CN203732159U - Non-uniformity correction device usable for thermal imager - Google Patents
Non-uniformity correction device usable for thermal imager Download PDFInfo
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- CN203732159U CN203732159U CN201320707960.2U CN201320707960U CN203732159U CN 203732159 U CN203732159 U CN 203732159U CN 201320707960 U CN201320707960 U CN 201320707960U CN 203732159 U CN203732159 U CN 203732159U
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- thermal imaging
- imaging system
- temperature
- correction device
- semiconductor
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- 238000012937 correction Methods 0.000 title claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 238000001931 thermography Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910001369 Brass Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 239000010951 brass Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 238000012360 testing method Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 206010057040 Temperature intolerance Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008543 heat sensitivity Effects 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
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Abstract
The utility model belongs to the technical field of photoelectric products, and particularly relates to a non-uniformity correction device usable for a thermal imager. The device comprises a semiconductor refrigerator and a temperature display system for displaying the temperature of the semiconductor refrigerator. The semiconductor refrigerator can provide different uniform temperature surfaces for the thermal imager through changing an input current of the semiconductor refrigerator. The device can provide two uniform temperature surfaces of different temperatures when the thermal imager conducts non-uniform correction of two points, so that better image quality can be achieved during outfield testing of the thermal imager under complex weather conditions.
Description
Technical field
The utility model belongs to photovoltaic applied technical field technical field, is specifically related to the nonuniformity correction device that a kind of thermal imaging system can be used.
Background technology
Along with the development of infrared imagery technique, the performance of thermal infrared imager has obtained significant raising, and many indexs such as resolution, heat sensitivity, dynamic range obviously improve.But the noise intrinsic due to infrared imaging device still exists, inevitably on image, show as spatial noise or fixed pattern noise, form the heterogeneity of infrared image, have a strong impact on the image quality of infrared thermal imagery.So must do Nonuniformity Correction in thermal imaging system use procedure, in order to improve image quality.Use and find through long-time test, in the time measuring remote Weak target, in order to improve image and the quality of data, preferably do 2 nonuniformity corrections, first block light path with the homogeneous background of lower temperature, and then block light path with the homogeneous background of higher temperature.
Under external field environment, do the background that non-homogeneous house of correction uses and all pick up from natural background, as adopt high elevation angle sky as low temperature background.But the uncertainty of meteorological condition during due to field trial, is therefore difficult to obtain the homogeneous background that is applicable to rectification sometimes, causes the effect of non-homogeneous rectification to reduce, and affects the most at last the image quality of thermal imaging system.
Utility model content
The utility model technical issues that need to address be thermal infrared imager under IFR conditions when field testing, be sometimes difficult to obtain and be applicable to the homogeneous background corrected, cause the effect of non-homogeneous rectification to reduce, affect the most at last the image quality of thermal imaging system.
The technical solution of the utility model is as described below:
The nonuniformity correction device that a kind of thermal imaging system can be used, comprise semiconductor cooler and temperature display system: temperature display system is for showing the temperature of semiconductor cooler, the size that semiconductor cooler can be by changing self input current provides different uniform temperature faces for thermal imaging system.
As preferred version: described semiconductor cooler comprises substrate, semiconductor refrigerating module and temperature sensor: described size of foundation base is greater than thermal imaging system camera lens actinal surface, its front surface towards camera lens is coated with high emissivity coating, and paste by semiconductor chilling plate its rear surface back to camera lens; Substrate is provided with several temperature sensors being connected with temperature display system.
As preferred version: this device is also provided with active heat removal assembly, it connects semiconductor chilling plate and realizes the long-time steady operation of semiconductor cooler.
As preferred version: this device is also provided with temperature control system, and it is connected with semiconductor cooler.
As preferred version: the semiconductor chilling plate of multi-disc parallel running is posted in described substrate rear surface.
The beneficial effects of the utility model are:
The nonuniformity correction device that thermal imaging system of the present utility model can be used, two uniform temperature faces of different temperatures can in the time that carrying out 2 Nonuniformity Corrections, thermal imaging system be provided, while making the field testing of thermal imaging system under IFR conditions, can form higher image quality.
Brief description of the drawings
Fig. 1 is the composition schematic diagram of the nonuniformity correction device that can use of thermal imaging system of the present utility model;
Fig. 2 is the semiconductor cooler structural representation of the nonuniformity correction device that can use of thermal imaging system of the present utility model.
In figure, 1-substrate, 2-semiconductor chilling plate, 3-temperature sensor.
Embodiment
Below in conjunction with drawings and Examples to a kind of thermal imaging system of the present utility model can with nonuniformity correction device be elaborated.
Embodiment 1
As shown in Figure 1, thermal imaging system in the present embodiment can with nonuniformity correction device comprise temperature display system and semiconductor cooler, temperature display system is for showing the temperature of semiconductor cooler, and the size that semiconductor cooler can be by changing self input current provides different uniform temperature faces for thermal imaging system.
As shown in Figure 2, described semiconductor cooler comprises substrate 1, semiconductor chilling plate 2 and temperature sensor 3.Described substrate 1 size is greater than thermal imaging system camera lens actinal surface, and its front surface towards camera lens is coated with high emissivity coating, so that substrate 1 surface temperature is even, paste by semiconductor chilling plate 2 its rear surface back to camera lens; Substrate 1 is provided with several temperature sensors 3 being connected with temperature display system, to monitor substrate 1 surface temperature.
Embodiment 2
The difference of the present embodiment and embodiment 1 is:
The thermal imaging system of the present embodiment can with nonuniformity correction device also comprise temperature control system, it is connected with semiconductor cooler, for controlling substrate 1 temperature.
