CN203817178U - Cut-off forming die assembly for manufacturing semiconductor lead frame - Google Patents
Cut-off forming die assembly for manufacturing semiconductor lead frame Download PDFInfo
- Publication number
- CN203817178U CN203817178U CN201420209024.3U CN201420209024U CN203817178U CN 203817178 U CN203817178 U CN 203817178U CN 201420209024 U CN201420209024 U CN 201420209024U CN 203817178 U CN203817178 U CN 203817178U
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- cut
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- pushing block
- mould
- forming convax
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Abstract
The utility model relates to a cut-off forming die assembly for manufacturing a semiconductor lead frame, which comprises an upper die, a lower die, a cut-off male die and a forming male die. The lower die is provided with left and right pushing blocks. The upper die is provided with upper and lower sliding blocks. The cut-off male die is configured to tightly abut against the lower sliding block under the effect of a resetting mechanism. The upper die is moved downwards to drive the right pushing block to push the upper sliding block. In this way, recesses and projections, arranged on the upper and lower sliding blocks respectively, are engaged with each other. The lower sliding block and the cut-off male die are moved upwards and then the upper die is moved upwards. The left pushing block pushes the upper sliding block to move rightwards and the lower sliding block is moved downwards. The cut-off male die is moved downwards and therefore the forming female die is protruded. According to the technical scheme of the utility model, based on the movement position of the cut-off male die, the cut-off male die is prevented from pulling the semiconductor lead frame. Therefore, the semiconductor lead frame is prevented from deforming and being out of tolerance in dimension.
Description
Technical field
The utility model relates to a kind of semiconductor lead frame and manufactures mould used, relates in particular to the mould that cuts into that semiconductor lead frame uses.
Background technology
Half guide wire framework refers to for connecting the contact point of semiconductor integrated block inside chip and the thin-sheet metal framework of outer lead, and its raw materials for production are mainly copper volumes.Conventional semiconductor lead frame mainly contains two kinds of manufacture crafts, a kind of etching method, and a kind of is mould punching method.Etching method is to etch away a part for material and make product by chemical substance, is applicable to small-scale production more; Mould punching method, is that the light sheet material of the stamping press punching press indexing transfer by mould is made, and is applicable to large-scale production more.Mould punching method generally has following processing step: punching press, surface treatment, cut-out moulding and inspection sheet packing, and punching press is exactly that copper sheet strikes out lead frame under the punching press of mould; Surface treatment is the lead frame of moulding to be carried out to the techniques such as silver-plated copper facing; Cutting off moulding is that the lead frame linking together is cut into single lead frame, and these lead frames are smoothed; Inspection sheet packing is tested to the complete lead frame of each moulding exactly, removes defect ware, and qualified product is packed and deposited.
The cut-out of semiconductor lead frame and mould belong to high-accuracy mould, and while completing the cut-out of these two semiconductor lead frames and moulding with single die, due to reasons such as artificial and equipment, the size fluctuation after cut-out is larger, and efficiency is lower.
Granted publication number is CN202076238U, Granted publication day is that the Chinese utility model patent on December 14th, 2011 discloses a kind of semiconductor lead frame continuous cutting molding structure, it is characterized in that: comprise front cut-out die, lower bolster, cut-out die block, material lift piece, concave template, stripper, cope match-plate pattern, pilot pin, cut-out punch, forming convax mould, guide pad, molding concave die and rear cut-out die; Shut-off mechanism after described rear cut-out die and cut-out punch form; Described forming convax mould, molding concave die and concave template form molded lead frame mechanism; The location material lifting device that described pilot pin, guide pad and material lift piece form; Shut-off mechanism before described front cut-out die and forming convax mould form.This semiconductor lead frame continuous cutting molding structure is combined into a procedure by cut-out and moulding two procedures, has saved die cost, has alleviated personnel labor intensity, has improved production efficiency.But, two procedures is combined into a procedure, by a mould, complete this twice technique and just have a problem, also action together of moulding when cutting off, will there is a process of pullling to semiconductor frame like this, finally cause the distortion of framework off-position and dimension overproof, the quality of the semiconductor lead frame of producing is subject to certain impact.
Utility model content
In order to overcome the above-mentioned defect that cuts into mould, the utility model provides a kind of mould that cuts into for semiconductor lead frame, this cuts into pattern prodigiosin and completes cut-out and two operations of moulding, saved die cost, improved production efficiency, produced semiconductor lead frame quality is good simultaneously, and size is accurate, without distortion.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is:
A kind of mould that cuts into for semiconductor lead frame, comprise patrix, counterdie, cut off punch and forming convax mould, patrix comprises fixedly backing plate and fixed head, fixedly backing plate is positioned at fixed head top, counterdie comprises discharging backing plate and stripper, discharging backing plate is positioned at stripper top, it is characterized in that: also comprise top shoe, sliding block, left pushing block, right pushing block and resetting-mechanism, described forming convax mould afterbody is arranged on fixed head, the head of forming convax mould is through discharging backing plate and stripper, on forming convax mould, be provided with cannelure, cutting off punch is arranged in cannelure, and can in cannelure, move up and down, cut off the head installation that nose of punch protrudes from forming convax mould, sliding block is arranged in cannelure, top shoe is arranged on fixedly in backing plate, described top shoe and sliding block contact, and in contact position, be provided with groove and the projection of mutual coupling, described left pushing block and right pushing block are fixed on stripper by discharging backing plate, left pushing block and right pushing block are all through fixed head and fixing backing plate, and can be at fixed head and fixedly in backing plate, move up and down, left pushing block and right pushing block contact with top shoe, and can promote top shoe side-to-side movement in fixing backing plate, resetting-mechanism is arranged in cannelure, and can allow cut-out punch afterbody be close on sliding block.
Described resetting-mechanism is back-moving spring or reseting shrapnel, and one end of resetting-mechanism is against in the cannelure of forming convax mould, and the other end is against and cuts off on punch.
Also comprise forming convax mould briquetting, forming convax mould briquetting is fixed by screws on fixed head, and forming convax mould briquetting is spacing on fixed head by forming convax mould.
Also comprise and cut off punch briquetting, cut off punch briquetting and be fixed on forming convax mould by lock-screw, cut-out punch briquetting is spacing in the cannelure of forming convax mould by cutting off punch.
Described cut-out punch is provided with the screw hole passing for lock-screw and the mounting groove of installing for cut-out punch briquetting, and the diameter of screw hole is greater than the diameter of lock screw, and the notch area of mounting groove is greater than the area that cuts off punch briquetting.
Described right pushing block is " T " font pushing block, comprise head, neck, body portion and afterbody, described head width is less than neck width, neck width is less than body portion width, and body portion width is less than tail width, and afterbody and body portion are perpendicular, neck and body portion joint are provided with an inclined-plane, the angle of inclined-plane and body portion center line is between 30 ° to 55 °, and described left pushing block comprises " T " font pushing block body, should on " T " font pushing block body, be provided with trapezoidal notch.
Cutting into the action relationships of mould when work is:
When semiconductor lead frame enters this mould, fixedly backing plate and fixed head move downward, forming convax mould and cut-out punch move downward thereupon, owing to cutting off punch, protrude from forming convax mould, cutting off punch contacts with semiconductor lead frame, when fixedly backing plate and fixed head move downward, fixedly backing plate and fixed head also move downward with respect to left pushing block and right pushing block, now right pushing block will promote top shoe in fixing backing plate to left movement, when cutting off punch, complete after cut-out action, under the effect of back-moving spring, the projection of upper sliding block and groove just in time embed mutually, the sliding block certain displacement that moves upward now, cut off the punch same displacement that also moves upward, cut off punch and no longer protrude from forming convax mould, during forming convax mould work, cutting off punch does not contact with semiconductor lead frame.After moulding, fixed head and fixedly backing plate move upward, left pushing block promotes top shoe to the right, top shoe is separated with groove with the projection of sliding block, top shoe promotes sliding block downwards, and sliding block promotes certain displacement downwards cut-out punch and makes to cut off punch and protrude from forming convax mould and complete homing action.So circulate down to complete to complete on a mould and cut off and two operations of moulding.
The utlity model has following advantage:
1, the utility model comprises patrix, counterdie, cut off punch and forming convax mould, patrix comprises fixedly backing plate and fixed head, fixedly backing plate is positioned at fixed head top, counterdie comprises discharging backing plate and stripper, discharging backing plate is positioned at stripper top, it is characterized in that: also comprise top shoe, sliding block, left pushing block, right pushing block and resetting-mechanism, described forming convax mould afterbody is arranged on fixed head, the head of forming convax mould is through discharging backing plate and stripper, on forming convax mould, be provided with cannelure, cutting off punch is arranged in cannelure, and can in cannelure, move up and down, cut off the head installation that nose of punch protrudes from forming convax mould, sliding block is arranged in cannelure, top shoe is arranged on fixedly in backing plate, described top shoe and sliding block contact, and in contact position, be provided with groove and the projection of mutual coupling, described left pushing block and right pushing block are fixed on stripper by discharging backing plate, left pushing block and right pushing block are all through fixed head and fixing backing plate, and can be at fixed head and fixedly in backing plate, move up and down, left pushing block and right pushing block contact with top shoe, and can promote top shoe side-to-side movement in fixing backing plate, resetting-mechanism is arranged in cannelure, and can allow cut-out punch afterbody be close on sliding block.When semiconductor lead frame enters this mould, fixedly backing plate and fixed head move downward, forming convax mould and cut-out punch move downward thereupon, owing to cutting off punch, protrude from forming convax mould, cutting off punch contacts with semiconductor lead frame, when fixedly backing plate and fixed head move downward, fixedly backing plate and fixed head also move downward with respect to left pushing block and right pushing block, now right pushing block will promote top shoe in fixing backing plate to left movement, when cutting off punch, complete after cut-out action, under the effect of back-moving spring, the projection of upper sliding block and groove just in time embed mutually, the sliding block certain displacement that moves upward now, cut off the punch same displacement that also moves upward, cut off punch and no longer protrude from forming convax mould, during forming convax mould work, cutting off punch does not contact with semiconductor lead frame.After moulding, fixed head and fixedly backing plate move upward, left pushing block promotes top shoe to the right, top shoe is separated with groove with the projection of sliding block, top shoe promotes sliding block downwards, and sliding block promotes certain displacement downwards cut-out punch and makes to cut off punch and protrude from forming convax mould and complete homing action.So circulate down to complete to complete on a mould and cut off and two operations of moulding.The size of mould has been dwindled in the merging of two operations greatly, after two operations merge, has reduced operation, has reduced the management cost in operation, can also improve the precision of processing and the assembling of mould simultaneously.A mould completes two operations, mutually can not interfere, and cuts off punch and also can not pull semiconductor lead frame, can not produce and pull stress, and semiconductor lead frame can not cause distortion due to the merging of two operations, affects the quality of semiconductor lead frame.
2, the utility model resetting-mechanism is back-moving spring or reseting shrapnel, and one end of resetting-mechanism is against in the cannelure of forming convax mould, and the other end is against and cuts off on punch.By the effect of back-moving spring or reseting shrapnel, make to cut off punch being attached on sliding block tightly all the time, while moving on sliding block, effect due to back-moving spring or reseting shrapnel, cut off punch and also can move up, make to cut off punch concordant with forming convax mould, when forming convax mould is worked like this, cut off punch and can not pull semiconductor lead frame, can not produce distortion and overproof.Use back-moving spring or reseting shrapnel to make return unit, be convenient to install.
3, forming convax mould briquetting of the present utility model is fixed by screws on fixed head, and forming convax mould briquetting is spacing on fixed head by forming convax mould.By forming convax mould briquetting, forming convax mould is spacing on fixed head, avoid forming convax mould to drop from fixed head, be beneficial to the stability of forming convax mould work.
4, cut-out punch briquetting of the present utility model, is fixed on forming convax mould by lock-screw, and cut-out punch briquetting is spacing in the cannelure of forming convax mould by cutting off punch.By cutting off punch briquetting, by cutting off, punch is spacing prevents that in the cannelure of forming convax mould cut off punch drops in the cannelure of forming convax mould, is beneficial to the stability of cutting off punch work.
5, the utility model cuts off punch and is provided with the screw hole passing for lock-screw and the mounting groove of installing for cut-out punch briquetting, and the diameter of screw hole is greater than the diameter of lock screw, and the notch area of mounting groove is greater than the area that cuts off punch briquetting.By such, arrange can be effectively spacingly in cannelure by cutting off punch, can also allow and cut off punch longitudinal sliding motion in cannelure simultaneously.
