CN203760446U - Semiconductor chip synchronizing and centering mechanism - Google Patents
Semiconductor chip synchronizing and centering mechanism Download PDFInfo
- Publication number
- CN203760446U CN203760446U CN201420145315.0U CN201420145315U CN203760446U CN 203760446 U CN203760446 U CN 203760446U CN 201420145315 U CN201420145315 U CN 201420145315U CN 203760446 U CN203760446 U CN 203760446U
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- Prior art keywords
- centering
- semiconductor wafer
- motor
- cam
- protractor
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- 230000007246 mechanism Effects 0.000 title claims abstract description 102
- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 230000001360 synchronised effect Effects 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims description 2
- 230000007423 decrease Effects 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a semiconductor chip synchronizing and centering mechanism which comprises a motor, a graduator, a synchronizing wheel mechanism, a cam mechanism, a guide mechanism, two centering mechanisms and a turnplate mechanism. An output shaft of the motor is connected with an input shaft of the cam mechanism through the synchronizing wheel mechanism, the guide mechanism tangentially contacts with a cam in the cam mechanism, the centering mechanisms are connected with two ends of the guide mechanism respectively, the output shaft of the motor is connected with an input shaft of the graduator, the turnplate mechanism and an output shaft of the graduator are fixed coaxially, and multiple suction nozzles corresponding to the centering mechanism and used for adsorbing semiconductor chips are distributed on the turnplate mechanism. The semiconductor chip synchronizing and centering mechanism is simple in structure and low in cost, and the centering mechanisms are completely synchronous.
Description
[technical field]
The utility model relates to a kind of position correction apparatus of semiconductor wafer, is specifically related to a kind of semiconductor wafer synchronous centering mechanism.
[background technology]
In the course of processing of semiconductor wafer, the position of wafer needs accurate location, the precision of guarantee wafer process and packaging efficiency, most two motors or two cylinders of adopting of semiconductor wafer synchronous centering mechanism of the prior art are as driving mechanism, and in semiconductor wafer synchronous centering mechanism, the cost of motor is the highest, adopt two motors to drive and cause high cost, and the response speed of cylinder is slow; On market, also have a kind of mechanism that carries out centering by protractor, but structure is too complicated, high cost.
[summary of the invention]
For above-mentioned defect, the utility model discloses a kind of semiconductor wafer synchronous centering mechanism, it is simple in structure, cost is low, and centering body Complete Synchronization.
The technical solution of the utility model is as follows:
A kind of semiconductor wafer synchronous centering mechanism, comprises motor, protractor, synchronizing wheel mechanism, cam mechanism, guiding mechanism, two centering bodies and rotating disk mechanism; The output shaft of described motor is connected with the power shaft of described cam mechanism by synchronizing wheel mechanism, described guiding mechanism and tangent contact of cam in cam mechanism, and described two centering bodies are connected with the two ends of described guiding mechanism respectively; The output shaft of described motor is connected with the power shaft of described protractor, and the output shaft of described rotating disk mechanism and protractor is coaxially fixing, is distributed with multiple corresponding to centering body adsorbing the suction nozzle of semiconductor wafer on described rotating disk mechanism.
Semiconductor wafer synchronous centering of the present utility model mechanism drives protractor by motor, drive with the co-axially fixed rotating disk mechanism of its output shaft and rotate by protractor, motor drives the cam rotation in cam mechanism by synchronizing wheel mechanism simultaneously, cam driven is the guiding mechanism lifting of tangent contact with it, when rising, guiding mechanism drive the centering body being connected with its two ends to rise, centering body reaches its centering position in rising, by the semiconductor wafer centering of adsorbing on the suction nozzle of corresponding rotating disk mechanism, guiding mechanism drives centering body to decline while decline, centering body leaves centering position, rotating disk mechanism feeding, semiconductor wafer synchronous centering mechanism enters next work period, semiconductor wafer synchronous centering of the present utility model mechanism drives by a motor, has reduced the use cost of motor in ensureing response speed, simultaneously simple in structure, and two centering bodies Complete Synchronization in the time of work, has promoted operating efficiency.
[brief description of the drawings]
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is that Fig. 1 removes the structural representation after rotating disk mechanism and centering body;
Fig. 3 is the structural representation of centering body in Fig. 1.
[embodiment]
Below in conjunction with accompanying drawing, embodiment of the present utility model is elaborated.
