CN203754831U - Full-automatic PCB uniform electroplating device - Google Patents
Full-automatic PCB uniform electroplating device Download PDFInfo
- Publication number
- CN203754831U CN203754831U CN201420028158.5U CN201420028158U CN203754831U CN 203754831 U CN203754831 U CN 203754831U CN 201420028158 U CN201420028158 U CN 201420028158U CN 203754831 U CN203754831 U CN 203754831U
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- China
- Prior art keywords
- conduct current
- anode
- baffle
- equiped
- cell wall
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 35
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 30
- 239000010936 titanium Substances 0.000 claims abstract description 30
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 238000007747 plating Methods 0.000 claims description 75
- 210000002421 cell wall Anatomy 0.000 claims description 38
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- 210000005056 cell body Anatomy 0.000 claims description 12
- 230000008901 benefit Effects 0.000 abstract description 3
- 230000009471 action Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a full-automatic PCB uniform electroplating device which is characterized in that an electroplating tank body comprises an electroplating tank, a left electroplating tank wall and a right electroplating tank wall; a left anodic conductive busbar, a right anodic conductive busbar, a left titanium basket, a right titanium basket, a left current guide plate, a right current guide plate, a left anodic baffle and a right anodic baffle are mounted in the electroplating tank; the left current guide plate and the right current guide plate are provided with current guide holes respectively; baffle hoisting mechanisms are mounted at the upper end parts of the left electroplating tank wall and the right electroplating tank wall respectively. During working, the uniformly distributed current guide holes can lead electrical wires to vertically and uniformly act on the electroplating surface of a PCB, and the baffle hoisting mechanisms can drive the corresponding left and right anodic baffles to move up and down to adapt to the size of the PCB, so that no electrical wires are led out from the current guide holes in the lower end of the PCB under the shielding action of the left and right anodic baffles. Therefore, the concentration of the electrical wires can be avoided, the uniform electroplating of the PCB is ensured, and the device has the advantages of being novel in structural design and high in automation level.
Description
Technical field
The utility model relates to electroplanting device technical field, relates in particular to a kind of full-automatic PCB uniformly-coating device.
Background technology
As the very important electronic product of one, PCB applies very extensive in various electronic products; In PCB process of manufacture, PCB need to be through electroplating processing, and for PCB, its electroplating quality directly affects the quality of PCB.
Wherein, a wherein important indicator of weighing PCB electroplating quality is exactly whether the thickness of electrolytic coating is even; But in the actual electroplating process of prior art, because power line is easy to concentrate and cause PCB plating inhomogeneous at the corner location of PCB, quality is difficult to be guaranteed.
Summary of the invention
The purpose of this utility model is to provide for the deficiencies in the prior art a kind of full-automatic PCB uniformly-coating device, and this full-automatic PCB uniformly-coating device can ensure that PCB electrolytic coating is even effectively, and structure design novelty and level of automation are high.
For achieving the above object, the utility model is achieved through the following technical solutions.
A kind of full-automatic PCB uniformly-coating device, include electroplating cell body, electroplating cell body forms opening up plating tank, electroplating cell body just include to and parallel interval left plating cell wall and the right plating cell wall arranged, right plating cell wall is positioned at the right-hand member side of left plating cell wall, left plating cell wall interior distolateral is equiped with left anode conducting busbar in plating tank, right plating cell wall interior distolateral is equiped with right anode conducting busbar in plating tank, left anode conducting busbar has mounted left titanium basket, right anode conducting busbar has mounted right titanium basket, in plating tank, be equiped with the left conduct current plate of vertical extension in the right-hand member side of left titanium basket, in plating tank, be equiped with the right conduct current plate of vertical extension in the left end side of right titanium basket, left conduct current plate and right conduct current plate just to and parallel interval arrange, left conduct current plate and right conduct current plate offer respectively left and right transverse horizontal and run through and be even spaced apart conduct current hole completely, the bottom of plating tank can the relative left anode baffle that is equiped with vertical extension between left conduct current plate and left titanium basket up and downly, the bottom of plating tank can the relative right anode baffle that is equiped with vertical extension between right conduct current plate and right titanium basket up and downly, the upper end of the upper end of left plating cell wall and right plating cell wall is equiped with respectively baffle plate hoisting mechanism, each baffle plate hoisting mechanism is connected with left anode baffle and the driving of right anode baffle of corresponding side respectively.
