CN203708530U - Coil panel, coil panel assembly and induction cooker - Google Patents
Coil panel, coil panel assembly and induction cooker Download PDFInfo
- Publication number
- CN203708530U CN203708530U CN201420007366.7U CN201420007366U CN203708530U CN 203708530 U CN203708530 U CN 203708530U CN 201420007366 U CN201420007366 U CN 201420007366U CN 203708530 U CN203708530 U CN 203708530U
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- China
- Prior art keywords
- coil panel
- pcb substrate
- coil
- louvre
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000006698 induction Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 74
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 230000000191 radiation effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 12
- 230000008901 benefit Effects 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 230000004087 circulation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 210000005069 ears Anatomy 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- General Induction Heating (AREA)
Abstract
The utility model discloses a coil panel, a coil panel assembly and an inductor cooker. The coil panel comprises PCB substrates and coils arranged on the PCB substrates, wherein each PCB substrate is provided with radiating holes, and projection of the coil on the PCB substrate is separate from the radiating holes. The coil panel of the utility model is good in heat radiation effect and has a wide application range.
Description
Technical field
The utility model relates to electrical equipment manufacturing technology field, in particular to a kind of coil panel, have the coil panel assembly of described coil panel and have the electromagnetic oven of described coil panel assembly.
Background technology
PCB(printed circuit board in correlation technique) coil panel, owing to connecting between layers very closely, coil is covered by substrate, there is no heat-dissipating space, and while causing using, heat is difficult for distributing, and coil heating is serious, has seriously limited the application of PCB coil panel.
Utility model content
The utility model is intended to solve at least to a certain extent one of above-mentioned technical problem in correlation technique.For this reason, an object of the present utility model is to propose a kind of coil panel, and this coil panel has good heat dissipation effect, the advantage such as applied widely.
Another object of the present utility model is to propose a kind of coil panel assembly with described coil panel.
Another object of the present utility model is to propose a kind of electromagnetic oven with described coil panel assembly.
For achieving the above object, first aspect of the present utility model proposes a kind of coil panel, described coil panel comprises PCB substrate and be located at the coil on described PCB substrate, and described PCB substrate is provided with louvre, and the projection of described coil on described PCB substrate separates with described louvre.
According to coil panel of the present utility model, by described louvre being set on described PCB substrate, and stagger in described louvre and the described coil position on described PCB substrate, can make like this air pass through described louvre at described coil panel internal circulation, thereby take away the heat of described coil, described coil is dispelled the heat, the temperature when significantly having reduced described coil panel and using, and then can widen the scope of application of described coil panel.Therefore, there is good heat dissipation effect, the advantage such as applied widely according to coil panel of the present utility model.
In addition, can also there is following additional technical characterictic according to coil panel of the present utility model:
Described PCB substrate is multiple, described coil is multiple, multiple described PCB substrates and multiple described coil alternatively up and down are stacked, the projection of multiple described coils in horizontal plane is overlapping, on each described PCB substrate, be equipped with described louvre, the projection of the louvre on multiple described PCB substrates in horizontal plane is overlapping and separate with the projection of multiple described coils in horizontal plane.Can improve thus the inductance value of described coil panel.
Described coil be multiturn and in the shape of a spiral dish be located on described PCB substrate, between coil, there is gap described in two adjacent circles, described louvre is positioned at described gap location.Can make like this position of described coil and described louvre stagger, guarantee the radiating effect of described louvre to described coil.
Described PCB substrate is provided with multiple described louvres, and each described louvre is the arcuate socket along the circumferential extension of place PCB substrate, and multiple described louvres are arranged in the multiple heat dissipating ring groups that arrange with one heart with the center of circle of place PCB substrate.Can further improve thus the radiating effect of described coil panel.
Each described heat dissipating ring group is made up of the multiple described louvre of the circumferential spaced set along place PCB substrate.Can further improve thus the radiating effect of multiple described louvres to described coil.
The quantity of the louvre that each described heat dissipating ring group comprises is identical and equal in length.Both can make thus the manufacture of described PCB substrate convenient.
The length of the louvre of multiple described heat dissipating ring groups is outwards increased gradually by the center of circle of place PCB substrate.Can improve like this uniformity of multiple described heat dissipating ring groups to described coil heat radiation,
Second aspect of the present utility model proposes a kind of coil panel assembly, and described coil panel assembly comprises: coil panel, and described coil panel is according to the coil panel described in first aspect of the present utility model, described PCB substrate is provided with magnetic post hole; And magnetic stripe, described magnetic stripe has magnetic post, and described magnetic stripe is located on described coil panel, and described magnetic post is engaged in described magnetic post hole.
According to coil panel assembly of the present utility model, by utilizing according to the coil panel described in first aspect of the present utility model, have that inductance value is high, a good heat dissipation effect, the advantage such as applied widely.
Described coil is located between the center and outer peripheral edges of described PCB substrate, and described magnetic post hole is formed on center and/or the outer peripheral edges place of described PCB substrate.Can avoid thus described magnetic post to contact with described coil.
The third aspect of the present utility model proposes a kind of electromagnetic oven, and described electromagnetic oven comprises according to the coil panel assembly described in second aspect of the present utility model.
According to electromagnetic oven of the present utility model, by utilizing according to the coil panel assembly described in second aspect of the present utility model, there is the advantages such as the efficiency of heating surface is high, performance safety is reliable.
Accompanying drawing explanation
Fig. 1 is according to the perspective view of the coil panel of the utility model embodiment.
Fig. 2 is the partial structurtes schematic diagram according to the coil panel of the utility model embodiment.
Fig. 3 is the planar structure schematic diagram according to the coil panel of the utility model embodiment.
Fig. 4 is according to the cutaway view of the coil panel of the utility model embodiment.
Reference numeral: coil panel 1, PCB substrate 10, louvre 11, magnetic post hole 12, mounting ear 13, coil 20.
Embodiment
Describe embodiment of the present utility model below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Be exemplary below by the embodiment being described with reference to the drawings, be intended to for explaining the utility model, and can not be interpreted as restriction of the present utility model.
Describe according to the coil panel 1 of the utility model embodiment below with reference to Fig. 1-Fig. 4.As Figure 1-Figure 4, comprise that according to the coil panel 1 of the utility model embodiment PCB substrate 10 is located at the coil 20 on PCB substrate 10, PCB substrate 10 is provided with louvre 11, and the projection of coil 20 on PCB substrate 10 separates with louvre 11.
According to the coil panel 1 of the utility model embodiment, by louvre 11 is set on PCB substrate 10, and louvre 11 staggers with the position of coil 20 on PCB substrate 10, can make like this air pass through louvre 11 at coil panel 1 internal circulation, thereby take away the heat of coil 20, coil 20 is dispelled the heat, significantly reduced temperature when coil panel 1 uses, and then can widen the scope of application of coil panel 1.Therefore, there is good heat dissipation effect, the advantage such as applied widely according to the coil panel 1 of the utility model embodiment.
Particularly, PCB substrate 10 can be multiple, coil 20 can be also multiple, multiple PCB substrates 10 and multiple coil 20 are can alternatively up and down stacked, the projection of multiple coils 20 in horizontal plane can be overlapping, on each PCB substrate 10, can be equipped with louvre 11, the projection of the louvre 11 on multiple PCB substrates 10 in horizontal plane can be overlapping, and the projection in horizontal plane of louvre 11 on multiple PCB substrate 10 can separate with the projection of multiple coils 20 in horizontal plane.The inductance value of coil panel 1 can be improved thus, thereby the efficiency of heating surface of electromagnetic oven can be improved.
Particularly, when making, can first coil 20 be overlayed on PCB substrate 10, the same position on each PCB substrate 10 is offered louvre 11, and then multiple coils 20 and multiple PCB substrate 10 are carried out to pressing, completes making.
In a specific embodiment of the present utility model, as shown in Figure 1-Figure 3, coil 20 can coil and be located on PCB substrate 10 for multiturn and in the shape of a spiral, can have gap between two adjacent circle coils 20, and louvre 11 can be positioned at described gap location.Can make full use of like this space on PCB substrate 10, be staggered in coil 20 and the position of louvre 11, guarantee the radiating effect of louvre 11 to coil 20.
In order further to improve the radiating effect of coil panel 1, multiple louvres 11 can be set on PCB substrate 10, each louvre 11 can be the arcuate socket along the circumferential extension of place PCB substrate 10, and multiple louvres 11 can be arranged in the multiple heat dissipating ring groups, the each described heat dissipating ring group that arrange with one heart with the center of circle of place PCB substrate 10 can be between adjacent two circle coils 20.Like this can be in the multiple circulations of air of the interior formation of coil panel 1 loop, make more air enter coil panel 1 inside to take away more heat, thus the temperature can further reduce coil 20 and use time.
