CN203648868U - Silicon slice detection device - Google Patents
Silicon slice detection device Download PDFInfo
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- CN203648868U CN203648868U CN201320882540.8U CN201320882540U CN203648868U CN 203648868 U CN203648868 U CN 203648868U CN 201320882540 U CN201320882540 U CN 201320882540U CN 203648868 U CN203648868 U CN 203648868U
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- silicon chip
- inspection
- air blowing
- transmission mechanism
- checkout gear
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Abstract
The utility model discloses a silicon slice detection device which comprises a conveying mechanism and a checking mechanism, wherein the checking mechanism comprises a checking controller, a sensor and at least one air-blowing checking part; the checking controller is in signal connection with the sensor and the air-blowing checking part; the sensor is used for sensing whether a silicon slice is in place; the air-blowing checking part is positioned above the conveying mechanism and is opposite to the conveying mechanism. The silicon slice detection device disclosed by the utility model realizes detection on the hidden crack defect of silicon slices; the problem that the silicon slices with hidden cracks are unlikely to detect out through a conventional silicon slice sorting machine. The silicon slice detection device can be used for simultaneously detecting whether the silicon slices are crushed or have the hidden cracks, and sorting the crushed silicon slices or the silicon slices with the hidden cracks; therefore, the detection quality and the detection efficiency are improved. The silicon slice detection device is simple and compact in structure and convenient to use.
Description
Technical field
The utility model belongs to silicon chip checkout equipment technical field, relates to a kind of for detection of the hidden silicon chip checkout gear splitting.
Background technology
Along with the development of World Economics, modernization construction constantly increases high efficient energy sources demand.Photovoltaic generation, as the one of the main energy sources of green energy resource and human kind sustainable development, is day by day subject to the attention of countries in the world and is greatly developed.Monocrystalline or polysilicon chip are the basic materials of photovoltaic generation, after section is cleaned, need, through sorting, to filter out underproof silicon chip, to guarantee product weight before packing delivery.For saving human cost and avoiding polluting silicon chip, silicon chip separator is progressively applied to production line.Existing silicon chip separator, or adopt vision system, or adopt fiber sensor, can whether be only fragment from test silicon wafer in appearance, and can not find that the hidden of silicon chip inside splits.There is the hidden packaged delivery of silicon chip of splitting defect, directly affect the qualification rate of finished product.
Utility model content
The purpose of this utility model is to provide a kind of silicon chip checkout gear, has solved existing silicon chip separator and has been difficult to detect the hidden problem of splitting silicon chip.
The technical solution of the utility model is, silicon chip checkout gear, comprise transmission mechanism and inspection body, inspection body comprises inspection controller, inductor and at least one air blowing inspection portion, check that controller is connected with inductor and air blowing inspection portion signal, air blowing check point, in the top of transmission mechanism, is oppositely arranged with transmission mechanism.
Feature of the present utility model is also:
Inspection body also comprises the moving part that is mechanically connected to air blowing inspection portion, checks that controller signals is connected in moving part; Moving part comprises inspection driver and the inspection driver of mechanical connection, and air blowing inspection portion is mechanically connected to inspection driver.
Air blowing inspection portion comprises mount pad and is installed on multiple inspection blowing nozzles of mount pad, and multiple blowing nozzles are all near the edge setting of mount pad, and ending is joined and formed a loop.
Air blowing inspection portion also comprises at least one maintenance blowing nozzle of the center that is positioned at multiple inspection blowing nozzles.
Inspection body comprises two air blowing inspection portions that are arranged side by side.
Transmission mechanism comprises relative input and output, and air blowing inspection portion, near input, is provided with measuring mechanism between air blowing inspection portion and output, and measuring mechanism and transmission mechanism are oppositely arranged.
Measuring mechanism comprises that a Mersure Controler and signal are connected in multiple sensors of Mersure Controler, and multiple sensors are arranged side by side.
Between air blowing inspection portion and measuring mechanism, be provided with guiding mechanism, guiding mechanism comprises the first correcting structure and the second correcting structure that lay respectively at transmission mechanism both sides, and the width of transmission mechanism is less than the back gauge of silicon chip.
