CN203775530U - 一种拼板 - Google Patents
一种拼板 Download PDFInfo
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- CN203775530U CN203775530U CN201420119064.9U CN201420119064U CN203775530U CN 203775530 U CN203775530 U CN 203775530U CN 201420119064 U CN201420119064 U CN 201420119064U CN 203775530 U CN203775530 U CN 203775530U
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- 239000000463 material Substances 0.000 claims abstract description 25
- 238000003754 machining Methods 0.000 claims abstract description 10
- 238000003801 milling Methods 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000004377 microelectronic Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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Abstract
Description
材料长 | 材料短 | 裁切数 | 发料长 | 发料宽 | 拼板长 | 拼板宽 | 拼板数 | 单元板出板数 | |
1带辅助边 | 48英寸 | 40英寸 | 4 | 24英寸 | 20英寸 | 8.732英寸 | 3.747英寸 | 12 | 48 |
2去辅助边 | 48英寸 | 40英寸 | 4 | 24英寸 | 20英寸 | 8.732英寸 | 3.221英寸 | 14 | 56 |
Claims (5)
Priority Applications (1)
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CN201420119064.9U CN203775530U (zh) | 2014-03-14 | 2014-03-14 | 一种拼板 |
Applications Claiming Priority (1)
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CN201420119064.9U CN203775530U (zh) | 2014-03-14 | 2014-03-14 | 一种拼板 |
Publications (1)
Publication Number | Publication Date |
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CN203775530U true CN203775530U (zh) | 2014-08-13 |
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CN201420119064.9U Expired - Lifetime CN203775530U (zh) | 2014-03-14 | 2014-03-14 | 一种拼板 |
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CN (1) | CN203775530U (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105629152A (zh) * | 2015-12-22 | 2016-06-01 | 深圳崇达多层线路板有限公司 | 提高无定位孔pcb单元板测试速度的方法及其装置 |
CN105934089A (zh) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | 电路板拼板及其制造方法 |
CN105934086A (zh) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | 一种电路板拼板 |
CN108811300A (zh) * | 2018-05-11 | 2018-11-13 | 胜华电子(惠阳)有限公司 | 一种可提高基板利用率的线路板排版工艺 |
CN109561592A (zh) * | 2018-12-24 | 2019-04-02 | 江苏弘信华印电路科技有限公司 | 一种零间隙拼板制作工艺 |
-
2014
- 2014-03-14 CN CN201420119064.9U patent/CN203775530U/zh not_active Expired - Lifetime
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105629152A (zh) * | 2015-12-22 | 2016-06-01 | 深圳崇达多层线路板有限公司 | 提高无定位孔pcb单元板测试速度的方法及其装置 |
CN105629152B (zh) * | 2015-12-22 | 2018-10-02 | 深圳崇达多层线路板有限公司 | 提高无定位孔pcb单元板测试速度的方法及其装置 |
CN105934089A (zh) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | 电路板拼板及其制造方法 |
CN105934086A (zh) * | 2016-05-31 | 2016-09-07 | 广东欧珀移动通信有限公司 | 一种电路板拼板 |
CN105934086B (zh) * | 2016-05-31 | 2018-09-04 | 广东欧珀移动通信有限公司 | 一种电路板拼板 |
CN105934089B (zh) * | 2016-05-31 | 2019-01-04 | 广东欧珀移动通信有限公司 | 电路板拼板及其制造方法 |
CN109195324A (zh) * | 2016-05-31 | 2019-01-11 | 广东欧珀移动通信有限公司 | 电路板拼板及其制造方法 |
CN108811300A (zh) * | 2018-05-11 | 2018-11-13 | 胜华电子(惠阳)有限公司 | 一种可提高基板利用率的线路板排版工艺 |
CN109561592A (zh) * | 2018-12-24 | 2019-04-02 | 江苏弘信华印电路科技有限公司 | 一种零间隙拼板制作工艺 |
CN109561592B (zh) * | 2018-12-24 | 2021-04-27 | 江苏弘信华印电路科技有限公司 | 一种零间隙拼板制作工艺 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
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Effective date of registration: 20171109 Address after: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop Patentee after: Huawei terminal (Dongguan) Co.,Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: HUAWEI DEVICE Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: Huawei terminal (Dongguan) Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210507 Address after: Unit 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong 518040 Patentee after: Honor Device Co.,Ltd. Address before: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: HUAWEI DEVICE Co.,Ltd. |
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TR01 | Transfer of patent right | ||
CX01 | Expiry of patent term |
Granted publication date: 20140813 |
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CX01 | Expiry of patent term |