CN203480207U - Spiral airflow dynamic gas lock for extreme ultraviolet lithography machine - Google Patents
Spiral airflow dynamic gas lock for extreme ultraviolet lithography machine Download PDFInfo
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- CN203480207U CN203480207U CN201320482568.2U CN201320482568U CN203480207U CN 203480207 U CN203480207 U CN 203480207U CN 201320482568 U CN201320482568 U CN 201320482568U CN 203480207 U CN203480207 U CN 203480207U
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- 238000001900 extreme ultraviolet lithography Methods 0.000 title abstract description 7
- 239000007789 gas Substances 0.000 claims description 52
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 4
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- 229910052734 helium Inorganic materials 0.000 claims description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
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Abstract
The utility model discloses a spiral airflow dynamic gas lock for an extreme ultraviolet lithography machine. The spiral airflow dynamic gas lock is communicated with a first chamber and a second chamber and prevents substances in the second chamber from entering the first chamber, and comprises a cylinder body with both opened ends, wherein one of the ends has a wide opening and the other has a narrow opening; the wide-opening end is connected with the first chamber; the narrow-opening end is connected with the second chamber; the lateral side, close to the narrow-opening end, of the cylinder body comprises multiple spiral airflow nozzles for blowing towards inside of the cylinder body; airflow ejecting from the multiple spiral airflow nozzles can rotate around the center shaft of the cylinder body to generate spiral airflow which converges on a place near the center shaft of the cylinder body; the lateral side, close to the wide-opening end, of the cylinder body comprises at least one air admission airflow nozzle which blows among the projection points of the spiral airflow nozzles on the center shaft of the cylinder body. The spiral airflow dynamic gas lock can be applied to extreme ultraviolet lithography machines, can inhibit impurity diffusion and can also well ensure that the extreme ultraviolet irradiates through the dynamic gas lock in a nearly lossless manner.
Description
Technical field
The utility model belongs to extreme ultraviolet laser technical field, is specifically related to a kind of lock of the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine (Extreme Ultraviolet Lithography, EUVL) (Dynamic Gas Lock, DGL).
Background technology
Because air and nearly all dioptrics material have strong absorption to the extreme ultraviolet of 13.5nm wavelength (EUV) irradiation, cause the litho machine under extreme ultraviolet photolithographic machine and normal air environment to differ widely.The principal feature of extreme ultraviolet photolithographic machine shows: optical system is reflective optical system; Internal environment is vacuum environment, except the EUV irradiation to 13.5nm has high permeability, also wants the polluter of generation to be discharged rapidly.The all parts systems such as the light source of extreme ultraviolet photolithographic machine, optical system, mask platform and work stage are all placed in vacuum environment.All parts working environment is different, and in extreme ultraviolet photolithographic machine, different vacuum chambers have different vacuum requirements.
The vacuum environment of the lamp optical system of extreme ultraviolet photolithographic machine, imaging optical system etc. is super clean vacuum environment, and this vacuum environment, under certain vacuum degree, can meet the super clean environment for use requirement of EUVL optical mirror slip.In this super clean vacuum environment, except guaranteeing approximate harmless the passing through of EUV irradiation, also to avoid the deposition of pollutant in optical system, the serviceable life of guaranteeing optical system, thus need the strict vacuum deflation rate of controlling super clean vacuum environment internal material and discharge the dividing potential drop of gas composition.There is document (Abneesh Srivastava, Stenio Pereira, Thomas Gaffney.Sub-Atmospheric Gas Purification for EUVL Vacuum Environment Control.SPIE, 2012) point out super clean vacuum environmental requirement hydrocarbon (C
xh
y) dividing potential drop is not more than 1 * 10
-9mbar, water partial pressure is not more than 1 * 10
-7mbar, to guarantee that the reflectivity loss in optical system 7～10 years is less than 1%.
The vacuum environment of the parts such as the mask platform of extreme ultraviolet photolithographic machine, silicon wafer stage is clean vacuum environment.In this vacuum environment, do not comprise optical element, only need meet clean vacuum requirement.In this clean vacuum environment, do not comprise optical element, EUV irradiation light path is only by seldom a part of region, so it is so high to require to be not so good as super clean vacuum environment, can allows the certain impurity of generation (as the pollutant that on the silicon chip of silicon wafer stage, photoresist exposure produces) but need the strictly diffusion of control impurity.
The logical light aperture that has certain pore size in super clean vacuum environment is connected with clean vacuum environment, and extreme ultraviolet irradiation is by this aperture, and the silicon chip being opposite in clean vacuum environment exposes.Can there is photochemical reaction in the photoresist of silicon chip surface, produce harmful waste gas and the contamination particle of optical element in super clean vacuum environment under the effect of extreme ultraviolet irradiation, must these waste gas and contamination particle be discharged in time by vacuum pumping system.
For maintaining super clean vacuum environment, be necessary very much to set up dynamic gas lock (Dynamic Gas Lock – DGL) between super clean vacuum environment and clean vacuum environment, thereby by two kinds of different environment isolation that require.
Utility model content
(1) technical matters that will solve
Technical problem to be solved in the utility model is how to suppress better producing pollutant in clean vacuum environment (as EUV light source, mask stage chamber or silicon wafer stage chamber etc.) to spread to super clean vacuum environment, and guarantees that extreme ultraviolet irradiation does not have large loss while locking by this dynamic gas.
(2) technical scheme
For solving the problems of the technologies described above, the utility model proposes a kind of lock of the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine, for being communicated with the first chamber and second chamber of extreme ultraviolet photolithographic machine, and stop material in the second chamber of clean vacuum environment to enter the first chamber of super clean vacuum environment, described dynamic gas lock comprises the stack shell of a both ends open, stack shell has a wide mouth end and a slot end, and described wide mouth end connects described the first chamber, and described slot end connects described the second chamber; The side of the close slot end of described stack shell comprises a plurality of for to the inner jet spiral air flow spout of stack shell, the air-flow that the plurality of spiral air flow spout sprays can be rotated around the central shaft of stack shell, produce spiral air flow in the same way, this spiral air flow converges near the central shaft of described stack shell; The side of the close wide mouth end of described stack shell comprises that at least one is for to the inner jet tonifying Qi air-flow spout of stack shell, and the intersection point of the axially-extending line of described tonifying Qi air-flow spout and the central shaft of described stack shell is at the spout of each spiral air flow spout group between the subpoint on this central shaft.
According to a kind of embodiment of the present utility model, the xsect of described stack shell is circular.
According to a kind of embodiment of the present utility model, described a plurality of spiral air flow spouts are divided into a plurality of spiral air flow spout groups, and each spiral air flow spout group is comprised of at least one spout being positioned on the same xsect of this stack shell.
According to a kind of embodiment of the present utility model, the spout of same spiral air flow spout group is uniformly distributed on the xsect of described stack shell.
According to a kind of embodiment of the present utility model, described each spiral air flow spout direction is all towards the inside of stack shell, and while the intersection point of the axially-extending line of each spiral air flow spout and described stack shell side in this spout with along between next adjacent ports of jet direction, minute air-flow that makes to spray from any spiral air flow spout is outside in minute air-flow along an adjacent ports ejection jet direction, inner along minute air-flow of next adjacent ports ejection of jet direction, to guarantee the formation of spiral air flow.
According to a kind of embodiment of the present utility model, adjacent spiral air flow spout group or its subpoint at central shaft distribute in the central axis direction equal intervals of described stack shell.
According to a kind of embodiment of the present utility model, the subpoint of the spout of the axially-extending line of described tonifying Qi air-flow spout and the intersection point of the central shaft of described stack shell and the spiral air flow spout group of the most close described tonifying Qi air-flow spout on described central shaft overlaps.
According to a kind of embodiment of the present utility model, described tonifying Qi air-flow spout is more than one, and is equidistantly arranged on the xsect of described stack shell.
According to a kind of embodiment of the present utility model, the jet velocity of the spout of each spiral air flow spout group is: more larger away from the jet velocity of the spout of described slot end.
According to a kind of embodiment of the present utility model, described gas is for being dried without assorted hydrogen, helium, argon gas, nitrogen or their two kinds/multiple mixed gass.
(3) beneficial effect
The spiral air flow dynamic gas lock construction the utility model proposes, in inhibition of impurities diffusion, better guarantees that extreme ultraviolet irradiation approaches harmless locking by dynamic gas.
Accompanying drawing explanation
Fig. 1 has shown the principle assumption diagram of spiral air flow dynamic gas lock of the present utility model;
Fig. 2 has shown the concrete structure of the stack shell that the spiral air flow dynamic gas of an embodiment of the present utility model is locked;
Fig. 3 has shown the section figure of the stack shell that the spiral air flow dynamic gas of an embodiment of the present utility model is locked, and has wherein shown the spiral air flow spout group arranging on it.
Embodiment
Generally speaking, the lock of the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine the utility model proposes is for being communicated with two chambers and stoping the material of one of them chamber to enter another chamber.
Specifically, this spiral air flow dynamic gas lock presents a tubular, comprises the stack shell of a both ends open, and stack shell has a wide mouth end and a slot end (being horn-like), and wide mouth end connects one first chamber, and slot end connects one second chamber.This dynamic gas lock is for stoping the material of the second chamber to enter the first chamber.For example the first chamber interior is super clean vacuum environment, and the second chamber interior is clean vacuum environment, and dynamic gas of the present utility model lock can prevent that impurity in clean vacuum environment, dust etc. from entering super clean vacuum environment.
And, at least one spiral air flow spout group of side arrangement at the close slot end of described stack shell, this spiral air flow spout group is by forming to the inner a plurality of air-flow spouts of blowing of stack shell, the plurality of spout all runs through the sidewall of stack shell, to blow a kind of gas by these spouts to stack shell inside, the air-flow that each spout blows to stack shell inside forms a minute air-flow.
The direction of each air-flow spout of spiral air flow spout group is configured to allow a minute air-flow for described each air-flow spout ejection be rotated around the central shaft of stack shell, produces spiral air flow in the same way.This spiral air flow converges near described central shaft.
In addition, at least one tonifying Qi air-flow spout group of side arrangement at the close wide mouth end of described stack shell, this tonifying Qi air-flow spout group is by forming to inner at least one the air-flow spout of blowing of stack shell, this at least one spout also runs through the sidewall of stack shell, to pass through to the inner blow gas of stack shell, the air-flow that each spout blows to stack shell inside also forms a minute air-flow, and within each minute, air-flow forms tonifying Qi air-flow.
The direction of the air-flow spout of tonifying Qi air-flow spout group is configured to make the gas of its ejection to blow to the middle part of spiral air flow spout group.Specifically, the intersection point of the axially-extending line of tonifying Qi air-flow spout and the central shaft of stack shell is at the spout of each spiral air flow spout group between the subpoint on this central shaft.Preferably, the subpoint of the spout of this intersection point and the spiral air flow spout group of the most close described tonifying Qi air-flow spout on described central shaft overlaps.Center tonifying Qi air-flow and spiral air flow are split up into the air-flow that gathers that inflow the first chamber gathers air-flow and flows into the second chamber after flowing into dynamic gas lock, then by the aspiration pump group of the first chamber and the second chamber, are discharged respectively.
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the utility model is described in further detail.
Fig. 1 is the principle assumption diagram of an embodiment of spiral air flow dynamic gas lock of the present utility model.As shown in Figure 1, the dynamic gas lock of this embodiment is applied to for extreme ultraviolet photolithographic machine, its integral body is a tubular, the hydraucone shape that its stack shell 3 is both ends open, its wide mouth end 31 connects one first chamber 1, it is super clean vacuum environment that its slot end 32 connects one second chamber 2, the first chambers 1 inner, and the second chamber 2 inside are clean vacuum environment.The stack shell of this dynamic gas lock can be any shape that one end is wider, the other end is narrower, but is preferably cylindrical shape, and its xsect is circular.
Described the first chamber 1 and the second chamber 2 have respectively an aspiration pump group, i.e. the first aspiration pump group 11 and the second aspiration pump group 12, for outwards bleeding from the first chamber 1 and the second chamber 2 respectively.
Side arrangement at the close slot end 32 of described stack shell has a plurality of spiral air flow spout groups 33, be four in this embodiment, be respectively the first spiral air flow spout group 331, the second spiral air flow spout group 332, triple helical air-flow spout group 333 and the 4th spiral air flow spout group 334.Each spiral air flow spout group 331～334(or its subpoint at central shaft) be preferably in the central axis direction equal intervals of stack shell 3 and distribute.In other words, the spacing of the adjacent central axis of spout of spiral air flow spout group and the intersection point of the sidewall of described stack shell is preferably and equates.
Each spiral air flow spout group 33 is by forming to the inner a plurality of air-flow spouts of blowing of stack shell.Fig. 3 has shown the wherein arrangement of the first spiral air flow spout group 331, and this figure is that stack shell 3 is at the sectional view at the first spiral air flow spout group place.As shown in Figure 3, the first spiral air flow spout group 331 comprises eight spouts 3311～3318, and it is spacedly distributed on described cross section, and all runs through the sidewall of stack shell.By these spouts, can blow to stack shell inside a kind of gas, the air-flow that each spout blows to stack shell inside forms a minute air-flow.The second to the 4th spiral air flow spout group 332～334 also with the first spiral air flow spout groups 331 have similar structure.
Refer again to Fig. 3, the direction of each air-flow spout of the first spiral air flow spout group 331 is configured to allow a minute air-flow for described each air-flow spout ejection be rotated around the central shaft of stack shell 3, produces spiral air flow.This spiral air flow converges near described central shaft.In this embodiment, the direction of each spiral air flow spout is all towards the inside of stack shell 3 and along the tangential direction of cross-sectional edge, as shown in Figure 3.But the utility model is not limited to this, described each spiral air flow spout direction all also can become with its tangential direction at the edge of described xsect a little angle towards the inside of stack shell 3, and the size of this angle need to guarantee that minute air-flow spraying from a spout can not have influence on the side of minute air-flow spraying with other spouts.In other words, the intersection point of the axially-extending line of each spiral air flow spout and described stack shell side is in this spout with along between next adjacent ports of jet direction, minute air-flow that makes to spray from any spiral air flow spout is outside in minute air-flow along an adjacent ports ejection jet direction, inner along minute air-flow of next adjacent ports ejection of jet direction, to guarantee the formation of spiral air flow.
In the embodiment shown in fig. 3, because 8 spiral air flow spouts are equally distributed, therefore, in order to reach above-mentioned requirements, the direction of spout and its tangent line angulation at the edge of described xsect are not more than 22.5 °.Each spout of the spiral air flow spout group being spacedly distributed for other, this angle is 180 °/n, n is the spout number in this spiral air flow spout group.
In order to coordinate direction and the angle of spout, the shape of the neighboring of stack shell can be done adaptive variation, as shown in Figure 3, but needs to guarantee that it still presents a tubular on the whole.
In addition, refer again to Fig. 2, at least one tonifying Qi air-flow spout group 34 of side arrangement at the close wide mouth end 31 of described stack shell 3, this tonifying Qi air-flow spout group 34 is by forming to inner at least one the air-flow spout of blowing of stack shell 3, this at least one spout also runs through the sidewall of stack shell, to pass through to the inner blow gas of stack shell, the air-flow that each spout blows to stack shell inside also forms a minute air-flow, and within each minute, air-flow forms tonifying Qi air-flow.In the embodiment of Fig. 2, a plurality of tonifying Qi air-flow spouts are equidistantly arranged on the xsect of stack shell 3 (in figure, shown upper and lower two spouts, actual in side, also can have several).When more than one of tonifying Qi air-flow spout group, each tonifying Qi air-flow spout group is also preferably axially equidistantly distributing at stack shell.
