CN203775528U - Heat dissipation type aluminum-silver copper-clad plate - Google Patents
Heat dissipation type aluminum-silver copper-clad plate Download PDFInfo
- Publication number
- CN203775528U CN203775528U CN201420095353.XU CN201420095353U CN203775528U CN 203775528 U CN203775528 U CN 203775528U CN 201420095353 U CN201420095353 U CN 201420095353U CN 203775528 U CN203775528 U CN 203775528U
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- Prior art keywords
- copper
- silver
- aluminum
- clad plate
- tin
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Abstract
The utility model discloses a heat dissipation type aluminum-silver copper-clad plate. The heat dissipation type aluminum-silver copper-clad plate comprises a copper plate, an aluminum substrate, a silver coating and a tin flanging, wherein the bottom of the copper plate is provided with a polyimide insulating layer which is fixed on the aluminum substrate through an adhesive layer, the bottom of the aluminum substrate is plated with the silver coating, the outer sides of the silver coating and the copper plate are provided with the tin flanging, the aluminum substrate in the middle of the copper plate is provided with a aluminum base tin soldering block, the center part of the copper plate is provided with copper base tin soldering blocks, a thermal conductive soldering foot is disposed on the upper surface of the aluminum base tin soldering block, electric conductive soldering feet are disposed on the upper surfaces of the copper based soldering blocks, and an element is connected onto the copper plate through the aluminum base soldering bock and the copper base soldering blocks. With adoption of the heat dissipation type aluminum-silver copper-clad plate, heat generated can be rapidly conducted and emitted out, thereby raising the heat conduction speed, enhancing the reliability of end products, and prolonging the service life of the end products; and the heat dissipation type aluminum-silver copper-clad plate is simple in manufacturing method, less in processes, and economical and practical.
Description
Technical field
The utility model relates to copper coin alloy technology field, is specially the copper-clad plate of a kind of heat radiating type aluminium silver.
Background technology
traditional metal-based copper-clad plate is comprised of Copper Foil, insulating barrier and metal substrate, wherein insulating barrier consists of polymer, generally all thicker, the metal-based copper-clad plate that particularly voltage withstand class is had relatively high expectations, insulating barrier is just thicker, insulating layer thickness just causes thermal resistance to increase, hinder thermal conduction rate, heat conduction is slow, the continuous cumulative rises of temperature, dissipation of heat is not gone out, and the product that postorder is produced so is just under a kind of condition of high temperature for a long time, has also been subject to certain impact in the reliability of its end product and useful life.
Therefore, need in the art to have a kind of novel metal-based copper-clad plate to solve above-mentioned technical problem and other technical problem, and the many technique effects that are better than prior art are provided.
Summary of the invention
The technical problem that the utility model solves is to provide the copper-clad plate of a kind of heat radiating type aluminium silver, to solve the problem in above-mentioned background technology.
The technical problem that the utility model solves realizes by the following technical solutions: the copper-clad plate of a kind of heat radiating type aluminium silver, comprise: copper coin, aluminium base, silver coating, tin is pulled limit, shown in copper coin bottom be provided with polyimide insulative layer, polyimide insulative layer is fixed on aluminium base by adhesive layer, aluminium base bottom is coated with silver coating, silver coating, copper coin outside is provided with tin and pulls limit, the aluminium base at copper coin middle part is provided with aluminium base soldering tin block, copper coin middle part is provided with copper base soldering tin block, aluminium base soldering tin block upper surface is provided with heat conduction leg, copper base soldering tin block upper surface is provided with conductive weld leg, components and parts are by aluminium base soldering tin block, copper base soldering tin block is connected on copper coin.
It is U-shaped structure that described tin is pulled limit, and tin is pulled inner side, limit and is provided with copper coin, polyimide insulative layer, adhesive layer, aluminium base, silver coating.
Described heat conduction leg, conductive weld leg middle part are provided with draw-in groove.
Comparing with public technology, there is following advantage in the utility model: the utility model can make the heat producing conduct as early as possible and to distribute, and has improved thermal conduction rate, thereby has improved reliability and the life-span of end product simultaneously; In addition, manufacture method of the present utility model is simple, and operation is few, economical and practical.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
In order to make technological means of the present utility model, creation characteristic, workflow, using method reach object and effect is easy to understand, below in conjunction with the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Figure 1, the copper-clad plate of a kind of heat radiating type aluminium silver, comprise: copper coin 1, aluminium base 4, silver coating 12, tin is pulled limit 11, shown in copper coin 1 bottom be provided with polyimide insulative layer 2, polyimide insulative layer 2 is fixed on aluminium base 4 by adhesive layer 3, aluminium base 4 bottoms are coated with silver coating 12, silver coating 12, copper coin 1 outside is provided with tin and pulls limit 11, the aluminium base 4 at copper coin 1 middle part is provided with aluminium base soldering tin block 5, copper coin 1 middle part is provided with copper base soldering tin block 8, aluminium base soldering tin block 5 upper surfaces are provided with heat conduction leg 9, copper base soldering tin block 8 upper surfaces are provided with conductive weld leg 10, components and parts 7 are by aluminium base soldering tin block 5, copper base soldering tin block 8 is connected on copper coin 1.
