CN203775516U - PCB with implantable heat dissipation copper block - Google Patents
PCB with implantable heat dissipation copper block Download PDFInfo
- Publication number
- CN203775516U CN203775516U CN201420038782.3U CN201420038782U CN203775516U CN 203775516 U CN203775516 U CN 203775516U CN 201420038782 U CN201420038782 U CN 201420038782U CN 203775516 U CN203775516 U CN 203775516U
- Authority
- CN
- China
- Prior art keywords
- installing hole
- pcb
- heat radiation
- heat dissipation
- pcb substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A PCB with an implantable heat dissipation copper block comprises a PCB substrate and an installing hole. The installing hole longitudinally penetrates the PCB substrate. A bottom portion of the PCB substrate is successively provided with an insulating layer and a heat conduction copper layer. The heat dissipation copper block is installed in the installing hole. The heat dissipation copper block passes through the insulating layer and is directly connected with the heat conduction copper layer. A top of the heat dissipation copper block is located above the PCB substrate. The heat dissipation copper block is fixed into the installing hole through a rubber ring. The structure is simple, usage is convenient and heat dissipation performance is good.
Description
Technical field
The utility model relates to a kind of pcb board, especially refers to a kind of pcb board with implanted heat radiation copper billet.
Background technology
Along with the electrical characteristic of modern electronic product is increasingly sophisticated, therefore more and more higher to the requirement of power supply, signal.On pcb board, there are a lot of electronic devices, electric device can produce heat when work, device interior temperature is raise, and now widely used pcb board is epoxy glass fabric base material or phenolic resins glass cloth base material, its thermal diffusivity is poor, the ability of sheet material conduction heat itself is very weak, in the course of time, can affect the serviceability of electronic device.
Summary of the invention
The purpose of this utility model is to overcome in prior art pcb board in the problem of inside of electronic component poor radiation, and a kind of simple in structure, pcb board with implanted heat radiation copper billet that thermal diffusivity is good is provided.
For realizing above object, technical solution of the present utility model is: a kind of pcb board with implanted heat radiation copper billet, comprise PCB substrate, installing hole, described installing hole longitudinally runs through PCB substrate, described PCB base plate bottom is disposed with insulating barrier and heat conduction copper layer, and radiating copper piece is housed in installing hole, and heat radiation copper billet passes insulating barrier and is directly connected with heat conduction copper layer, heat radiation copper billet top bit is on PCB substrate, and heat radiation copper billet is fixed on installing hole inside by rubber ring.
The thickness of described insulating barrier is between 1-5 millimeter.
The louvre that is provided with perforation on described heat conduction copper layer, the number of louvre is at least two.
Described louvre is irregular to be positioned on heat conduction copper layer.
The utility model is simple in structure, easy to use, perfect heat-dissipating.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation;
Fig. 2 is the structural representation of heat conduction copper layer in the utility model.
In figure: PCB substrate 1, installing hole 2, insulating barrier 3, heat conduction copper layer 4, heat radiation copper billet 5, rubber ring 6, louvre 7.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail:
Referring to Fig. 1 to Fig. 2, a kind of pcb board with implanted heat radiation copper billet, comprise PCB substrate 1, installing hole 2, described installing hole 2 longitudinally runs through PCB substrate 1, described PCB substrate 1 bottom is disposed with insulating barrier 3 and heat conduction copper layer 4, and radiating copper piece 5 is housed in installing hole 2, and heat radiation copper billet 5 passes insulating barrier 3 and is directly connected with heat conduction copper layer 4, heat radiation copper billet 5 tops are positioned on PCB substrate 1, and heat radiation copper billet 5 is fixed on installing hole 2 inside by rubber ring 6.
The thickness of described insulating barrier 3 is between 1-5 millimeter.
The louvre 7 that is provided with perforation on described heat conduction copper layer 4, the number of louvre 7 is at least two.
Described louvre 7 is irregular to be positioned on heat conduction copper layer 4.
When the electronic device adstante febre being positioned on PCB substrate 1, the heat radiation copper billet 5 that is positioned at installing hole 2 inside can conduct heat, because heat radiation copper billet 5 passes insulating barrier 3 and is directly connected with heat conduction copper layer 4, heat can propagate on heat conduction copper layer 4 faster, and heat will Quick diffusing by metal.On heat conduction copper layer 4, be provided with the louvre 7 of perforation, and louvre 7 is irregular is positioned on heat conduction copper layer 4, make like this heat conduction copper layer 4 go for placing the PCB substrate 1 of different electronic devices, and large with the contact area of air, and radiating effect is better.The thickness of insulating barrier 3, between 1-5 millimeter, can be guaranteed can not to be connected by electricity between PCB substrate 1 and heat conduction copper layer 4, has guaranteed the normal work of the electronic device on PCB substrate 1.6 of rubber rings play the effect that heat radiation copper billet 5 is fixed on to installing hole 2 inside on PCB substrate 1.
The utility model is simple in structure, easy to use, perfect heat-dissipating.
Claims (4)
1. the pcb board with implanted heat radiation copper billet, comprise PCB substrate (1), installing hole (2), described installing hole (2) longitudinally runs through PCB substrate (1), it is characterized in that: described PCB substrate (1) bottom is disposed with insulating barrier (3) and heat conduction copper layer (4), radiating copper piece (5) is housed in installing hole (2), heat radiation copper billet (5) passes insulating barrier (3) and is directly connected with heat conduction copper layer (4), heat radiation copper billet (5) top is positioned on PCB substrate (1), and heat radiation copper billet (5) is fixed on installing hole (2) inside by rubber ring (6).
2. a kind of pcb board with implanted heat radiation copper billet according to claim 1, is characterized in that: the thickness of described insulating barrier (3) is between 1-5 millimeter.
3. a kind of pcb board with implanted heat radiation copper billet according to claim 1, is characterized in that: on described heat conduction copper layer (4), be provided with the louvre (7) of perforation, the number of louvre (7) is at least two.
4. a kind of pcb board with implanted heat radiation copper billet according to claim 3, is characterized in that: described louvre (7) is irregular to be positioned on heat conduction copper layer (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420038782.3U CN203775516U (en) | 2014-01-22 | 2014-01-22 | PCB with implantable heat dissipation copper block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420038782.3U CN203775516U (en) | 2014-01-22 | 2014-01-22 | PCB with implantable heat dissipation copper block |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203775516U true CN203775516U (en) | 2014-08-13 |
Family
ID=51292656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420038782.3U Expired - Fee Related CN203775516U (en) | 2014-01-22 | 2014-01-22 | PCB with implantable heat dissipation copper block |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203775516U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104270886A (en) * | 2014-10-20 | 2015-01-07 | 上海空间电源研究所 | Multi-layer printed board structure and manufacturing method thereof |
-
2014
- 2014-01-22 CN CN201420038782.3U patent/CN203775516U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104270886A (en) * | 2014-10-20 | 2015-01-07 | 上海空间电源研究所 | Multi-layer printed board structure and manufacturing method thereof |
| CN104270886B (en) * | 2014-10-20 | 2017-10-27 | 上海空间电源研究所 | Multilayer board structure and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151231 Address after: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Huang Tian Tianjia Industrial District 16 building two floor, A District Patentee after: Shenzhen best Electronics Co., Ltd. Address before: 441300 Shenzhen Industrial Park, Suizhou Economic Development Zone, Hubei Patentee before: Hubei Mei Yadi precision circuit Co., Ltd |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140813 Termination date: 20200122 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |