CN203504954U

CN203504954U - Chip removing device

Info

Publication number: CN203504954U
Application number: CN201320608309.XU
Authority: CN
Inventors: 刁鹏; 万鸣
Original assignee: CHENGDU SEEKCON MICROWAVE COMMUNICATION Co Ltd
Current assignee: CHENGDU SEEKCON MICROWAVE COMMUNICATION Co Ltd
Priority date: 2013-09-30
Filing date: 2013-09-30
Publication date: 2014-03-26
Anticipated expiration: 2023-09-30

Abstract

The utility model discloses a chip removing device. The chip removing device comprises a device cap, a device seat and a device plate which are connected into one body. A circular truncated cone is disposed in the device cap, and two ends of the device plates are provided with gaps. When the chip removing device is used, the device plate is placed on four rows of chip pins of a chip, the device cap is sleeved on a solder tip of an electric soldering iron, heat collected from the solder tip is transmitted to the device plate under the device seat through the device seat, the device plate heats tin at the chip pins to be molten, so that a failure chip can be removed fast, and back repair cost, maintenance cost and processing fabricating cost of a circuit board are lowered.

Description

Chip removes device

Technical field

The utility model belongs to the micro-packaging technology of microwave field, relates generally to for removing and is arranged on the chip of chip failing on circuit board and removes device.

Background technology

In the course of processing of microwave device circuit board, often can run into the situation that the chip being originally arranged on circuit board will be removed.Traditional chip removes needs professional machinery equipment, but that professional chip removes machinery equipment is expensive, but also needs professional person to operate, and what greatly increased circuit board reprocesses maintenance and processing and fabricating cost.If removed without machinery equipment, need to cut four sections of silver jacketed wires suitable with chip width, be placed on respectively on four row's core pin of chip, and by the tin of again burn-oning on silver jacketed wire, the core pin at silver jacketed wire and place is linked together by the tin of again burn-oning, and then arrange two personal 4 electric iron respectively four sections of thin silver jacketed wires to be heated simultaneously, when then the tin on four row's core pin such as grade melts simultaneously, chip is removed, operation is wasted time and energy like this, and is easy to circuit board to weld fault.

Utility model content

For above-mentioned deficiency of the prior art, the chip that the utility model provides removes device and has solved the problem that chip failing cost is high that removes in prior art.

In order to reach foregoing invention object, the technical solution adopted in the utility model is: provide a kind of chip to remove device, comprise the device cap, device seat and the device plate that connect as one; Described device cap inside is provided with a frustum of a cone, and device plate two ends are provided with a gap.

Further, four of described device seat jiaos is arc structure.

Further, the device plate directly over described gap is arranged to sharp arc structure.

The beneficial effects of the utility model are: during use, device plate is placed on four row's core pin of chip, device cap sleeve is on the solder horn of electric iron, the heat of collecting from solder horn is passed to the device plate below device seat by device seat, device plate is again by the tin heat fused at core pin place, the rapid moving that reaches chip failing removes, thereby reduced chip, removes cost, has also reduced the reprocessing of circuit board, maintenance and processing and fabricating cost simultaneously;

The frustum of a cone is arranged in device cap inside, makes this chip remove the solder horn that device had both been applicable to Kuan Zui, sharp mouth electric iron, can guarantee and solder horn between good contact, collect to greatest extent heat, and easy to process;

The gap that device plate two ends are reserved, facilitates sharp mouth tweezers to probe into chip bottom by this gap, reaches the object that chip is removed.

accompanying drawing is described

Fig. 1 is the end view that chip removes device;

Fig. 2 is the vertical view that chip removes device;

Fig. 3 is the upward view that chip removes device.

Wherein, 1, the frustum of a cone; 2, device cap; 3, device seat; 31, arc structure; 4, device plate; 41, sharp arc structure; 5, gap.

Embodiment

As shown in Figure 1 to Figure 3, this chip removes device and comprises device cap 2, device seat 3 and the device plate 4 connecting as one; Described device cap 2 inside are provided with a frustum of a cone 1, and device plate 4 two ends are provided with a gap 5.Device cap 1 is enclosed within on the solder horn of electric iron, and the heat of collecting from solder horn is passed to the device plate 4 below device seat 3 by device seat 3, and device plate 4 is again by the tin heat fused at core pin place, and the rapid moving that reaches chip failing removes.

The frustum of a cone 1 is arranged in this programme device cap 2 inside, makes this chip remove the solder horn that device had both been applicable to Kuan Zui, sharp mouth electric iron, can guarantee and solder horn between good contact, collect to greatest extent heat, and easy to process.

The gap 5 that device plate 4 two ends are reserved, facilitates sharp mouth tweezers to probe into chip bottom by this gap 5, reaches the object that chip is removed.3 four jiaos of the device seats of this programme are arc structure 31, are conducive to heat and preserve better, transfer heat to as much as possible device plate 4; 5 upper ends, space arrange sharp arc structure and 41 are not right angles, are mainly that such setting is more conducive to heat and to device plate 4, transmits preferably.

Thermal conductivity and the conductivity of metal have close ties, conventionally electric conductivity is better, its heat conductivility is just better, three kinds of best metals of conductivity are followed successively by silver, copper, aluminium from high to low by conductivity, the chip of this programme removes device and adopts copper as material, in three kinds of metals, the hardness of copper is high, fusing point is high, thermal conductivity good and low price, is the metal material of cost performance optimum.

This programme optimizer plate 4 is highly greater than the core pin of chip to the height at chip top, to reduce to greatest extent scattering and disappearing of heat, the optimum height ideal value of device plate 4 is just to equal chip height, but the wearing and tearing while considering every day use, expand with heat and contract with cold and mismachining tolerance, this programme highly arranges device plate 4 to be greater than chip height, is 1.5mm; Device seat 3 is highly too low, has around the corner more heat transfer loss, and device seat 3 excessive height increase heat and transmit distance, also can increase the loss that heat transmits, and the device seat 3 of this programme is highly set to 1.8mm; The height of the frustum of a cone 1 of device cap 2 inside is set to 10.8mm, to make device cap 2 encase well solder horn; Device plate 4 width are the overall width of every row's core pin, i.e. 6.0mm.

Although by reference to the accompanying drawings embodiment of the present utility model is described in detail, should not be construed as the restriction to the protection range of this patent.In the described scope of claims, the various modifications that those skilled in the art can make without creative work and distortion still belong to the protection range of this patent.

Claims

1. chip removes a device, comprises the device cap, device seat and the device plate that connect as one; Described device cap inside is provided with a frustum of a cone, and device plate two ends are provided with a gap.

2. chip according to claim 1 removes device, it is characterized in that: four jiaos of described device seat is arc structure.

3. chip according to claim 1 removes device, it is characterized in that: the device plate directly over described gap is arranged to sharp arc structure.

4. chip according to claim 1 removes device, it is characterized in that: the height of described device plate is greater than chip core pin to the height at chip top.

5. according to the arbitrary described chip of claim 1-4, remove device, it is characterized in that: the material that described chip removes device is copper.