CN203731132U - LED lamp filament substrate and lighting device - Google Patents
LED lamp filament substrate and lighting device Download PDFInfo
- Publication number
- CN203731132U CN203731132U CN201420006441.8U CN201420006441U CN203731132U CN 203731132 U CN203731132 U CN 203731132U CN 201420006441 U CN201420006441 U CN 201420006441U CN 203731132 U CN203731132 U CN 203731132U
- Authority
- CN
- China
- Prior art keywords
- led filament
- filament substrate
- bonding area
- substrate
- crystal bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model is applicable to the technical field of lighting and provides an LED lamp filament substrate and a lighting device. The LED lamp filament substrate comprises a plurality of metal frames connected in order through a plurality of transverse connection ribs; the middle of each metal frame is provided with a die-bonding area. The metal frames are in the same plane, the whole substrate is flat during manufacturing of LED lamp filaments, adding a step to flatten the substrate is not required, and the LED lamp filaments are manufactured and packaged at lower cost. Therefore, the LED lamp filament substrate is widely applicable to various lighting devices, and lighting effect is excellent.
Description
Technical field
The utility model belongs to lighting technical field, relates in particular to a kind of LED filament substrate and lighting device.
Background technology
At present, LED filament product mainly adopts transparency carrier, as crystalline ceramics, and glass etc.But pottery is expensive with glass substrate material, and existing LED filament substrate need make it smooth in the time making LED filament, and it is high that expense is made in encapsulation.
Utility model content
The object of the utility model embodiment is to provide a kind of LED filament substrate, is intended to solve existing LED filament substrate and need makes it smooth problem in the time making LED filament.
The utility model embodiment is achieved in that a kind of LED filament substrate, comprises multiple metallic frameworks that sequentially connected by horizontal dowel, and described metallic framework mid portion is crystal bonding area, and wherein said horizontal dowel is many.
Another object of the utility model embodiment is to provide a kind of lighting device, and described lighting device is made up of above-mentioned LED filament substrate.
The utility model embodiment sequentially connects the metallic framework in LED filament substrate by horizontal dowel, wherein said metallic framework mid portion is crystal bonding area, described horizontal dowel is many, under ensureing each metallic framework, part is in same plane, in making LED filament process, whole substrate is smooth, make it smooth without separately establishing operation, reduced LED filament and made packaging cost.Thereby this LED filament substrate can be widely used in various lighting devices, illuminating effect is splendid.
Brief description of the drawings
Fig. 1 is the structural representation of the LED filament substrate that provides of the utility model embodiment;
Fig. 2 is the side view of Fig. 1;
Fig. 3 is the structural representation of the metallic framework that provides of the utility model embodiment;
Fig. 4 is the structural representation of the LED filament that provides of the utility model embodiment.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
The utility model embodiment sequentially connects the metallic framework in LED filament substrate by horizontal dowel, wherein said metallic framework mid portion is crystal bonding area, described horizontal dowel is many, under ensureing each metallic framework, part is in same plane, in making LED filament process, whole substrate is smooth, make it smooth without separately establishing operation, reduced LED filament and made packaging cost.
Below in conjunction with specific embodiment, realization of the present utility model is described in detail.
As shown in Fig. 1～4, the LED filament substrate that the utility model embodiment provides comprises multiple metallic frameworks 1 that sequentially connected by horizontal dowel 6, and described metallic framework 1 mid portion is crystal bonding area 11, and wherein said horizontal dowel 6 is many.Under so having ensured each metallic framework 1, part is in same plane, and in making LED filament process, whole substrate will, in formation state, make it smooth without separately establishing operation, reduce LED filament and make packaging cost.
As preferably, this LED filament substrate also comprises many longitudinal dowels 8 that are connected with framework 7, and each longitudinal dowel 8 is parallel to each other; Described horizontal dowel 6 one end and longitudinal vertical being connected of dowel 8, the other end and described vertical being connected of metallic framework 1.So more be conducive to ensure the flatness of whole LED filament substrate, but also greatly increase the density that LED filament is arranged, improve substrate utilization rate, increase production capacity.
Metallic framework 1 described in the utility model embodiment first processes by machining, chemical etching or other forming method, meanwhile processes aforementioned lateral dowel 6 and longitudinal dowel 8.Then, make the interconnected circuit of LED chip 3 and external electrical in 11 designs of described crystal bonding area, and set firmly LED chip 3.Then, by fluorescent glue 2 described in the technological forming such as injection moulding or mold pressing, make it entirely to wrap up the part metals skeleton at LED chip 3 and place, 11(Ji crystal bonding area, crystal bonding area), thus realize linear luminous body, similar incandescent lamp illumination effect.
Conventionally, described LED filament can be both bilateral single electrode, can be also monolateral bipolar electrode, flexible design.As shown in Figure 3,4, the LED filament that the present embodiment provides is taked bilateral single electrode pattern, wherein said metallic framework 1 two ends are wire welding area 12,11You one end, described crystal bonding area and wire welding area 12 disconnect, so the positive and negative electrode of this LED filament can be disconnected, whole metallic framework 1 is destroyed less, be more conducive to make whole substrate to keep smooth.Certainly, 11 two ends, described crystal bonding area all disconnect and also can with corresponding wire welding area 12.
Wherein, a bending part 13 is established with that one end that wire welding area 12 disconnects in described crystal bonding area 11, establishes one or two welding zones 14 with the wire welding area 12 that described crystal bonding area 11 disconnects, and described two welding zones 14 are parallel to bending part 13, as shown in Figure 3,4.Locate two welding zones 14 and bending part 13 at this by described fluorescent glue 2, they are separated by a distance, and are parallel to each other.This structural design, after described fluorescent glue 2 moulding, has strengthened the bonding strength of the gap of described crystal bonding area 11 and wire welding area 12, further promotes the reliability of made LED filament.
For strengthening button glue power, ensure described fluorescent glue 2 and metallic framework 1 bond strength, establish to fill the through hole 15 of fluorescent glue near the end of crystal bonding area 11 in described wire welding area 12.The through hole 15 of this increase has reduced the area of the excessive glue of described fluorescent glue, also can shorten the distance of described fluorescent glue at the metallic framework 1 excessive glue in surface.As preferably, described through hole 15 is only filled by fluorescent glue near the part of crystal bonding area 11, so both can reach aforementioned effect, can save again described fluorescent glue.The surface of described LED filament substrate is coated with nickel film, palladium film, golden film or silverskin, strengthens this LED filament light extraction efficiency with this, and makes filament substrate surface not oxidized.
For optimizing this LED filamentray structure, make described LED filament substrate each several part size meet following formula: 0.5d < a < 5d, wherein a is the width of described crystal bonding area 11, and d is the thickness of described metallic framework 1, that is the thickness of described LED filament substrate.Described fluorescent glue 2 is for being mixed with the thermosets of fluorescent material, and it is square, circular or oval that its cross section can be, and so that the part metals skeleton at 11 places, crystal bonding area is wrapped, prevents that made LED filament from leaking blue.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.
Claims (9)
1. a LED filament substrate, is characterized in that, comprises multiple metallic frameworks that sequentially connected by horizontal dowel, and described metallic framework mid portion is crystal bonding area, and wherein said horizontal dowel is many.
2. LED filament substrate as claimed in claim 1, is characterized in that, also comprises many longitudinal dowels that are connected with framework; Described horizontal dowel one end is connected with longitudinal dowel is vertical, and the other end is connected with described metallic framework is vertical.
3. LED filament substrate as claimed in claim 1 or 2, is characterized in that, described metallic framework two ends are wire welding area, and described crystal bonding area has at least one end and wire welding area to disconnect.
