CN203556976U - Dual-in-line integrated circuit board disassembling tool - Google Patents
Dual-in-line integrated circuit board disassembling tool Download PDFInfo
- Publication number
- CN203556976U CN203556976U CN201320677260.3U CN201320677260U CN203556976U CN 203556976 U CN203556976 U CN 203556976U CN 201320677260 U CN201320677260 U CN 201320677260U CN 203556976 U CN203556976 U CN 203556976U
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- dual
- pressing plate
- buckle
- mounted integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003825 pressing Methods 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a dual-in-line integrated circuit board disassembling tool which is made of a red copper material and comprises a pressing plate, wherein a buckle which is perpendicular to the pressing plate is arranged in the center of the upper part of the pressing plate; the upper end of the buckle is opened; the opened part is fastened through a bolt. The tool is simple in structure, low in manufacturing cost, convenient to use, short in disassembling time and good in disassembling quality as dual-in-line integrated circuit boards of 4-63 pins can be disassembled, and high in practicability as the printed circuit boards are not damaged, improves the working efficiency, and has good popularization and application values.
Description
Technical field
The utility model relates to surface-mounted integrated circuit dismantling technology field, especially relates to a kind of dual-in-line surface-mounted integrated circuit extracting tool.
Background technology
During ordinary maintenance circuit board, often need to dismantle integrated circuit from printed circuit board, because the pin of integrated circuit is many and close, dismantle very difficultly, speed is slow, wastes time and energy, dismantle of poor qualityly, method for dismounting is to making again printed circuit board damage, thereby affects normal maintenance work.And extracting tool in the market because cost is high, service life is short, inefficiency, easily make the former thereby less uses such as circuit board damage.
Summary of the invention
For addressing the above problem, the purpose of this utility model is to provide a kind of dual-in-line surface-mounted integrated circuit extracting tool simple in structure, easy to use.
For achieving the above object, the utility model adopts following technical scheme:
A dual-in-line surface-mounted integrated circuit extracting tool, it adopts red copper material to make, and comprises pressing plate, and pressing plate center upper portion is provided with vertical with it buckle, buckle upper end open, opening part passes through bolted.
Described dual-in-line surface-mounted integrated circuit extracting tool, its pressing plate length is 0.5～2cm, 2～5cm or 5～8cm.
Described dual-in-line surface-mounted integrated circuit extracting tool, its thickness of compressive plate is 1～2mm, width is 0.5～2cm.
Described dual-in-line surface-mounted integrated circuit extracting tool, its pressing plate is arranged on electric iron front end by buckle, and buckle is sleeved on the heat-generating pipe outside of electric iron.
Owing to adopting technical scheme as above, the utlity model has following superiority:
This dual-in-line surface-mounted integrated circuit extracting tool, it is simple in structure, novelty reasonable in design, cost of manufacture is low, easy to use, and copper plate has good heat conductivity, easily processing, feature that mechanical strength is good, can dismantle the dual-in-line surface-mounted integrated circuit of 4～64 pin, take-down time is short, only needs tens seconds, and dismounting quality is good, can not cause damage to printed circuit board, practical, improved operating efficiency, there is good application value.
Accompanying drawing explanation
Fig. 1 is the structural representation of one of the utility model embodiment;
Fig. 2 is two the structural representation of the utility model embodiment;
Fig. 3 is three the structural representation of the utility model embodiment;
In figure: 1-bolt; 2-buckle; 3-pressing plate; 4-connecting portion.
The specific embodiment
Below by embodiment, also by reference to the accompanying drawings the technical solution of the utility model is described in further detail.
As shown in Figure 1, 2, 3, this dual-in-line surface-mounted integrated circuit extracting tool, it adopts red copper material to make, comprise pressing plate 3, pressing plate center upper portion is provided with vertical with it buckle 2, buckle upper end open, it is fastening by bolt 1 that the end of opening has all upwards extended in parallel connecting portion 4, two connecting portions.
Above-mentioned dual-in-line surface-mounted integrated circuit extracting tool, it is when dismantling the dual-in-line surface-mounted integrated circuit of 4～10 pin, and pressing plate 3 length are 0.5～2cm, as shown in Figure 1; While being used for dismantling the dual-in-line surface-mounted integrated circuit of 12～40 pin, pressing plate 3 length are 2～5cm, as shown in Figure 2; While being used for dismantling the dual-in-line surface-mounted integrated circuit of 42～64 pin, pressing plate 3 length are 5～8cm, as shown in Figure 3.
Above-mentioned thickness of compressive plate is 1～2mm, and width is 0.5～2cm, can guarantee good heat dispersion, can guarantee mechanical strength again.
During use, the solder horn of electric iron is removed in heat-generating pipe, the heat-generating pipe that the buckle of extracting tool is contained in to electric iron by bolt sleeve is outside; Pressing plate is placed on dual-in-line surface-mounted integrated circuit one tubulation pin, utilize the heat-generating pipe of electric iron that heat is reached on pressing plate, to this tubulation pin scolding tin heating, wait reaching scolding tin temperature by after the scolding tin thawing on pin, operating personnel extract this tubulation pin with the hand of wearing proximity gloves, make it separated with printed board; Adopt above-mentioned same operation, another tubulation pin of dual-in-line surface-mounted integrated circuit can be extracted, complete whole dismantlement work.
Claims (4)
1. a dual-in-line surface-mounted integrated circuit extracting tool, is characterized in that: it adopts red copper material to make, and comprises pressing plate (3), and pressing plate center upper portion is provided with vertical with it buckle (2), buckle upper end open, and opening part is fastening by bolt (1).
2. dual-in-line surface-mounted integrated circuit extracting tool according to claim 1, is characterized in that: its pressing plate length is 0.5～2cm, 2～5cm or 5～8cm.
3. dual-in-line surface-mounted integrated circuit extracting tool according to claim 1 and 2, is characterized in that: its thickness of compressive plate is 1～2mm, and width is 0.5～2cm.
4. dual-in-line surface-mounted integrated circuit extracting tool according to claim 1, is characterized in that: its pressing plate is arranged on electric iron front end by buckle, and buckle is sleeved on the heat-generating pipe outside of electric iron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320677260.3U CN203556976U (en) | 2013-10-31 | 2013-10-31 | Dual-in-line integrated circuit board disassembling tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320677260.3U CN203556976U (en) | 2013-10-31 | 2013-10-31 | Dual-in-line integrated circuit board disassembling tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203556976U true CN203556976U (en) | 2014-04-23 |
Family
ID=50506727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320677260.3U Expired - Fee Related CN203556976U (en) | 2013-10-31 | 2013-10-31 | Dual-in-line integrated circuit board disassembling tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203556976U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109604755A (en) * | 2018-12-29 | 2019-04-12 | 芜湖鑫芯微电子有限公司 | A kind of sensor provision for disengagement |
-
2013
- 2013-10-31 CN CN201320677260.3U patent/CN203556976U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109604755A (en) * | 2018-12-29 | 2019-04-12 | 芜湖鑫芯微电子有限公司 | A kind of sensor provision for disengagement |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140423 Termination date: 20151031 |
|
| EXPY | Termination of patent right or utility model |