6, the right pushing block of the utility model is " T " font pushing block, comprise head, neck, body portion and afterbody, described head width is less than neck width, neck width is less than body portion width, and body portion width is less than tail width, and afterbody and body portion are perpendicular, neck and body portion joint are provided with an inclined-plane, the angle of inclined-plane and body portion center line is between 30 ° to 55 °, and described left pushing block comprises " T " font pushing block body, should on " T " font pushing block body, be provided with trapezoidal notch.This structure of left and right pushing block guarantee to promote top shoe follow fixed head and fixedly backing plate when moving up and down, move left and right, that realize to cut off punch can complete the action of protruding forming convax mould and concordant forming convax mould.
Accompanying drawing explanation
Fig. 1 is the newly section of structure when cutting off semiconductor lead frame of this practicality;
Fig. 2 is the new section of structure when moulding semiconductor lead frame of this practicality;
Fig. 3 is for cutting off the assembling schematic diagram of punch and forming convax mould;
Fig. 4 is the enlarged drawing at A place in Fig. 3;
Fig. 5 is the top view of Fig. 3;
Fig. 6 is the side view of Fig. 3;
Fig. 7 is left pushing block structural representation;
Fig. 8 is right pushing block structural representation.
Mark 10, afterbody in figure, 11, body portion, 12, neck, 13, head, 14, fixing backing plate, 15, fixed head, 16, discharging backing plate, 17, stripper, 18, right pushing block, 19, left pushing block, 20, top shoe, 21, sliding block, 22, screw, 23, forming convax mould briquetting, 24, cannelure, 25, cut off punch, 26, forming convax mould, 27, back-moving spring, 28, cut off punch briquetting, 29, lock-screw, 30, " T " font pushing block body, 31, trapezoidal notch.
The specific embodiment
The utility model provides the mould that cuts into for the manufacture of semiconductor lead frame, this cuts into mould cut-out and two operations of moulding is united two into one, on a mould, realize this two operations, also can not cause semiconductor lead frame distortion, there will not be the size of the semiconductor lead frame error that is above standard is overproof defect simultaneously.
This cuts into mould and comprises patrix, counterdie, cut off punch 25 and protruding 26 moulds of moulding, patrix comprises fixedly backing plate 14 and fixed head 15, fixedly backing plate 14 is positioned at fixed head 15 tops, counterdie comprises discharging backing plate 16 and stripper 17, discharging backing plate 16 is positioned at stripper 17 tops, it is characterized in that: also comprise top shoe 20, sliding block 21, left pushing block 19, right pushing block 18 and resetting-mechanism, described forming convax mould 26 afterbodys are arranged on fixed head 15, the head of forming convax mould 26 is through discharging backing plate 16 and stripper 17, on forming convax mould 26, be provided with cannelure 24, cutting off punch 25 is arranged in cannelure 24, and can in cannelure 24, move up and down, cut off the head installation that punch 25 heads protrude from forming convax mould 26, sliding block 21 is arranged in cannelure 24, top shoe 20 is arranged on fixedly in backing plate 14, described top shoe 20 and sliding block 21 contact, and in contact position, be provided with groove and the projection of mutual coupling, described left pushing block 19 and right pushing block 18 are fixed on stripper 17 by discharging backing plate 16, left pushing block 19 and right pushing block 18 are all through fixed head 15 and fixing backing plate 14, and can be at fixed head 15 and fixedly in backing plate 14, move up and down, left pushing block 19 and right pushing block 18 contact with top shoe 20, and can promote top shoe 20 in the fixedly interior side-to-side movement of backing plate 14, resetting-mechanism is arranged in cannelure 24, and can allow cut-out punch 25 afterbodys be close on sliding block 21.
When semiconductor lead frame enters this mould, fixedly backing plate and fixed head move downward, forming convax mould and cut-out punch move downward thereupon, owing to cutting off punch, protrude from forming convax mould, cutting off punch contacts with semiconductor lead frame, when fixedly backing plate and fixed head move downward, fixedly backing plate and fixed head also move downward with respect to left pushing block and right pushing block, now right pushing block will promote top shoe in fixing backing plate to left movement, when cutting off punch, complete after cut-out action, under the effect of back-moving spring, the projection of upper sliding block and groove just in time embed mutually, the sliding block certain displacement that moves upward now, cut off the punch same displacement that also moves upward, cut off punch and no longer protrude from forming convax mould, during forming convax mould work, cutting off punch does not contact with semiconductor lead frame.After moulding, fixed head and fixedly backing plate move upward, left pushing block promotes top shoe to the right, top shoe is separated with groove with the projection of sliding block, top shoe promotes sliding block downwards, and sliding block promotes certain displacement downwards cut-out punch and makes to cut off punch and protrude from forming convax mould and complete homing action.So circulate down to complete to complete on a mould and cut off and two operations of moulding.The size of mould has been dwindled in the merging of two operations greatly, after two operations merge, has reduced operation, has reduced the management cost in operation, can also improve the precision of processing and the assembling of mould simultaneously.A mould completes two operations, mutually can not interfere, and cuts off punch and also can not pull semiconductor lead frame, can not produce and pull stress, and semiconductor lead frame can not cause distortion due to the merging of two operations, affects the quality of semiconductor lead frame.
As for resetting-mechanism, can select back-moving spring 27 or reseting shrapnel, the gap of its installation site between the cannelure 24 cutting off on punch 25 and forming convax mould 26, one end of back-moving spring 27 or reseting shrapnel is against and cuts off on punch 25, the other end is against in the cannelure 24 of forming convax mould 26, the effect of back-moving spring 27 or reseting shrapnel is to cutting off 25 1 elastic force that make progress at any time of punch, the afterbody that guarantee to cut off punch 25 being attached on sliding block 21 tightly, while moving on sliding block 21 like this, cut off punch 25 also can with on move.
In order to limit forming convax mould 26 in the position of fixed head 16, we are fixed on fixed head 15 by screw 22 with forming convax mould briquetting 23.
For cut-out punch 25 is spacing in the cannelure 24 of forming convax mould 26, we,, with cutting off punch briquetting 28, are fixed on forming convax mould 26 by lock-screw 29, and cut-out punch 25 can be moved up and down, and but can in cannelure 24, not come off.
Cut off punch 25 and be provided with the screw hole B passing for lock-screw 29 and the mounting groove C installing for cut-out punch briquetting 28, the diameter of screw hole B is greater than the diameter of lock screw 29, and the notch area of mounting groove C is greater than the area that cuts off punch briquetting 28.By such, arrange can be effectively spacingly in cannelure by cutting off punch, can also allow and cut off punch longitudinal sliding motion in cannelure simultaneously.
The concrete structure of the right pushing block 18 of the utility model is: be shaped as " T " font pushing block, comprise head 13, neck 12, body portion 11 and afterbody 10, described head 13 width are less than neck 12 width, neck 12 width are less than body portion 11 width, body portion 11 width are less than afterbody 10 width, afterbody 10 is perpendicular with body portion 11, and neck 12 is provided with an inclined-plane with body portion 11 joints, and the angle of inclined-plane and body portion center line is between 30 ° to 55 °.
The left pushing block 19 of the utility model comprises " T " font pushing block body 30, should on " T " font pushing block body 30, be provided with 31 mouthfuls of dovetail grooves.
This structure of left and right pushing block guarantee to promote top shoe follow fixed head and fixedly backing plate when moving up and down, move left and right, realize to cut off punch and complete the action of protruding forming convax mould and concordant forming convax mould.
Claims (6)
1. the mould that cuts into for semiconductor lead frame, comprise patrix, counterdie, cut off punch and forming convax mould, patrix comprises fixedly backing plate and fixed head, fixedly backing plate is positioned at fixed head top, counterdie comprises discharging backing plate and stripper, discharging backing plate is positioned at stripper top, it is characterized in that: also comprise top shoe, sliding block, left pushing block, right pushing block and resetting-mechanism, described forming convax mould afterbody is arranged on fixed head, the head of forming convax mould is through discharging backing plate and stripper, on forming convax mould, be provided with cannelure, cutting off punch is arranged in cannelure, and can in cannelure, move up and down, cut off the head installation that nose of punch protrudes from forming convax mould, sliding block is arranged in cannelure, top shoe is arranged on fixedly in backing plate, described top shoe and sliding block contact, and in contact position, be provided with groove and the projection of mutual coupling, described left pushing block and right pushing block are fixed on stripper by discharging backing plate, left pushing block and right pushing block are all through fixed head and fixing backing plate, and can be at fixed head and fixedly in backing plate, move up and down, left pushing block and right pushing block contact with top shoe, and can promote top shoe side-to-side movement in fixing backing plate, resetting-mechanism is arranged in cannelure, and can allow cut-out punch afterbody be close on sliding block.