Wherein, each described heat dissipating ring group can be made up of multiple louvres 11 of the circumferential spaced set along place PCB substrate 10.That is to say, multiple louvres 11 can be arranged along the circumferential and spaced radial of PCB substrate 10 respectively.Can further improve thus the radiating effect of multiple louvres 11 to coil 20.
Particularly, the quantity of the louvre 11 that each described heat dissipating ring group comprises can be identical, and the length of the louvre 11 that comprises of each described heat dissipating ring group can equate.For example, each described heat dissipating ring group can comprise six louvres 11 equal in length.Both can guarantee thus the radiating effect of louvre 11 to coil 20, again can be so that the processing of multiple louvre 11, so that the manufacture of PCB substrate 10 is convenient.
Advantageously, as shown in Figure 1-Figure 3, the length of the louvre 11 of multiple described heat dissipating ring groups can outwards be increased gradually by the center of circle of place PCB substrate 10.In other words, the multiple described heat dissipating ring group on each PCB substrate 10, the length that is wherein positioned at the louvre 11 that comprises of heat dissipating ring group in outside can be greater than the length that is positioned at the louvre 11 that the heat dissipating ring group of inner side comprises.The quantity of the louvre 11 that can comprise in each described heat dissipating ring group is like this identical, improve the uniformity that multiple described heat dissipating ring groups are dispelled the heat to coil 20, guarantee that the air that the heat of the various piece of coil 20 all can be circulated takes away.
In a concrete example of the present utility model, PCB substrate 10 can be glass mat, and coil 20 can be Copper Foil.
As shown in Figure 1-Figure 3, the outer peripheral edges of each PCB substrate 10 can be provided with mounting ear 13, the mounting ear 13 of multiple PCB substrates 10 can be on above-below direction position correspondence.Can utilize thus multiple mounting ears 13 that coil panel 1 is arranged in corresponding equipment, thereby can make the easier for installation, firm of coil panel 1.
Coil panel assembly according to the utility model embodiment is described below, and described coil panel assembly comprises coil panel and magnetic stripe (not shown).
Described coil panel is the coil panel 1 according to the utility model above-described embodiment, and PCB substrate 10 is provided with magnetic post hole 12.Described magnetic stripe has magnetic post, and described magnetic stripe is located on coil panel 1, and described magnetic post is engaged in magnetic post hole 12.
According to the coil panel assembly of the utility model embodiment, by utilizing according to the coil panel 1 of the utility model above-described embodiment, have that inductance value is high, a good heat dissipation effect, the advantage such as applied widely.
Particularly, as shown in figures 1 and 3, coil 20 can be located between the center and outer peripheral edges of PCB substrate 10, and magnetic post hole 12 can be formed on center and/or the outer peripheral edges place of PCB substrate 10.Can avoid thus described magnetic post to contact with coil 20.
Advantageously, between described magnetic stripe and coil panel 1, can be connected by fixing glue.Particularly, described magnetic stripe can be bonded on PCB substrate 10 by fixing glue.Can improve thus the stability of described magnetic stripe.
The electromagnetic oven according to the utility model embodiment is described below, and described electromagnetic oven comprises the coil panel assembly according to the utility model above-described embodiment.
According to the electromagnetic oven of the utility model embodiment, by utilizing according to the coil panel assembly of the utility model above-described embodiment, there is the advantages such as the efficiency of heating surface is high, performance safety is reliable.
Be all known for those of ordinary skills according to other formations of the electromagnetic oven of the utility model embodiment and operation, be not described in detail here.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of indications such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, rather than device or the element of indication or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as restriction of the present utility model.
In addition, term " first ", " second " be only for describing object, and can not be interpreted as indication or hint relative importance or the implicit quantity that indicates indicated technical characterictic.Thus, one or more these features can be expressed or impliedly be comprised to the feature that is limited with " first ", " second ".In description of the present utility model, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the utility model, unless otherwise clearly defined and limited, the terms such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and for example, can be to be fixedly connected with, and can be also to removably connect, or integral; Can be mechanical connection, can be also electrical connection; Can be to be directly connected, also can indirectly be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, can understand as the case may be the concrete meaning of above-mentioned term in the utility model.
In the utility model, unless otherwise clearly defined and limited, First Characteristic Second Characteristic it " on " or D score can comprise that the first and second features directly contact, also can comprise that the first and second features are not directly contacts but by the other feature contact between them.And, First Characteristic Second Characteristic " on ", " top " and " above " comprise First Characteristic directly over Second Characteristic and oblique upper, or only represent that First Characteristic level height is higher than Second Characteristic.First Characteristic Second Characteristic " under ", " below " and " below " comprise First Characteristic under Second Characteristic and tiltedly, or only represent that First Characteristic level height is less than Second Characteristic.
In the description of this specification, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present utility model or example in conjunction with specific features, structure, material or the feature of this embodiment or example description.In this manual, to the schematic statement of above-mentioned term not must for be identical embodiment or example.And specific features, structure, material or the feature of description can be with suitable mode combination in any one or more embodiment or example.In addition, those skilled in the art can engage the different embodiment that describe in this specification or example and combine.
Although illustrated and described embodiment of the present utility model above, be understandable that, above-described embodiment is exemplary, can not be interpreted as restriction of the present utility model, those of ordinary skill in the art can change above-described embodiment in scope of the present utility model, modification, replacement and modification.
Claims (10)
1. a coil panel, is characterized in that, comprises PCB substrate and is located at the coil on described PCB substrate, and described PCB substrate is provided with louvre, and the projection of described coil on described PCB substrate separates with described louvre.
2. coil panel according to claim 1, it is characterized in that, described PCB substrate is multiple, described coil is multiple, multiple described PCB substrates and multiple described coil alternatively up and down are stacked, the projection of multiple described coils in horizontal plane is overlapping, on each described PCB substrate, is equipped with described louvre, and the projection of the louvre on multiple described PCB substrates in horizontal plane is overlapping and separate with the projection of multiple described coils in horizontal plane.
3. coil panel according to claim 1, is characterized in that, described coil be multiturn and in the shape of a spiral dish be located on described PCB substrate, between coil, there is gap described in two adjacent circles, described louvre is positioned at described gap location.
4. coil panel according to claim 3, it is characterized in that, described PCB substrate is provided with multiple described louvres, each described louvre is the arcuate socket along the circumferential extension of place PCB substrate, and multiple described louvres are arranged in the multiple heat dissipating ring groups that arrange with one heart with the center of circle of place PCB substrate.
5. coil panel according to claim 4, is characterized in that, each described heat dissipating ring group is made up of the multiple described louvre of the circumferential spaced set along place PCB substrate.
6. coil panel according to claim 5, is characterized in that, the quantity of the louvre that each described heat dissipating ring group comprises is identical and equal in length.
7. coil panel according to claim 6, is characterized in that, the length of the louvre of multiple described heat dissipating ring groups is outwards increased gradually by the center of circle of place PCB substrate.
8. a coil panel assembly, is characterized in that, comprising:
Coil panel, described coil panel is that described PCB substrate is provided with magnetic post hole according to the coil panel described in any one in claim 1-7; With
Magnetic stripe, described magnetic stripe has magnetic post, and described magnetic stripe is located on described coil panel, and described magnetic post is engaged in described magnetic post hole.
9. coil panel assembly according to claim 8, is characterized in that, described coil is located between the center and outer peripheral edges of described PCB substrate, and described magnetic post hole is formed on center and/or the outer peripheral edges place of described PCB substrate.
10. an electromagnetic oven, is characterized in that, comprises coil panel assembly according to claim 8 or claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420007366.7U CN203708530U (en) | 2014-01-06 | 2014-01-06 | Coil panel, coil panel assembly and induction cooker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420007366.7U CN203708530U (en) | 2014-01-06 | 2014-01-06 | Coil panel, coil panel assembly and induction cooker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203708530U true CN203708530U (en) | 2014-07-09 |
Family
ID=51058905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420007366.7U Expired - Lifetime CN203708530U (en) | 2014-01-06 | 2014-01-06 | Coil panel, coil panel assembly and induction cooker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203708530U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108696957A (en) * | 2017-04-07 | 2018-10-23 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel and its processing method, electromagnetism cooking equipment |
-
2014
- 2014-01-06 CN CN201420007366.7U patent/CN203708530U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108696957A (en) * | 2017-04-07 | 2018-10-23 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel and its processing method, electromagnetism cooking equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140709 |