CN203674194U - Triode - Google Patents
Triode Download PDFInfo
- Publication number
- CN203674194U CN203674194U CN201420012003.2U CN201420012003U CN203674194U CN 203674194 U CN203674194 U CN 203674194U CN 201420012003 U CN201420012003 U CN 201420012003U CN 203674194 U CN203674194 U CN 203674194U
- Authority
- CN
- China
- Prior art keywords
- chip
- base plate
- triode
- pin
- radiating part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Thermistors And Varistors (AREA)
Abstract
The utility model discloses a triode. The triode comprises a body composed of a bottom plate, a chip, a plastic package body and pins, the chip is welded and fixed on the bottom plate, and the plastic package body and the bottom plate are injection molded as one to wrap the chip. The three pins are arranged side by side, one of the pins is connected with the bottom plate as one, and the other two pins are electrically connected with two electrified areas on the chip respectively. One end of the bottom plate is extended to the exterior of the plastic package body towards a direction far away from the pins to form a radiating part, and the radiating part is equipped with a fixing hole. In a direction perpendicular to the chip, one surface of the radiating part far away from the chip is a radiating surface, and one surface of the radiating part opposite to the radiating surface and the hole wall of the fixing hole are covered with insulating layers. When the triode of the utility model is fixed, insulating pads do not need to be arranged additionally, so that the work efficiency is improved, and the performance of a product is more stable.
Description
Technical field
The utility model relates to a kind of triode, belongs to electronic devices and components structural design field.
Background technology
Triode is conventional electronic component, electric current and signal can be amplified, is applied to the multiple fields such as signal amplifier and electronic switch.Triode in use, can produce a large amount of heats, if the heat of triode cannot discharge, is easy to burn out triode, then damages product.
In order to solve heat dissipation problem, on existing triode, be mostly provided with fin, and on fin, be provided with fixing hole; In the time of fixing triode, described fin is fixedly connected with metallic plate or metal shell with screw, like this, the heat that triode produces is in use delivered to metallic plate or metal shell through fin, thereby reaches the object of heat radiation.Although this triode has good result of use, but still Shortcomings: in the time of fixing triode, need to additionally insulation spacer be set so that screw and fin insulation so just make the comparatively inconvenience of fixed installation of triode, reduce operating efficiency; Meanwhile, set up insulation spacer and make screw and fin insulation, reliability is not high.
Utility model content
To this, the purpose of this utility model is to provide the more rational triode of a kind of structure, and this triode can additionally be set up insulation spacer when fixing, has improved operating efficiency, and the performance of product is more stable.
The technical scheme that realizes the utility model object is:
A kind of triode, comprises the body being made up of base plate, chip, plastic-sealed body and pin;
Described chips welding is fixed on described base plate;
Described plastic-sealed body and described base plate are injected into one and wrap up described chip;
The quantity of described pin is three, and three pins are arranged side by side, and one of them pin is connected with described base plate, and two other pin is electrically connected with the Liang Gejie electricity district on described chip respectively;
One end of described base plate is towards extending to described plastic-sealed body outside to form radiating part away from described pin direction, described radiating part is provided with fixing hole;
In the direction perpendicular to described chip, described radiating part is radiating surface away from the one side of described chip, on the one side that described radiating part is relative with described radiating surface and the hole wall of described fixing hole, is covered with insulating barrier.
In technique scheme, described base plate is provided with the fixed structure that strengthens itself and described plastic-sealed body adhesion.
In technique scheme, described fixed structure comprises the first groove of being located on described base plate, and described the first groove is dovetail grooved, and described the first groove and described chip are located at the homonymy of described base plate.
In technique scheme, described fixed structure also comprises the second groove of being located at the two side ends that described base plate is relative.
In technique scheme, there are at least two pads in the wire and the described Jie electricity district that connect described pin and described Jie electricity district.
The utlity model has positive effect: in (1) triode of the present utility model, in the direction perpendicular to described chip, described radiating part is radiating surface away from the one side of described chip, on the one side that described radiating part is relative with described radiating surface and the hole wall of described fixing hole, is covered with insulating barrier.By adopting said structure in the time that triode is fixing, just need not set up again insulation spacer, parts minimizing, triode fixing convenient, has improved operating efficiency; In addition, by adopting said structure to make insulation property better, improved the stability of product.(2) in triode of the present utility model, by the first groove and the second groove are set, in the time of plastic-sealed body and base plate injection moulding, the first groove and the second groove can be filled, thereby strengthen the adhesion of base plate and plastic-sealed body, effectively reduce the layering causing because of thermal coefficient of expansion.(3), in the utility model, there are at least two pads in the wire and the described Jie electricity district that connect described pin and described Jie electricity district.Adopt this structure can increase the contact area in wire Yu Jie electricity district, thereby improve the instantaneous conduction of electric current, compared with single pad, booster probability reduces greatly, has guaranteed product stability.
Accompanying drawing explanation
Fig. 1 is the structural representation of triode of the present utility model;
Fig. 2 is the structural representation of triode shown in Fig. 1 when fixing.
Reference numeral shown in figure is: 1-base plate; 11-radiating part; 12-fixing hole; 13-radiating surface; 14-insulating barrier; 15-the first groove; 16-the second groove; 2-chip; 3-plastic-sealed body; 4-pin; 5-wire; 6-pad; 7-screw; 8-metallic plate or metal shell; 9-insulating paper.
Embodiment
Below in conjunction with Figure of description, the concrete structure of triode of the present utility model is elaborated:
A kind of triode, as shown in Figure 1, comprises the body being made up of base plate 1, chip 2, plastic-sealed body 3 and pin 4; The plastic-sealed body that described plastic-sealed body 3 is made for epoxy resin; Described chip 2 is weldingly fixed on described base plate 1; Described plastic-sealed body 3 is injected into one and wraps up described chip 2 with described base plate 1; The quantity of described pin 4 is three, and three pins 4 are arranged side by side, and one of them pin 4 is connected with described base plate 1, and two other pin 4 is electrically connected with the Liang Gejie electricity district on described chip 2 respectively; One end of described base plate 1 is towards extending to described plastic-sealed body 3 outsides to form radiating part 11 away from described pin 4 directions, described radiating part 11 is provided with fixing hole 12; In the direction perpendicular to described chip 2, described radiating part 11 is radiating surface 13 away from the one side of described chip, on the one side that described radiating part 11 is relative with described radiating surface 13 and the hole wall of described fixing hole 12, be covered with insulating barrier 14, described insulating barrier 14 can moulding together in the time of injection molding.By adopting said structure in the time that triode is fixing, just need not set up again insulation spacer, parts minimizing, triode fixing convenient, has improved operating efficiency; In addition, by adopting said structure insulation property better, improved the stability of product.As shown in Figure 2, the triode of the present embodiment, when fixing, is fixed triode and metallic plate or metal shell 8 with screw 7; The heat that triode produces imports on metallic plate or metal shell 8 through radiating surface, is beneficial to heat radiation; Should be noted: must between triode and metallic plate or metal shell 8, insulating paper 9 be set and insulate.
In order to strengthen the adhesion of base plate 1 and plastic-sealed body 3, reduce the layering that causes because of thermal coefficient of expansion, described base plate 1 of the present utility model is provided with the fixed structure that strengthens itself and described plastic-sealed body 3 adhesions.
Concrete, the described fixed structure in the present embodiment comprises the first groove 15 of being located on described base plate 1, and described the first groove 15 is dovetail grooved, and described the first groove 15 and described chip 2 are located at the homonymy of described base plate 1; Described fixed structure also comprises the second groove 16 of being located at the two side ends that described base plate 1 is relative, in the time that plastic-sealed body 3 and base plate 1 carry out injection moulding, the first groove 15 and the second groove 16 can be filled.