Also comprise that signal is connected in the mechanism for sorting of measuring mechanism, mechanism for sorting comprises sorting transport part, sorting drive division and sorting container; Sorting transport part comprises conveyer belt, is positioned on the extended line of transmission mechanism.
Also comprise man-machine interface, man-machine interface signal is connected in the inspection controller of inspection body and the Mersure Controler of measuring mechanism, and is arranged at the input of transmission mechanism by support.
The utlity model has following beneficial effect:
1, the utility model has been realized the hidden detection of splitting defect of silicon chip, has solved existing silicon chip separator and has been difficult to detect the hidden problem of splitting silicon chip.
2, whether the utility model can to detect silicon chip broken or have hidden splitting simultaneously, and broken or the hidden silicon chip splitting are sorted out, and not only improved detection quality, and improved detection efficiency.
3, the utility model is simple and compact for structure, easy to use.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model silicon chip checkout gear;
Fig. 2 is the inspection body schematic diagram of the utility model silicon chip checkout gear;
Fig. 3 uses the utility model silicon chip checkout gear to detect the schematic diagram of silicon chip.
In figure, 11. transmission mechanisms, 12. inspection bodies, 13. guiding mechanisms, 14. measuring mechanisms, 15. mechanism for sorting, 100. silicon chips, 110. inputs, 111. outputs, 121. inductors, 122. moving parts, 123. air blowing inspection portions, 1230. mount pads, 1231. check blowing nozzle, 1232. keep blowing nozzle, 1233. baffle plate, 130. correcting slide rails, 131. first correcting structures, 132. second correcting structures, 133. fixed wheel, 141. sensors, 150. sorting transport parts, 151. sorting drive divisions, 152. sorting containers, 153. sorting ends.
The specific embodiment
Below in conjunction with the specific embodiment and multiple accompanying drawing, the utility model is elaborated.
The silicon chip checkout gear that the technical program provides, whether broken or have hidden splitting for detection of silicon chip, and broken or the hidden silicon chip splitting are sorted out.See figures.1.and.2, silicon chip checkout gear comprises transmission mechanism 11, inspection body 12, guiding mechanism 13, measuring mechanism 14, mechanism for sorting 15 and man-machine interface 16.Inspection body 12, guiding mechanism 13 and measuring mechanism 14 are set in turn in transmission mechanism 11.Mechanism for sorting 15 is positioned at one end of transmission mechanism 11.
Air blowing inspection portion 123 comprises mount pad 1230, multiple inspection blowing nozzle 1231 and at least one maintenance blowing nozzle 1232.Mount pad 1230 is connected in moving part 122.Multiple inspection blowing nozzles 1231 and at least one maintenance blowing nozzle 1232 are all installed on mount pad 1230.Multiple inspection blowing nozzles 1231 are all near the edge setting of mount pad 1230, and loop of end to end formation.Multiple inspection blowing nozzles 1231 for to silicon chip blow, if there is the hidden defect of splitting in silicon chip, will be cracked under airflow function.At least one keeps blowing nozzle 1232 to be positioned at the center of multiple inspection blowing nozzles 1231.The air-flow blowing out is mainly used in silicon chip to remain on transmission mechanism 11.Inspection blowing nozzle 1231 is only followed in air blowing inspection portion 123 when silicon chip moves and is blown, and keeps blowing nozzle 1232 all to blow in whole process.In the present embodiment, check that blowing nozzle 1231 is four, keeping blowing nozzle 1232 is one, and preferably, mount pad 1230 has polylith baffle plate 1233, can be by the control of silicon fragment within the specific limits.
Whether measuring mechanism 14 is between at least one air blowing inspection portion 123 and output 111, and itself and transmission mechanism 11 are oppositely arranged, be fragment for detection of the silicon chip behind at least one air blowing inspection portion 123.Measuring mechanism 14 comprises that a Mersure Controler (not shown) and signal are connected in multiple sensors 141 of Mersure Controler.Multiple sensors 141 are arranged side by side, for passing through the time of the multiple positions of sensing silicon chip.The sensing result of Mersure Controler reception more multiple sensor 141, judges that if unequal this silicon chip is as fragment, judges that this silicon chip is qualified if equate.In the present embodiment, sensor 141 is FIBER OPTIC SENSORS, while arrival, starts timing at the edge that senses silicon chip, leaves and stops timing until sense another relative edge of silicon chip.Certainly, measuring mechanism 14 can also share a controller with inspection body 12.
