are installed on pcb board by the mode of welding, it is little that this drive circuit is controlled electric current, circuit structure is complicated, but circuit is integrated in pcb board, simple in structure, with low cost, typical case's application as small-sized inverter, frequency converter etc.;
2, high-power drive circuit more than 100KW: control device is used high-power IGBT module, matrix is used stack bus bar, high-power IGBT module is bolted to connection in stack bus bar, it is large that this drive circuit is controlled electric current, circuit structure is simple, reliability is high, but expensive, and typical case's application is as track traffic, boats and ships driving, intelligent grid etc.;
3, the middle power driving circuit between 10KW to 100KW: the main control mode of high-power drive circuit that adopts drives at present, utilize IGBT module in conjunction with stack bus bar, make middle power driving circuit cost high, expensive, typical field of application comprises electric automobile, solar power generation, middle power inverter and inverter etc.
for middle power driving circuit, from design principle, can adopt the mode of a plurality of igbt chips or metal-oxide-semiconductor parallel connection to drive, the cost of power driving circuit in reducing under the prerequisite that guarantees reliability, but existing pcb board cannot bear the electric current of middle power driving circuit, and igbt chip or metal-oxide-semiconductor cannot be welded in existing stack bus bar, this technical scheme cannot be realized.Therefore, how to provide a kind of new stack bus bar, in reducing in the time of in conjunction with low-power drive circuit and high-power drive circuit advantage, the cost of power driving circuit, becomes the major issue that power driving circuit technical field need to solve.
Utility model content
the purpose of this utility model is to provide a kind of novel stack bus bar, can carry out the welding of igbt chip or metal-oxide-semiconductor, and for middle power driving circuit provides technical foundation, the utility model provides following technical scheme:
a novel stack bus bar, it comprises the stack bus bar body that multilayer conductive layer and multilayer dielectric layer form, the surface of stack bus bar body is fitted with pcb board.Pcb board fits in the surface of stack bus bar body by the mode of pressing.Pcb board can fit in the upper surface of stack bus bar body, also can fit in the lower surface of stack bus bar body.During production and processing, between pcb board and stack bus bar body, be placed with the sticking dielectric film of two-sided tool, by press, pcb board and the pressing of stack bus bar body be integrated.
on plate and stack bus bar body, all offer a plurality of installing holes, and pcb board is corresponding one by one with a plurality of installing holes on stack bus bar body, pcb board and stack bus bar body fit into after one, and the installing hole on pcb board and stack bus bar body runs through up and down.The position of mounting hole that the conductive layer of stack bus bar body need to weld offers strip structure, and the centre of strip is provided with welding hole.The width of strip is than the large 0～3mm of the diameter of welding hole.Like this, when carrying out components and parts welding, guarantee effective gathering of welding hole place heat, reliably components and parts are welded in to the conductive layer of stack bus bar body.Components and parts are welded in pcb board according to existing components and parts welding operation.
as a kind of preferred version of the present utility model, the width of described strip is than the large 0.5～2mm of the diameter of described welding hole.
as another kind of preferred version of the present utility model, the width of described strip is than the large 0.5～1mm of the diameter of described welding hole.
the strip structure of the conductive layer of stack bus bar body can be also other regular or irregular structure, can offer the welding hole for welding component, its optimum overall structure is slender type, both be convenient to production and processing, can slow down the conduction of velocity of components and parts heat in welding process again, guarantee that components and parts can weld reliably.
the position of mounting hole that the conductive layer of stack bus bar body need to weld also can directly be provided with welding hole, and welding hole is connected in installing hole by plural rib.The outward flange of welding hole can be circle, also can be for square, or other shape.The rib that connects welding hole and installing hole can be selected suitable width size according to the actual size of welding hole.
in stack bus bar body, the structure such as the strip of conductive layer, installing hole, welding hole, rib, conventionally in the disposable punch forming of processing initial stage, to reduce manufacturing procedure, improves globality and the reliability of this structure.
the utility model advantage is:
1, in the utility model installing hole that conductive layer need to weld with components and parts in stack bus bar body, offer strip structure, on strip, offer welding hole, make components and parts can be welded in stack bus bar, thereby realized the direct welding of igbt chip or metal-oxide-semiconductor and stack bus bar;
2, the utility model, by multi-disc igbt chip or metal-oxide-semiconductor are installed, substitutes the power driving circuit of existing IGBT module and stack bus bar combination, has realized novel middle power driving circuit, has greatly reduced the cost of middle power driving circuit;
3, the utility model is compounded to form novel stack bus bar by pcb board and existing stack bus bar simultaneously, when igbt chip or metal-oxide-semiconductor are installed on novel stack bus bar, the control signal of igbt chip or metal-oxide-semiconductor and being electrically connected to of system control signal have effectively been realized; And effective combination of pcb board and stack bus bar, has simplified the circuit structure of control system, make whole middle power driving circuit system bulk small and exquisite, easy to use, simple in structure;
4, the utility model combines the advantage of low-power drive circuit and high-power drive circuit, is high reliability, and middle power driving circuit provides technical foundation cheaply, promotes progress and the development of power control circuit technology.
Accompanying drawing explanation
fig. 1 is the utility model stack bus bar body and pcb board laminating perspective view;
fig. 2 is the utility model stack bus bar body and pcb board isolating construction schematic diagram;
fig. 3 is the utility model blast structural representation;
fig. 4 is the conductive coating structure front view of the utility model stack bus bar body;
fig. 5 is the concrete Application Example structural front view of the utility model structure;
fig. 6 is the local structure for amplifying schematic diagram of A part in Fig. 5;
fig. 7 A is the local structure for amplifying schematic diagram of A segmentation scheme B in Fig. 5;
fig. 7 B is the local structure for amplifying schematic diagram of A segmentation scheme C in Fig. 5;
fig. 7 C is the local structure for amplifying schematic diagram of A segmentation scheme D in Fig. 5;
fig. 7 D is the local structure for amplifying schematic diagram of A segmentation scheme E in Fig. 5;
fig. 8 is the concrete Application Example structure of the utility model structure vertical view.
number in the figure is:
1-stack bus bar body, 11-conductive layer, 111-strip
112-installing hole, 113-welding hole, 114-rib
12-dielectric film, 2-pcb board, 21-protuberance
3-igbt chip, 4-radiator
Embodiment
below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that, protection range of the present utility model is made to more explicit defining.
as shown in accompanying drawing 1 the utility model stack bus bar body and pcb board laminating perspective view, stack bus bar body 1 fits into one with PBC plate 2, and the splicing ear of stack bus bar body 1 stretches out from the side.The protuberance 21 of pcb board 2 is provided with connector, and this protuberance 21 can also be installed electronic devices and components, can design according to the specific requirement of control system.Installing hole 112 runs through stack bus bar body 1 and pcb board 2, for the components and parts such as igbt chip, metal-oxide-semiconductor, electric capacity are installed.
as shown in accompanying drawing 2 the utility model stack bus bar bodies and pcb board isolating construction schematic diagram and accompanying drawing 3 the utility model blast structural representations, stack bus bar body 1 comprises multilayer conductive layer 11 and the multilayer dielectric layer being comprised of dielectric film 12, the utility model can be according to the structure of Fig. 2, first make stack bus bar body 1, after stack bus bar body 1 completes, again stack bus bar body 1 and pcb board 2 are carried out to pressing, it is fit together; The utility model also can after being ready to all conductive layers 11 and dielectric film 12 of stack bus bar body 1, then carry out pressing together with pcb board 2 according to the structure of Fig. 3, makes its disposable pressing and forming, further reduces operation, reduces production costs.Between stack bus bar body 1 and pcb board 2, there is dielectric film 12, or be equipped with dielectric film 12 between the conductive layer 11 of stack bus bar body 1 and pcb board 2.