In the utility model, connecting described pin 4 has at least two pads 6 with the wire 5 in described Jie electricity district with described Jie electricity district.Adopt this structure can increase the contact area in wire 5 Yu Jie electricity districts, thereby improve the instantaneous conduction of electric current, compared with single pad 6, booster probability reduces greatly, guarantee product stability, the quantity of pad 6 described in the present embodiment has two, and in practical operation, the quantity of described pad 6 can be even three or four.
Obviously, above-described embodiment of the present utility model is only for the utility model example is clearly described, and is not the restriction to execution mode of the present utility model.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also giving exhaustive to all execution modes.And these belong to apparent variation or the variation that connotation of the present utility model extends out and still belong to protection range of the present utility model.
Claims (5)
1. a triode, comprises the body being made up of base plate (1), chip (2), plastic-sealed body (3) and pin (4);
Described chip (2) is weldingly fixed on described base plate (1);
Described plastic-sealed body (3) is injected into one and wraps up described chip (2) with described base plate (1);
The quantity of described pin (4) is three, and three pins (4) are arranged side by side, one of them pin (4) is connected with described base plate (1), and two other pin (4) is electrically connected with the Liang Gejie electricity district on described chip (2) respectively;
Described base plate (1) is outside to form radiating part (11) towards extend to described plastic-sealed body (3) away from described pin (4) direction, and described radiating part (11) is provided with fixing hole (12);
It is characterized in that: in the direction perpendicular to described chip (2), described radiating part (11) is radiating surface (13) away from the one side of described chip, on the hole wall of the one side that described radiating part (11) is relative with described radiating surface (13) and described fixing hole (12), is covered with insulating barrier (14).
2. triode according to claim 1, is characterized in that: described base plate (1) is provided with the fixed structure that strengthens itself and described plastic-sealed body (3) adhesion.
3. triode according to claim 2, it is characterized in that: described fixed structure comprises the first groove (15) of being located on described base plate (1), described the first groove (15) is dovetail grooved, and described the first groove (15) and described chip (2) are located at the homonymy of described base plate (1).
4. triode according to claim 3, is characterized in that: described fixed structure also comprises the second groove (16) of being located at the two side ends that described base plate (1) is relative.
5. according to the triode described in any one in claim 1 to 4, it is characterized in that: connecting described pin (4) has at least two pads (6) with the wire (5) in described Jie electricity district with described Jie electricity district.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420012003.2U CN203674194U (en) | 2014-01-08 | 2014-01-08 | Triode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420012003.2U CN203674194U (en) | 2014-01-08 | 2014-01-08 | Triode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203674194U true CN203674194U (en) | 2014-06-25 |
Family
ID=50970459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420012003.2U Expired - Fee Related CN203674194U (en) | 2014-01-08 | 2014-01-08 | Triode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203674194U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104377178A (en) * | 2014-10-13 | 2015-02-25 | 东莞市柏尔电子科技有限公司 | Triode with heat dissipation face |
| CN108133911A (en) * | 2017-12-21 | 2018-06-08 | 王孝裕 | A kind of seal ring structure for being used to protect IC chip |
-
2014
- 2014-01-08 CN CN201420012003.2U patent/CN203674194U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104377178A (en) * | 2014-10-13 | 2015-02-25 | 东莞市柏尔电子科技有限公司 | Triode with heat dissipation face |
| CN108133911A (en) * | 2017-12-21 | 2018-06-08 | 王孝裕 | A kind of seal ring structure for being used to protect IC chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190306 Address after: 325600 No. 288, Wei16 Road, Yueqing Economic Development Zone, Yuehua Holding Group Co., Ltd. Patentee after: Zhejiang Herui Semiconductor Technology Co., Ltd. Address before: 325604 Xinguang Industrial Park, Liushi Town, Yueqing City, Wenzhou, Zhejiang, China Patentee before: Zhejiang Donghe Electronic Technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140625 Termination date: 20200108 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |