CN203733845U - LED encapsulation structure - Google Patents
LED encapsulation structure Download PDFInfo
- Publication number
- CN203733845U CN203733845U CN201420059685.2U CN201420059685U CN203733845U CN 203733845 U CN203733845 U CN 203733845U CN 201420059685 U CN201420059685 U CN 201420059685U CN 203733845 U CN203733845 U CN 203733845U
- Authority
- CN
- China
- Prior art keywords
- substrate
- led
- light source
- encapsulating structure
- led light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
An LED encapsulation structure comprises a substrate and LED light sources; the substrate comprises side walls and a top part; at least one of the side walls is provided with the LED light sources; the LED encapsulation structure further comprises an encapsulation layer; and the encapsulation layer at least integrally covers the LED light sources and the top part of the substrate. The LED encapsulation structure has the advantages of simple structure and large light-emitting angle.
Description
Technical field
The utility model relates to LED encapsulation technology field, particularly a kind of LED encapsulating structure.
Background technology
The encapsulation technology of LED encapsulates LED chip exactly, makes the light source that can directly use.The encapsulating structure of LED is many, and the common encapsulating structure of current a kind of industry is: LED chip is fixed on the substrate of a plane, then in a plane of substrate, utilizes encapsulated layer that this LED chip is encapsulated on this substrate.The utility model patent that the patent No. of for example authorizing on May 23rd, 2012 is ZL201120356103.3, has disclosed a kind of encapsulating structure of paster LED.This LED encapsulating structure comprises: LED chip, substrate, silver coating, described LED chip is arranged on the upper surface of described substrate.Yet, because the lighting angle that light source is intrinsic is smaller, be generally 120 °, so the rising angle of this kind of scheme is less, be difficult to realize the luminous of wide-angle.When the encapsulating structure of this paster LED is applied to light fixture, if it is luminous to realize wide-angle, common way is that the encapsulating structure that a three-dimensional structure is carried this paster LED is set at present, luminous to realize wide-angle, this just makes the overall structure of light fixture more complicated, is unfavorable for reducing costs.
Utility model content
In view of this, be necessary the LED encapsulating structure that provides a kind of lighting angle large, simple in structure.
A LED encapsulating structure, comprises substrate, LED light source, and this substrate comprises sidewall and top, at least one sidewall of this substrate, this LED light source is installed, and also comprises encapsulated layer, and this encapsulated layer at least one covers the top of this LED light source and this substrate.
Compared with prior art, on at least one sidewall of the substrate of this LED encapsulating structure, this LED light source is installed, and this encapsulated layer at least one covers the top of this LED light source and this substrate, during work, the light that this LED light source sends is dispersed to surrounding by this substrate top through the dispersion of this encapsulated layer.When this LED encapsulating structure is applied in light fixture, because this LED encapsulating structure carries without three-dimensional structure is set again, the light that the LED light source of this LED encapsulating structure sends just can illuminate surrounding, make this LED encapsulating structure have advantages of simple in structure, lighting angle is large.
Accompanying drawing explanation
Fig. 1 is the structural representation that the utility model LED encapsulating structure is applied to the first embodiment in light fixture;
Fig. 2 is the structural representation that the utility model LED encapsulating structure is applied to the second embodiment in light fixture.
Description of reference numerals:
10 body 20 substrate 30a, 30b encapsulated layer
40 LED light source 50 bulb housing 60 driving IC chip
70 reflector 21 sidewall 22 tops
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is described in further detail.
Fig. 1 is the structural representation that the utility model LED encapsulating structure is applied to the first embodiment in light fixture.Please refer to Fig. 1, this LED encapsulating structure comprises substrate 20, LED light source 40 and encapsulated layer 30a.
Please refer to Fig. 1, this substrate 20 is made by Heat Conduction Material, and this substrate 20 comprises sidewall 21 and top 22.This substrate 20 is platy structure.On a sidewall 21 of this substrate 20, this LED light source 40 is installed.This encapsulated layer 30a one covers the top 22 of this LED light source 40 and this substrate 20.In this encapsulated layer 30a, be provided with printing opacity scattering material.This encapsulated layer 30a comprises fluorescent material (not shown) and heat-conducting glue.On this substrate 20, also integrated being provided with drives electronic component 60.When this LED encapsulating structure is applied in light fixture, also comprise body 10, this substrate 20 is roughly vertically arranged on this body 10.In addition, also comprise bulb housing 50, this bulb housing 50 is arranged on top the cover of this body 10 and establishes this substrate 20.
In sum, on substrate 20 at least one sidewall 21 of this LED encapsulating structure, this LED light source 40 is installed, and this encapsulated layer 30a at least one covers the top 22 of this LED light source 40 and this substrate 20, during work, the light that this LED light source 40 sends passes through the dispersion of this encapsulated layer 30a and is dispersed to surrounding by these substrate 20 tops.This has just promoted the lighting angle of this LED encapsulating structure effectively, can realize the lighting angle that is greater than 180 degree.When this LED encapsulating structure is applied in light fixture, because this LED encapsulating structure carries without three-dimensional structure is set again, the light that the LED light source 40 of this LED encapsulating structure sends just can illuminate surrounding, make this LED encapsulating structure have advantages of simple in structure, lighting angle is large.In addition, the heat producing when luminous due to these LED light sources 40 can be dispersed into by the heat-conducting glue of this encapsulated layer 30a on this substrate 20 in time, by this substrate 20, distributed, make this LED encapsulating structure also have advantages of that heat radiation is good, can be without radiator is separately set again while being applied in light fixture.
Please refer to Fig. 2, Fig. 2 is the structural representation that the utility model LED encapsulating structure is applied to the second embodiment in light fixture, be with the difference of aforementioned LED encapsulating structure, these LED light sources 40 are separately positioned on two sidewalls 21 of this substrate 20, and these LED light sources 40 are near top 22 settings of this substrate 20.In addition, on two sidewalls 21 of this substrate 20, be respectively equipped with reflector 70, this reflector 70 is near these LED light sources 40 settings and be positioned at these LED light source 40 belows.This reflector 70 is provided with reflector layer (not shown) towards the sidewall of described LED light source 40.This reflector 70 is in the setting that tilts of the direction away from described LED light source 40.The reflector layer of this reflector 70 upwards disperses these light for reflecting the light of these LED light sources 40, improves light utilization.This encapsulated layer 30b one covers LED light source 40 on these substrate 20 two sides 21 and the top 21 of this substrate 20.The outline of this encapsulated layer 30b is class spherical structure, so that the light that LED light source 40 sends is uniformly distributed in space.During this encapsulated layer of moulding, this reflector 70 also can be used for stoping this encapsulated layer 30b to flow downward, and makes more easy-formation, easily fixing of this encapsulated layer 30b.
The utility model also provides the LED method for packing of manufacturing above-mentioned LED encapsulating structure, comprise the steps, on at least two sidewalls 21 near the top of substrate 20, LED chip 40 is set, by the die cavity (not shown) of a pair of mould close up be arranged on this substrate 20 both sides to surround respectively described LED light source 40; Liquid encapsulated layer is injected to the die cavity of this mould, make liquid encapsulated layer curing molding, open the die cavity of described mould.The die cavity of this mould has curved-surface structure, to make the outline of this this encapsulated layer 30b, is class spherical structure.
Claims (9)
1. a LED encapsulating structure, comprises substrate, LED light source, and this substrate comprises sidewall and top, it is characterized in that, on at least one sidewall of this substrate, described LED light source is installed, also comprises encapsulated layer, this encapsulated layer at least one covers the top of this LED light source and this substrate.
2. LED encapsulating structure according to claim 1, is characterized in that: described LED light source is separately positioned on two sidewalls of this substrate, and described LED light source is near the top setting of this substrate.
3. LED encapsulating structure according to claim 1, is characterized in that: in this encapsulated layer, be provided with printing opacity scattering material or fluorescent material.
4. LED encapsulating structure according to claim 2, is characterized in that: this encapsulated layer one covers LED light source on this substrate two side and the top of this substrate.
