CN203526788U - Wire-clamping welding device for double-interface-card - Google Patents
Wire-clamping welding device for double-interface-card Download PDFInfo
- Publication number
- CN203526788U CN203526788U CN201320511139.3U CN201320511139U CN203526788U CN 203526788 U CN203526788 U CN 203526788U CN 201320511139 U CN201320511139 U CN 201320511139U CN 203526788 U CN203526788 U CN 203526788U
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- Prior art keywords
- pressing piece
- double
- chip
- interface card
- perforation
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- Expired - Lifetime
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- 238000003466 welding Methods 0.000 title abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 85
- 238000005476 soldering Methods 0.000 claims description 38
- 229910000679 solder Inorganic materials 0.000 claims description 32
- 238000001179 sorption measurement Methods 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000035515 penetration Effects 0.000 abstract 3
- 230000007246 mechanism Effects 0.000 description 12
- 230000000694 effects Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
The utility model discloses a wire-clamping welding device for a double-interface-card. The wire-clamping welding device comprises an absorbing part (1), a welding head (2), a first driving part (3), and a pressing structure used for enabling a chip (10) to be welded to abut against the absorbing part (1). The welding head (2) is fixedly provided with at least two welding openings (21), and the two welding openings (21) are arranged on one side, towards the absorbing part (1), of the welding head (2) in parallel. Penetration holes for penetration of the two welding openings (21) are formed in the pressing structure. The first driving part (3) is used for driving the welding head (2) to drive the two welding openings (21) to move along the welding surface towards the chip (10) and penetrate through the penetration holes, and the two welding openings (21) weld two antenna heads inside a chip groove of the double-interface-card to two predetermined welding spots in the chip (10) at the same time. The wire-clamping welding device has the advantage of improving the production efficiency.
Description
Technical field
The utility model relates to the equipment of preparing double-interface card, more particularly, relates to a kind of clamp welder of double-interface card.
Background technology
Along with information technology and economic develop rapidly all over the world, economy and information interchange between people are more and more frequent, people are also finding various communication media easily always simultaneously, the contact type CPU card (smart card) using from early stage magnetic card storage card, logic encryption card and now a lot of field finally.Smart card is also being brought into play irreplaceable effect in people's life at present, is that contact intelligent card or contact type intelligent card all have its merits and demerits separately, and the wearing and tearing between contact intelligent card and card machine tool, have shortened its service life greatly.And non-contact card is in the occasion of Radio frequency interference severity, its application is limited; Secondly owing to passing through coupling transferring energy, so require its power consumption very low; Moreover, due to now a lot of industries, as there is technology and the infrastructure of the application of a large amount of contact card in the industries such as finance, communication, they also will continue to use contact card, between this situation set the double-interface card of contact card and non-contact card advantage arise at the historic moment, the demand to double-interface card on market is increasing.
In prior art, the method for producing double-interface card generally comprises following steps:
1, be built-in with groove milling knockout film trap position on the double-interface card of antenna, chip groove exposes built-in aerial in position;
2, choose two aerial heads of built-in aerial;
3,2 predetermined solder joints on two aerial heads and chip weld respectively;
4, by implanted chip chip groove position, then encapsulate, with this, manufacture double-interface card.
Above-mentioned steps 3, generally the clamp welder by double-interface card carries out, the clamp welder of double-interface card of the prior art comprises positive adsorption piece, the plumb joint for adsorbing chip and the actuator that drives plumb joint, on plumb joint, be connected with a soldering opening, soldering opening is used for welding antenna and predetermined solder joint.During actual motion, soldering opening first welds together first antenna and first predetermined solder joint, actuator drives soldering opening to move to second antenna and second predetermined solder joint place again, and soldering opening welds together second antenna and second predetermined solder joint again.Visible soldering opening once can only weld an antenna and a predetermined solder joint, and therefore the clamp welder of double-interface card of the prior art exists following defect: production efficiency is lower.
Utility model content
The technical problems to be solved in the utility model is, for the above-mentioned defect of prior art, provides the clamp welder of the double-interface card that a kind of production efficiency is higher.
The utility model solves the technical scheme that its technical problem adopts: the clamp welder of constructing a kind of double-interface card, comprise adsorption piece, plumb joint, the first actuator, and for chip to be welded being supported to the pressing structure on described adsorption piece, on described plumb joint, be connected with at least two soldering openings, two described soldering openings walk abreast and are arranged on described plumb joint towards a side of described adsorption piece, in described pressing structure, be formed with for two perforation that described soldering opening wears, described the first actuator is for driving described plumb joint to drive two described soldering openings to move and pass described perforation along the solder side towards described chip, two described soldering openings are welded to two aerial heads in double-interface card chip groove on two predetermined solder joints of described chip simultaneously.
In the clamp welder of double-interface card described in the utility model, described pressing structure comprise the first pressing piece, the second pressing piece and drive described the first pressing piece and described the second pressing piece along the second actuator moving back and forth towards the solder side of described chip.
In the clamp welder of double-interface card described in the utility model, two described perforation are respectively the first perforation and the second perforation, and described the first perforation is formed on described the first pressing piece, and described the second perforation is formed on described the second pressing piece.
In the clamp welder of double-interface card described in the utility model, the clamp welder of described double-interface card also comprises installing rack, described the first pressing piece and described the second pressing piece are all arranged on described installing rack, and described the second actuator drives described installing rack to move back and forth along the solder side towards described chip.
In the clamp welder of double-interface card described in the utility model, the clamp welder of described double-interface card also comprises the 3rd actuator and fourth drive member, described the 3rd actuator is connected with described the first pressing piece, described fourth drive member is connected with described the second pressing piece, and described the 3rd actuator and described fourth drive member are used for driving described the first pressing piece and described the second pressing piece move toward one another or opposing motion on described installing rack.
In the clamp welder of double-interface card described in the utility model, the first baffle plate and second baffle that described the first pressing piece comprises the first main body and is fixed in respectively described first main body one end, form described the first perforation between described the first baffle plate and described second baffle.
In the clamp welder of double-interface card described in the utility model, the 3rd baffle plate and the 4th baffle plate that described the second pressing piece comprises the second main body and is fixed in respectively described second main body one end, form described the second perforation between described the 3rd baffle plate and described the 4th baffle plate.
Implement the clamp welder of double-interface card of the present utility model, there is following beneficial effect: the first pressing piece can be by the back side that is pressed in chip, the second pressing piece also can be by the back side that is pressed in chip simultaneously, under the effect of the first pressing piece, the second pressing piece and adsorption piece, chip is clamped like this, thus the welding operation of cooperation plumb joint; Two soldering openings, respectively through the first perforation and the second perforation, are welded to two aerial heads on two predetermined solder joints simultaneously, have improved like this production efficiency, also make the qualification rate of product higher.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:
Fig. 1 is the structural representation that the clamp welder of the utility model double-interface card and chip turning device of the prior art and chip positioning device are assembled together;
Fig. 2 is the partial enlarged drawing at A place in Fig. 1;
Fig. 3 is the top view of the clamp welder embodiment of the utility model double-interface card;
Fig. 4 is the structural representation of the clamp welder embodiment of the utility model double-interface card;
Fig. 5 is the partial enlarged drawing at B place in Fig. 4;
In figure:
1-adsorption piece;
2-plumb joint; 21-soldering opening;
3-the first actuator;
4-the first pressing piece; 41-the first perforation, 42-the first main body, 43-the first baffle plate, 44-second baffle;
5-the second pressing piece; 51-the second perforation, 52-the second main body, 53-the 3rd baffle plate, 54-the 4th baffle plate;
6-the second actuator;
7-installing rack;
8-the 3rd actuator;
9-fourth drive member;
10-chip.
The specific embodiment
For technical characterictic of the present utility model, object and effect being had more clearly, understand, now contrast accompanying drawing and describe the specific embodiment of the present utility model in detail.
As shown in Figure 1, Fig. 1 is the structural representation that the clamp welder of the utility model double-interface card and chip turning device (not shown) of the prior art and chip positioning device (not shown) are assembled together, certainly, in certain embodiments, the clamp welder of double-interface card of the present utility model also can be installed separately.
As shown in Figure 3-Figure 5, comprise adsorption piece 1, plumb joint 2, the first actuator 3, and for chip 10 to be welded being supported to the pressing structure on adsorption piece 1, on plumb joint 2, be connected with at least two soldering openings 21, two soldering openings 21 walk abreast and are arranged on plumb joint 2 towards a side of adsorption piece 1, in pressing structure, be formed with for two perforation that soldering opening 21 wears, the first actuator 3 is for driving plumb joint 2 to drive two soldering openings 21 to move and pass through hole along the solder side towards chip 10, two soldering openings 21 are welded to two aerial heads in double-interface card chip groove on two predetermined solder joints of chip 10 simultaneously.
Adsorption piece 1 is for adsorbing the front of chip 10, and there are two predetermined solder joints at the back side of chip 10.The front that adsorption piece 1 can adsorb chip 10 by sucker or internally provided with vacuum pipeline, adsorption piece 1 adopts conventional adsorption piece in prior art, does not repeat them here.The front of chip 10 refers to that chip 10 is after implanting the chip groove position of double-interface card, the one side being exposed; The back side of chip 10 refers to the one side of the chip groove position of chip 10 implantation double-interface cards; Two predetermined solder joints at the back side of chip 10 lay respectively at the both sides at the back side of chip 10, and two aerial heads and two predetermined solder joints weld the communication connection that can realize chip and double-interface card built-in aerial (built-in aerial has two above-mentioned aerial heads).
Preferably, affixed two soldering openings 21 on plumb joint 2, the affixed mode of affixed two soldering openings 21 of plumb joint 2 can be welding or the affixed mode such as one-body molded, soldering opening 21 adopts the mode of resistance heatings to produce heat and welds.Two soldering openings 21 are all positioned at plumb joint 2 towards one end of adsorption piece 1, and two soldering opening 21 parallel arrangements.
Pressing structure comprises the second actuator 6 that the first pressing piece 4, the second pressing piece 5 and driving the first pressing piece 4 and the second pressing piece 5 move back and forth along the solder side towards chip 10.The first pressing piece 4 and the second pressing piece 5 are all located between plumb joint 2 and adsorption piece 1.
Two perforation are respectively the first perforation 41 and the second perforation 51, the first perforation 41 are formed on the first pressing piece 4, and the second perforation 51 is formed on the second pressing piece 5.
The first actuator 3 can be also screw-drive mechanism, by screw rod and nut meshing, carry out transferring power, plumb joint 2 is fixed in the end of screw rod, when plumb joint 2 is retracted, (away from adsorption piece 1) plumb joint 2 is contactless with chip 10, when plumb joint 2 stretches out, (towards adsorption piece 1) two soldering openings 21, respectively through first perforation the 41 and second perforation 51, are welded to two aerial heads on two predetermined solder joints simultaneously; Or the first actuator 3 is the conventional driving mechanisms such as hydraulic cylinder.
As shown in Figure 5, the first pressing piece 4 comprise the first main body 42 and be fixed in respectively first baffle plate 43 of first main body 42 one end and second baffle 44, the first baffle plates 43 and second baffle 44 between form the first perforation 41.Affixed mode can be welding or one-body molded or securing member connection etc.The first perforation 41 is passed for a soldering opening 21, and therefore the shape of the first perforation 41 and size should be suitable with shape and the size of a soldering opening 21.
As shown in Figure 5, the second pressing piece 5 comprise the second main body 52 and be fixed in respectively the 3rd baffle plate 53 of second main body 52 one end and the 4th baffle plate 54, the three baffle plates 53 and the 4th baffle plate 54 between form the second perforation 51.Affixed mode can be welding or one-body molded or securing member connection etc.The second perforation 51 is passed for another soldering opening 21, and therefore the shape of the second perforation 51 and size should be suitable with shape and the size of another soldering opening 21.
The front of adsorption piece 1 absorption chip 10, the first pressing piece 4 and the second pressing piece 5 all can clamp vertical chip 10 like this by the back side that is pressed in chip 10, are convenient to follow-up welding operation.Further, the first pressing piece 4 is that the second pressing piece 5 is by being pressed in second aerial head and second predetermined solder joint place by being pressed in first aerial head and first predetermined solder joint place; Like this after two soldering openings 21 are respectively through first perforation the 41 and second perforation 51, a soldering opening 21 just touches to weld with the junction of first aerial head and first predetermined solder joint, and another soldering opening 21 just touches to weld with the junction of second aerial head and second predetermined solder joint.
The second actuator 6 can be screw-drive mechanism, by screw rod and nut meshing, carrys out transferring power.Further, the second actuator 6 comprises the first screw-drive mechanism and the second screw-drive mechanism: the first screw-drive mechanism comprises the first screw rod and the first nut, the first pressing piece 4 is fixed on the end of the first screw rod, by the first screw rod and the first nut meshing, drives the first pressing piece 4 to move back and forth along the solder side towards chip 10; The second screw-drive mechanism comprises the second screw rod and the second nut, and the second pressing piece 5 is fixed on the end of the second screw rod, by the second screw rod and the second nut meshing, drives the second pressing piece 5 to move back and forth along the solder side towards chip 10.In certain embodiments, the second actuator 6 can be also the conventional driving mechanisms such as hydraulic cylinder.
In certain embodiments, the clamp welder of double-interface card also comprises that installing rack 7, the first pressing pieces 4 and the second pressing piece 5 are all arranged on installing rack 7, and the second actuator 6 drive installation framves 7 move back and forth along the solder side towards chip 10.Further, the first pressing piece 4 adopts the modes such as welding or securing member connection to be fixed on one end of installing rack 7, the second pressing piece 5 adopts the modes such as welding or securing member connection to be fixed on the other end of installing rack 7, the second actuator 6 can be screw-drive mechanism, by screw rod and nut meshing, carry out transferring power, installing rack 7 is fixed on the end of screw rod, by the meshing of screw rod and nut, comes drive installation frame 7 to move back and forth along the solder side towards chip 10.Other is identical with the present embodiment.
In further embodiments, can also be, the clamp welder of double-interface card also comprises the 3rd actuator 8 and fourth drive member 9, the 3rd actuator 8 is connected with the first pressing piece 4, fourth drive member 9 is connected with the second pressing piece 5, and the 3rd actuator 8 and fourth drive member 9 are for driving the first pressing piece 4 and the second pressing piece 5 move toward one another or opposing motion on installing rack 7.Now, the first pressing piece 4 is slidably arranged on installing rack 7, and sliding type can be realized by the slide rail and the chute that are slidably matched, and the second pressing piece 5 is also slidably arranged on installing rack 7, and sliding type can be realized by the slide rail and the chute that are slidably matched.The 3rd actuator 8 can be screw-drive mechanism, by screw rod and nut meshing, carrys out transferring power, for example, the first pressing piece 4 is fixed on to the end of screw rod; Fourth drive member 9 can be also screw-drive mechanism, by screw rod and nut meshing, carrys out transferring power, for example, the second pressing piece 5 is fixed on to the end of screw rod; With this, drive the first pressing piece 4 and the second pressing piece 5 move toward one another or opposing motion on installing rack 7.In certain embodiments, the second actuator 6 can be also the conventional driving mechanisms such as hydraulic cylinder.Other is identical with the present embodiment.
During concrete operations, with chip groove position the double-interface card of choosing 2 aerial heads in chip groove position be placed in adsorption piece 1 below, now the front of adsorption piece 1 absorption chip 10, makes chip 10 be erected at the top of double-interface card; Then the second actuator 6 drives the first pressing piece 4 and the second pressing piece 5 synchronizing movings, makes the first pressing piece 4 and the second pressing piece 5 all by being pressed on the back side of chip 10; Now the first actuator 3 drives two soldering openings 21 respectively through first perforation the 41 and second perforation 51, and two aerial heads are welded on two predetermined solder joints simultaneously.
In the present embodiment, the first pressing piece 4 can be by the back side that is pressed in chip 10, the second pressing piece 5 also can clamp chip 10 like this by the back side that is pressed in chip 10 under the effect of the first pressing piece 4, the second pressing piece 5 and adsorption piece 1 simultaneously, thereby coordinates the welding operation of plumb joint 2; Two soldering openings 21, respectively through first perforation the 41 and second perforation 51, are welded to two aerial heads on two predetermined solder joints simultaneously, have improved like this production efficiency, also make the qualification rate of product higher.
By reference to the accompanying drawings embodiment of the present utility model is described above; but the utility model is not limited to the above-mentioned specific embodiment; the above-mentioned specific embodiment is only schematic; rather than restrictive; those of ordinary skill in the art is under enlightenment of the present utility model; not departing from the scope situation that the utility model aim and claim protect, also can make a lot of forms, within these all belong to protection of the present utility model.
Claims (7)
1. the clamp welder of a double-interface card, comprise adsorption piece (1), plumb joint (2), the first actuator (3), and for chip to be welded (10) being supported to the pressing structure on described adsorption piece (1), it is characterized in that, on described plumb joint (2), be connected with at least two soldering openings (21), two described soldering openings (21) are parallel is arranged on described plumb joint (2) towards a side of described adsorption piece (1), in described pressing structure, be formed with the perforation wearing for two described soldering openings (21), described the first actuator (3) is for driving described plumb joint (2) to drive two described soldering openings (21) to move and pass described perforation along the solder side towards described chip (10), two described soldering openings (21) are welded to two aerial heads in double-interface card chip groove on two predetermined solder joints of described chip (10) simultaneously.
2. the clamp welder of double-interface card according to claim 1, it is characterized in that, described pressing structure comprise the first pressing piece (4), the second pressing piece (5) and drive described the first pressing piece (4) and described the second pressing piece (5) along the second actuator (6) moving back and forth towards the solder side of described chip (10).
3. the clamp welder of double-interface card according to claim 2, it is characterized in that, two described perforation are respectively the first perforation (41) and the second perforation (51), it is upper that described the first perforation (41) is formed on described the first pressing piece (4), and described the second perforation (51) is formed on described the second pressing piece (5).
4. the clamp welder of double-interface card according to claim 3, it is characterized in that, the clamp welder of described double-interface card also comprises installing rack (7), it is upper that described the first pressing piece (4) and described the second pressing piece (5) are all arranged on described installing rack (7), and described the second actuator (6) drives described installing rack (7) to move back and forth along the solder side towards described chip (10).
5. the clamp welder of double-interface card according to claim 4, it is characterized in that, the clamp welder of described double-interface card also comprises the 3rd actuator (8) and fourth drive member (9), described the 3rd actuator (8) is connected with described the first pressing piece (4), described fourth drive member (9) is connected with described the second pressing piece (5), and described the 3rd actuator (8) and described fourth drive member (9) are for driving described the first pressing piece (4) and described the second pressing piece (5) in the upper move toward one another of described installing rack (7) or opposing motion.
6. the clamp welder of double-interface card according to claim 3, it is characterized in that, the first baffle plate (43) and second baffle (44) that described the first pressing piece (4) comprises the first main body (42) and is fixed in respectively described the first main body (42) one end, form described the first perforation (41) between described the first baffle plate (43) and described second baffle (44).
7. the clamp welder of double-interface card according to claim 3, it is characterized in that, the 3rd baffle plate (53) and the 4th baffle plate (54) that described the second pressing piece (5) comprises the second main body (52) and is fixed in respectively described the second main body (52) one end, form described the second perforation (51) between described the 3rd baffle plate (53) and described the 4th baffle plate (54).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320511139.3U CN203526788U (en) | 2013-08-20 | 2013-08-20 | Wire-clamping welding device for double-interface-card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320511139.3U CN203526788U (en) | 2013-08-20 | 2013-08-20 | Wire-clamping welding device for double-interface-card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203526788U true CN203526788U (en) | 2014-04-09 |
Family
ID=50413050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320511139.3U Expired - Lifetime CN203526788U (en) | 2013-08-20 | 2013-08-20 | Wire-clamping welding device for double-interface-card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203526788U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104148833A (en) * | 2014-08-01 | 2014-11-19 | 广州市明森机电设备有限公司 | Double-interface smart card chip welding method and device |
| CN105478984A (en) * | 2016-01-07 | 2016-04-13 | 广州市明森机电设备有限公司 | Chip spot-welding device for double-interface card |
-
2013
- 2013-08-20 CN CN201320511139.3U patent/CN203526788U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104148833A (en) * | 2014-08-01 | 2014-11-19 | 广州市明森机电设备有限公司 | Double-interface smart card chip welding method and device |
| CN105478984A (en) * | 2016-01-07 | 2016-04-13 | 广州市明森机电设备有限公司 | Chip spot-welding device for double-interface card |
| CN105478984B (en) * | 2016-01-07 | 2017-12-12 | 广州明森科技股份有限公司 | A kind of chip spot welding device of double-interface card |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 523710 Guangdong city of Dongguan province Tangxia City Tian Xin Keyuan Keyuan Road No. three Jin Lei Industrial Park building E Patentee after: SUNRISE TECHNOLOGY CO.,LTD. Address before: 523710 Guangdong city of Dongguan province Tangxia City Tian Xin Keyuan Keyuan Road No. three Jin Lei Industrial Park building E Patentee before: Guangdong Shuguang automation equipment Co.,Ltd. Address after: 523710 Guangdong city of Dongguan province Tangxia City Tian Xin Keyuan Keyuan Road No. three Jin Lei Industrial Park building E Patentee after: Guangdong Shuguang automation equipment Co.,Ltd. Address before: 523710 Guangdong city of Dongguan province Tangxia City Tian Xin Keyuan Keyuan Road No. three Jin Lei Industrial Park building E Patentee before: SUNRISE TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 523710 Guangdong city of Dongguan province Tangxia City Tian Xin Keyuan Keyuan Road No. three Jin Lei Industrial Park building E Patentee after: JOYCREAT TECHNOLOGY LTD. Address before: 523710 Guangdong city of Dongguan province Tangxia City Tian Xin Keyuan Keyuan Road No. three Jin Lei Industrial Park building E Patentee before: SUNRISE TECHNOLOGY CO.,LTD. |
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| CX01 | Expiry of patent term |
Granted publication date: 20140409 |
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| CX01 | Expiry of patent term |