Described tin is pulled limit 11 for U-shaped structure, and tin is pulled 11 inner sides, limit and is provided with copper coin 1, polyimide insulative layer 2, adhesive layer 3, aluminium base 4, silver coating 12.
Described heat conduction leg 9, conductive weld leg 10 middle parts are provided with draw-in groove.
In the utility model, the heat conduction leg 9 of components and parts 7 just utilizes the scolding tin being filled in aluminium base soldering tin block 5 to be welded direct on aluminium base 4 by the aluminium base soldering tin block 5 of circuit board, thereby the thermal impedance that there is no polyimide insulative layer 2, because scolding tin and aluminium base 4 have good conduction and the performance of distribute heat, thereby realized, the heat of generation can be conducted and be distributed as early as possible, improve the conduction velocity of heat.And insulating barrier adopts polyimides, makes its class of insulation high, and it is high that proof voltage punctures grade, improved reliability and the life-span of end product, and this half hollow type is simple, economical and practical containing the metal-based copper-clad plate manufacture method of polyimide insulative layer.
More than show and described basic principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and specification, describes just illustrates principle of the present utility model; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.Claimed scope of the present utility model is defined by appending claims and equivalent thereof.
Claims (3)
1. heat radiating type aluminium silver copper-clad plate, comprise: copper coin, aluminium base, silver coating, tin is pulled limit, it is characterized in that: shown in copper coin bottom be provided with polyimide insulative layer, polyimide insulative layer is fixed on aluminium base by adhesive layer, aluminium base bottom is coated with silver coating, silver coating, copper coin outside is provided with tin and pulls limit, the aluminium base at copper coin middle part is provided with aluminium base soldering tin block, copper coin middle part is provided with copper base soldering tin block, aluminium base soldering tin block upper surface is provided with heat conduction leg, copper base soldering tin block upper surface is provided with conductive weld leg, components and parts are by aluminium base soldering tin block, copper base soldering tin block is connected on copper coin.
2. a kind of heat radiating type aluminium silver according to claim 1 copper-clad plate, is characterized in that: it is U-shaped structure that described tin is pulled limit, tin is pulled inner side, limit and is provided with copper coin, polyimide insulative layer, adhesive layer, aluminium base, silver coating.
3. a kind of heat radiating type aluminium silver according to claim 1 copper-clad plate, is characterized in that: described heat conduction leg, conductive weld leg middle part are provided with draw-in groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420095353.XU CN203775528U (en) | 2014-03-04 | 2014-03-04 | Heat dissipation type aluminum-silver copper-clad plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420095353.XU CN203775528U (en) | 2014-03-04 | 2014-03-04 | Heat dissipation type aluminum-silver copper-clad plate |
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CN203775528U true CN203775528U (en) | 2014-08-13 |
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Family Applications (1)
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CN201420095353.XU Expired - Fee Related CN203775528U (en) | 2014-03-04 | 2014-03-04 | Heat dissipation type aluminum-silver copper-clad plate |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104501120A (en) * | 2014-11-25 | 2015-04-08 | 福建省辉尚光电科技有限公司 | Novel LED lamp heat-radiating structure |
CN105228333A (en) * | 2015-08-25 | 2016-01-06 | 昆山鼎鑫电子有限公司 | A kind of there is heat sinking function circuit board and processing jig and processing method |
-
2014
- 2014-03-04 CN CN201420095353.XU patent/CN203775528U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104501120A (en) * | 2014-11-25 | 2015-04-08 | 福建省辉尚光电科技有限公司 | Novel LED lamp heat-radiating structure |
CN105228333A (en) * | 2015-08-25 | 2016-01-06 | 昆山鼎鑫电子有限公司 | A kind of there is heat sinking function circuit board and processing jig and processing method |
CN105228333B (en) * | 2015-08-25 | 2018-07-20 | 昆山鼎鑫电子有限公司 | A kind of circuit board and its processing jig and processing method with heat sinking function |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140813 Termination date: 20170304 |
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CF01 | Termination of patent right due to non-payment of annual fee |