CN203645200U - High-voltage power distribution cabinet semiconductor device heat-dissipating system - Google Patents
High-voltage power distribution cabinet semiconductor device heat-dissipating system Download PDFInfo
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- CN203645200U CN203645200U CN201320760968.5U CN201320760968U CN203645200U CN 203645200 U CN203645200 U CN 203645200U CN 201320760968 U CN201320760968 U CN 201320760968U CN 203645200 U CN203645200 U CN 203645200U
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- temperature sensor
- water
- water pipe
- controller
- plate
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Abstract
The utility model discloses a high-voltage power distribution cabinet semiconductor device heat-dissipating system comprising cooling water tank, a water pump, a cold water plate, a cyclic water pipe, and a control system. The water pump is installed on the cyclic water pipe. One end of the cyclic water pipe is connected with the cooling water tank. The other end of the cyclic water pipe is connected with the cyclic water pipe through the cold water plate. The cold water plate is provided with clamping members. Each clamping member comprises an installing plate, a first elastic clamping member, and a second elastic clamping member. Extension plates are disposed on one end, far from the installing plate, of each of the first elastic clamping member and the second elastic clamping member, and provided with pin roll holes. The control system comprises a first temperature sensor, a second temperature sensor, and a controller. The first temperature sensor and the second temperature sensor are both connected with the input end of the controller. The output end of the controller is connected with a pump driving circuit. The pump driving circuit is connected with the water pump. A first solenoid valve and a second solenoid valve are both connected with the output end of the controller. The high-voltage power distribution cabinet semiconductor device heat-dissipating system has simple structure and a good heat-dissipating effect.
Description
Technical field
The utility model relates to a kind of cooling system, particularly relates to a kind of high voltage power distributing cabinet semiconductor device cooling system.
Background technology
In high-low voltage electric power distribution cabinet field, due to interior a large amount of connectors and the various semiconductor device installed of power distribution cabinet, the in the situation that of conduction, can distribute a large amount of heats, temperature in power distribution cabinet is improved suddenly, nowadays conventional heat dissipating method be in rack, install powerful axial flow blower additional, and offer louvre, make the wind that axial flow blower blows out form air-cooled circulation, the heat of high-low voltage electric power distribution cabinet inside is blown out to body fast, reach the effect of heat radiation, but adopt this radiating mode radiating rate slow, and need on cabinet, beat a lot of louvres, cause cabinet dust-proof effect poor.
Utility model content
The purpose of this utility model is to overcome above-mentioned deficiency of the prior art, and a kind of high voltage power distributing cabinet semiconductor device cooling system is provided.Simple in structure, good heat dissipation effect, the production cost of this high voltage power distributing cabinet semiconductor device cooling system are low, are convenient to promote the use of.
For achieving the above object, the technical solution adopted in the utility model is: a kind of high voltage power distributing cabinet semiconductor device cooling system, it is characterized in that: comprise cooling water tank, water pump, cold water plate and circulating water pipe, described cold water plate is arranged on the semiconductor device of high voltage power distributing cabinet, described water pump is arranged on circulating water pipe, one end of described circulating water pipe is connected with cooling water tank, the other end of described circulating water pipe is connected with circulating water pipe after subcooled water plate, described circulating water pipe is serpentine and lays on cold water plate, the top of described cooling water tank is provided with water inlet, the bottom of described cooling water tank is provided with delivery port, on described water inlet, be provided with the first electromagnetically operated valve, on described delivery port, be provided with the second electromagnetically operated valve, on described cold water plate, be provided with multiple for blocking the fastener of circulating water pipe, described fastener comprises the mounting panel for being connected with cold water plate and is arranged on the first flexible clamp piece and the second flexible clamp piece on mounting panel, described the first flexible clamp piece and the second flexible clamp piece are all circular arc, described the first flexible clamp piece and the second flexible clamp piece are provided with extension board away from one end of mounting panel, on described extension board, offer pin shaft hole, also comprise control system, described control system comprises for detection of the first temperature sensor of water temperature in cooling water tank with for detection of the second temperature sensor of cold water plate temperature, and for receiving the first temperature sensor and the second temperature sensor output signal and controlling water pump, the controller of the first electromagnetically operated valve and the second electromagnetically operated valve, described the first temperature sensor and the second temperature sensor all join with the input of controller, the output of described controller is connected to pump drive circuit, described pump drive circuit and water pump join, described the first electromagnetically operated valve and the second electromagnetically operated valve all join with the output of controller.
Above-mentioned a kind of high voltage power distributing cabinet semiconductor device cooling system, is characterized in that: the output of described controller is also connected to the display for showing water temperature and cold water plate temperature in cooling water tank.
The utility model compared with prior art has the following advantages:
1, of the present utility model simple in structure, rationally novel in design, be easy to install.
2, the utility model is delivered to circulating water pipe by water pump by the water pump in cooling water tank, by circulating water pipe, the heat on cold water plate is taken away to its good heat dissipation effect.
3, the utility model is connected to circulating water pipe on cold water plate by bayonet socket part, has guaranteed that circulating water pipe is connected firmly.
4, the utility model is by the temperature of control system Real-Time Monitoring cold water plate, in the time of the excess Temperature of cold water plate, accelerates the rotating speed of water pump by pump drive circuit, the flow velocity of water in circulating water pipe accelerated, and then increased the radiating rate of cold water plate; Water temperature in all right Real-Time Monitoring cooling water tank, in the time of its water temperature over-high, by controlling the first electromagnetically operated valve and the second electromagnetically operated valve, in time for cooling water tank changes water.
4, of the present utility model to realize cost low, and result of use is good, is convenient to promote the use of.
In sum, the utility model is simple in structure, and rationally novel in design, functional reliability is high, long service life, and result of use is good, is convenient to promote the use of.
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is that the utility model circulating water pipe is at cold water plate laying structure schematic diagram.
Fig. 3 is the structural representation of the utility model fastener.
Fig. 4 is the schematic block circuit diagram of the utility model control system.
Description of reference numerals:
1-high voltage power distributing cabinet; 2-fixed head; 3-circulating water pipe;
The 4-the second temperature sensor; The 5-the first temperature sensor; 6-semiconductor device;
7-cold water plate; 8-water pump; 9-cooling water tank;
9-1-water inlet; 9-2-delivery port; 10-display;
11-fastener; 11-1-mounting panel; 11-2-the first flexible clamp piece;
11-3-the second flexible clamp piece; 11-4-extension board; 11-5-pin shaft hole;
12-controller; The 13-the first electromagnetically operated valve; The 14-the second electromagnetically operated valve;
15-pump drive circuit.
Embodiment
As Fig. 1, Fig. 2, a kind of high voltage power distributing cabinet semiconductor device cooling system shown in Fig. 3 and Fig. 4, comprise cooling water tank 9, water pump 8, cold water plate 7 and circulating water pipe 3, described cold water plate 7 is arranged on the semiconductor device 6 of high voltage power distributing cabinet 1, described semiconductor device 6 is arranged on the fixed head 2 of high voltage power distributing cabinet 1, described water pump 8 is arranged on circulating water pipe 3, one end of described circulating water pipe 3 is connected with cooling water tank 9, the other end of described circulating water pipe 3 is connected with circulating water pipe 3 after subcooled water plate 7, described circulating water pipe 3 is serpentine and lays on cold water plate 7, the top of described cooling water tank 9 is provided with water inlet 9-1, the bottom of described cooling water tank 9 is provided with delivery port 9-2, on described water inlet 9-1, be provided with the first electromagnetically operated valve 13, on described delivery port, 9-2 is provided with the second electromagnetically operated valve 14, on described cold water plate 7, be provided with multiple for blocking the fastener 11 of circulating water pipe 3, described fastener 11 comprises the mounting panel 11-1 for being connected with cold water plate 7 and is arranged on the first flexible clamp piece 11-2 and the second flexible clamp piece 11-3 on mounting panel 11-1, described the first flexible clamp piece 11-2 and the second flexible clamp piece 11-3 are all circular arc, described the first flexible clamp piece 11-2 and the second flexible clamp piece 11-3 are provided with extension board 11-4 away from one end of mounting panel 11-1, on described extension board 11-4, offer pin shaft hole 11-5, also comprise control system, described control system comprises for detection of the first temperature sensor 5 of cooling water tank 9 interior water temperatures with for detection of the second temperature sensor 4 of cold water plate 7 temperature, and for receiving the first temperature sensor 5 and the second temperature sensor 4 output signals and controlling water pump 8, the controller 12 of the first electromagnetically operated valve 13 and the second electromagnetically operated valve 14, described the first temperature sensor 5 and the second temperature sensor 4 all join with the input of controller 12, the output of described controller 12 is connected to pump drive circuit 15, described pump drive circuit 15 joins with water pump 8, described the first electromagnetically operated valve 13 and the second electromagnetically operated valve 14 all join with the output of controller 12.
In the present embodiment, circulating water pipe 3 delivered to by the water pump in cooling water tank 9 by described water pump 8, by circulating water pipe 3, the heat on cold water plate 7 taken away to its good heat dissipation effect, by bayonet socket part 11, circulating water pipe 3 is connected on cold water plate 7, has guaranteed that circulating water pipe 3 is connected firmly.Pass through control system, temperature in temperature and the cooling water tank 9 of Real-Time Monitoring cold water plate 7, in the time of the excess Temperature of cold water plate 7, accelerates the rotating speed of water pump 8 by pump drive circuit 15, the flow velocity of circulating water pipe 3 interior water is accelerated, and then increased the radiating rate of cold water plate 7; Water temperature in all right Real-Time Monitoring cooling water tank 9, in the time of its water temperature over-high, by controlling the first electromagnetically operated valve 13 and the second electromagnetically operated valve 14, changes water for cooling water tank 9 in time.
In the present embodiment, the output of described controller 12 is also connected to the display 10 for showing the interior water temperature of cooling water tank 9 and cold water plate 7 temperature.
The above; it is only preferred embodiment of the present utility model; not the utility model is imposed any restrictions; every any simple modification, change and equivalent structure transformation of above embodiment being done according to the utility model technical spirit, all still belongs in the protection range of technical solutions of the utility model.
Claims (2)
1. a high voltage power distributing cabinet semiconductor device cooling system, it is characterized in that: comprise cooling water tank (9), water pump (8), cold water plate (7) and circulating water pipe (3), described cold water plate (7) is arranged on the semiconductor device (6) of high voltage power distributing cabinet (1), described water pump (8) is arranged on circulating water pipe (3), one end of described circulating water pipe (3) is connected with cooling water tank (9), the other end of described circulating water pipe (3) is connected with circulating water pipe (3) after subcooled water plate (7), described circulating water pipe (3) is serpentine and lays on cold water plate (7), the top of described cooling water tank (9) is provided with water inlet (9-1), the bottom of described cooling water tank (9) is provided with delivery port (9-2), on described water inlet (9-1), be provided with the first electromagnetically operated valve (13), on described delivery port, (9-2) is provided with the second electromagnetically operated valve (14), on described cold water plate (7), be provided with multiple for blocking the fastener (11) of circulating water pipe (3), described fastener (11) comprises the mounting panel (11-1) for being connected with cold water plate (7) and is arranged on the first flexible clamp piece (11-2) and the second flexible clamp piece (11-3) on mounting panel (11-1), described the first flexible clamp piece (11-2) and the second flexible clamp piece (11-3) are all circular arc, described the first flexible clamp piece (11-2) and the second flexible clamp piece (11-3) are provided with extension board (11-4) away from one end of mounting panel (11-1), on described extension board (11-4), offer pin shaft hole (11-5), also comprise control system, described control system comprises for detection of first temperature sensor (5) of the interior water temperature of cooling water tank (9) with for detection of second temperature sensor (4) of cold water plate (7) temperature, and for receiving the first temperature sensor (5) and the second temperature sensor (4) output signal and controlling water pump (8), the controller (12) of the first electromagnetically operated valve (13) and the second electromagnetically operated valve (14), described the first temperature sensor (5) and the second temperature sensor (4) all join with the input of controller (12), the output of described controller (12) is connected to pump drive circuit (15), described pump drive circuit (15) joins with water pump (8), described the first electromagnetically operated valve (13) and the second electromagnetically operated valve (14) all join with the output of controller (12).
2. a kind of high voltage power distributing cabinet semiconductor device cooling system according to claim 1, is characterized in that: the output of described controller (12) is also connected to the display (10) for showing the interior water temperature of cooling water tank (9) and cold water plate (7) temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320760968.5U CN203645200U (en) | 2013-11-25 | 2013-11-25 | High-voltage power distribution cabinet semiconductor device heat-dissipating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320760968.5U CN203645200U (en) | 2013-11-25 | 2013-11-25 | High-voltage power distribution cabinet semiconductor device heat-dissipating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203645200U true CN203645200U (en) | 2014-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320760968.5U Expired - Fee Related CN203645200U (en) | 2013-11-25 | 2013-11-25 | High-voltage power distribution cabinet semiconductor device heat-dissipating system |
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| CN (1) | CN203645200U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109358665A (en) * | 2018-09-21 | 2019-02-19 | 襄阳赛克斯电气股份有限公司 | A kind of overtemperature protection system for switchgear |
-
2013
- 2013-11-25 CN CN201320760968.5U patent/CN203645200U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109358665A (en) * | 2018-09-21 | 2019-02-19 | 襄阳赛克斯电气股份有限公司 | A kind of overtemperature protection system for switchgear |
| CN109358665B (en) * | 2018-09-21 | 2020-09-04 | 襄阳赛克斯电气股份有限公司 | Overheat protection device for switch cabinet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140611 Termination date: 20141125 |
|
| EXPY | Termination of patent right or utility model |