Mechanism for sorting 15 signals are connected in measuring mechanism 14, sort out for the silicon chip that measuring mechanism 14 is judged to be to fragment.Mechanism for sorting 15, near the output 111 of transmission mechanism 11, comprises sorting transport part 150, sorting drive division 151 and sorting container 152.Sorting transport part 150 is also conveyer belt, is positioned on the extended line of transmission mechanism 11.In the present embodiment, sorting transport part 150, by driving belt, shares power set with transmission mechanism 11.A silicon chip is once only transmitted in sorting transport part 150, has the sorting end 153 away from transmission mechanism 11.Sorting drive division 151 is mechanically connected to sorting end 153, sorting drive division 151 can be cylinder, by the switching of elongation or contraction state, drive the end of sorting transport part 150 in the pass through position identical with the transmission direction of transmission mechanism 11, or superseded position in forming an angle with the transmission direction of transmission mechanism 11.Sorting container 152 is positioned at the sorting end 153 of sorting transport part 150, for collecting superseded silicon chip.
Man-machine interface 16 can be arranged at by support the input 110 of transmission mechanism 11.Man-machine interface 16 signals are connected in the inspection controller of inspection body 12 and the Mersure Controler of measuring mechanism 14, detect executing state for carrying out setting parameter for operator and showing in real time.
The silicon chip checkout gear of the technical program can be used as a part of silicon chip separator, or uses as detecting the hidden device that splits defect of silicon chip separately.
Referring to Fig. 1 to Fig. 3, below is example by the silicon chip checkout gear take the technical program with two air blowing inspection portions 123, concrete steps when this silicon chip checkout gear operation is described:
Carry out detected parameters setting by man-machine interface 16.
Two air blowing inspection portions 123 of inspection body 12 are all positioned at initial position, when inductor 121 has sensed object, judge that silicon chip 100 puts in place.Now, all there is a silicon chip 100 123 belows, each air blowing inspection portion, now check that blowing nozzle 1231 do not blow, and keep blowing nozzle 1232 to blow.Check controller control moving part 122 and air blowing inspection portion 123, make moving part 122 drive two air blowing inspection portions 123 and two silicon chip 100 synchronizing movings, make two air blowing inspection portions 123 blow to two silicon chips, 100 surfaces simultaneously.Now, check blowing nozzle and keep blowing nozzle 1232 all to blow, the gas blowing out is compressed air, in the present embodiment, and pressure 0.3MPa.Two air blowing inspection portions 123 and one section of scheduled time T of two silicon chip 100 synchronizing movings, after 0.3 second, return to initial position, now checks that blowing nozzle 1231 stops blowing, and keeps blowing nozzle 1232 to blow.The pressure and the scheduled time T that are appreciated that blow gas can arrange according to detecting specific requirement.In this checking process, there are the hidden silicon chip splitting 100 fragmentations.
Subsequently, silicon chip 100 is transferred to guiding mechanism 13.Guiding mechanism 13 is activated after inductor 121 senses one section of scheduled time T that silicon chip put in place, if silicon chip 100 run-off the straights, will be by guiding mechanism 13 correctings, because fixed wheel 133 is rotatable, this correcting action is carried out in the situation that not affecting silicon chip 100 normal transmission.
When silicon chip 100 process measuring mechanism 14, passing through the time of multiple positions of multiple sensor 141 sensing silicon chips 100, after Mersure Controler compares, judges that silicon chip 100 is fragments or qualified.
Mechanism for sorting 15 receives the measurement result of measuring mechanism 14, if qualified, sorting drive division 151 is motionless and make to sort transport part 150 in position, smoothly silicon chip 100 being exported with identical the passing through of transmission direction of transmission mechanism 11.If fragment, sorting drive division 151 shrinks, and overturns in sorting transport part 150, thus the superseded position of sorting transport part 150 in forming an angle with the transmission direction of transmission mechanism 11, and sorting end 153 is aimed at sorting container 152, silicon chip 100 falls into sorting container 152.
Silicon chip checkout gear of the present utility model, utilizes inspection body 12 to blow to silicon chip to be detected 100, can make the hidden silicon chip splitting 100 fragmentations and sort out.The correcting effect of guiding mechanism 13 to silicon chip 100, can be beneficial to measuring mechanism 14 and measure and obtain result accurately.The moving part 122 of inspection body 12 drives air blowing inspection portion 123 and silicon chip synchronizing moving, can save the time that air blowing inspection portion 123 waits for that silicon chip moves into place.In addition, the air blowing inspection portion 123 of inspection body 12 is two, once can detect two silicon chips 100, can further improve detection efficiency.
A kind of silicon chip checkout gear that the utility model provides, has solved existing silicon chip separator and has been difficult to detect the hidden problem of splitting silicon chip, utilizes inspection body to blow to silicon chip to be detected, can make the hidden silicon chip fragmentation of splitting and sort out, and detection efficiency is high.
Claims (10)
1. silicon chip checkout gear, it is characterized in that, comprise transmission mechanism (11) and inspection body (12), described inspection body (12) comprises inspection controller, inductor (121) and at least one air blowing inspection portion (123), described inspection controller is connected with inductor (121) and air blowing inspection portion (123) signal, described air blowing inspection portion (123) is positioned at the top of transmission mechanism (11), is oppositely arranged with transmission mechanism (11).
2. silicon chip checkout gear according to claim 1, is characterized in that, described inspection body (12) also comprises the moving part (122) that is mechanically connected to described air blowing inspection portion (123), and described inspection controller signals is connected in described moving part (122).
3. silicon chip checkout gear according to claim 1 and 2, it is characterized in that, described air blowing inspection portion (123) comprises mount pad (1230) and is installed on multiple inspection blowing nozzles (1231) of described mount pad (1230), described multiple blowing nozzle (1231) is all near the edge setting of described mount pad (1230), and ending is joined and formed a loop.
4. silicon chip checkout gear according to claim 3, is characterized in that, described air blowing inspection portion (123) also comprises at least one maintenance blowing nozzle (1232) of the center that is positioned at described multiple inspection blowing nozzles (1231).
5. silicon chip checkout gear according to claim 1 and 2, is characterized in that, described inspection body (12) comprises two air blowing inspection portions (123) that are arranged side by side.
6. silicon chip checkout gear according to claim 1 and 2, it is characterized in that, described transmission mechanism (11) comprises relative input (110) and output (111), described air blowing inspection portion (123) is near described input (110), between described air blowing inspection portion (123) and output (111), be provided with measuring mechanism (14), described measuring mechanism (14) is oppositely arranged with described transmission mechanism (11).
7. silicon chip checkout gear according to claim 6, is characterized in that, described measuring mechanism (14) comprises that a Mersure Controler and signal are connected in multiple sensors (141) of described Mersure Controler, and described multiple sensors (141) are arranged side by side.
8. silicon chip checkout gear according to claim 1 and 2, it is characterized in that, between described air blowing inspection portion (123) and described measuring mechanism (14), be provided with guiding mechanism (13), described guiding mechanism (13) comprises the first correcting structure (131) and the second correcting structure (132) that lay respectively at described transmission mechanism (11) both sides, and the width of described transmission mechanism (11) is less than the back gauge of described silicon chip.
9. silicon chip checkout gear according to claim 1 and 2, it is characterized in that, also comprise that signal is connected in the mechanism for sorting of described measuring mechanism (14) (15), described mechanism for sorting (15) comprises sorting transport part (150), sorting drive division (151) and sorting container (152); Described sorting transport part (150) comprises conveyer belt, is positioned on the extended line of transmission mechanism (11).
10. silicon chip checkout gear according to claim 1 and 2, it is characterized in that, also comprise man-machine interface (16), described man-machine interface (16) signal is connected in the inspection controller of inspection body (12) and the Mersure Controler of measuring mechanism (14), and is arranged at the input (110) of transmission mechanism (11) by support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320882540.8U CN203648868U (en) | 2013-12-30 | 2013-12-30 | Silicon slice detection device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320882540.8U CN203648868U (en) | 2013-12-30 | 2013-12-30 | Silicon slice detection device |
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| CN203648868U true CN203648868U (en) | 2014-06-18 |
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| CN201320882540.8U Expired - Fee Related CN203648868U (en) | 2013-12-30 | 2013-12-30 | Silicon slice detection device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104259109A (en) * | 2014-07-28 | 2015-01-07 | 中国电子科技集团公司第四十八研究所 | Stepping silicon wafer quality sorting system |
| CN104835717A (en) * | 2015-03-23 | 2015-08-12 | 中建材浚鑫科技股份有限公司 | Pre-cleaning process before texturing process |
| CN104900554A (en) * | 2015-04-15 | 2015-09-09 | 四川虹视显示技术有限公司 | OLED substrate metal layer detection and distribution device |
| CN105789082A (en) * | 2016-05-18 | 2016-07-20 | 上海柏凌电子科技有限公司 | System for detecting silicon chip subfissure |
| CN109632792A (en) * | 2018-12-05 | 2019-04-16 | 彩虹（合肥）液晶玻璃有限公司 | A kind of testing agency and detection device |
| CN109841706A (en) * | 2019-03-23 | 2019-06-04 | 东莞市科隆威自动化设备有限公司 | Solar silicon wafers tear piece laminating method and imbrication general assembly line open |
-
2013
- 2013-12-30 CN CN201320882540.8U patent/CN203648868U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104259109A (en) * | 2014-07-28 | 2015-01-07 | 中国电子科技集团公司第四十八研究所 | Stepping silicon wafer quality sorting system |
| CN104835717A (en) * | 2015-03-23 | 2015-08-12 | 中建材浚鑫科技股份有限公司 | Pre-cleaning process before texturing process |
| CN104835717B (en) * | 2015-03-23 | 2018-04-17 | 中建材浚鑫科技股份有限公司 | Pre-cleaning processes before a kind of making herbs into wool process |
| CN104900554A (en) * | 2015-04-15 | 2015-09-09 | 四川虹视显示技术有限公司 | OLED substrate metal layer detection and distribution device |
| CN105789082A (en) * | 2016-05-18 | 2016-07-20 | 上海柏凌电子科技有限公司 | System for detecting silicon chip subfissure |
| CN105789082B (en) * | 2016-05-18 | 2018-04-06 | 上海柏凌电子科技有限公司 | A kind of silicon chip is hidden to split detecting system |
| CN109632792A (en) * | 2018-12-05 | 2019-04-16 | 彩虹（合肥）液晶玻璃有限公司 | A kind of testing agency and detection device |
| CN109632792B (en) * | 2018-12-05 | 2022-02-22 | 彩虹（合肥）液晶玻璃有限公司 | Detection mechanism and detection device |
| CN109841706A (en) * | 2019-03-23 | 2019-06-04 | 东莞市科隆威自动化设备有限公司 | Solar silicon wafers tear piece laminating method and imbrication general assembly line open |
| CN109841706B (en) * | 2019-03-23 | 2024-03-29 | 广东科隆威智能装备股份有限公司 | Solar silicon wafer disassembling and laminating method and laminated tile assembly line |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 710100 Changan District, Shaanxi Province, aerospace Road, No. 388, No. Patentee after: Longji green energy Polytron Technologies Inc Address before: 710100 Changan District, Shaanxi Province, aerospace Road, No. 388, No. Patentee before: Xi'an Longji-Silicon Co., LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171205 Address after: 750021 Yinchuan, the Ningxia Hui Autonomous Region (national level) economic and Technological Development Zone Kaiyuan Road, No. 15 Patentee after: Yinchuan LONGi Silicon Material Co.,Ltd. Address before: 710100 Changan District, Shaanxi Province, aerospace Road, No. 388, No. Patentee before: Longji green energy Polytron Technologies Inc |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140618 Termination date: 20191230 |
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| CF01 | Termination of patent right due to non-payment of annual fee |