CN203707481U - High-speed board-to-board electronic connector and multilayer circuit board assembly - Google Patents
High-speed board-to-board electronic connector and multilayer circuit board assembly Download PDFInfo
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- CN203707481U CN203707481U CN201320699815.4U CN201320699815U CN203707481U CN 203707481 U CN203707481 U CN 203707481U CN 201320699815 U CN201320699815 U CN 201320699815U CN 203707481 U CN203707481 U CN 203707481U
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Abstract
The utility model discloses a high-speed board-to-board electronic connector. The high-speed board-to-board electronic connector comprises a board shaped insulation main body, a grounding through hole, a grounding terminal, a signal through hole, a signal terminal, and a wire, wherein a wiring groove and a first through hole are opened in the board shaped insulation main body, the wiring groove stretches and is connected with the first through hole to form a shielding space in a surrounding manner, and a second through hole is disposed in the shielding space; the grounding through hole is disposed in the first through hole; the grounding terminal is disposed in the grounding through hole and forms close cooperation with an internal wall of the grounding through hole, and two ends of the grounding terminal protrudes at opening parts at two ends of the grounding through hole; the signal through hole is disposed in the second through hole; the signal terminal is disposed in the signal through hole and is in close cooperation with an internal wall of the signal through hole, and two ends of the signal terminal protrudes at opening parts at two ends of the signal through hole; the wire is disposed in the wiring groove and stretches along the wiring groove, the wire is connected with the grounding through hole, and the wire is provided with at least a shielding through hole. The utility model also discloses a multilayer circuit board assembly comprising the high-speed board-to-board electronic connector. The high-speed board-to-board electronic connector is capable of overcoming the defect of large size of an electronic connector in the prior art, and providing the high-speed board-to-board electronic connector and the multilayer circuit board assembly which are good in shielding effect, and capable of reducing size.
Description
Technical field
The utility model relates to art of printed circuit boards.Be specially a kind of High-Speed-Board to plate electric power connector and there is the multilayer circuit board component of this kind of High-Speed-Board to plate electric power connector.
Background technology
Interference between the impedance stability of the signal terminal of high-speed electrical connector and signal and signal is the key factor that affects the performance of electric power connector.Therefore,, in the design of existing high-speed electrical connector, how to guarantee that impedance and lower crosstalking that the signal terminal in high-speed electrical connector keeps stable in the process of signal transmission are the emphasis that designer need to consider.The crosstalking of high-speed electrical connector normally cause by adjacent several signals, and the source of crosstalking comprises crosstalking between the same thin slice (Wafer) of high-speed electrical connector and contiguous slices.A for example differential signal in center, not only can be subject to the interference of adjacent two signals in same thin slice, is also subject to the impact of the signal of upper and lower two adjacent thin slices simultaneously.
In the design of existing high-speed electrical connector, in order to reduce crosstalking between the signal of same thin slice, conventionally in same thin slice inside, between Difference signal pair pin, add ground pin.And between contiguous slices, conventionally by adding ground shielding sheet, be generally the metallic shield such as iron plate or copper sheet sheet, control crosstalking between contiguous slices signal.In addition, more existing high-speed electrical connectors, can be in the bottom of male connector and both sides arrange respectively and shield accordingly chip architecture, also can reach the object of shielding.Although interpolation shielding sheet can reach the object of crosstalk reduction, but the size that can make undoubtedly connector becomes large, and at present owing to chasing the miniaturization of electronic device, the installing space of leaving electric power connector for is more and more less, this requires the size of electric power connector also will dwindle, and the electric power connector that shielding sheet is housed obviously cannot meet this requirement.
Utility model content
The technical problem that the utility model solves is to overcome the large shortcoming of existing electric power connector size, provide a kind of shield effectiveness well simultaneously again the High-Speed-Board of reduced size to plate electric power connector and multilayer circuit board component.
High-Speed-Board of the present utility model, to plate electric power connector, comprising:
Tabular insulating body, described insulating body offers the trough that connects described insulating body upper and lower surface, also offer the first through hole that at least one connects described insulating body upper and lower surface, described trough extends and joins and surround at least one shielding space with described the first through hole, is provided with at least one and connects the second through hole of described insulating body upper and lower surface in described shielding space;
At least one ground connection via hole, described ground connection via hole is located in described the first through hole;
At least one earth terminal, described earth terminal is located in described ground connection via hole, and forms tight fit with the inwall of described ground connection via hole, and the two ends of described earth terminal are outstanding from the both ends open place of described ground connection via hole;
At least one signal via, described signal via is located in described the second through hole;
At least one signal terminal, described signal terminal is located in described signal via and with the inwall of described signal via and is formed tight fit, and the two ends of described signal terminal are outstanding from the both ends open place of described signal via;
Cabling, described cabling is located in described trough and is extended along described trough, and cabling connects described ground connection via hole, and described cabling is provided with at least one shielding via hole.