Wherein, each described baffle plate hoisting mechanism includes and is installed in the described left plating cell wall of corresponding side and elevator motor and the elevator rotating shaft of described right plating cell wall upper end, the power output shaft of each elevator motor is provided with respectively worm screw, the corresponding worm screw in end of each elevator rotating shaft is equiped with respectively turbine, turbine coordinates with corresponding worm screw, between the described left anode baffle of each elevator rotating shaft and corresponding side and described right anode baffle, is provided with respectively winch rope.
Wherein, in described plating tank, corresponding described left anode conducting busbar is equiped with left anode carrier, in plating tank, corresponding described right anode conducting busbar is equiped with right anode carrier, left anode conducting busbar is installed in the upper end of left anode carrier, and right anode conducting busbar is installed in the upper end of right anode carrier.
Wherein, the upper end of described left conduct current plate is provided with the left retaining plate that horizontal cross is extended, the upper end of described right conduct current plate is provided with the right retaining plate that horizontal cross is extended, left retaining plate is installed in the upper end of described left anode carrier, and right retaining plate is installed in the upper end of described right anode carrier.
Wherein, the described winch rope of described left retaining plate and the corresponding corresponding side of described right retaining plate is equiped with respectively elevator guide deflection sheave.
Wherein, the internal surface of described left conduct current plate and described right conduct current plate offers respectively support slot, and in each support slot, inlay card has the gib block of horizontal expansion respectively.
Wherein, the diameter value in each described conduct current hole is 1.5mm.
The beneficial effects of the utility model are: the full-automatic PCB uniformly-coating of one described in the utility model device, its electroplating cell body comprises plating tank, left plating cell wall and right plating cell wall, the left anode conducting busbar of interior distolateral installing of left plating cell wall, the right anode conducting busbar of interior distolateral installing of right plating cell wall, left anode conducting busbar mounts left titanium basket, right anode conducting busbar mounts right titanium basket, left titanium basket right-hand member side is installed left conduct current plate, right titanium basket left end side is installed right conduct current plate, left conduct current plate and right conduct current plate are offered respectively conduct current hole, left anode baffle is installed in the bottom of plating tank between left conduct current plate and left titanium basket, right anode baffle is installed in the bottom of plating tank between right conduct current plate and right titanium basket, baffle plate hoisting mechanism is installed respectively in the upper end of left plating cell wall and right plating cell wall.When work, electroplate car driving PCB and stretch in the electroplate liquid of plating tank, because conduct current hole is uniformly distributed in left conduct current plate and right conduct current plate, conduct current hole can guide power line Vertical Uniform and act on the electroplating surface of PCB; In addition, each baffle plate hoisting mechanism can drive corresponding left anode baffle and right anode baffle up-down adjustment to move to adapt to the size of PCB, and then the conduct current hole that makes to be positioned at PCB lower end side blocks and do not have power line to penetrate due to corresponding left anode baffle and right anode baffle, the corner location of PCB bottom there will not be power line to gather.Comprehensive above-mentioned situation is known, and the utility model can be avoided the power line concentration phenomenon occurring in electroplating process effectively, and then can effectively ensure that PCB electroplates evenly, the utlity model has the advantage that structure design novelty and level of automation are high.
Brief description of the drawings
Utilize accompanying drawing to be further detailed the utility model below, but the embodiment in accompanying drawing does not form any restriction of the present utility model.
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation at another visual angle of the utility model.
Fig. 3 is diagrammatic cross-section of the present utility model.
Fig. 4 is the structural representation of left conduct current plate of the present utility model.
In Fig. 1 to Fig. 4, include:
1---electroplating cell body 11---plating tank
12---left plating cell wall 13---right plating cell wall
21---left anode conducting busbar 22---right anode conducting busbar
31---left titanium basket 32---right titanium basket
41---left conduct current plate 411---left retaining plate
42---right conduct current plate 421---right retaining plate
43---conduct current hole 44---support slot
51---left anode baffle 52---right anode baffle
6---baffle plate hoisting mechanism 61---elevator motor
62---elevator rotating shaft 63---winch rope
71---left anode carrier 72---right anode carrier
8---gib block 9---elevator guide deflection sheave.
Embodiment
Below in conjunction with concrete embodiment, the utility model is described.
As shown in Figures 1 to 4, a kind of full-automatic PCB uniformly-coating device, include electroplating cell body 1, electroplating cell body 1 forms opening up plating tank 11, electroplating cell body 1 just include to and parallel interval left plating cell wall 12 and the right plating cell wall 13 arranged, right plating cell wall 13 is positioned at the right-hand member side of left plating cell wall 12, left plating cell wall 12 interior distolateral is equiped with left anode conducting busbar 21 in plating tank 11, right plating cell wall 13 interior distolateral is equiped with right anode conducting busbar 22 in plating tank 11, left anode conducting busbar 21 has mounted left titanium basket 31, right anode conducting busbar 22 has mounted right titanium basket 32, in plating tank 11, be equiped with the left conduct current plate 41 of vertical extension in the right-hand member side of left titanium basket 31, in plating tank 11, be equiped with the right conduct current plate 42 of vertical extension in the left end side of right titanium basket 32, left conduct current plate 41 and right conduct current plate 42 just to and parallel interval arrange, left conduct current plate 41 and right conduct current plate 42 offer respectively left and right transverse horizontal and run through and be even spaced apart conduct current hole 43 completely, the bottom of plating tank 11 can the relative left anode baffle 51 that is equiped with vertical extension between left conduct current plate 41 and left titanium basket 31 up and downly, the bottom of plating tank 11 can the relative right anode baffle 52 that is equiped with vertical extension between right conduct current plate 42 and right titanium basket 32 up and downly, the upper end of the upper end of left plating cell wall 12 and right plating cell wall 13 is equiped with respectively baffle plate hoisting mechanism 6, each baffle plate hoisting mechanism 6 is connected with left anode baffle 51 and 52 drivings of right anode baffle of corresponding side respectively.
In the utility model working process, electroplating raw material is positioned in left titanium basket 31 and right titanium basket 32, left anode conducting busbar 21 and right anode conducting busbar 22 are connected respectively anodic current, enter to the plating tank 11 of electroplating cell body 1 when interior when electroplating PCB that car carries electroplated, electroplating car connects cathodic current and makes PCB connect cathodic current, electroplating car drives the PCB of electroplated to stretch in the electroplate liquid of plating tank 11, and the PCB of electroplated is between left conduct current plate 41 and right conduct current plate 42, because conduct current hole 43 is uniformly distributed in corresponding left conduct current plate 41 and right conduct current plate 42, conduct current hole 43 can guide power line Vertical Uniform and act on the electroplating surface of PCB, in addition, according to the PCB dimensions of electroplated, each baffle plate hoisting mechanism 6 of the present utility model can drive corresponding left anode baffle 51 and right anode baffle 52 up-down adjustment to move to adapt to the size of PCB, and then the conduct current hole 43 that makes to be positioned at PCB lower end side blocks and do not have power line to penetrate due to corresponding left anode baffle 51 and right anode baffle 52, the corner location of PCB bottom there will not be power line to gather.
Need further to explain, regulate in the process of corresponding left anode baffle 51 and right anode baffle 52 at baffle plate hoisting mechanism 6, left anode baffle 51 and right anode baffle 52 synchronously regulate mobile in the same way.
Comprehensive above-mentioned situation is known, and the utility model can be avoided the power line concentration phenomenon occurring in electroplating process effectively, and then can effectively ensure that PCB electroplates evenly, the utlity model has the advantage that structure design novelty and level of automation are high.
As preferred embodiment, each baffle plate hoisting mechanism 6 includes and is installed in the left plating cell wall 12 of corresponding side and elevator motor 61 and the elevator rotating shaft 62 of right plating cell wall 13 upper ends, the power output shaft of each elevator motor 61 is provided with respectively worm screw, the corresponding worm screw in end of each elevator rotating shaft 62 is equiped with respectively turbine, turbine coordinates with corresponding worm screw, between the left anode baffle 51 of each elevator rotating shaft 62 and corresponding side and right anode baffle 52, is provided with respectively winch rope 63.
Below in conjunction with concrete course of action, the regulate process of left anode baffle 51 and right anode baffle 52 is described in detail, be specially: in the time that the PCB of electroplated dimensions is larger, elevator motor 61 moves and drives corresponding elevator rotating shaft 62 to rotate by turbine and worm mechanism, elevator rotating shaft 62 is loosened winch rope 63 and corresponding left anode baffle 51 and right anode baffle 52 is moved down, until left anode baffle 51 is concordant with the upper end-face edge of right anode baffle 52 and the lower edge of PCB, be that left anode baffle 51 and right anode baffle 52 are blocked respectively the conduct current hole 43 that the left conduct current plate 41 of corresponding side and right conduct current plate 42 be positioned at PCB lower end side and penetrated power line, when the PCB of electroplated dimensions hour, elevator motor 61 rotates backward and drives corresponding elevator rotating shaft 62 to rotate by turbine and worm mechanism, elevator rotating shaft 62 rolling winch ropes 63 also move up corresponding left anode baffle 51 and right anode baffle 52, until left anode baffle 51 is concordant with the upper end-face edge of right anode baffle 52 and the lower edge of PCB, left anode baffle 51 and right anode baffle 52 are blocked respectively the conduct current hole 43 that the left conduct current plate 41 of corresponding side and right conduct current plate 42 be positioned at PCB lower end side and are penetrated power line.
As preferred embodiment, install fixing for ease of left anode conducting busbar 21 and right anode conducting busbar 22, the utility model adopts following structure design, be specially: the left anode conducting busbar 21 of the interior correspondence of plating tank 11 is equiped with left anode carrier 71, the right anode conducting busbar 22 of the interior correspondence of plating tank 11 is equiped with right anode carrier 72, left anode conducting busbar 21 is installed in the upper end of left anode carrier 71, and right anode conducting busbar 22 is installed in the upper end of right anode carrier 72.
Further, the upper end of left conduct current plate 41 is provided with the left retaining plate 411 that horizontal cross is extended, the upper end of right conduct current plate 42 is provided with the right retaining plate 421 that horizontal cross is extended, left retaining plate 411 is installed in the upper end of left anode carrier 71, and right retaining plate 421 is installed in the upper end of right anode carrier 72; Be that left conduct current plate 41 of the present utility model and right conduct current plate 42 are installed fixing by left anode carrier 71 and the right anode carrier 72 of corresponding side respectively.
Further, the winch rope 63 of left retaining plate 411 and right retaining plate 421 corresponding corresponding sides is equiped with respectively elevator guide deflection sheave 9; Elevator guide deflection sheave 9 is for guiding the winch rope 63 of corresponding side flexible.
For guiding PCB is in the interior movement of plating tank 11, the utility model is installed respectively gib block 8 in left conduct current plate 41 and right conduct current plate 42, interior when mobile in plating tank 11 at PCB, and the gib block 8 that is positioned at PCB both sides matches and merges guiding PCB and move; Wherein, the internal surface of left conduct current plate 41 and right conduct current plate 42 offers respectively support slot 44, and gib block 8 is embedded in respectively in corresponding support slot 44.
As preferred embodiment, as shown in Figure 4, the diameter value in each conduct current hole 43 is 1.5mm; In addition, as shown in Figure 4, conduct current hole 43 entirety of arrangement in a row are and are in tilted layout.
Above content is only preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.
Claims (7)
1. a full-automatic PCB uniformly-coating device, it is characterized in that: include electroplating cell body (1), electroplating cell body (1) forms opening up plating tank (11), electroplating cell body (1) just include to and parallel interval left plating cell wall (12) and the right plating cell wall (13) arranged, right plating cell wall (13) is positioned at the right-hand member side of left plating cell wall (12), the interior distolateral left anode conducting busbar (21) that is equiped with in plating tank (11) of left plating cell wall (12), the interior distolateral right anode conducting busbar (22) that is equiped with in plating tank (11) of right plating cell wall (13), left anode conducting busbar (21) has mounted left titanium basket (31), right anode conducting busbar (22) has mounted right titanium basket (32), in plating tank (11), be equiped with the left conduct current plate (41) of vertical extension in the right-hand member side of left titanium basket (31), in plating tank (11), be equiped with the right conduct current plate (42) of vertical extension in the left end side of right titanium basket (32), left conduct current plate (41) and right conduct current plate (42) just to and parallel interval arrange, left conduct current plate (41) and right conduct current plate (42) offer respectively left and right transverse horizontal and run through and be even spaced apart conduct current hole (43) completely, the bottom of plating tank (11) can the relative left anode baffle (51) that is equiped with vertical extension between left conduct current plate (41) and left titanium basket (31) up and downly, the bottom of plating tank (11) can the relative right anode baffle (52) that is equiped with vertical extension between right conduct current plate (42) and right titanium basket (32) up and downly, the upper end of the upper end of left plating cell wall (12) and right plating cell wall (13) is equiped with respectively baffle plate hoisting mechanism (6), each baffle plate hoisting mechanism (6) is connected with left anode baffle (51) and right anode baffle (52) driving of corresponding side respectively.