4. LED filament substrate as claimed in claim 3, is characterized in that, a bending part is established in that one end that described crystal bonding area and wire welding area disconnect, and establishes one or two welding zones with the wire welding area that described crystal bonding area disconnects, and described two welding zones are parallel to bending part.
5. LED filament substrate as claimed in claim 4, is characterized in that, the through hole of fluorescent glue is established to fill in described wire welding area near the end of crystal bonding area.
6. LED filament substrate as claimed in claim 5, is characterized in that, described through hole is only filled by fluorescent glue near the part of crystal bonding area.
7. the LED filament substrate as described in claim 4,5 or 6, is characterized in that, the surface of described LED filament substrate is coated with nickel film, palladium film, golden film or silverskin.
8. LED filament substrate as claimed in claim 7, is characterized in that, described LED filament substrate each several part size meets following formula:
0.5d < a < 5d, the width that wherein a is described crystal bonding area, the thickness that d is described metallic framework.
9. a lighting device, is characterized in that, described lighting device is made up of the LED filament substrate as described in any one in claim 1～8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420006441.8U CN203731132U (en) | 2014-01-06 | 2014-01-06 | LED lamp filament substrate and lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420006441.8U CN203731132U (en) | 2014-01-06 | 2014-01-06 | LED lamp filament substrate and lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203731132U true CN203731132U (en) | 2014-07-23 |
Family
ID=51201202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420006441.8U Expired - Fee Related CN203731132U (en) | 2014-01-06 | 2014-01-06 | LED lamp filament substrate and lighting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203731132U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103851388A (en) * | 2014-01-06 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | LED (light-emitting diode) lamp filament base plate and lighting device |
-
2014
- 2014-01-06 CN CN201420006441.8U patent/CN203731132U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103851388A (en) * | 2014-01-06 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | LED (light-emitting diode) lamp filament base plate and lighting device |
| CN103851388B (en) * | 2014-01-06 | 2016-12-07 | 深圳市瑞丰光电子股份有限公司 | A kind of LED filament substrate and illuminator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103840071A (en) | LED lamp bar manufacturing method and LED lamp bar | |
| CN103872224A (en) | Novel LED (Light Emitting Diode) illuminating element | |
| CN103904197A (en) | LED lamp filament piece, manufacturing method of LED lamp filament piece and LED lamp filament piece bulb | |
| CN103851388A (en) | LED (light-emitting diode) lamp filament base plate and lighting device | |
| CN203659854U (en) | Spiral LED packaging lamp filament | |
| CN101958387A (en) | Novel LED light resource module packaging structure | |
| CN203731132U (en) | LED lamp filament substrate and lighting device | |
| CN103824926A (en) | Method for producing multi-chip LED (light-emitting diode) package | |
| CN202758885U (en) | Light emitting diode module packaging structure | |
| CN103700753A (en) | 360-degree luminous flexible LED (Light-emitting Diode) light bar | |
| CN103682066A (en) | Light-emitting diode module and manufacturing method thereof | |
| CN203746847U (en) | LED filament and illumination device | |
| CN203367278U (en) | White light LED light source device | |
| CN203644775U (en) | LED filament and lighting apparatus | |
| CN103855280A (en) | LED wafer-level packaging method | |
| CN203733836U (en) | LED filament and illuminating device | |
| CN204216084U (en) | A kind of LED silk | |
| CN107482108A (en) | A kind of new SMD lamp beads | |
| CN205303508U (en) | High -power LED lamp pearl of high light efficiency of low thermal resistance | |
| CN203746897U (en) | Led | |
| CN103855145B (en) | A kind of LED filament and ligthing paraphernalia | |
| CN203617344U (en) | Surface mount type LED lead frame | |
| CN102916089B (en) | Method for forming packaging structure of light emitting diode and method for forming base of packaging structure | |
| CN201887044U (en) | Encapsulating structure for LED light source module | |
| CN201758139U (en) | Novel LED light source module packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20160106 |