by reference to the accompanying drawings in the conductive coating structure front view of 4 the utility model stack bus bar bodies, the accompanying drawing concrete Application Example structural front view of 5 the utility model structure and accompanying drawing 6 Fig. 5 shown in the local structure for amplifying schematic diagram of A part, on conductive layer 11, the position of corresponding installing hole 112 is provided with strip 111, on strip 111, offer welding hole 113, welding hole 113 is positioned at the centre of strip 111, in the present embodiment, strip 11 is regular structure, and the optimal location of welding hole 113 is the center of strip 111.In this technical scheme, the width of strip 111 is than the large 0～3mm of the diameter of welding hole 113.
the mounting hole site that the conductive layer of stack bus bar body need to weld from components and parts is equipped with multiple different technical scheme, respectively as shown in accompanying drawing 7A, Fig. 7 B, Fig. 7 C, Fig. 7 D, the centre bore of welding hole 113 is circular, outward flange can be the circle shown in accompanying drawing 7A, Fig. 7 B, Fig. 7 C, also can be for shown in Fig. 7 D square, can also be other similar shapes.Welding hole 113 is connected in installing hole 112 by two above ribs 114, and as shown in accompanying drawing 7A and accompanying drawing 7B, the rib 114 of connection is two, and as shown in accompanying drawing 7C, the rib 114 of connection is three, and as shown in accompanying drawing 7D, the rib 114 of connection is four.
be below the embodiment 1 of the concrete application of the utility model:
as shown in the accompanying drawing concrete Application Example structural front view of 5 the utility model structure and the concrete Application Example structure of accompanying drawing 8 the utility model structure vertical view, radiator 4 in figure is not connected with igbt chip 3, so that the utility model technology is described in detail, and not represent final connection status of the present utility model.A kind of novel stack bus bar, it comprises the stack bus bar body 1 being comprised of multilayer conductive layer 11 and multilayer dielectric layer, insulating barrier is comprised of dielectric film 12, the surface of stack bus bar body 1 is fitted with pcb board 2,12 igbt chips 3 are installed on the installing hole 112 on stack bus bar body 1 and pcb board 2, on igbt chip 3, are connected and installed with radiator 4.Igbt chip 3 is welded in stack bus bar body 1 by welding hole 113, and in the present embodiment, welding hole 113 diameters are 1.8mm, and the width of strip 111 is 3mm, and the width of strip 111 is than the large 1.2mm of the diameter of welding hole 113.In the present embodiment, the power supply of the utility model embodiment is three-phase 380V power supply, 4 igbt chips are installed between every two phase lines, the drive current of single igbt chip is 25A, through estimation, the utility model embodiment installs 12 driving forces after igbt chip and is approximately 380 * 25 * 4=38KW, is a basic middle power driving circuit.
the utility model product of take is simple in structure as the middle power driving circuit that basic production and processing forms, and igbt chip can freely distribute, and is more conducive to the heat radiation of system; The cost of 12 igbt chips is about 30 yuan, compares IGBT module, in cost to ten/mono-.The development that the utility model technology is novel middle power driving circuit provides technical foundation.
embodiment 2:
the difference of the present embodiment and embodiment 1 is: the diameter of welding hole 113 is 1.8mm, and the width of strip 111 is also 1.8mm, and the width of strip 111 is than the large 0mm of the diameter of welding hole 113.
embodiment 3:
the difference of the present embodiment and embodiment 1 is: the diameter of welding hole 113 is 1.8mm, and the width of strip 111 is 2.3mm, and the width of strip 111 is than the large 0.5mm of the diameter of welding hole 113.
embodiment 4:
the difference of the present embodiment and embodiment 1 is: the diameter of welding hole 113 is 1.8mm, and the width of strip 111 is 2.8mm, and the width of strip 111 is than the large 1mm of the diameter of welding hole 113.
embodiment 5:
the difference of the present embodiment and embodiment 1 is: the diameter of welding hole 113 is 1.8mm, and the width of strip 111 is 3.8mm, and the width of strip 111 is than the large 2mm of the diameter of welding hole 113.
embodiment 6:
the difference of the present embodiment and embodiment 1 is: the diameter of welding hole 113 is 1.8mm, and the width of strip 111 is 4.8mm, and the width of strip 111 is than the large 3mm of the diameter of welding hole 113.
the above; it is only embodiment of the present utility model; but protection range of the present utility model is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the utility model; the variation that can expect without creative work or replacement, within all should being encompassed in protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range that claims were limited.
Claims (7)
1. a novel stack bus bar, it comprises the stack bus bar body that multilayer conductive layer and multilayer dielectric layer form, and it is characterized in that: the surface of described stack bus bar body is fitted with pcb board.
2. a kind of novel stack bus bar according to claim 1, is characterized in that: described pcb board fits in the surface of described stack bus bar body by the mode of pressing.
3. according to a kind of novel stack bus bar described in claim 1 or 2, it is characterized in that: on described pcb board and described stack bus bar body, all offer a plurality of installing holes, the position of mounting hole that the conductive layer of described stack bus bar body need to weld offers strip structure, and the centre of described strip is provided with welding hole.
4. a kind of novel stack bus bar according to claim 3, is characterized in that: the width of described strip is than the large 0～3mm of the diameter of described welding hole.
5. a kind of novel stack bus bar according to claim 3, is characterized in that: the width of described strip is than the large 0.5～2mm of the diameter of described welding hole.
6. a kind of novel stack bus bar according to claim 3, is characterized in that: the width of described strip is than the large 0.5～1mm of the diameter of described welding hole.
7. according to a kind of novel stack bus bar described in claim 1 or 2, it is characterized in that: on described pcb board and described stack bus bar body, all offer a plurality of installing holes, the position of mounting hole that the conductive layer of described stack bus bar body need to weld is provided with welding hole, and described welding hole is connected in installing hole by plural rib.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420264772.1U CN203883271U (en) | 2014-05-22 | 2014-05-22 | Novel aminated busbar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420264772.1U CN203883271U (en) | 2014-05-22 | 2014-05-22 | Novel aminated busbar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203883271U true CN203883271U (en) | 2014-10-15 |
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ID=51683739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420264772.1U Expired - Lifetime CN203883271U (en) | 2014-05-22 | 2014-05-22 | Novel aminated busbar |
Country Status (1)
| Country | Link |
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| CN (1) | CN203883271U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022414A (en) * | 2014-05-22 | 2014-09-03 | 苏州西典机电有限公司 | Novel laminated busbar |
| CN107069617A (en) * | 2016-12-09 | 2017-08-18 | 九江赛晶科技股份有限公司 | A kind of composite bus bar of small current application |
| CN108206443A (en) * | 2016-12-20 | 2018-06-26 | 泰连德国有限公司 | Current transmission mechanism, particularly electrical or electromechanical current bar |
| CN111628370A (en) * | 2019-02-28 | 2020-09-04 | 株式会社村田制作所 | Bus bar member and method for manufacturing bus bar member |
-
2014
- 2014-05-22 CN CN201420264772.1U patent/CN203883271U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104022414A (en) * | 2014-05-22 | 2014-09-03 | 苏州西典机电有限公司 | Novel laminated busbar |
| CN104022414B (en) * | 2014-05-22 | 2016-08-31 | 苏州西典机电有限公司 | A kind of stack bus bar |
| CN107069617A (en) * | 2016-12-09 | 2017-08-18 | 九江赛晶科技股份有限公司 | A kind of composite bus bar of small current application |
| CN108206443A (en) * | 2016-12-20 | 2018-06-26 | 泰连德国有限公司 | Current transmission mechanism, particularly electrical or electromechanical current bar |
| CN111628370A (en) * | 2019-02-28 | 2020-09-04 | 株式会社村田制作所 | Bus bar member and method for manufacturing bus bar member |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 521, Zhujiang Road, high tech Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Xidian New Energy Electric Co.,Ltd. Address before: No. 521, Zhujiang Road, high tech Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU WEST DEANE MACHINERY Inc. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141015 |