CN203836664U - LED lamp - Google Patents
LED lamp Download PDFInfo
- Publication number
- CN203836664U CN203836664U CN201420170509.6U CN201420170509U CN203836664U CN 203836664 U CN203836664 U CN 203836664U CN 201420170509 U CN201420170509 U CN 201420170509U CN 203836664 U CN203836664 U CN 203836664U
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- Prior art keywords
- led
- led lamp
- luminescence chip
- chip group
- substrate
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- 239000000758 substrate Substances 0.000 claims abstract description 77
- 238000004020 luminiscence type Methods 0.000 claims description 76
- 239000000463 material Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000005275 alloying Methods 0.000 claims description 2
- 239000005357 flat glass Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 239000008280 blood Substances 0.000 description 4
- 210000004369 blood Anatomy 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 206010027146 Melanoderma Diseases 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000001149 thermolysis Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The utility model provides an LED lamp. The LED lamp comprises an LED lamp shade, a substrate and an LED luminous chip. One side of the substrate is tightly attached to the inner surface of the LED lamp shade, the other side of the substrate is tightly attached to the LED luminous chip, and the LED luminous chip is tightly attached to the inner surface of the LED lamp shade 1. As the LED luminous chip is tightly attached to the LED lamp shade, the LED luminous chip can make full contact with the lamp shade, the LED luminous chip can be closer to the outside, heat generated by the LED luminous chip can be dissipated outside more easily, heat dissipation efficiency is greatly improved, the service life of the LED lamp is prolonged, and the use efficiency of the LED lamp is improved. The heat dissipation mode is simpler and more convenient, operation and implementation are easy, and good market value is achieved.
Description
Technical field
The utility model relates to LED lighting field, and especially a kind of LED lamp particularly, relates to the LED lamp with excellent heat dispersion performance.
Background technology
Along with the widespread adoption of LED, the advantage as emerging illumination new light sources, is embodied day by day significantly, but simultaneously, the unidirection luminous property of price, LED and LED need large-area heat abstractor.
The part that the puzzlement of following several items also becomes LED illumination development day by day hinders.
A, price: LED illumination is comprised of LED light source, power drives, LED heat abstractor and four major parts of bulb structure, and along with constantly dropping of LED light source price, it is severe that the Cost Problems of other three parts becomes.
B, large-scale heat abstractor
Because LED can produce a large amount of heats when luminous; in design, be that protection properties of product are stable; must assist heat radiation with large-area metal, this part metal has increased the directionality that light fixture cost has limited the unidirectional bright dipping of LED, goes back the globality of the light fixture bright dipping of partial occlusion.
For example, number of patent application is that 201310242060.X, utility model name are called " the U-shaped pipe heat dissipation, energy conservation of LED chip lamp ", and number of patent application is 201310190476.1, patent name has all proposed technical solution separately for " a kind of line style LED light source ".The utility model is wished the technical scheme that provides on this basis different.
Utility model content
For LED lamp heat radiation in prior art, exist technical problem to need improved present situation, the purpose of this utility model is to provide a kind of LED lamp, it is characterized in that, at least comprises LED lampshade 1, substrate 2 and LED luminescence chip group 3;
Wherein, a side of described substrate 2 is attached at the inner surface of described LED lampshade 1, and described LED luminescence chip group 3 is attached at the opposite side of described substrate 2.
Preferably, the part that described luminescence chip group 3 is placed in described LED lampshade 1 tail end is connected with electric power driving module.
Preferably, the upper surface of the one or more LED luminescence chips at least described LED luminescence chip group 3 scribbles fluorescent material.
Preferably, described substrate 2 is provided with at least one via hole 21 as loophole for attaching region or the peripheral region of described LED luminescence chip group 3.
Further, described at least one via hole 21, described loophole is evenly distributed.
Further, the surface area of described substrate 2 is greater than the surface area of described LED luminescence chip group 3.
Preferably, described substrate 2 is any composition in following material: sheet metal; Alloying metal sheet; Or sheet glass.
Preferably, described substrate 2 is transparence or translucent.
Further, the quantity of described substrate 2 is one or more, and accordingly, the quantity of described LED luminescence chip group 3 is no less than the quantity of described substrate 2.