As shown in Figure 1 to Figure 3, semiconductor wafer synchronous centering of the present utility model mechanism, comprises motor 2, protractor 9, synchronizing wheel mechanism, cam mechanism, guiding mechanism, two centering bodies 7 and rotating disk mechanism 8; The output shaft of described motor 2 is connected with the power shaft of described cam mechanism by synchronizing wheel mechanism, described guiding mechanism and tangent contact of cam 17 in cam mechanism, and described two centering bodies 7 are connected with the two ends of described guiding mechanism respectively; The output shaft of described motor 2 is connected with the power shaft of described protractor 9, and described rotating disk mechanism 8 is coaxially fixing with the output shaft of protractor 9, is distributed with multiple corresponding to centering body 7 adsorbing the suction nozzle of semiconductor wafer on described rotating disk mechanism 8;
Semiconductor wafer synchronous centering of the present utility model mechanism drives protractor by motor 2, drive with the co-axially fixed rotating disk mechanism 8 of its output shaft and rotate by protractor 9, some calibration on protractor 9 are corresponding with several suction nozzles on rotating disk mechanism 8, motor 2 often rotates a circle, protractor 9 rotates a calibration, and rotating disk mechanism 8 marches forward to the position of a suction nozzle; Motor 2 drives the cam rotation in cam mechanism by synchronizing wheel mechanism simultaneously, cam driven is the guiding mechanism lifting of tangent contact with it, when rising, guiding mechanism drive the centering body 7 being connected with its two ends to rise, centering body 7 reaches its centering position in the time rising to peak corresponding to cam stroke, by the semiconductor wafer centering of adsorbing on the suction nozzle of corresponding rotating disk mechanism 8, guiding mechanism drives centering body to decline while decline, centering body leaves centering position, rotating disk mechanism feeding, semiconductor wafer synchronous centering mechanism enters next work period; Semiconductor wafer synchronous centering of the present utility model mechanism drives by a motor 2, has reduced the use cost of motor in ensureing response speed, simultaneously simple in structure, and two centering bodies 7 Complete Synchronization in the time of work, has promoted operating efficiency.
Preferably, semiconductor wafer synchronous centering mechanism also comprises first substrate 1 and motor fixing seat 3, and described motor 2 is fixed on first substrate 1 by motor fixing seat 3, so that install fixing;
Preferably, described synchronizing wheel mechanism comprises with the co-axially fixed driving pulley 4 of output shaft of described motor 2, the rotating shaft 12 fixing with described cam 17, with the co-axially fixed driven pulley 6 of described rotating shaft 12 and be connected the Timing Belt 5 of described driving pulley 4 and driven pulley 6; Motor 2 drives driving pulley 4 to rotate, and driving pulley 4 drives driven pulley 6 to rotate by Timing Belt 5, thereby drives fixing cam 17 in rotating shaft 12 to rotate, and drives the guiding mechanism action of tangent contact with it by cam 17;
Further, described synchronizing wheel mechanism also comprises the bearing pedestal 15 with clutch shaft bearing, and described rotating shaft 12 is fixed in bearing pedestal 15, and described bearing pedestal 15 is fixedly connected on the top of protractor 9, for rotating shaft 12 provides supporting;
Preferably, described guiding mechanism comprises guide plate 14, is fixed on two first axis of guides 13 on protractor 9 tops, and the two ends of described guide plate 14 are provided with the through hole being slidably connected with described first axis of guide 13; Described guide plate 14 is slidably connected by described through hole and first axis of guide 13, make guide plate 14 sliding axially along first axis of guide 13 under the driving of cam 17, to ensure the direction of feed of guide plate 14, and then ensure two centering bodies 7 Complete Synchronization in the time of work;
Further, between the upper end of the described axis of guide 13 and guide plate 14, be provided with the first Compress Spring 18, between described guide plate 14 and cam 17, connect by the tangent contact of clutch shaft bearing 16, by Compress Spring 18, guide plate 14 is compressed, the close contact ensureing between clutch shaft bearing 16 and cam 17, between cam 17 and guide plate 14, and then guarantee reliable transmission;
Preferably, semiconductor wafer synchronous centering mechanism also comprises second substrate 10, and described centering body 7 is fixed on described second substrate 10; Described second substrate 10 is provided with the through hole for the output shaft by described protractor 9;
Preferably, described centering body comprises centering sheet 20, for promoting the second Compress Spring, second axis of guide 19 of described centering sheet 20, and the bottom of described second axis of guide 19 is fixed with the second bearing; In the time that cam 17 rotates to the low spot in its shape journey under motor 2 drives, second axis of guide 19 moves apart centering body, and Compress Spring is lax, makes centering sheet in open configuration; When motor driving cam 17 rotates to the peak in its stroke, Compress Spring compression, centering sheet 20 closures under the pressure effect of Compress Spring, by the semiconductor wafer centering of adsorbing on corresponding suction nozzle;
Preferably, the output shaft of described motor 2 is connected with the power shaft of described protractor by shaft coupling.
Above-described embodiment of the present invention, does not form limiting the scope of the present invention.Any amendment of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in claim protection range of the present invention.
Claims (9)
1. a semiconductor wafer synchronous centering mechanism, is characterized in that: comprise motor, protractor, synchronizing wheel mechanism, cam mechanism, guiding mechanism, two centering bodies and rotating disk mechanism; The output shaft of described motor is connected with the power shaft of described cam mechanism by synchronizing wheel mechanism, described guiding mechanism and tangent contact of cam in cam mechanism, and described two centering bodies are connected with the two ends of described guiding mechanism respectively; The output shaft of described motor is connected with the power shaft of described protractor, and the output shaft of described rotating disk mechanism and protractor is coaxially fixing, is distributed with multiple corresponding to centering body adsorbing the suction nozzle of semiconductor wafer on described rotating disk mechanism.
2. semiconductor wafer synchronous centering as claimed in claim 1 mechanism, is characterized in that: also comprise first substrate and motor fixing seat, described motor is fixed on first substrate by motor fixing seat.
3. semiconductor wafer synchronous centering as claimed in claim 1 mechanism, is characterized in that: described synchronizing wheel mechanism comprises with the co-axially fixed driving pulley of output shaft of described motor, the rotating shaft fixing with described cam, with the co-axially fixed driven pulley of described rotating shaft and be connected the Timing Belt of described driving pulley and driven pulley.
4. semiconductor wafer synchronous centering as claimed in claim 3 mechanism, is characterized in that: also comprise the bearing pedestal with clutch shaft bearing, described rotating shaft is fixed in bearing pedestal, and described bearing pedestal is fixedly connected on the top of protractor.
5. semiconductor wafer synchronous centering as claimed in claim 1 mechanism, is characterized in that: described guiding mechanism comprises guide plate, is fixed on two first axis of guides on protractor top, and the two ends of described guide plate are provided with the through hole being slidably connected with the described axis of guide.
6. semiconductor wafer synchronous centering as claimed in claim 5 mechanism, is characterized in that: between the upper end of the described axis of guide and guide plate, be provided with the first Compress Spring, between described guide plate and cam, connect by the tangent contact of clutch shaft bearing.
7. semiconductor wafer synchronous centering as claimed in claim 1 mechanism, is characterized in that: also comprise second substrate, described centering body is fixed on described second substrate; Described second substrate is provided with the through hole for the output shaft by described protractor.
8. semiconductor wafer synchronous centering as claimed in claim 1 mechanism, is characterized in that: described centering body comprises centering sheet, for promoting the second Compress Spring, second axis of guide of described centering sheet, and the bottom of described second axis of guide is fixed with the second bearing.
9. semiconductor wafer synchronous centering as claimed in claim 1 mechanism, is characterized in that: the output shaft of described motor is connected with the power shaft of described protractor by shaft coupling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420145315.0U CN203760446U (en) | 2014-03-27 | 2014-03-27 | Semiconductor chip synchronizing and centering mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420145315.0U CN203760446U (en) | 2014-03-27 | 2014-03-27 | Semiconductor chip synchronizing and centering mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203760446U true CN203760446U (en) | 2014-08-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420145315.0U Expired - Lifetime CN203760446U (en) | 2014-03-27 | 2014-03-27 | Semiconductor chip synchronizing and centering mechanism |
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| Country | Link |
|---|---|
| CN (1) | CN203760446U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113035764A (en) * | 2021-05-24 | 2021-06-25 | 宁波润华全芯微电子设备有限公司 | Wafer centering device |
-
2014
- 2014-03-27 CN CN201420145315.0U patent/CN203760446U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113035764A (en) * | 2021-05-24 | 2021-06-25 | 宁波润华全芯微电子设备有限公司 | Wafer centering device |
| CN113035764B (en) * | 2021-05-24 | 2021-08-03 | 宁波润华全芯微电子设备有限公司 | Wafer centering device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140806 |