As preferably, described insulating body is made up of pcb board material.
As preferably, described trough and described the first through hole are cut apart described insulating body to be synthetic into multiple shielding spaces that adjoin, each described shielding space is surrounded with the trough that is connected two described the first through holes by two described the first through holes, and two described the first through holes are oppositely arranged.
As preferably, in each described shielding space, be provided with two described the second through holes, in each described the second through hole, be provided with a described signal via.
As preferably, the upper surface of the upper surface of described cabling and described ground connection via hole is concordant and be connected, and the lower surface of the lower surface of described cabling and described ground connection via hole is concordant and be connected.
As preferably, described earth terminal and/or signal terminal are diamond, the wherein outer wall at two of diamond relative angles and the inwall tight fit of described ground connection via hole and/or described signal via, two other relative cornicult of diamond for described ground connection via hole and/opening of signal via.
As preferably, described earth terminal and/or signal terminal protrude from described ground connection via hole and/part of the opening of signal via is round and smooth arc.
As preferably, in described shielding space, be also provided with the pore that at least one runs through described insulating body upper and lower surface.
As preferably, described pore and described the second through hole interval arrange.
As preferably, described signal terminal is difference signal terminal.
The utility model also provides a kind of multilayer circuit board component, comprises at least two-tier circuit plate, between adjacent circuit plate, by High-Speed-Board as above, plate electric power connector is connected.
High-Speed-Board of the present utility model to plate electric power connector and multilayer circuit board component compared with prior art, has following beneficial effect:
High-Speed-Board of the present utility model has surrounded blind zone to the signal via of plate electric power connector and the cabling that offers shielding via hole, prevents the signal phase mutual interference that signal terminal transmits, and its shield effectiveness is suitable with the effect of employing interpolation metallic shield sheet.Cabling is embedded in insulating body, can make the size reduction of whole high speed board to board connector compared with the structure of metallic shield sheet is set between plate.
In the situation that insulating body is made up of pcb board material, because the thickness of pcb board material is very little, this makes the utility model on the basis that keeps good anti-crosstalk performance, can further reduce the thickness of whole high speed board to board connector.
Accompanying drawing explanation
Fig. 1 is the High-Speed-Board of an embodiment of the utility model structural representation to plate electric power connector.
Fig. 2 is that the High-Speed-Board of an embodiment of the utility model is removed the structural representation after insulating body to plate electric power connector.
Fig. 3 is the structure for amplifying schematic diagram of the High-Speed-Board of an embodiment of the utility model ground connection via hole to plate electric power connector.
Fig. 4 is the structure for amplifying schematic diagram of the High-Speed-Board of an embodiment of the utility model earth terminal to plate electric power connector.
Fig. 5 is the structure for amplifying schematic diagram after the High-Speed-Board of an embodiment of the utility model coordinates with ground connection via hole the earth terminal of plate electric power connector.
Fig. 6 is the cabling of High-Speed-Board to plate electric power connector and the structural representation of earth terminal of an embodiment of the utility model.
Fig. 7 is the STRUCTURE DECOMPOSITION schematic diagram of the multilayer circuit board component of an embodiment of the utility model.
1-insulating body, 2-ground connection via hole, 3-earth terminal, 4-signal via, 5-signal terminal, 6-cabling, 7-upper surface, 8-lower surface, 9-shields via hole, 10-circuit board, 11-High-Speed-Board is to plate electric power connector, 12-pore.
Embodiment
Fig. 1 is the High-Speed-Board of an embodiment of the utility model structural representation to plate electric power connector, and Fig. 2 is that the High-Speed-Board of an embodiment of the utility model is removed the structural representation after insulating body to plate electric power connector.As depicted in figs. 1 and 2, High-Speed-Board of the present utility model comprises plate electric power connector 11: tabular insulating body 1, insulating body 1 offers the first through hole of at least one trough that connects insulating body 1 upper and lower surface 7,8 and at least one perforation insulating body 1 upper and lower surface 7,8, and trough extends and joins and surround at least one shielding space with the first through hole.In shielding space, be provided with the second through hole that at least one connects insulating body 1 upper and lower surface 7,8.In the first through hole, be provided with at least one ground connection via hole 2, in ground connection via hole 2, be provided with earth terminal 3.Earth terminal 3 forms tight fit with the inwall of ground connection via hole 2 and is electrically connected to realize, give prominence to from the both ends open place of ground connection via hole 2 for matching with the ground pin of printed circuit board (PCB) at the two ends of earth terminal 3, and earth terminal 3 protrudes from the height of ground connection via hole 2 and can set according to actual demand.
In the second through hole, be provided with signal via 4, in signal via 4, be provided with signal terminal 5, the inwall of signal terminal 5 and signal via 4 forms tight fit and be electrically connected to realize, being electrically connected of the two ends of signal terminal 5 outstanding respective element with realization and circuit board from the both ends open place of signal via 4.
Ground connection via hole 2 and signal via 4 are hollow conductor, and in the time that alternating current passes through conductor, because induction effect causes that on cross-sectional area of conductor, CURRENT DISTRIBUTION is inhomogeneous, nearer conductive surface current density is larger.This phenomenon claims " skin effect ".Skin effect increases the impedance of conductor, adopts the version of via hole, makes to pass through from via hole by the electric current major part of earth terminal 3 and signal terminal 5, makes electric power connector keep stable and less impedance.The shape of the cross section of ground connection via hole 2 and signal via 4 can be circle, rectangle or other shapes.Correspondingly, the shape of the first through hole and the second through hole is also suitable with the shape of ground connection via hole 2 and signal via 4.Fig. 3 is the structure for amplifying schematic diagram of the High-Speed-Board of an embodiment of the utility model ground connection via hole to plate electric power connector, and in the present embodiment, the cross section of via hole is rectangle.The pore wall thickness of ground connection via hole 2 and signal via 4 need only meet respectively the requirement of the mechanical force that it is applied of bearing earth terminal 3 and signal terminal 5.
Cabling 6 is conductor, generally adopts copperly, and its thickness and width can be set according to the actual needs.Cabling 6 is located in trough and is extended along trough, Fig. 6 is the cabling 6 of High-Speed-Board to plate electric power connector and the structural representation of earth terminal 3 of an embodiment of the utility model, as shown in Figure 6, cabling 6 connects ground connection via hole 2 to realize and being electrically connected with ground connection via hole 2, and cabling 6 is provided with at least one shielding via hole 9.Cabling 6 and ground connection via hole 2 are used for providing return flow path for the electric current in signal terminal 5.In the present embodiment, shielding via hole 9 runs through the through hole of cabling 6 on thickness direction, and it is shaped as rectangle.Shielding via hole 9 shortens return flow path, reduces the area that the return flow path of signal surrounds, and reduces the EMI(electromagnetic interference of signal) radiation, thus reduce crosstalking between signal.Complete High-Speed-Board of the present utility model to the connection between plate electric power connector and circuit board 10 after, the upper and lower surface 7,8 of cabling 6 be connected after circuit board between have certain distance, this distance is set according to the actual needs.
By above structure, ground connection via hole 2 has surrounded blind zone with the cabling 6 that offers shielding via hole 9, prevents the signal phase mutual interference that signal terminal 5 transmits, and its shield effectiveness is suitable with the effect that metallic shield sheet is added in employing.Cabling 6 is embedded in insulating body 1, has cancelled metallic shield sheet, makes the size reduction of whole high speed board to board connector.
As preferably, insulating body 1 is by PCB(Printed Circuit Board), be that printed circuit board sheet material forms, the thickness of pcb board material is very little, and this makes the utility model on the basis that keeps good anti-crosstalk performance, further reduce the thickness of whole high speed board to board connector.The thickness of pcb board material is preferably 0.5mm-2mm.Pcb board material is selected the sheet material that dielectric constant is lower.In the present embodiment, pcb board material can be Neclo4000-13 SI model sheet material.
As further preferred, trough and the first through hole are cut apart insulating body 1 to be synthetic into multiple shielding spaces that adjoin.In the present embodiment, form 16 shielding spaces, be arranged in 4 thin slices, each thin slice comprises 4 shielding spaces.In each shielding space, be provided with two the second through holes, be provided with a signal via 4 in each the second through hole, be provided with a signal terminal 5 in each signal via 4, in the present embodiment, signal terminal 5 is difference signal terminal 5.