The utility model is by being close to LED lampshade by LED euthermic chip, LED euthermic chip can fully be contacted with lampshade, and then make the LED euthermic chip can be closer to the external world, making LED euthermic chip to be more easily dispersed into the external world goes, improve widely radiating efficiency, improved service life and the service efficiency of LED lamp.And this radiating mode is easier, easy operating and realization, have good market value.
Accompanying drawing explanation
By reading the detailed description of non-limiting example being done with reference to the following drawings, it is more obvious that other features, objects and advantages of the present utility model will become:
Fig. 1 illustrates according to a specific embodiment of the present utility model, the structural representation of LED lamp;
Fig. 2 illustrates according to the first embodiment of the present utility model, the layout architecture schematic diagram of LED lamp; And
Fig. 3 illustrates according to the first embodiment of the present utility model, the structural representation of LED lamp substrate and lampshade, LED luminescence chip group 3 annexations.
The specific embodiment
Those skilled in the art understand, the utility model mainly provides a kind of LED lamp with excellent heat dispersion performance, and realizing heat sinking function is mainly to rely on the LED euthermic chip of LED lamp to press close to LED lampshade, make that LED euthermic chip can short distance be liftoff more approaches with external environment condition, make the euthermic chip of LED can more directly contact external environment, realize more simply and easily the heat radiation of LED euthermic chip.Further, the shape that it will be appreciated by those skilled in the art that the lampshade of described LED lamp can be circular, can be rectangle, can be also other any shapes, and this does not affect flesh and blood of the present utility model, do not repeat them here,
Particularly, Fig. 1 illustrates according to a specific embodiment of the present utility model, the structural representation of LED lamp.Wherein, in Fig. 1, the legend of lower left is enlarged drawing, and it amplifies demonstration by this position separately in order more to clearly illustrate the present embodiment.Further, it will be appreciated by those skilled in the art that the utility model provides a kind of LED lamp, it at least comprises LED lampshade 1, substrate 2 and LED luminescence chip group 3.Preferably, it will be appreciated by those skilled in the art that described LED lampshade 1 has formed inner space 8, and in prior art scheme, described LED luminescence chip is placed in described inner space 8.Further, those skilled in the art understand, described LED luminescence chip group 3 is tightly attached at the inwall of described LED lampshade 1 by substrate 2, by described luminescence chip group 3 is tightly attached with the inwall of described LED lampshade and can be made the heat that described luminescence chip group 3 produces be dispersed in the residing external environment condition of LED lamp by the shortest approach by substrate 2, preferably, the heat of described LED luminescence chip group 3 conducts to LED lampshade 1 by substrate 2, thereby heat is absorbed by described LED lampshade 1 equably, the heat that described LED luminescence chip group 3 produces only need to just can directly be dispersed into the external world by very thin one deck LED lampshade, and the heat that can not make described LED euthermic chip 3 produce is present in described LED lamp in large quantities, can not cause the heat radiation difficulty of LED lamp, the heat that described LED luminescence chip group 3 is produced can be gone out by Quick diffusing, the temperature that has guaranteed LED lamp remains in rational scope, and then assurance LED lamp is normal, safety and efficient operation.
Particularly, it will be appreciated by those skilled in the art that a side of described substrate 2 is close to the inner surface of described LED lampshade 1, the opposite side of described substrate 2 is close to described LED luminescence chip group 3.Further, those skilled in the art understand, the inwall that described LED luminescence chip is directly attached, is fixed on to described LED lampshade 1 has great difficulty in the realization of technology, therefore need by place described substrate 2 in the middle of described LED lampshade 1 and described luminescence chip 3, described substrate 2 can be fixed with described lampshade 1 well, described substrate 2 can be fixed with described luminescence chip 3, therefore, by described substrate 2, can realize well the inwall that described luminescence chip 3 is fixed on described LED lampshade 1.Further, those skilled in the art understand, fixed form between fixed form between described LED lampshade 1 and described substrate 2 and described substrate 2 and described LED luminescence chip group 3 is not unique, can realize the relatively fixing of three, this does not affect flesh and blood of the present utility model, does not repeat them here.
Preferably, it will be appreciated by those skilled in the art that described substrate 2 is preferably translucent or transparence.Preferably, those skilled in the art understand, described substrate 2 is designed to translucent or transparence and can guarantees to greatest extent that the wide part that described LED luminescence chip group 3 is launched can both exhale, if described substrate 2 is nontransparent shape or light transmission extreme difference, can cause the illuminating effect extreme difference of LED lamp, can be that the light that LED lamp projects produces many shades and blackspot, greatly affect illuminating effect and the function of LED lamp.Further, those skilled in the art understand, realize described substrate 2 transparence or translucent can be by using transparent material make described substrate 2, also can be by punching at described substrate 2, so also can increase the penetration capacity of light, can make the illuminating effect of LED lamp better.Any processing that can realize transparent or translucentization of described substrate 2, all can meet the requirement of the utility model to described substrate 2, and this does not affect flesh and blood of the present utility model, does not repeat them here.
Preferably, it will be appreciated by those skilled in the art that in this specific embodiment, the surface of described substrate 2 is obviously little than described LED luminescence chip group 3.The effect that described substrate 2 plays is mainly for connecting described LED lampshade 1 and described LED luminescence chip group 3, so the size of described substrate 2 is not had to strict restriction, can realizing above-mentioned linkage function.But consider that if described substrate is too large, and will affect the illumination effect that described LED luminescence chip group 3 sees through described LED lampshade 1, the illuminating effect of described LED lamp is made a big impact.Therefore, described substrate 2 should be realizing under the prerequisite that connects described LED lampshade 1 and described LED luminescence chip group 3 functions, as much as possible little.Can not affect largely like this lighting function of described LED luminescence chip group 3, guarantee the illuminating effect of described LED lamp, its object is consistent with described substrate 2 is designed to the transparent or translucent effect that will reach, and does not repeat them here.
Further, those skilled in the art understand, in another specific embodiment, example is specific embodiment as shown in Figure 3, the surface area of described substrate 2 is preferably more than the area of described LED luminescence chip group 3, thereby described LED luminescence chip group 3 is adhered on described substrate 2 by integral body, and further described substrate 2 is fixedly attached to the inner surface of described LED lampshade 1.Further, it will be appreciated by those skilled in the art that the attaching that the utility model is set forth does not represent that described basic 2 are attached to the inner surface of described LED lampshade 1, and only represent that both are fixed relatively.
Further, it will be appreciated by those skilled in the art that the thickness of described substrate 2 should be less.When the thickness of described substrate 2 remains in a less thickness range, can realize better light transmission, the light that is unlikely to described LED luminescence chip group 3 is launched causes very large decay after described substrate 2, has guaranteed the illuminating effect of light transmission and described LED lamp.Further, if it will be appreciated by those skilled in the art that, described substrate 2 is too thick, can serious mistake stop the light that described LED luminescence chip group 3 is launched, and causes the significantly decay of described light, also can affect the heat dispersion of described LED lamp.
Preferably, it will be appreciated by those skilled in the art that the position of described substrate 2 is not fixed, its position can be determined according to the position of described LED luminescence chip group 3 is corresponding.Meanwhile, the quantity of described substrate 2 is not unique yet, and it can be also a plurality of can being one.Further, those skilled in the art understand determining of quantity and the determining of position of described substrate 2, mainly in order better described LED lampshade 1 to be fitted with described LED luminescence chip group 3, can be in concrete realization, quantity and the position of dynamically adjusting described substrate 2, do not repeat them here.
In sum, described LED lamp is mainly comprised of described LED lampshade 1, described substrate 2 and described LED luminescence chip group 3.By described substrate 2, realize being connected of described LED lampshade 1 and described LED luminescence chip group 3, make described LED luminescence chip group 3 directly fit in described LED lampshade 1, greatly shortened the heat conducting distance of described LED luminescence chip group 3, the heat that described LED luminescence chip group 3 is produced directly just can promptly be passed in external environment condition and go by the LED lampshade of thin layer, greatly improved the radiating efficiency of described LED lamp, formed the good thermal conductivity of LED lamp, and then the service life and the service efficiency that extend LED lamp, solved simply and easily the heat dissipation problem of LED lamp.
Further, it will be appreciated by those skilled in the art that in this specific embodiment, the upper surface of the LED luminescence chip in described LED luminescence chip group 3 scribbles fluorescent material.Particularly, described LED luminescence chip group 3 comprises one or more LED luminescence chips, and preferably, when it comprises a plurality of LED luminescence chip, each LED luminescence chip all can obtain the electric power providing from electric power driving module, does not repeat them here.Further, preferably, the upper surface of wherein one or more LED luminescence chips scribbles fluorescent material, thereby the light that the LED luminescence chip of coated fluorescent material is sent is more even, and color is more easily received by consumer.
Further, those skilled in the art understand, Fig. 1 only shows the schematic diagram of LED luminescence chip group 3 described in a described substrate 2 and a group, this does not show that the utility model only only limits to one group of LED luminescence chip group 3, for example the schematic diagram that shows LED luminescence chip group 3 described in the described substrate 2 of many groups and a group embodiment illustrated in fig. 2, does not repeat them here.And the annexation schematic diagram of described luminescence chip group 3 and described electric power driving module is not shown in the specific embodiment shown in Fig. 1, but those skilled in the art are appreciated that in conjunction with prior art, described luminescence chip group 3 preferably drives by described electric power driving module and is luminous, does not repeat them here.Further, those skilled in the art also understand, and wherein length, thickness, the shape of basic 2 length, thickness and described LED luminescence chip group 3 are only a kind of signals, do not represent that the technical program only limits to this kind of shape.
Fig. 2 illustrates according to the first embodiment of the present utility model, the layout architecture schematic diagram of LED lamp.The layout architecture that it will be appreciated by those skilled in the art that described LED lamp is only not figure described in figure, and described LED luminescence chip group 3 can be various shapes with the combination of described substrate 2.Figure shown in described Fig. 2 is the moulding of petal type bulb lamp, wherein said LED luminescence chip group 3 is petal type structure, shape extends from the afterbody of described LED lampshade 1, and spread out with strip along the inner surface of described LED lampshade 1, then at the top of described LED lampshade 1, again gather, its shape is as petal.And described LED luminescence chip group 3 is connected on the inner surface of described LED lampshade 1 by described substrate 2, utilize LED lampshade 1 to carry out direct cross-ventilation heat radiation, LED lamp bar directly contacts with LED lampshade 1, the heat that LED produces conducts endlessly to LED lampshade 1, LED lampshade 1 is through horizontal and vertical conduction air, externally, under the convection action of cold air, constantly carrying out heat exchange, LED lampshade 1 has played good thermolysis.By this kind of design, the heat that LED luminescence chip group 3 is produced is more easily dispersed in air.It will be appreciated by those skilled in the art that the pattern diagram for other LED lamp, its general configuration, as Fig. 2 institute formula, is only that the structure of LED luminescence chip group 3 is different, therefore do not repeat them here.
With reference to embodiment illustrated in fig. 2, those skilled in the art understand, preferably, the part that described luminescence chip group 3 is placed in described LED lampshade 1 tail end is connected with electric power driving module, described electric power driving module is connected with power supply by the screw socket of described LED lampshade 1 afterbody, and the in the situation that of Power supply, described luminescence chip group 3 is powered, driven, thereby described in gained, luminescence chip group 3 is luminous, and then make LED lamp provided by the utility model luminous.
Fig. 3 illustrates according to the first embodiment of the present utility model, the structural representation of LED lamp substrate.Fig. 3 shown in it will be appreciated by those skilled in the art that is not unique LED lamp substrate structural representation, and the object of this figure only shows the general configuration of substrate 2 described in LED lamp.As shown in Figure 3, described substrate 2 is attached on the inner surface of described LED lampshade 1, and described LED luminescence chip group 3 (this is not shown) is attached on described substrate 2 accordingly.Wherein, in this Fig. 3, a part for the substrate 2 illustrating, inwhole, be only the part of the LED lampshade 1 of arcuation.
Further, in the present embodiment, described substrate 2 at least comprises via hole 21, particularly, the via hole 21 distributing with laser ablation ad hoc rules on described substrate 2, via hole 21 diameters, between 0.1～0.5, the light of LED luminescence chip group 3 can be passed through.It is not changeless it will be appreciated by those skilled in the art that the quantity of described via hole 21 and distributing.For example preferably, described via hole 21 be uniformly distributed be one rectangular, in a further advantageous embodiment, described via hole 21 is uniformly distributed and is a round shape, and in another preferred embodiment, the part of described via hole 21 is uniformly distributed, another part non-uniform Distribution, and this does not affect concrete technical scheme of the present utility model.It will be appreciated by those skilled in the art that described via hole 21, at least as loophole purposes, does not repeat them here.
More specifically, described substrate 2 adopts aluminium base by punch forming, substrate 2 presents linear pattern mode cabling, which can facilitate bending, make LED luminescence chip group 3 be more prone to brake forming on substrate 2, the width of LED luminescence chip group 3 can be selected between 0.5～5mm, substrate 2 thickness are selected between 0.3～2.0, one group of LED luminescence chip group 3 power is preferably between 1～3W, LED luminescence chip group 3 combination is divided into the various combinations such as 3,4,6,8, to be combined into the LED bulb lamp of different capacity, do not repeat them here.
Above specific embodiment of the utility model is described.It will be appreciated that, the utility model is not limited to above-mentioned specific implementations, and those skilled in the art can make various distortion or modification within the scope of the claims, and this does not affect flesh and blood of the present utility model.
Claims (9)
1. a LED lamp, is characterized in that, at least comprises LED lampshade (1), substrate (2) and LED luminescence chip group (3);
Wherein, a side of described substrate (2) is attached at the inner surface of described LED lampshade (1), and described LED luminescence chip group (3) is attached at the opposite side of described substrate (2).
2. LED lamp according to claim 1, is characterized in that, the part that described luminescence chip group (3) is placed in described LED lampshade (1) tail end is connected with electric power driving module.
3. LED lamp according to claim 1 and 2, is characterized in that, the upper surface of the LED luminescence chip at least described LED luminescence chip group (3) scribbles fluorescent material.
4. LED lamp according to claim 1 and 2, is characterized in that, described substrate (2) is provided with at least one via hole (21) as loophole for attaching region or the peripheral region of described LED luminescence chip group (3).
5. LED lamp according to claim 4, is characterized in that, described at least one via hole (21) is evenly distributed.
6. according to the LED lamp described in claim 1 or 2 or 5, it is characterized in that, the surface area of described substrate (2) is greater than the surface area of described LED luminescence chip group (3).
7. LED lamp according to claim 6, is characterized in that, described substrate (2) is any composition in following material:
-sheet metal;
-alloying metal sheet; Or
-sheet glass.
8. LED lamp according to claim 7, is characterized in that, preferably, described substrate (2) is transparence or translucent.
9. according to the LED lamp described in claim 7 or 8, it is characterized in that, the quantity of described substrate (2) is one or more, and accordingly, the quantity of described LED luminescence chip group (3) is no less than the quantity of described substrate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420170509.6U CN203836664U (en) | 2014-04-09 | 2014-04-09 | LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420170509.6U CN203836664U (en) | 2014-04-09 | 2014-04-09 | LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203836664U true CN203836664U (en) | 2014-09-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420170509.6U Expired - Lifetime CN203836664U (en) | 2014-04-09 | 2014-04-09 | LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203836664U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103883910A (en) * | 2014-04-09 | 2014-06-25 | 上海鼎晖科技股份有限公司 | LED lamp |
| CN104465638A (en) * | 2014-12-05 | 2015-03-25 | 苏州紫昱天成光电有限公司 | LED lamp and filament thereof |
-
2014
- 2014-04-09 CN CN201420170509.6U patent/CN203836664U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103883910A (en) * | 2014-04-09 | 2014-06-25 | 上海鼎晖科技股份有限公司 | LED lamp |
| CN103883910B (en) * | 2014-04-09 | 2015-12-02 | 上海鼎晖科技股份有限公司 | A kind of LED |
| CN104465638A (en) * | 2014-12-05 | 2015-03-25 | 苏州紫昱天成光电有限公司 | LED lamp and filament thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140917 |
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| CX01 | Expiry of patent term |