2. a kind of mould that cuts into for semiconductor lead frame according to claim 1, it is characterized in that: described resetting-mechanism is back-moving spring or reseting shrapnel, one end of resetting-mechanism is against in the cannelure of forming convax mould, and the other end is against and cuts off on punch.
3. a kind of mould that cuts into for semiconductor lead frame according to claim 1, it is characterized in that: also comprise forming convax mould briquetting, forming convax mould briquetting is fixed by screws on fixed head, and forming convax mould briquetting is spacing on fixed head by forming convax mould.
4. a kind of mould that cuts into for semiconductor lead frame according to claim 1, it is characterized in that: also comprise and cut off punch briquetting, cut off punch briquetting and be fixed on forming convax mould by lock-screw, cut-out punch briquetting is spacing in the cannelure of forming convax mould by cutting off punch.
5. a kind of mould that cuts into for semiconductor lead frame according to claim 4, it is characterized in that: described cut-out punch is provided with the screw hole passing for lock-screw and the mounting groove of installing for cut-out punch briquetting, the diameter of screw hole is greater than the diameter of lock screw, and the notch area of mounting groove is greater than the area that cuts off punch briquetting.
6. a kind of mould that cuts into for semiconductor lead frame according to claim 1, it is characterized in that: described right pushing block is " T " font pushing block, comprise head, neck, body portion and afterbody, described head width is less than neck width, neck width is less than body portion width, body portion width is less than tail width, afterbody and body portion are perpendicular, neck and body portion joint are provided with an inclined-plane, the angle of inclined-plane and body portion center line is between 30 ° to 55 °, described left pushing block comprises " T " font pushing block body, should on " T " font pushing block body, be provided with trapezoidal notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420209024.3U CN203817178U (en) | 2014-04-28 | 2014-04-28 | Cut-off forming die assembly for manufacturing semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420209024.3U CN203817178U (en) | 2014-04-28 | 2014-04-28 | Cut-off forming die assembly for manufacturing semiconductor lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203817178U true CN203817178U (en) | 2014-09-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420209024.3U Expired - Fee Related CN203817178U (en) | 2014-04-28 | 2014-04-28 | Cut-off forming die assembly for manufacturing semiconductor lead frame |
Country Status (1)
| Country | Link |
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| CN (1) | CN203817178U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106955936A (en) * | 2017-03-29 | 2017-07-18 | 郑荣波 | High-speed stamping die blanking shaping synchrolock, which is fixedly mounted with, to be put |
| CN111993001A (en) * | 2020-08-24 | 2020-11-27 | 石家庄恒融世通电子科技有限公司 | Lead frame die and forming male die machining method |
| CN114769414A (en) * | 2022-06-21 | 2022-07-22 | 四川旭茂微科技有限公司 | Semiconductor forming and separating die |
-
2014
- 2014-04-28 CN CN201420209024.3U patent/CN203817178U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106955936A (en) * | 2017-03-29 | 2017-07-18 | 郑荣波 | High-speed stamping die blanking shaping synchrolock, which is fixedly mounted with, to be put |
| CN106955936B (en) * | 2017-03-29 | 2019-01-29 | 郑荣波 | High-speed stamping die blanking molding synchrolock, which is fixedly mounted with, to be set |
| CN111993001A (en) * | 2020-08-24 | 2020-11-27 | 石家庄恒融世通电子科技有限公司 | Lead frame die and forming male die machining method |
| CN114769414A (en) * | 2022-06-21 | 2022-07-22 | 四川旭茂微科技有限公司 | Semiconductor forming and separating die |
| CN114769414B (en) * | 2022-06-21 | 2022-09-20 | 四川旭茂微科技有限公司 | Semiconductor forming and separating die |
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Legal Events
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140910 Termination date: 20190428 |
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| CF01 | Termination of patent right due to non-payment of annual fee |