CN203768454U - Clamp for depositing diamond film in inner bore of die - Google Patents
Clamp for depositing diamond film in inner bore of die Download PDFInfo
- Publication number
- CN203768454U CN203768454U CN201320873732.2U CN201320873732U CN203768454U CN 203768454 U CN203768454 U CN 203768454U CN 201320873732 U CN201320873732 U CN 201320873732U CN 203768454 U CN203768454 U CN 203768454U
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- heated filament
- diamond film
- mould
- spring
- heated
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Abstract
The utility model relates to a clamp for depositing a diamond film in an inner bore of a die. The clamp is characterized by comprising a V-shaped copper base plate, an electrode rod, a hot filament die-pin, a hot filament pull rod, a spring bracket, a gas supply pipeline and a plurality of hot filaments threaded through the inner bore of the die, wherein the hot filaments are parallely arranged on the hot filament die-pin and the hot filament pull rod which are respectively connected with the electrode rod, one ends of the hot filament are fixed in a hot filament groove of the hot filament pull rod while the other ends of the hot filaments are fixed on a spring of the spring bracket, and the spring bracket and the horizontal plane form an included angle of 30 degrees. According to the clamp provided by the utility model, an excellent diamond film can be deposited in the inner bore of the die, the center can be automatically aligned and hot filament drawing can be automatically compensated.
Description
Technical field
The utility model relates to a kind of frock clamp of interior pore membrane tool depositing diamond film, and also energy automatic alignment center, auto-compensation heated filament draw specifically can to realize mould endoporus deposition gem grade diamond film.
Background technology
Interior punch die mainly contains the classifications such as wortle, punch die, extrusion die, be that wire rod and the requisite moulds of pipe drawing such as welding wire, welding rod, stainless steel, cold Upsetting steel, copper, aluminium, steel alloy, tungsten, Molybdenum are made in enormous quantities, industrialization, must possess that long service life, dimensional precision are high, wire rod or the measured effect of tube surfaces matter.
But the cold extension of metallic substance, orientation is drawn, is pulled out, as: the drawing of pipe, line, diameter tolerance requires high, accuracy requirement is stable, surface smoothness is good, batch production is worked continuously just higher to requiring the work-ing life of mould, and because metallic substance self hardness is just high, the making of mould just must be used superhard material.
The mould that at present wire rod and tubing industry are used is mainly sintered-carbide die and natural diamond, polycrystalline diamond mould, diamond thick-film cutting blade.Sintered-carbide die is with low cost, and early application is extensive, but the sintered-carbide die life-span is short, easy sizing, and production efficiency is low, and work piece tolerance of dimension is unstable; Natural diamond die hardness is high, wear resistance good, but natural diamond and polycrystalline diamond and diamond thick-film all exist fragility large, and difficulty of processing is large, expensive, and size and area little, be used for the interior punch die below the 2mm of Inner footpath.
The interior punch die being greater than more than 2mm has been used the advanced technologies method at hard alloy substrate inwall depositing diamond film.Because high tenacity and diamond high rigidity, super wear-resisting characteristic that the interior casement of such diamond film coating has possessed Wimet are a kind of effective means of desirable raising endoporus mold performance simultaneously.
But on CVD coating apparatus, realize endoporus depositing diamond film and will produce that to realize industrialization by no means easy in batches! Make the inner hole wall deposition tool high rigidity that diameter is very little, high adhesive force, low-friction coefficient and the diamond rete of even thickness, just the temperature heated filament above up to 2000 ° must be passed in the middle of endoporus, heated filament energising must be connected the battery lead rod at chip bench two ends, and heated filament diameter only has 0.2-0.6mm, will produce extension (elongation) sagging after heating, span is larger, sagging just more serious.Once there is the sagging workpiece inwall that touches of the heated filament of high temperature, high pressure, will burn out mould.In Here it is, punch die depositing diamond film film is realized the technical barrier that industrialization is difficult to go beyond.
Also there is mould is parallel, vertical, to tilt the methods such as installation utility model patent before.But these patent fixtures do not have to realize the reliability of industrialization.The described parallel mode with tilting to install to realize single-piece or the production of 1-2 part.At right angle setting method has been considered the requirement of batch production, but also can only realize monofilament multimode (3-4 part at most), and vertically to connect electrode be very unpractical at the two ends that are achieved many heated filaments in the metal space of the narrow of the coating apparatus of excessive temperature and conduction, therefore, multifibres multimode can only be a kind of good hope.
Utility model content
The utility model provides the fixture of a kind of large span, auto-compensation, high efficiency mould endoporus depositing diamond film, also energy automatic alignment center, auto-compensation heated filament draw, and can realize batch production can to realize wortle endoporus depositing diamond film.
Above-mentioned purpose is achieved through the following technical solutions:
The fixture of mould endoporus depositing diamond film, comprise V-type copper pad, battery lead rod, heated filament pressure pin, heated filament pull bar, spring suppport, steam line and the several heated filaments compositions that pass mould endoporus, described heated filament is arranged in parallel on heated filament pressure pin and heated filament pull bar, described heated filament pressure pin is connected with battery lead rod respectively with heated filament pull bar, one end of described heated filament is fixed in the heated filament groove of heated filament pull bar, the other end is fixed on the spring of spring suppport, described spring suppport becomes the angle of 30 ° with horizontal plane, described spring suppport one end is arranged on heated filament pressure pin by ceramic jacket, the other end is provided with a spring by ceramic jacket, described V-type copper pad be arranged on heated filament under, and the V-type groove center line of described V-type copper pad is parallel with heated filament, bottom and the chip bench of described V-type copper pad link together.
On described V-type copper pad, be also provided with steam line, described steam line is over against the larger one end of mould diameter of bore, the less one end of mould diameter of bore is towards vacuum pump bleeding point, and the suction that makes mixed gas make full use of vacuum pump is transported to carbon source and the needed gas of deposition growing diamond film in each mould endoporus.
Described battery lead rod, chip bench inside are equipped with cooling water circulation pipe, many heated filaments of guaranteeing to arrange and use high-power the produced heat water-cooled that is cooled in time.
The utility model technique effect is as follows:
(1) solved heated filament produces extension, saggingly touches the key issue that workpiece inwall burns out mould under High Temperature High Pressure.The angle that spring suppport of the present utility model and horizontal plane are 30 °, by the roller slip effect of spring force effect and heated filament pressure pin, make heated filament elongate and be compensated adding thermogenetic extension, heated filament is not sagging in whole coating institute is free, remains on the straight medullary ray that is arranged in mould endoporus.
(2) steam line of the present utility model is over against the larger one end of mould diameter of bore, the less one end of mould diameter of bore is towards vacuum pump bleeding point, under the acting in conjunction of bleeding at steam line air feed and vacuum pump, carbon source and the needed gas of deposition growing diamond film are fully transported in each mould endoporus, have guaranteed good coating quality.
(3) battery lead rod of the present utility model, chip bench inside are equipped with cooling water circulation pipe, and many heated filaments of guaranteeing to arrange and use high-power the produced heat water-cooled that is cooled are in time guaranteed the controlled of equipment operating safety and chamber temp.
(4) the utility model adopts multifibres, multiple-grooved (V-type copper pad) parallel arrangement, guarantees every heat interior punch die of coating in a large number.The chip bench of diameter Ф 200mm of take is example, and every heat can be processed 60-100 part, effectively reduces production cost, and the industrial scale of mould endoporus depositing diamond film, industrialization are come true.
Accompanying drawing explanation
Fig. 1 is the utility model front view.
Fig. 2 is the utility model vertical view.
In accompanying drawing: 1-ceramic jacket, 2-spring, 3-spring suppport, 4-battery lead rod, 5-V-type copper pad, 6-chip bench, 7-mould, 8-heated filament pressure pin, 9-heated filament, 10-heated filament pull bar, 11-steam line, 12-vacuum pump bleeding point.
Embodiment
As shown in Figure 1 and Figure 2, a kind of fixture of internal coating diamond film, several heated filaments 9 compositions that comprise V-type copper pad 5, battery lead rod 4, heated filament pressure pin 8, heated filament pull bar 10, spring suppport 3, steam line and pass mould 7 endoporus.Described heated filament 9 is arranged in parallel on heated filament pressure pin 8 and heated filament pull bar 10, described heated filament pressure pin 8 is connected with battery lead rod 4 respectively with heated filament pull bar 10, one end of described heated filament 9 is fixed in heated filament 9 grooves of heated filament pull bar 10, the other end is fixed on the spring 2 of spring suppport 3, described spring suppport 3 becomes the angle of 30 ° with horizontal plane, described spring suppport 3 one end are arranged on heated filament pressure pin 8 by ceramic jacket 1, and the other end is provided with a spring 2 by ceramic jacket 1.Described spring suppport 3 acts on by spring 2 and the roller slip effect of heated filament pressure pin 8, make heated filament 9 elongate and be compensated adding thermogenetic extension, heated filament 9 is not sagging in whole coating institute is free, remains on the straight medullary ray that is arranged in mould 7 endoporus.
Described V-type copper pad 5 be arranged on heated filament 9 under, and the V-type groove center line of described V-type copper pad 5 is parallel with heated filament 9, the bottom of described V-type copper pad 5 and chip bench 6 link together.
On described V-type copper pad 5, be also provided with steam line 11, described steam line 11 is over against the larger one end of mould 7 diameter of bores, the less one end of mould 7 diameter of bores is towards vacuum pump bleeding point 12, and the suction that makes mixed gas make full use of vacuum pump is transported to carbon source and the needed gas of deposition growing diamond film in each mould 7 endoporus.
Described battery lead rod 4, chip bench 6 inside are equipped with cooling water circulation pipe, and many heated filaments 9 of guaranteeing to arrange and use high-power the produced heat water-cooled that is cooled are in time guaranteed the controlled, adjustable of equipment operating safety and chamber temp.
Claims (3)
1. the fixture of mould endoporus depositing diamond film, it is characterized in that: it comprises V-type copper pad, battery lead rod, heated filament pressure pin, heated filament pull bar, spring suppport, steam line and the several heated filaments that pass mould endoporus, described heated filament is arranged in parallel on heated filament pressure pin and heated filament pull bar, described heated filament pressure pin is connected with battery lead rod respectively with heated filament pull bar, one end of described heated filament is fixed in the heated filament groove of heated filament pull bar, the other end is fixed on the spring of spring suppport, described spring suppport becomes the angle of 30 ° with horizontal plane, described spring suppport one end is arranged on heated filament pressure pin by ceramic jacket, the other end is provided with a spring by ceramic jacket, described V-type copper pad be arranged on heated filament under, and the V-type groove center line of described V-type copper pad is parallel with heated filament, bottom and the chip bench of described V-type copper pad link together.
2. the fixture of mould endoporus depositing diamond film as claimed in claim 1, it is characterized in that: on described V-type copper pad, be also provided with steam line, described steam line is over against the larger one end of mould diameter of bore, the less one end of mould diameter of bore is towards vacuum pump bleeding point, and the suction that makes mixed gas make full use of vacuum pump is transported to carbon source and the needed gas of deposition growing diamond film in each mould endoporus.
3. the fixture of mould endoporus depositing diamond film as claimed in claim 1, it is characterized in that: described battery lead rod, chip bench inside are equipped with cooling water circulation pipe many heated filaments of guaranteeing to arrange and use high-power the produced heat water-cooled that is cooled in time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320873732.2U CN203768454U (en) | 2014-05-20 | 2014-05-20 | Clamp for depositing diamond film in inner bore of die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320873732.2U CN203768454U (en) | 2014-05-20 | 2014-05-20 | Clamp for depositing diamond film in inner bore of die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203768454U true CN203768454U (en) | 2014-08-13 |
Family
ID=51285664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320873732.2U Expired - Fee Related CN203768454U (en) | 2014-05-20 | 2014-05-20 | Clamp for depositing diamond film in inner bore of die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203768454U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112501582A (en) * | 2020-11-27 | 2021-03-16 | 上海征世科技有限公司 | Hot wire chemical vapor deposition device and metal support |
| CN113549894A (en) * | 2021-07-29 | 2021-10-26 | 久钻科技(成都)有限公司 | Diamond coating wire drawing mould processingequipment |
-
2014
- 2014-05-20 CN CN201320873732.2U patent/CN203768454U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112501582A (en) * | 2020-11-27 | 2021-03-16 | 上海征世科技有限公司 | Hot wire chemical vapor deposition device and metal support |
| WO2022111182A1 (en) * | 2020-11-27 | 2022-06-02 | 上海征世科技股份有限公司 | Hot filament chemical vapor deposition device and metal support |
| CN113549894A (en) * | 2021-07-29 | 2021-10-26 | 久钻科技(成都)有限公司 | Diamond coating wire drawing mould processingequipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140813 Termination date: 20160520 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |