CN203606311U - Heating type humidity sensor - Google Patents
Heating type humidity sensor Download PDFInfo
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- CN203606311U CN203606311U CN201320758802.XU CN201320758802U CN203606311U CN 203606311 U CN203606311 U CN 203606311U CN 201320758802 U CN201320758802 U CN 201320758802U CN 203606311 U CN203606311 U CN 203606311U
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- electric capacity
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- lower electrode
- heating resistor
- electrode pad
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Abstract
The utility model discloses a heating type humidity sensor. The heating type humidity sensor comprises a substrate (1) and further comprises a humidity sensitive capacitor and a heating circuit, wherein the substrate (1) is a square thin sheet and is used as a supporting structure and arranged on the lowest layer; the heating circuit is arranged around the humidity sensitive capacitor. When the heating type humidity sensor is used, the two independent heating type humidity sensors are mounted on the same data acquisition board; one heating type humidity sensor is used for dehumidifying and cooling and the other heating type humidity sensor is used for carrying out humidity measurement; after one working period, the two heating type humidity sensors exchange the working manners. According to the heating type humidity sensor, in an environment temperature range from 50 DEG C to -90 DEG C, a humidity measuring range is 0%-100%RH, a humidity measuring error is less than +/-3%, a humidity resolution ratio is less than 0.1% and the room-temperature environment response time is less than one second.
Description
Technical field
The utility model relates to a kind of humidity sensor, particularly a kind of heated type humidity sensor.
Background technology
Aerological circumstance complication is changeable, and aerial humidity is with highly there being the larger space rate of change, the state of temperature in continuous decrease; And humidity sensor is easily polluted in the time rising by the high humidity environment such as cloud, rain, under low temperature environment, also easily there is frost, these directly cause the serious deviation of humidity detection accuracy.
Traditional capacitance type humidity sensor only comprises humidity sensitive capacitive part, is made up of substrate, electric capacity top electrode, capacitor lower electrode, electrode pad and electric capacity humidity-sensitive medium layer.For realizing high-altitude low temperature and high relative humidity environmental testing, introduce heating and dehumidification technology, the heater circuit being formed by resistive heater and pad, when work, electric current is by heating resistor, and the effect of dehumidifying is played in resistance wire heating.Two humidity detecting module Integrated Humidity Sensors of the integrated heating circuit that for example a kind of MEMS method is made, its structure for covering heater circuit on substrate, above heater circuit, comprise respectively two humidity sensitive electric capacity, the mode of coated heating makes humicap heat loss process slow, two humidity sensitive electric capacity are integrated on same chip, the heat that heating process gives out can humidity sensitive electric capacity interfering with each other moisture measurement accuracy, and the method for making step complexity of this kind of sensor, device yield is lower.
Utility model content
The purpose of this utility model is to provide a kind of heated type humidity sensor, solves current aerological sounding humidity sensor under high-altitude low temperature environment, and surface is easily polluted by water and frost and humidity measurement accuracy and the lower problem of sensitivity occur.
A kind of heated type humidity sensor, comprise: substrate, also comprise: humidity sensitive electric capacity and heater circuit, wherein humidity sensitive electric capacity comprises: capacitor lower electrode metallic substrate layer, capacitor lower electrode, electric capacity humidity-sensitive medium layer, electric capacity top electrode, capacitor lower electrode pad, capacitor lower electrode pad metal basalis, electric capacity top electrode pad and electric capacity top electrode pad metal basalis, heater circuit comprises: heating resistor, heating resistor metallic substrate layer, heating resistor pad and heating resistor pad metal basalis.Substrate is square sheet, is placed in lowermost layer as supporting construction.Capacitor lower electrode metallic substrate layer, capacitor lower electrode pad metal basalis, electric capacity top electrode pad metal basalis are positioned on substrate, and capacitor lower electrode, capacitor lower electrode pad and electric capacity top electrode pad lay respectively in the capacitor lower electrode metallic substrate layer, capacitor lower electrode pad metal basalis, electric capacity top electrode pad metal basalis of same shape size.Capacitor lower electrode metallic substrate layer is connected with capacitor lower electrode pad metal basalis, gapped between capacitor lower electrode metallic substrate layer and electric capacity top electrode pad metal basalis, capacitor lower electrode pad metal basalis and electric capacity top electrode pad metal basalis are placed in the both sides of capacitor lower electrode metallic substrate layer.Electric capacity humidity-sensitive medium layer covers on capacitor lower electrode, does not cover capacitor lower electrode pad and top electrode pad.Electric capacity top electrode is positioned at the capacitor lower electrode top that is coated with electric capacity humidity-sensitive medium layer, and electric capacity top electrode afterbody lead-in wire contacts with electric capacity top electrode pad.Heater circuit is surrounded on humidity sensitive electric capacity around, heating resistor metallic substrate layer and heating resistor pad metal basalis are positioned on substrate, and heating resistor and heating resistor pad lay respectively in the heating resistor metallic substrate layer and heating resistor pad metal basalis of same shape size.Heating resistor metallic substrate layer is connected with heating resistor pad metal basalis, and two heating resistor pad metal basalises are placed in the both sides of heating resistor metallic substrate layer.Electric capacity humidity-sensitive medium layer covers on heating resistor and does not cover heating resistor pad, and electric capacity humidity-sensitive medium layer plays the effect of surface passivation.
The substrate of heated type humidity sensor is selected the one in the silicon chip after quartz, glass, pottery or surface oxidation, and at least one side of substrate is polished surface and surface insulation, and the thickness of substrate is 0.2mm～0.5mm.
Heating resistor metallic substrate layer and heating resistor pad metal basalis are identical material, adopt any in NiCr, Cr, TiWu or Ta, and thickness is 30nm～250nm.
Heating resistor and heating resistor pad are identical material, adopt any in NiCr or Pt, and thickness is 100nm～400nm, and resistance value is 30 Ω～150 Ω.
Capacitor lower electrode metallic substrate layer, capacitor lower electrode pad metal basalis and electric capacity top electrode pad metal basalis are identical material, adopt any in NiCr, Cr, TiWu or Ta, and thickness is 30nm～250nm.
Capacitor lower electrode, capacitor lower electrode pad and electric capacity top electrode pad are identical material, adopt any material in Au, Cu, Al or Pt, and thickness is 100nm～400nm.
The thickness of electric capacity humidity-sensitive medium layer is 300nm～1000nm.
Electric capacity top electrode adopts any in Au, Cu, Al or Pt, and thickness is 5nm～100nm, and electric capacity top electrode adopts grid type open-celled structure, and perforate is the square aperture of 5 μ m～50 μ m, is uniformly distributed; Perforate position is not island chain shape ventilating structure.
When the work of heated type humidity sensor, on humidity sensitive electric capacity, apply voltage difference, electric charge moves under the effect of electric field, because the electric capacity humidity-sensitive medium layer between electric capacity top electrode and capacitor lower electrode is nonconducting, hinder moving of electric charge and made charge accumulated on electric capacity top electrode and capacitor lower electrode, caused the storage of electric charge and form electric capacity.The absorption of electric capacity humidity-sensitive medium layer or release hydrone, when in space when hydrone concentration change, also respective change thereupon of the hydrone quantity of electric capacity humidity-sensitive medium layer absorption, cause the variation of electric capacity humidity-sensitive medium layer specific inductive capacity, cause the obstruction ability of charge movement also to change thereupon, therefore the magnitude of the stored charge on capacitance electrode can change along with the variation of the adsorbance of electric capacity humidity-sensitive medium layer hydrone, causes final capacitance to change.Electric capacity top electrode pad and capacitor lower electrode pad welding lead, to data collector, carry out humidity detection by the variation of measuring capacitance between capacitance electrode.When heater circuit work, on heating resistor pad, apply voltage, when electric current passes through snakelike heating resistor, heating resistor self produces heat, and heat is delivered to other regions of chip, by humidity sensitive electric capacity and the heating of whole chip.In addition the electric capacity humidity-sensitive medium layer covering on heating resistor, also plays the effect that prevents heating resistor short circuit in the situation of getting wet.Capacitor lower electrode metallic substrate layer, capacitor lower electrode pad metal basalis, electric capacity top electrode pad metal basalis, heating resistor metallic substrate layer, heating resistor pad metal basalis are transition metal layer, only play the effect that improves capacitor lower electrode, capacitor lower electrode pad, electric capacity top electrode pad, heating resistor, heating resistor pad adhesion, can not affect the movement of electric charge under potential difference (PD).
When heated type humidity sensor uses, two independently heated type humidity sensors are installed in same data acquisition board, in the process of heated type humidity sensor heating and dehumidification and cooling, another heated type humidity sensor carries out moisture measurement; After the work period, two heated type humidity sensors exchange working method, and one is carried out moisture measurement, and another carries out heating and dehumidification and cooling.Heated type humidity sensor carries out or not moisture measurement in the process of heating and dehumidification and cooling, carries out or not heating and dehumidification in the process of moisture measurement.
Heated type humidity sensor of the present utility model, in the ambient temperature range of 50 ℃～-90 ℃, moisture measurement scope is 0%～100%RH, moisture measurement error is less than ± and 3%, humidity resolution is less than 0.1%, the normal temperature environment response time is lower than 1s, realized the integrated of heating and humidity detecting function, be less than 5s by the heater circuit heat time, can make-60 ℃ of capacitance temperatures in environment be increased to rapidly+more than 70 ℃, the function that plays heating and dehumidification, is applicable to aerological sounding.The present invention adopts planar semiconductor technique to be fabricated on micro chip with the humidity sensor of heater circuit, and the size of heated type humidity sensor can be adjusted according to required capacitance and heating power, and minimum dimension is less than 3.5mm × 2.0mm.Adopt the first wet etching electric capacity humidity-sensitive medium layer that the mode of polymerization is made again to play the effect of humidity response and heating resistor passivation simultaneously, prevent the short circuit that gets wet, the method does not need to carry out humidity sensing layer dry etching and passivation layer is made, optimize process route, reduce difficulty of processing, and the high conformity of heated type humidity sensor.
Accompanying drawing explanation
The structural representation of a kind of heated type humidity sensor of Fig. 1;
The vertical view of a kind of heated type humidity sensor of Fig. 2.
1. substrate 2. heating resistor metallic substrate layer 3. heating resistor 4. heating resistor pad metal basalis 5. heating resistor pad 6. capacitor lower electrode metallic substrate layer 7. capacitor lower electrode 8. capacitor lower electrode pad metal basalis 9. electric capacity top electrode pad metal basalis 10. capacitor lower electrode pad 11. electric capacity top electrode pad 12. electric capacity humidity-sensitive medium layer 13. electric capacity top electrode.
Embodiment
A kind of heated type humidity sensor, comprising: substrate 1, humidity sensitive electric capacity and heater circuit; Wherein humidity sensitive electric capacity comprises: capacitor lower electrode metallic substrate layer 6, capacitor lower electrode 7, electric capacity humidity-sensitive medium layer 12, electric capacity top electrode 13, capacitor lower electrode pad 10, capacitor lower electrode pad metal basalis 8, electric capacity top electrode pad 11 and electric capacity top electrode pad metal basalis 9, heater circuit comprises: heating resistor 3, heating resistor metallic substrate layer 2, heating resistor pad 5 and heating resistor pad metal basalis 4.Substrate 1 is square sheet, is placed in lowermost layer as supporting construction.Capacitor lower electrode metallic substrate layer 6, capacitor lower electrode pad metal basalis 8, electric capacity top electrode pad metal basalis 9 are positioned on substrate 1, and capacitor lower electrode 7, capacitor lower electrode pad 10 and electric capacity top electrode pad 11 lay respectively in the capacitor lower electrode metallic substrate layer 6, capacitor lower electrode pad metal basalis 8, electric capacity top electrode pad metal basalis 9 of same shape size.Capacitor lower electrode metallic substrate layer 6 is connected with capacitor lower electrode pad metal basalis 8, gapped between capacitor lower electrode metallic substrate layer 6 and electric capacity top electrode pad metal basalis 9, capacitor lower electrode pad metal basalis 8 and electric capacity top electrode pad metal basalis 9 are placed in the both sides of capacitor lower electrode metallic substrate layer 6.Electric capacity humidity-sensitive medium layer 12 covers on capacitor lower electrode 7, does not cover capacitor lower electrode pad 10 and top electrode pad 11.Electric capacity top electrode 13 is positioned at capacitor lower electrode 7 tops that are coated with electric capacity humidity-sensitive medium layer 12, and electric capacity top electrode 13 afterbody lead-in wires contact with electric capacity top electrode pad 11.Heater circuit is surrounded on the surrounding of humidity sensitive electric capacity, heating resistor metallic substrate layer 2 and heating resistor pad metal basalis 4 are positioned on substrate 1, and heating resistor 3 and heating resistor pad 5 lay respectively in the heating resistor metallic substrate layer 2 and heating resistor pad metal basalis 4 of same shape size.Heating resistor metallic substrate layer 2 is connected with heating resistor pad metal basalis 4, and two heating resistor pad metal basalises 4 are placed in the both sides of heating resistor metallic substrate layer 2.Electric capacity humidity-sensitive medium layer 12 covers on the heating resistor 3 of heater circuit, does not cover heating resistor pad 5.
When the work of heated type humidity sensor, on humidity sensitive electric capacity, apply voltage difference, electric charge moves under the effect of electric field, because the electric capacity humidity-sensitive medium layer 12 between electric capacity top electrode 13 and capacitor lower electrode 7 is nonconducting, hinder moving of electric charge and made charge accumulated on electric capacity top electrode 13 and capacitor lower electrode 7, caused the storage of electric charge and form electric capacity.Electric capacity humidity-sensitive medium layer 12 adsorbs or discharges hydrone, when in space when hydrone concentration change, also respective change thereupon of the hydrone quantity that electric capacity humidity-sensitive medium layer 12 adsorbs, cause the variation of electric capacity humidity-sensitive medium layer 12 specific inductive capacity, cause the obstruction ability of charge movement also to change thereupon, therefore the magnitude of the stored charge on capacitance electrode can change along with the variation of the adsorbance of electric capacity humidity-sensitive medium layer 12 hydrone, causes final capacitance to change.Electric capacity top electrode pad 11 and capacitor lower electrode pad 10 welding leads, to data collector, carry out humidity detection by the variation of measuring capacitance between capacitance electrode.When heater circuit work, on heating resistor pad 5, apply voltage, when electric current passes through snakelike heating resistor 3, heating resistor 3 self produces heat, and heat is delivered to other regions of chip, by humidity sensitive electric capacity and the heating of whole chip.In addition the electric capacity humidity-sensitive medium layer 12 covering on heating resistor 3, also plays the effect that prevents heating resistor 3 short circuit in the situation of getting wet.Capacitor lower electrode metallic substrate layer 6, capacitor lower electrode pad metal basalis 8, electric capacity top electrode pad metal basalis 9, heating resistor metallic substrate layer 2, heating resistor pad metal basalis 4 are transition metal layer, only play the effect that improves capacitor lower electrode 7, capacitor lower electrode pad 10, electric capacity top electrode pad 11, heating resistor 3, heating resistor pad 5 adhesion, can not affect the movement of electric charge under potential difference (PD).
When heated type humidity sensor uses, two independently heated type humidity sensors are installed in same data acquisition board, in the process of heated type humidity sensor heating and dehumidification and cooling, another heated type humidity sensor carries out moisture measurement; After the work period, two heated type humidity sensors exchange working method, and one is carried out moisture measurement, and another carries out heating and dehumidification and cooling.Heated type humidity sensor carries out or not moisture measurement in the process of heating and dehumidification and cooling, carries out or not heating and dehumidification in the process of moisture measurement.
embodiment mono-
The substrate 1 of heated type humidity sensor is selected quartz, and the wherein one side of substrate 1 is polished surface and surface insulation, and the thickness of substrate 1 is 0.3mm.
Heating resistor metallic substrate layer 2 and heating resistor pad metal basalis 4 all adopt NiCr, and NiCr metal layer thickness is 30nm.
Heating resistor 3 and heating resistor pad 5 all adopt Pt, and Pt metal layer thickness is 100nm, and resistance value is 50 Ω.
Capacitor lower electrode metallic substrate layer 6, capacitor lower electrode pad metal basalis 8 and electric capacity top electrode pad metal basalis 9 all adopt NiCr, and thickness is 100nm.
Capacitor lower electrode 7, capacitor lower electrode pad 10 and electric capacity top electrode pad 11 all adopt Au, and thickness is 200nm.
The thickness of electric capacity humidity-sensitive medium layer 12 is 600nm.
Electric capacity top electrode 13 adopts Au, and thickness is 10nm, and electric capacity top electrode 13 adopts grid type open-celled structure, and perforate is the square aperture of 10 μ m, is uniformly distributed; Perforate position is not island chain shape ventilating structure.
embodiment bis-
The substrate 1 of heated type humidity sensor is selected glass, substrate 1 is two-sided be polished surface and surface insulation, the thickness of substrate 1 is 0.5mm.
Heating resistor metallic substrate layer 2 and heating resistor pad metal basalis 4 all adopt Cr, and Cr metal layer thickness is 50nm.
Heating resistor 3 and heating resistor pad 5 all adopt NiCr, and NiCr metal layer thickness is 200nm, and resistance value is 70 Ω.
Capacitor lower electrode metallic substrate layer 6, capacitor lower electrode pad metal basalis 8 and electric capacity top electrode pad metal basalis 9 all adopt NiCr, and thickness is 180nm.
Capacitor lower electrode 7, capacitor lower electrode pad 10 and electric capacity top electrode pad 11 all adopt Al, and thickness is 150nm.
Capacitor dielectric thin layer 12 thickness are 400nm.
Electric capacity top electrode 13 adopts Al, and thickness is 20nm, and electric capacity top electrode 13 adopts grid type open-celled structure, and perforate is the square aperture of 20 μ m, is uniformly distributed, and perforate position is not island chain shape ventilating structure.
Claims (8)
1. a heated type humidity sensor, comprise: substrate (1), characterized by further comprising: humidity sensitive electric capacity and heater circuit, wherein humidity sensitive electric capacity comprises: capacitor lower electrode metallic substrate layer (6), capacitor lower electrode (7), electric capacity humidity-sensitive medium layer (12), electric capacity top electrode (13), capacitor lower electrode pad (10), capacitor lower electrode pad metal basalis (8), electric capacity top electrode pad (11) and electric capacity top electrode pad metal basalis (9), heater circuit comprises: heating resistor (3), heating resistor metallic substrate layer (2), heating resistor pad (5) and heating resistor pad metal basalis (4), substrate (1) is square sheet, is placed in lowermost layer as supporting construction, it is upper that capacitor lower electrode metallic substrate layer (6), capacitor lower electrode pad metal basalis (8), electric capacity top electrode pad metal basalis (9) are positioned at substrate (1), and capacitor lower electrode (7), capacitor lower electrode pad (10) and electric capacity top electrode pad (11) lay respectively in the capacitor lower electrode metallic substrate layer (6), capacitor lower electrode pad metal basalis (8), electric capacity top electrode pad metal basalis (9) of same shape size, capacitor lower electrode metallic substrate layer (6) is connected with capacitor lower electrode pad metal basalis (8), gapped between capacitor lower electrode metallic substrate layer (6) and electric capacity top electrode pad metal basalis (9), capacitor lower electrode pad metal basalis (8) and electric capacity top electrode pad metal basalis (9) are placed in the both sides of capacitor lower electrode metallic substrate layer (6), it is upper that electric capacity humidity-sensitive medium layer (12) covers capacitor lower electrode (7), do not cover capacitor lower electrode pad (10) and top electrode pad, electric capacity top electrode (13) is positioned at capacitor lower electrode (7) top that is coated with electric capacity humidity-sensitive medium layer (12), and electric capacity top electrode (13) afterbody lead-in wire contacts with electric capacity top electrode pad (11), heater circuit is surrounded on humidity sensitive electric capacity around, it is upper that heating resistor metallic substrate layer (2) and heating resistor pad metal basalis (4) are positioned at substrate (1), and heating resistor (3) and heating resistor pad (5) lay respectively in the heating resistor metallic substrate layer (2) and heating resistor pad metal basalis (4) of same shape size, heating resistor metallic substrate layer (2) is connected with heating resistor pad metal basalis (4), and two heating resistor pad metal basalises (4) are placed in the both sides of heating resistor metallic substrate layer (2), electric capacity humidity-sensitive medium layer (12) covers on heating resistor (3) and does not cover heating resistor pad (5), and electric capacity humidity-sensitive medium layer (12) plays the effect of surface passivation.
2. heated type humidity sensor according to claim 1, it is characterized in that: the substrate (1) of heated type humidity sensor is selected the one in the silicon chip after quartz, glass, pottery or surface oxidation, the at least one side of substrate (1) is polished surface and surface insulation, and the thickness of substrate (1) is 0.2mm～0.5mm.
3. heated type humidity sensor according to claim 1, it is characterized in that: heating resistor metallic substrate layer (2) and heating resistor pad metal basalis (4) are identical material, adopt any in NiCr, Cr, TiWu or Ta, thickness is 30nm～250nm.
4. heated type humidity sensor according to claim 1, it is characterized in that: heating resistor (3) and heating resistor pad (5) are identical material, adopt any in NiCr or Pt, thickness is 100nm～400nm, and resistance value is 30 Ω～150 Ω.
5. heated type humidity sensor according to claim 1, it is characterized in that: capacitor lower electrode metallic substrate layer (6), capacitor lower electrode pad metal basalis (8) and electric capacity top electrode pad metal basalis (9) are identical material, adopt any in NiCr, Cr, TiWu or Ta, thickness is 30nm～250nm.
6. heated type humidity sensor according to claim 1, it is characterized in that: capacitor lower electrode (7), capacitor lower electrode pad (10) and electric capacity top electrode pad (11) are identical material, adopt any material in Au, Cu, Al or Pt, thickness is 100nm～400nm.
7. heated type humidity sensor according to claim 1, is characterized in that: the thickness of electric capacity humidity-sensitive medium layer (12) is 300nm～1000nm.
8. heated type humidity sensor according to claim 1, it is characterized in that: electric capacity top electrode (13) adopts any in Au, Cu, Al or Pt, thickness is 5nm～100nm, electric capacity top electrode (13) adopts grid type open-celled structure, perforate is the square aperture of 5 μ m～50 μ m, is uniformly distributed; Perforate position is not island chain shape ventilating structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320758802.XU CN203606311U (en) | 2013-11-27 | 2013-11-27 | Heating type humidity sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320758802.XU CN203606311U (en) | 2013-11-27 | 2013-11-27 | Heating type humidity sensor |
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| CN203606311U true CN203606311U (en) | 2014-05-21 |
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| CN201320758802.XU Withdrawn - After Issue CN203606311U (en) | 2013-11-27 | 2013-11-27 | Heating type humidity sensor |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103698367A (en) * | 2013-11-27 | 2014-04-02 | 北京长峰微电科技有限公司 | Heating type humidity sensor and manufacturing method thereof |
| CN104062322A (en) * | 2014-07-10 | 2014-09-24 | 苏州能斯达电子科技有限公司 | Humidity sensor and preparation method thereof |
| CN106404038A (en) * | 2016-08-31 | 2017-02-15 | 成都市和平科技有限责任公司 | Humidity sensor |
| CN107257923A (en) * | 2015-02-27 | 2017-10-17 | Em微电子-马林有限公司 | Humidity sensor with thermal modules |
| CN109696255A (en) * | 2017-10-23 | 2019-04-30 | 南京开天眼无人机科技有限公司 | A kind of Temperature Humidity Sensor |
| CN112683966A (en) * | 2021-03-18 | 2021-04-20 | 南京高华科技股份有限公司 | Self-correcting MEMS capacitive humidity sensor and preparation method thereof |
-
2013
- 2013-11-27 CN CN201320758802.XU patent/CN203606311U/en not_active Withdrawn - After Issue
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103698367A (en) * | 2013-11-27 | 2014-04-02 | 北京长峰微电科技有限公司 | Heating type humidity sensor and manufacturing method thereof |
| CN103698367B (en) * | 2013-11-27 | 2015-11-25 | 北京长峰微电科技有限公司 | A kind of heated type humidity sensor and preparation method thereof |
| CN104062322A (en) * | 2014-07-10 | 2014-09-24 | 苏州能斯达电子科技有限公司 | Humidity sensor and preparation method thereof |
| CN107257923A (en) * | 2015-02-27 | 2017-10-17 | Em微电子-马林有限公司 | Humidity sensor with thermal modules |
| CN107257923B (en) * | 2015-02-27 | 2020-10-23 | Em微电子-马林有限公司 | Humidity sensor with thermal module |
| CN106404038A (en) * | 2016-08-31 | 2017-02-15 | 成都市和平科技有限责任公司 | Humidity sensor |
| CN109696255A (en) * | 2017-10-23 | 2019-04-30 | 南京开天眼无人机科技有限公司 | A kind of Temperature Humidity Sensor |
| CN112683966A (en) * | 2021-03-18 | 2021-04-20 | 南京高华科技股份有限公司 | Self-correcting MEMS capacitive humidity sensor and preparation method thereof |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20140521 Effective date of abandoning: 20151125 |
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| C25 | Abandonment of patent right or utility model to avoid double patenting |