2. the full-automatic PCB uniformly-coating of one according to claim 1 device, it is characterized in that: each described baffle plate hoisting mechanism (6) includes and is installed in the described left plating cell wall (12) of corresponding side and elevator motor (61) and the elevator rotating shaft (62) of described right plating cell wall (13) upper end, the power output shaft of each elevator motor (61) is provided with respectively worm screw, the corresponding worm screw in end of each elevator rotating shaft (62) is equiped with respectively turbine, turbine coordinates with corresponding worm screw, between the described left anode baffle (51) of each elevator rotating shaft (62) and corresponding side and described right anode baffle (52), be provided with respectively winch rope (63).
3. the full-automatic PCB uniformly-coating of one according to claim 2 device, it is characterized in that: in described plating tank (11), corresponding described left anode conducting busbar (21) is equiped with left anode carrier (71), in plating tank (11), corresponding described right anode conducting busbar (22) is equiped with right anode carrier (72), left anode conducting busbar (21) is installed in the upper end of left anode carrier (71), and right anode conducting busbar (22) is installed in the upper end of right anode carrier (72).
4. the full-automatic PCB uniformly-coating of one according to claim 3 device, it is characterized in that: the upper end of described left conduct current plate (41) is provided with the left retaining plate (411) that horizontal cross is extended, the upper end of described right conduct current plate (42) is provided with the right retaining plate (421) that horizontal cross is extended, left retaining plate (411) is installed in the upper end of described left anode carrier (71), and right retaining plate (421) is installed in the upper end of described right anode carrier (72).
5. the full-automatic PCB uniformly-coating of one according to claim 4 device, is characterized in that: the described winch rope (63) of described left retaining plate (411) and the corresponding corresponding side of described right retaining plate (421) is equiped with respectively elevator guide deflection sheave (9).
6. the full-automatic PCB uniformly-coating of one according to claim 5 device, it is characterized in that: the internal surface of described left conduct current plate (41) and described right conduct current plate (42) offers respectively support slot (44), in each support slot (44), inlay card has the gib block (8) of horizontal expansion respectively.
7. according to the full-automatic PCB uniformly-coating of the one device described in claim 1 to 6 any one, it is characterized in that: the diameter value in each described conduct current hole (43) is 1.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420028158.5U CN203754831U (en) | 2014-01-16 | 2014-01-16 | Full-automatic PCB uniform electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420028158.5U CN203754831U (en) | 2014-01-16 | 2014-01-16 | Full-automatic PCB uniform electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203754831U true CN203754831U (en) | 2014-08-06 |
Family
ID=51250130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420028158.5U Expired - Lifetime CN203754831U (en) | 2014-01-16 | 2014-01-16 | Full-automatic PCB uniform electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203754831U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104762652A (en) * | 2015-04-27 | 2015-07-08 | 栾善东 | Composite acid system PCB vertical continuous electroplating device and method |
| CN107916443A (en) * | 2017-12-11 | 2018-04-17 | 常德力元新材料有限责任公司 | Electroplating bath for continuous ribbon-like materials |
-
2014
- 2014-01-16 CN CN201420028158.5U patent/CN203754831U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104762652A (en) * | 2015-04-27 | 2015-07-08 | 栾善东 | Composite acid system PCB vertical continuous electroplating device and method |
| CN104762652B (en) * | 2015-04-27 | 2017-06-20 | 栾善东 | A kind of compound acid system PCB vertical continuous electroplanting device and method |
| CN107916443A (en) * | 2017-12-11 | 2018-04-17 | 常德力元新材料有限责任公司 | Electroplating bath for continuous ribbon-like materials |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140806 |
|
| CX01 | Expiry of patent term |