CN203536462U

CN203536462U - Led filament

Info

Publication number: CN203536462U
Application number: CN201320674278.8U
Authority: CN
Inventors: 张汝京; 余洁闻; 尚荣耀; 陈海鸿
Original assignee: Rong Rockchips Photoelectric Technology (shanghai) Co Ltd
Current assignee: Rong Rockchips Photoelectric Technology (shanghai) Co Ltd
Priority date: 2013-10-28
Filing date: 2013-10-28
Publication date: 2014-04-09
Anticipated expiration: 2023-10-28

Abstract

The utility model provides an LED filament comprising a substrate, a plurality of chips fixedly disposed on the substrate, an encircling chip, and a protection layer of the substrate. The chip comprises, from bottom to top, an underlayer, a first gallium nitride, an illuminating layer, and a second gallium nitride. The material of the substrate adopts the light-transmitting material, and therefore the light of the illuminating layer can pass through the substrate, and the 360DEG all-dimensional uniform illumination can be realized. When the substrate adopts the light-transmitting material, the reflecting layer is not required, the patterning LED underlayer is not required, and therefore the production technology can be greatly simplified, and the production costs can be reduced.

Description

LED filament

Technical field

The utility model relates to LED lighting field, relates in particular to a kind of LED filament.

Background technology

Light-emitting diode (Light Emitting Diode, LED) is a kind of solid-state semiconductor device that can be visible ray by electric energy conversion, and it can directly be converted into light electricity.The internal characteristics of LED has determined that it is that optimal light source goes to replace traditional light source, has purposes widely.LED light source has following features: energy-conservation, long-lived, environmental protection, solid-state encapsulation, belong to cold light source type etc.

Tradition LED light source, in order to improve rising angle, need install the optics of lens and so on additional, affects lighting effect, can reduce the due energy-saving effect of LED light source.Yet it is luminous that LED filament can be realized 360 ° of full angles, wide-angle is luminous and do not need to add lens, can become three-dimensional light source, brings unprecedented lighting experience.

Please refer to Fig. 1, in prior art, LED filament comprises: chip 10, substrate 20 and fluorescent glue 70, described chip 10 is fixed on described substrate 20, described fluorescent glue 70 surrounds described chip 10 and substrate 20, wherein, described chip 10 comprises reflector 30, graphical LED substrate 40, the first gallium nitride layer 51, luminescent layer 60 and the second gallium nitride layer 52 from bottom to top successively.

In use, chip 10 adopts graphical LED substrate 40 to described LED filament, and in graphical LED substrate 40 plating reflector, the back side 30, with this, farthest obtains the forward bright dipping of chip 10.The light being sent by described luminescent layer 60 can pass through described reflector 30, the second gallium nitride layer 52 and fluorescent glue 70 reflections or penetrate out, realize 360 ° omnibearing luminous, please refer to Fig. 2.Yet, because the current substrate 20 of LED filament process using is traditional aluminium base, be that material is aluminium, because aluminium base can not printing opacity, therefore, although causing described LED filament is that 360 ° of full angles are luminous, non-uniform light, there will be that to be positioned at the one side of substrate partially bright, carry on the back in the partially dark situation of the one side of substrate, light is as shown in Fig. 2 arrow.

So how to make LED filament can realize the luminous of 360 ° of Omnibearing evens, just become those skilled in the art and be badly in need of the technical problem solving.

Utility model content

The purpose of this utility model is to provide a kind of LED filament, can realize the luminous of 360 ° of Omnibearing evens.

In order to realize the problems referred to above, the utility model proposes a kind of LED filament, comprising:

A plurality of chips, substrate and protective layer, described chip is fixed on described substrate, and described protective layer surrounds described chip and substrate; Described chip comprises substrate, the first gallium nitride, luminescent layer and the second gallium nitride from bottom to top successively, and the material of described substrate is light transmissive material.

Further, a plurality of described chips adopt series system to link together.

Further, described substrate is silicon substrate, gallium nitride substrate, silicon nitride substrate or Sapphire Substrate.

Further, the thickness range of described substrate is 10 microns～100 microns.

Further, described the first gallium nitride is n type gallium nitride.

Further, described the second gallium nitride is P type gallium nitride.

Further, described protective layer is fluorescent glue.

Further, described substrate is light-transmitting materials, comprises glass, quartz, plastics, pottery or semi-conducting material.

Further, the thickness range of described substrate is 1 millimeter～5 millimeters.

Further, described LED filament also comprises two metal joints and insulating joint, and described insulating joint is separately fixed at the two ends of described substrate, and described metal joint is separately fixed at the two ends of described insulating joint, and described metal joint is electrically connected to described chip.

Compared with prior art, the beneficial effects of the utility model are mainly reflected in: substrate is used to light transmissive material, can allow the light penetration substrate of luminescent layer, can realize the luminous of 360 ° of Omnibearing evens; When substrate is light transmissive material,, without using reflector, also, without using patterning LED substrate, therefore simplified greatly production technology, reduced production cost.

Accompanying drawing explanation

Fig. 1 is the structural representation of LED filament in prior art;

Fig. 2 is the schematic diagram of LED filament light-emitting in prior art;

Fig. 3 is the cross section structure schematic diagram of LED filament in the utility model one embodiment;

Fig. 4 is the schematic diagram of LED filament light-emitting in the utility model one embodiment;

Fig. 5 is the vertical view of LED filament in the utility model one embodiment.

Embodiment

Below in conjunction with schematic diagram, LED filament of the present utility model is described in more detail, wherein represented preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.

For clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the utility model chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example, according to the restriction of relevant system or relevant business, by an embodiment, change into another embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.

In the following passage, with reference to accompanying drawing, with way of example, the utility model is more specifically described.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.

Please refer to Fig. 3, in the present embodiment, proposed a kind of LED filament, described LED filament comprises:

A plurality of chips 100, substrate 300 and protective layer 200, described chip 100 is fixed on described substrate 300, and described protective layer 200 surrounds described chip 100 and substrate 300; Described chip 100 comprises substrate 110, the first gallium nitride 120, luminescent layer 130 and the second gallium nitride 140 from bottom to top successively, and the material of described substrate 300 is light transmissive material.

In the present embodiment, a plurality of described chips 100 adopt series system to link together, and form larger light emitting source; Wherein, described substrate 110 is the conventional substrate in LED field, for example, comprise silicon substrate, gallium nitride substrate, silicon nitride substrate, Sapphire Substrate, take in the present embodiment Sapphire Substrate as example, the thickness range of described substrate 110 is 10 microns～100 microns, for example, be 50 microns; Described the first gallium nitride 120 is n type gallium nitride, adopts the mode of Implantation to form n type gallium nitride; Described the second gallium nitride 140 is P type gallium nitride, also adopts the mode of Implantation to form P type gallium nitride; Wherein luminescent layer 130 is for generation of light.

In the present embodiment, described protective layer 200 is fluorescent glue, and its effect is the described chip 100 of protection and substrate 300 on the one hand, is on the other hand the blue light of described luminescent layer 130 generations to be changed over to white light launch the color of elimination light; The material of described substrate 300 is light transmissive material, comprise glass, quartz, plastics, pottery or semi-conducting material etc., the thickness range of described substrate 300 is 1 millimeter～5 millimeters, it is for example 3 millimeters, the light can be thoroughly being produced by described luminescent layer 130 due to light transmissive material, can realize the luminous of 360 ° of Omnibearing evens, as shown in Figure 4; Therefore described chip 100, just without forming reflector and patterning LED substrate, can be simplified production technology greatly, reduces production costs.

Please refer to Fig. 5, in the present embodiment, described LED filament also comprises two metal joints 400, two described metal joints 400 join end to end and connect with described chip 100 respectively, described LED filament also comprises two metal joints 400 and insulating joint 500, described insulating joint 500 is separately fixed at the two ends of described substrate 300, described metal joint 400 is separately fixed at the two ends of described insulating joint 500, described metal joint 400 is electrically connected to described chip 100, described metal joint 400, for switching on power, makes described chip 100 luminous.

To sum up, in the LED filament providing at the utility model embodiment, substrate is used to light transmissive material, can allow the light penetration substrate of luminescent layer, can realize the luminous of 360 ° of Omnibearing evens; When substrate is light transmissive material,, without using reflector, also, without using patterning LED substrate, therefore simplified greatly production technology, reduced production cost.

Above are only preferred embodiment of the present utility model, the utility model is not played to any restriction.Any person of ordinary skill in the field; within not departing from the scope of the technical solution of the utility model; the technical scheme that the utility model is disclosed and technology contents are made any type of changes such as replacement or modification that are equal to; all belong to the content that does not depart from the technical solution of the utility model, within still belonging to protection range of the present utility model.

Claims

1. a LED filament, is characterized in that, described LED filament comprises:

2. LED filament as claimed in claim 1, is characterized in that, a plurality of described chips adopt series system to link together.

3. LED filament as claimed in claim 1, is characterized in that, described substrate is silicon substrate, gallium nitride substrate, silicon nitride substrate or Sapphire Substrate.

4. LED filament as claimed in claim 3, is characterized in that, the thickness range of described substrate is 10 microns～100 microns.

5. LED filament as claimed in claim 1, is characterized in that, described the first gallium nitride is n type gallium nitride.

6. LED filament as claimed in claim 1, is characterized in that, described the second gallium nitride is P type gallium nitride.

7. LED filament as claimed in claim 1, is characterized in that, described protective layer is fluorescent glue.

8. LED filament as claimed in claim 1, is characterized in that, described substrate is light-transmitting materials, comprises glass, quartz, plastics, pottery or semi-conducting material.

9. LED filament as claimed in claim 8, is characterized in that, the thickness range of described substrate is 1 millimeter～5 millimeters.

10. LED filament as claimed in claim 1, it is characterized in that, described LED filament also comprises two metal joints and insulating joint, described insulating joint is separately fixed at the two ends of described substrate, described metal joint is separately fixed at the two ends of described insulating joint, and described metal joint is electrically connected to described chip.