Each shielding space is surrounded with the trough that is connected two the first through holes by two the first through holes, and two the first through holes are oppositely arranged.In the present embodiment, ground connection via hole 2 and the earth terminal 3 between same row and adjacent shielding space shares.In addition, as shown in Figure 6, between the earth terminal 3 of adjacent row's adjacent shielding space, stagger, can realize better anti-crosstalk effect.
As preferably, the upper surface 7 of cabling 6 is concordant with the upper surface 7 of ground connection via hole 2 and be connected, and the lower surface 8 of cabling 6 is concordant with the lower surface 8 of ground connection via hole 2 and be connected, to guarantee stable being electrically connected between cabling 6 and ground connection via hole 2.
As preferably, the direction of extending along cabling 6 is provided with multiple shielding via holes 9 on cabling 6.The width of shielding via hole 9 is 8mil(mil, and this area is commonly used to represent the unit of thickness, 1mil=25.39999918 μ m, lower with) to 20mil, between adjacent shielding via hole 9, be spaced apart 6mil to 20mil.On the one hand, multiple shielding via holes can play good shielding action, and on the other hand, the density of shielding via hole rationally arranges, and prevents from affecting too greatly because of density the integrality of signal.
Fig. 4 is the structure for amplifying schematic diagram of the High-Speed-Board of an embodiment of the utility model earth terminal 3 to plate electric power connector, and Fig. 5 is the structure for amplifying schematic diagram after the High-Speed-Board of an embodiment of the utility model coordinates with ground connection via hole 2 earth terminal 3 of plate electric power connector.As shown in Figure 4 and Figure 5, as preferably, earth terminal 3 is diamond, the wherein outer wall at two of diamond relative angles and the inwall tight fit of ground connection via hole 2, two other relative cornicult of diamond for the opening of ground connection via hole 2 so that match with the parts of printed circuit board (PCB).The shape of earth terminal 3 and signal terminal 5 can be identical, also can be different.In the present embodiment, the shape of ground connection via hole and signal via is identical, and signal terminal 5 is identical with the shape of earth terminal 3.The terminal one side of this shape can be saved conductor material compared with solid terminal, there is on the other hand good mechanical performance, can form reliable and stable being electrically connected with the inwall of via hole, certainly, signal terminal and earth terminal also can adopt other hollow and with the friction tight shape of via hole.
As preferably, earth terminal 3 and/or signal terminal 5 protrude from ground connection via hole 2 and/part of the opening of signal via 4 is round and smooth arc, as 4 and Fig. 5 as shown in.This design can reduce the mechanical stress of terminal itself on the one hand, is also convenient on the other hand the cooperation between the respective element of printed circuit board (PCB).
As preferably, in shielding space, be also provided with at least one pore 12(that runs through insulating body upper and lower surface and for example see Fig. 1).In high-frequency range, in signals transmission, signal is along the place arriving, between holding wire and reference planes (power supply or ground level) due to the foundation of electric field, can produce an immediate current, if transmission line is isotropic, so as long as signal is transmitting, just there is all the time an electric current I, and if the output level of signal is V, in signals transmission, transmission line will equivalence become a resistance, size is V/I, this equivalent resistance is called to the characteristic impedance Z of transmission line, and characteristic impedance is relevant to capacitance characteristic.Signal is in the process of transmission, if the characteristic impedance on transmission path changes, signal will produce reflection at the node of impedance discontinuity.It is the capacitive in order to reduce signal that pore is set in shielding space, reduces signal capacitance characteristic around, thereby improves characteristic impedance.In the present embodiment, be provided with three pores 12 in each shielding space, pore 12 and the second through hole interval arrange.
In the present embodiment, signal terminal 5 is difference signal terminal.Certainly the also terminal of other kinds of the signal terminal 5 in the utility model, is also applicable to the transmission of other signals.
The utility model also provides a kind of multilayer circuit board component, Fig. 7 is the STRUCTURE DECOMPOSITION schematic diagram of the multilayer circuit board component of an embodiment of the utility model, as shown in Figure 7, comprise at least two-tier circuit plate 10, between adjacent circuit board 10, by plate, plate electric power connector is connected, plate is that High-Speed-Board is as above to plate electric power connector 11 to plate electric power connector.After having it should be noted that High-Speed-Board is to the connection between plate electric power connector 11 and circuit board 10, between the upper and lower surface 7,8 of cabling 6 and circuit board 10, have certain distance, the two is discontiguous, and this distance is set according to the actual needs.
Multilayer circuit board component of the present utility model, has good anti-signal cross-talk performance on the one hand, and its size reduces greatly with respect to existing electric power connector on the other hand, thereby can adapt to the trend of electronics miniaturization.
Above embodiment is only exemplary embodiment of the present utility model, is not used in restriction the utility model, and protection range of the present utility model is defined by the claims.Those skilled in the art in essence of the present utility model and protection range, various modifications that the utility model is made or be equal to replacement and also drop in protection range of the present utility model.
Claims (11)
1. High-Speed-Board, to a plate electric power connector, is characterized in that, comprising:
Tabular insulating body, described insulating body offers the trough that connects described insulating body upper and lower surface, also offer the first through hole that at least one connects described insulating body upper and lower surface, described trough extends and joins and surround at least one shielding space with described the first through hole, is provided with at least one and connects the second through hole of described insulating body upper and lower surface in described shielding space;
At least one ground connection via hole, described ground connection via hole is located in described the first through hole;
At least one earth terminal, described earth terminal is located in described ground connection via hole, and forms tight fit with the inwall of described ground connection via hole, and the two ends of described earth terminal are outstanding from the both ends open place of described ground connection via hole;
At least one signal via, described signal via is located in described the second through hole;
At least one signal terminal, described signal terminal is located in described signal via and with the inwall of described signal via and is formed tight fit, and the two ends of described signal terminal are outstanding from the both ends open place of described signal via;
Cabling, described cabling is located in described trough and is extended along described trough, and cabling connects described ground connection via hole, and described cabling is provided with at least one shielding via hole.
2. High-Speed-Board according to claim 1, to plate electric power connector, is characterized in that, described insulating body is made up of pcb board material.
3. High-Speed-Board according to claim 1 is to plate electric power connector, it is characterized in that, described trough and described the first through hole are cut apart described insulating body to be synthetic into multiple shielding spaces that adjoin, each described shielding space is surrounded with the trough that is connected two described the first through holes by two described the first through holes, and two described the first through holes are oppositely arranged.
4. High-Speed-Board according to claim 3, to plate electric power connector, is characterized in that, is provided with two described the second through holes in each described shielding space, in each described the second through hole, is provided with a described signal via.
5. High-Speed-Board according to claim 1, to plate electric power connector, is characterized in that, the upper surface of the upper surface of described cabling and described ground connection via hole is concordant and be connected, and the lower surface of the lower surface of described cabling and described ground connection via hole is concordant and be connected.
6. High-Speed-Board according to claim 1 is to plate electric power connector, it is characterized in that, described earth terminal and/or signal terminal are diamond, the wherein outer wall at two of diamond relative angles and the inwall tight fit of described ground connection via hole and/or described signal via, two other relative cornicult of diamond for described ground connection via hole and/opening of signal via.
7. High-Speed-Board according to claim 6, to plate electric power connector, is characterized in that, described earth terminal and/or signal terminal protrude from described ground connection via hole and/part of the opening of signal via is round and smooth arc.
8. High-Speed-Board according to claim 1, to plate electric power connector, is characterized in that, is also provided with the pore that at least one runs through described insulating body upper and lower surface in described shielding space.
9. High-Speed-Board according to claim 8, to plate electric power connector, is characterized in that, described pore and described the second through hole interval arrange.
According to the High-Speed-Board described in any one in claim 1-9 to plate electric power connector, it is characterized in that, described signal terminal is difference signal terminal.
11. 1 kinds of multilayer circuit board component, comprise at least two-tier circuit plate, it is characterized in that, between adjacent circuit board, by the High-Speed-Board as described in any one in claim 1-10, plate electric power connector are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320699815.4U CN203707481U (en) | 2013-11-06 | 2013-11-06 | High-speed board-to-board electronic connector and multilayer circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320699815.4U CN203707481U (en) | 2013-11-06 | 2013-11-06 | High-speed board-to-board electronic connector and multilayer circuit board assembly |
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| Publication Number | Publication Date |
|---|---|
| CN203707481U true CN203707481U (en) | 2014-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320699815.4U Expired - Fee Related CN203707481U (en) | 2013-11-06 | 2013-11-06 | High-speed board-to-board electronic connector and multilayer circuit board assembly |
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| CN (1) | CN203707481U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105006665A (en) * | 2015-07-25 | 2015-10-28 | 吕永锋 | Fuzz button inter-board electric connector |
-
2013
- 2013-11-06 CN CN201320699815.4U patent/CN203707481U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105006665A (en) * | 2015-07-25 | 2015-10-28 | 吕永锋 | Fuzz button inter-board electric connector |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 Termination date: 20161106 |