Embodiment 3
The difference of the present embodiment and above-mentioned two embodiment is:
In the nonuniformity correction device that the thermal imaging system of the present embodiment can be used, the semiconductor chilling plate 2 of multi-disc parallel running is posted in described substrate 1 rear surface.
Embodiment 4
The difference of the present embodiment and above-mentioned three embodiment is:
The thermal imaging system of the present embodiment can with nonuniformity correction device also comprise radiating subassembly, it connects semiconductor chilling plate 2 and realizes heat radiation, ensures the long-time steady operation of equipment.
Embodiment 5
The difference of the present embodiment and above-mentioned four embodiment is:
In the nonuniformity correction device that the thermal imaging system of the present embodiment can be used, brass or aluminum material that described substrate 1 material is good heat conductivity.
Claims (4)
1. the nonuniformity correction device that thermal imaging system can be used, comprise semiconductor cooler and temperature display system, it is characterized in that: temperature display system is for showing the temperature of semiconductor cooler, the size that semiconductor cooler can be by changing self input current provides different uniform temperature faces for thermal imaging system; Wherein, semiconductor cooler comprises substrate (1), semiconductor chilling plate (2) and temperature sensor (3), described substrate (1) size is greater than thermal imaging system camera lens actinal surface, its front surface towards camera lens is coated with high emissivity coating, and paste by semiconductor chilling plate (2) its rear surface back to camera lens; Substrate (1) is provided with several temperature sensors being connected with temperature display system (3).
2. the nonuniformity correction device that thermal imaging system as claimed in claim 1 can be used, is characterized in that: this device is also provided with radiating subassembly, and it connects semiconductor chilling plate (2) and realizes heat radiation.
3. the nonuniformity correction device that thermal imaging system as claimed in claim 1 or 2 can be used, is characterized in that: the semiconductor chilling plate (2) of multi-disc parallel running is posted in described substrate (1) rear surface.
4. the nonuniformity correction device that thermal imaging system as claimed in claim 1 or 2 can be used, is characterized in that: brass or aluminum material that described substrate (1) material is good heat conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320707960.2U CN203732159U (en) | 2013-11-11 | 2013-11-11 | Non-uniformity correction device usable for thermal imager |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320707960.2U CN203732159U (en) | 2013-11-11 | 2013-11-11 | Non-uniformity correction device usable for thermal imager |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203732159U true CN203732159U (en) | 2014-07-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320707960.2U Expired - Lifetime CN203732159U (en) | 2013-11-11 | 2013-11-11 | Non-uniformity correction device usable for thermal imager |
Country Status (1)
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| CN (1) | CN203732159U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104374479A (en) * | 2014-11-24 | 2015-02-25 | 广州呼研所红外科技有限公司 | Noise reduction background device used for infrared thermography inspection |
| CN105716723A (en) * | 2016-04-05 | 2016-06-29 | 中国计量学院 | Device and method for improving temperature measuring precision of industrial site thermal imager |
| CN106403465A (en) * | 2016-11-08 | 2017-02-15 | 上海航天控制技术研究所 | Flexible mounting structure for thermoelectric refrigerating unit |
| CN107233082A (en) * | 2016-03-29 | 2017-10-10 | 广州斯摩莱信息科技有限公司 | Infrared thermal imaging detecting system |
| CN107356343A (en) * | 2017-06-27 | 2017-11-17 | 秦皇岛富连京电子股份有限公司 | Semiconductor refrigerating chip detection method based on infrared thermal imaging technique |
| CN107957297A (en) * | 2017-11-23 | 2018-04-24 | 北京环境特性研究所 | A kind of thermal imaging system radiation calibration precision analytical method |
-
2013
- 2013-11-11 CN CN201320707960.2U patent/CN203732159U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104374479A (en) * | 2014-11-24 | 2015-02-25 | 广州呼研所红外科技有限公司 | Noise reduction background device used for infrared thermography inspection |
| CN107233082A (en) * | 2016-03-29 | 2017-10-10 | 广州斯摩莱信息科技有限公司 | Infrared thermal imaging detecting system |
| CN107233082B (en) * | 2016-03-29 | 2020-04-21 | 广州斯摩莱信息科技有限公司 | Infrared thermal imaging detection system |
| CN105716723A (en) * | 2016-04-05 | 2016-06-29 | 中国计量学院 | Device and method for improving temperature measuring precision of industrial site thermal imager |
| CN105716723B (en) * | 2016-04-05 | 2018-08-07 | 中国计量学院 | Improve the apparatus and method of industry spot thermal imaging system temperature measurement accuracy |
| CN106403465A (en) * | 2016-11-08 | 2017-02-15 | 上海航天控制技术研究所 | Flexible mounting structure for thermoelectric refrigerating unit |
| CN106403465B (en) * | 2016-11-08 | 2019-03-05 | 上海航天控制技术研究所 | A kind of thermoelectric cooler flexible installing structure |
| CN107356343A (en) * | 2017-06-27 | 2017-11-17 | 秦皇岛富连京电子股份有限公司 | Semiconductor refrigerating chip detection method based on infrared thermal imaging technique |
| CN107356343B (en) * | 2017-06-27 | 2019-06-28 | 秦皇岛富连京电子股份有限公司 | Semiconductor refrigerating chip detection method based on infrared thermal imaging technique |
| CN107957297A (en) * | 2017-11-23 | 2018-04-24 | 北京环境特性研究所 | A kind of thermal imaging system radiation calibration precision analytical method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140723 |