5. LED encapsulating structure according to claim 1, is characterized in that: also comprise body, this substrate is roughly vertically arranged on this body, also comprises bulb housing, and this bulb housing is arranged on top the cover of this body and establishes this substrate.
6. LED encapsulating structure according to claim 1, is characterized in that: this substrate is made by Heat Conduction Material, the integrated driving electronic component that is provided with also on this substrate.
7. LED encapsulating structure according to claim 1, is characterized in that: this substrate is provided with reflector, and this reflector is near this LED light source setting and be positioned at described LED light source below, and this reflector is provided with reflector layer towards the sidewall of described LED light source.
8. LED encapsulating structure according to claim 7, is characterized in that: this reflector is in the setting that tilts of the direction away from described LED light source.
9. LED encapsulating structure according to claim 4, is characterized in that: the outline of this encapsulated layer is class spherical structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420059685.2U CN203733845U (en) | 2014-02-09 | 2014-02-09 | LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420059685.2U CN203733845U (en) | 2014-02-09 | 2014-02-09 | LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203733845U true CN203733845U (en) | 2014-07-23 |
Family
ID=51203892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420059685.2U Expired - Fee Related CN203733845U (en) | 2014-02-09 | 2014-02-09 | LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203733845U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104776326A (en) * | 2014-11-12 | 2015-07-15 | 吴喜荣 | LED (Light Emitting Diode) filament lamp with shock absorbing function |
-
2014
- 2014-02-09 CN CN201420059685.2U patent/CN203733845U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104776326A (en) * | 2014-11-12 | 2015-07-15 | 吴喜荣 | LED (Light Emitting Diode) filament lamp with shock absorbing function |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8552456B1 (en) | Light-emitting diode packaging structure of low angular correlated color temperature deviation | |
| WO2014015655A1 (en) | Method for constructing universal led bulb and flange snap ring type led bulb and led lamp | |
| KR20130002732U (en) | Foot-hidden type high power LED support and package structure | |
| CN108286687A (en) | A kind of new waterproof plant lamp | |
| CN204693116U (en) | Solid-state sealed LED bulb | |
| US9640740B2 (en) | LED lighting device and packaging method | |
| CN203733845U (en) | LED encapsulation structure | |
| CN103794707A (en) | LED packaging structure and LED packaging method | |
| CN208422911U (en) | A kind of LED component | |
| CN103117352B (en) | A kind of LED encapsulation structure and realize the method for fluorescent material shape-preserving coating based on it | |
| CN103633235A (en) | LED module and manufacturing process thereof | |
| CN203162616U (en) | Light emitting diode lamp source plate | |
| CN103928601B (en) | A kind of LED module | |
| CN207217530U (en) | A kind of electrical integrated module of LED light | |
| CN205807284U (en) | A kind of high-powered LED lamp module | |
| CN206274525U (en) | A kind of LED encapsulation | |
| CN206130793U (en) | LED headlamp | |
| CN204114650U (en) | Insulating radiation COB bulb lamp device | |
| CN202049993U (en) | Light-emitting diode (LED) packaging structure | |
| CN203731154U (en) | All-angle LED lamp bulb | |
| CN203733840U (en) | LED bracket and LED illuminating part | |
| CN203348995U (en) | LED lamp | |
| CN203082755U (en) | Light emitting diode (LED) vehicle lighting source with long-strip-shaped lighting area | |
| CN209165063U (en) | A kind of LED bar graph light bulb of radiator center pillar combination foot of radiator heat dissipation | |
| US20150377472A1 (en) | Overmolded replaceable light emitting diode lamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170125 Address after: Xingtai Industrial Park Economic Development Zone, Changtai County, Fujian city of Zhangzhou province 363999 Patentee after: ZHANGZHOU LIDAXIN PHOTOELECTRON TECHNOLOGY CO., LTD. Address before: 361010 Fujian city of Zhangzhou province Changtai Xingtai County Development Zone Patentee before: Leedarson Green Lighting Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20210209 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |