CN203520436U - Ultrathin mobile phone paster IC card - Google Patents
Ultrathin mobile phone paster IC card Download PDFInfo
- Publication number
- CN203520436U CN203520436U CN201320545802.1U CN201320545802U CN203520436U CN 203520436 U CN203520436 U CN 203520436U CN 201320545802 U CN201320545802 U CN 201320545802U CN 203520436 U CN203520436 U CN 203520436U
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- card
- mobile phone
- paster
- circuit board
- ultrathin
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- Expired - Lifetime
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Abstract
The utility model provides an ultrathin mobile phone paster IC card through which an intelligent mobile phone achieves a paster swiping function. The ultrathin mobile phone paster IC card comprises a flexible circuit board printed and etched with an induction coil, an IC card chip is welded to the induction coil, the IC card chip is coated with an epoxy resin protection film, a sintering-type wave-absorbing layer is pasted on the flexible circuit board having the thickness of 0.13-0.15 mm. According to the utility model, by the utilization of the sintering-type wave-absorbing material and the induction coil etched on the FPC ultrathin flexible circuit board which is used for preparing the non-contact IC card, the thickness of the mobile phone paster IC card is greatly reduced on one hand, and on the other hand the interference by mobile phone electromagnetic wave can be maximumly shielded by the utilization of the sintering wave-absorbing material. By employing the ultrathin mobile phone paster IC card, a problem that the paster IC card cannot be employed by a conventional ultrathin intelligent mobile phone is solved, the beauty of the card in not influenced, the cost is low, the IC card can be held in a battery cover inside the mobile phone, and the IC card can also be embedded in a mobile phone protection cover.
Description
Technical field
The utility model relates to a kind of IC-card, especially a kind of ultra thin handset paster IC-card.
Background technology
Development along with Technology of Radio Frequency Card, various contactless IC cards become a part indispensable in people's daily life, in the face of miscellaneous IC card product, people more and more come wants the such card of similar mass transit card to bundle with mobile phone, aspect people's trip and use.Also the mass transit card that had occurred in recent years the outer subsides of many mobile phones or interior subsides on market, but often because its practicality is not strong, by people, do not received, especially along with smart mobile phone develops as ultra-thin aspect, be subject to the limitation that paster IC-card produces the thickness of sheet own and technique, such as present market share smart mobile phone: IPHONE and Samsung GALAXY series mobile phone the most widely, in mobile phone, paste and the outer IC card product pasting of mobile phone is more and more difficult to realization.
Utility model content
The utility model provides a kind of ultra thin handset paster IC-card that smart mobile phone paster is swiped the card of realizing.
Realize a kind of ultra thin handset paster IC-card of the utility model object, comprise the printing flexible circuit board that is etched with inductive coil alive, on described inductive coil, be welded with IC chip, on described IC chip, scribble epoxy resin diaphragm, in described flexible circuit board, be pasted with slug type and inhale ripple layer;
The thickness of described flexible circuit board is at 0.13～0.15mm.
Described slug type is inhaled the thickness of ripple layer at 0.1～0.15mm.
Described slug type is inhaled ripple layer and is provided with removable non-drying glue layer.
The frequency range that described slug type is inhaled ripple layer is 13.56MHz.
The beneficial effect of a kind of ultra thin handset paster IC-card of the present utility model is as follows:
A kind of ultra thin handset paster IC-card of the present utility model, by using FPC ultrathin flexible wiring board, make the inductive coil of contactless IC card and use slug type absorbing material, greatly reducing on the one hand the thickness of mobile phone paster IC-card, is that its THICKNESS CONTROL is in 0.3mm; On the other hand, use the absorbing material of slug type can shield to greatest extent the interference that battery of mobile phone ripple produces.Thereby realizing smart mobile phone paster swipes the card; can effectively solve the problem that current ultra-thin smart handset is used paster IC-card, not affect the attractive in appearance of card, it is with low cost simultaneously; can be placed on the battery cover the inside of interior of mobile phone, can be to be also embedded in mobile phone protective cover the inside.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of ultra thin handset paster IC-card of the present utility model.
Fig. 2 is the structural representation of the flexible circuit board of a kind of ultra thin handset paster IC-card of the present utility model.
Embodiment
As shown in Figure 1, 2, a kind of ultra thin handset paster IC-card of the present utility model, comprise the printing flexible circuit board 1 that is etched with inductive coil 2 alive, on described inductive coil 2, be welded with IC chip 3, on described IC chip 3, scribble epoxy resin diaphragm 4, in described flexible circuit board 1, be pasted with slug type and inhale ripple layer 5;
The thickness of described flexible circuit board 1 is at 0.13～0.15mm.
Described slug type is inhaled the thickness of ripple layer 5 at 0.1～0.15mm.
Described slug type is inhaled ripple layer 5 and is provided with removable non-drying glue layer 6.
The frequency range that described slug type is inhaled ripple layer 5 is 13.56MHz.
The method for making of a kind of ultra thin handset paster IC-card of the present utility model is as follows:
1, first make the ultra-thin FPC flexible circuit board of inductive coil, THICKNESS CONTROL word 0.1 ~ 0.13mm, the size of coil can be adjusted according to actual needs;
2, by FLIP conducting resinl packaging technology by IC chip bonding on the two poles of the earth of circuit board coil (binding point);
3, on the chip of having bound, be coated with one deck epoxide-resin glue, for the protection of chip.
4, according to the size of FPC plate, make slug type and inhale ripple layer, its thickness is between 0.13-0.15mm.
5, FPC plate and absorbing material are bonded together by glue, and at the removable non-drying glue layer of surface attachment.
Embodiment recited above is described preferred implementation of the present utility model; not scope of the present utility model is limited; design under spiritual prerequisite not departing from the utility model; various distortion and improvement that the common engineering technical personnel in this area make technical solutions of the utility model, all should fall in the definite protection domain of claims of the present utility model.
Claims (4)
1. a ultra thin handset paster IC-card, it is characterized in that: comprise the printing flexible circuit board that is etched with inductive coil alive, on described inductive coil, be welded with IC chip, on described IC chip, scribble epoxy resin diaphragm, in described flexible circuit board, be pasted with slug type and inhale ripple layer;
The thickness of described flexible circuit board is at 0.13～0.15mm.
2. a kind of ultra thin handset paster IC-card according to claim 1, is characterized in that: described slug type is inhaled the thickness of ripple layer at 0.1～0.15mm.
3. a kind of ultra thin handset paster IC-card according to claim 1 and 2, is characterized in that: described slug type is inhaled ripple layer and is provided with removable non-drying glue layer.
4. a kind of ultra thin handset paster IC-card according to claim 1 and 2, is characterized in that: the frequency range that described slug type is inhaled ripple layer is 13.56MHz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320545802.1U CN203520436U (en) | 2013-09-04 | 2013-09-04 | Ultrathin mobile phone paster IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320545802.1U CN203520436U (en) | 2013-09-04 | 2013-09-04 | Ultrathin mobile phone paster IC card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203520436U true CN203520436U (en) | 2014-04-02 |
Family
ID=50379332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320545802.1U Expired - Lifetime CN203520436U (en) | 2013-09-04 | 2013-09-04 | Ultrathin mobile phone paster IC card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203520436U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021134554A1 (en) * | 2019-12-31 | 2021-07-08 | 李庆远 | Portable device protective sleeve with built-in electronic label |
-
2013
- 2013-09-04 CN CN201320545802.1U patent/CN203520436U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021134554A1 (en) * | 2019-12-31 | 2021-07-08 | 李庆远 | Portable device protective sleeve with built-in electronic label |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140402 |
|
| CX01 | Expiry of patent term |