CN203801153U - Chip mounter suction nozzle - Google Patents
Chip mounter suction nozzle Download PDFInfo
- Publication number
- CN203801153U CN203801153U CN201320863726.9U CN201320863726U CN203801153U CN 203801153 U CN203801153 U CN 203801153U CN 201320863726 U CN201320863726 U CN 201320863726U CN 203801153 U CN203801153 U CN 203801153U
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- China
- Prior art keywords
- suction nozzle
- adsorption
- chip mounter
- vacuum tube
- head
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- Expired - Fee Related
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- Supply And Installment Of Electrical Components (AREA)
Abstract
The utility model belongs to the surface mounting technology in the electronic element assembling, and specifically relates to a chip mounter suction nozzle suitable for abnormal element assembling; the chip mounter suction nozzle comprises a vacuum tube, a suction nozzle fixing piece arranged on a top of the vacuum tube, a visual background sheet arranged on the vacuum tube, and a suction head arranged in the bottom of the vacuum tube; an end face of the suction head is rectangular. The chip mounter suction nozzle is suitable for vacuum suction of abnormal elements, so the mounting step of the abnormal elements can be automatically operated, thereby saving labor cost, improving work efficiency, and ensuring product quality; only the suction nozzle needs to be replaced on an existing device so as to realize the relative function, so the chip mounter suction nozzle can be fast promoted for usage.
Description
Technical field
The utility model belongs to surface installation technique in electronic devices and components assembling, is specifically related to be suitable for a kind of chip mounter suction nozzle of special-shaped components and parts assembling.
Background technology
Chip mounter is the capital equipment in surface-assembled (SMT) production line, and it takes out element from feed appliance, and the adjustment through to position of components and direction, is then placed with on substrate (PCB).And picking and placeing of element is that vacuum slot by chip mounter completes.
It is circular that the lower surface of current vacuum slot mostly is, traditional circuit-board, because resistance used, electric capacity and angle chip size are larger, therefore there is enough large plane and be suitable for suction nozzle absorption, and along with industry development, occur increasing heterotype element, at position of centre of gravity, there is not the larger plane being enough to for suction nozzle absorption in this class component, if adjust suction nozzle size, single suction nozzle is not enough to element to hold, and has also increased the difficulty of processing of suction nozzle.Therefore current heterotype element mounts mainly by manually completing, and has so not only increased human cost, has also reduced placement accuracy.
Utility model content
Technical problem to be solved in the utility model is that heterotype element mounts and need manually complete, and in order to overcome above deficiency, provides a kind of chip mounter suction nozzle.
In order to solve the problems of the technologies described above, the technical solution of the utility model is: described chip mounter suction nozzle, comprise vacuum tube, be arranged on vacuum tube top suction nozzle fixed block, be arranged on the visual background sheet on vacuum tube and be arranged on the adsorption head of vacuum tube bottom, the lower surface of described adsorption head is rectangle.
Preferably, described adsorption head comprises body, is arranged on the strip adsorption plane of body bottom and is arranged on a plurality of adsorption holes on adsorption plane, and described body communicates with vacuum tube with the cavity between adsorption plane.
Preferably, in the middle of described strip adsorption plane, uniform odd number adsorption hole side by side, respectively arranges an adsorption hole in the end position at two ends, described absorption face length limit.Guarantee absorption affinity and the gas leakage of anti-not-go-end position.
Preferably, the aperture of described adsorption hole equals the width of adsorption plane.
Preferably, the adsorption hole arranging in the middle of described adsorption plane is under vacuum tube.The adsorption hole arranging in the middle of that is to say and the gas circuit between vacuum tube are without bending.
Preferably, described adsorption head also comprises and is arranged in body and is positioned at the vacuum layer under adsorption plane.Described vacuum layer can make adsorption plane directly not contact with components and parts, during absorption, can not cause damage to components and parts surface.
Preferably, described suction nozzle fixed block is chamfering rectangle, and described suction nozzle fixed block is fastened on the placement head of chip mounter suction nozzle is fixed.
Preferably, the long limit of described suction nozzle fixed block and the long limit of adsorption head are mutually vertical.
The technical scheme that the utility model provides is applicable to the vacuum suction of heterotype element, realized the automation mechanized operation that heterotype element is placed with, saved human cost, improved operating efficiency, guaranteed the quality of product, on the basis of existing equipment, only need to change suction nozzle and can realize corresponding function, can promote the use of rapidly.
Accompanying drawing explanation
Fig. 1 is the structural representation of chip mounter suction nozzle one embodiment described in the utility model;
Fig. 2 is that the A-A of Fig. 1 is to cutaway view;
Fig. 3 is that the B-B of Fig. 1 is to cutaway view;
Fig. 4 is the vertical view of Fig. 3.
Shown in figure:
1-vacuum tube, 2-suction nozzle fixed block, 3-visual background sheet, 4-adsorption head, 41-body, 42-adsorption plane, 43-adsorption hole, 44-vacuum layer, 5-heterotype element.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail:
As shown in Fig. 1～4, chip mounter suction nozzle described in the utility model, comprise vacuum tube 1, be arranged on vacuum tube 1 top suction nozzle fixed block 2, be arranged on the visual background sheet 3 on vacuum tube 1 and be arranged on the adsorption head 4 of vacuum tube 1 bottom, the lower surface of described adsorption head 4 is rectangle, and the width d1 of described adsorption head 4 is 0.96-1mm.
As shown in Figure 2, described adsorption head 4 comprises body 41, is arranged on the strip adsorption plane 42 of body 41 bottoms, is arranged on 5 adsorption holes 43 on adsorption plane 42 and is arranged in body 41 and is positioned at the vacuum layer 44 under adsorption plane 42, and described body 41 communicates with vacuum tube 1 with the cavity 44 between adsorption plane 42.Uniform 3 adsorption holes 43 side by side in the middle of described adsorption plane 42, and they be all positioned at vacuum tube 1 under, in the end position at described adsorption plane 42 two ends, long limit, an adsorption hole 43 is respectively set.
As shown in Figure 1, the aperture of described adsorption hole 43 equals the width d2 of adsorption plane 42.
As shown in Figure 3, described suction nozzle fixed block 2 is chamfering rectangle, and described suction nozzle fixed block 2 is fastened on the placement head of chip mounter suction nozzle is fixed.As shown in Figure 4, the long limit L1 of described suction nozzle fixed block 2 and the long limit L2 of adsorption head 4 are mutually vertical.
As shown in Figure 3, for the heterotype element 5 that cannot adsorb by circular suction nozzle, chip mounter suction nozzle described in the utility model can realize vacuum suction by fillet type adsorption head 4 and automation picks and places.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model utility model.Like this, if within of the present utility model these are revised and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these change and modification.
Claims (6)
1. a chip mounter suction nozzle, comprise vacuum tube, be arranged on vacuum tube top suction nozzle fixed block, be arranged on the visual background sheet on vacuum tube and be arranged on the adsorption head of vacuum tube bottom, it is characterized in that, the lower surface of described adsorption head is rectangle, described adsorption head comprises body, is arranged on the strip adsorption plane of body bottom and is arranged on a plurality of adsorption holes on adsorption plane, described body communicates with vacuum tube with the cavity between adsorption plane, and described adsorption head also comprises and is arranged in body and is positioned at the vacuum layer under adsorption plane.
2. a kind of chip mounter suction nozzle according to claim 1, is characterized in that, in the middle of described strip adsorption plane, uniform odd number adsorption hole side by side, respectively arranges an adsorption hole in the end position at two ends, described absorption face length limit.
3. a kind of chip mounter suction nozzle according to claim 1, is characterized in that, the aperture of described adsorption hole equals the width of adsorption plane.
4. a kind of chip mounter suction nozzle according to claim 1, is characterized in that, the adsorption hole arranging in the middle of described adsorption plane is under vacuum tube.
5. a kind of chip mounter suction nozzle according to claim 1, is characterized in that, described suction nozzle fixed block is chamfering rectangle, and described suction nozzle fixed block is fastened on the placement head of chip mounter suction nozzle is fixed.
6. a kind of chip mounter suction nozzle according to claim 5, is characterized in that, the long limit of described suction nozzle fixed block is mutually vertical with the long limit of adsorption head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320863726.9U CN203801153U (en) | 2013-12-25 | 2013-12-25 | Chip mounter suction nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320863726.9U CN203801153U (en) | 2013-12-25 | 2013-12-25 | Chip mounter suction nozzle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203801153U true CN203801153U (en) | 2014-08-27 |
Family
ID=51383335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320863726.9U Expired - Fee Related CN203801153U (en) | 2013-12-25 | 2013-12-25 | Chip mounter suction nozzle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203801153U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485307A (en) * | 2014-09-30 | 2015-04-01 | 无锡市羊尖盛裕机械配件厂 | Material slice suction device |
| CN105491812A (en) * | 2014-09-18 | 2016-04-13 | 甘宁 | Automatic suction nozzle replacing frame of chip mounter |
| CN105491811A (en) * | 2014-09-18 | 2016-04-13 | 甘宁 | Automatic suction nozzle changing structure of chip mounter |
| CN109375396A (en) * | 2018-11-30 | 2019-02-22 | 苏州威创达智能设备有限公司 | A kind of liquid crystal display panel conducting luminescence detection apparatus |
-
2013
- 2013-12-25 CN CN201320863726.9U patent/CN203801153U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105491812A (en) * | 2014-09-18 | 2016-04-13 | 甘宁 | Automatic suction nozzle replacing frame of chip mounter |
| CN105491811A (en) * | 2014-09-18 | 2016-04-13 | 甘宁 | Automatic suction nozzle changing structure of chip mounter |
| CN104485307A (en) * | 2014-09-30 | 2015-04-01 | 无锡市羊尖盛裕机械配件厂 | Material slice suction device |
| CN109375396A (en) * | 2018-11-30 | 2019-02-22 | 苏州威创达智能设备有限公司 | A kind of liquid crystal display panel conducting luminescence detection apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140827 Termination date: 20171225 |