The direction of the air-flow spout of tonifying Qi air-flow spout group 34 is configured to make the gas of its ejection to blow to the middle part of spiral air flow spout group, and the intersection point of the axially-extending line of tonifying Qi air-flow spout and the central shaft of described stack shell 3 is at the spout of each spiral air flow spout group between the subpoint on this central shaft.Preferably, as shown in Figure 2, the subpoint of the spout of the spiral air flow spout group of the axially-extending line of tonifying Qi air-flow spout and the intersection point of the central shaft of described stack shell 3 and the most close described tonifying Qi air-flow spout (being spiral air flow spout group 334 in Fig. 2) on described central shaft overlaps.
Center tonifying Qi air-flow and spiral air flow flow into be split up into after dynamic gas lock flow into the first chamber 1 gather air-flow h1 and flow into the second chamber 2 gather air-flow h2, then by the aspiration pump group 11,21 of the first chamber 1 and the second chamber 2, discharged respectively.
Along with spiral air flow is to the converging of central shaft, part inflow gas can, to the second chamber 2 and first chamber 1 shunting of super clean vacuum environment of clean vacuum environment, cause like this air-flow lower the closer to central shaft, the air pressure of cylindrical shell 3 on inflow path.For near air pressure compensation central shaft, by the spout group 34 of center tonifying Qi air-flow, directly towards spiral air flow Pan Zu center, be blown into, make cylindrical shell 3 near that slot end 32(hydraucone slot part of the second chamber 2 of clean vacuum environment) from wall to Dou Wei higher-pressure region, center, can effectively stop the pollutant of generation in the second chamber 2 to the diffusion of the first chamber 1 of super clean vacuum environment.
In addition, the gas that layout can make great majority flow into cylindrical shells 3 so all merge into flow into clean vacuum environment the second chamber 2 gather air-flow h2, thereby improve the service efficiency of inflow gas.Because flow into the air-flow h1 that gathers of the first chamber of super clean vacuum, can not to super clean vacuum environment, spreading by contaminant restraining, is invalid air-flow.
Preferably, the puff prot of all tonifying Qi air-flow spout groups 34 and the central shaft of cylindrical shell intersect at a point, and this point is the spiral air flow spout Zu334 center of close wide mouth end.
Because the spiral air flow that each spiral air flow spout group produces is all at the interior generation of stack shell 3 spiral air flow in the same way, regulate the jet velocity of the spout of each spiral air flow spout group, make more away from the jet velocity of the spout of slot end greatlyr, can make the higher-pressure region pressure of spiral air flow spout group inside approximate consistent.Like this, the stream condition parameter of spiral air flow spout group inside (pressure, density, temperature etc.) is more even, less on the extreme ultraviolet illuminated optical characteristic seeing through (being mainly aberration) impact, can guarantee that extreme ultraviolet irradiation approaches locking by dynamic gas of aberrationless loss.
Consider that hydrogen, helium, argon gas, nitrogen are relatively little to the absorption coefficient of extreme ultraviolet irradiation, each component air-flow in dynamic gas lock gases used for dry without assorted hydrogen, helium, argon gas, nitrogen or their two kinds/multiple mixed gass.Like this, can guarantee that extreme ultraviolet irradiation approaches locking by dynamic gas of noenergy loss.
Above-described specific embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiment of the utility model; be not limited to the utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (10)
1. the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine is locked, for being communicated with the first chamber and second chamber of extreme ultraviolet photolithographic machine, and stop material in the second chamber of clean vacuum environment to enter the first chamber of super clean vacuum environment, it is characterized in that:
Described dynamic gas lock comprises the stack shell of a both ends open, and stack shell has a wide mouth end and a slot end, and described wide mouth end connects described the first chamber, and described slot end connects described the second chamber;
The side of the close slot end of described stack shell comprises a plurality of for to the inner jet spiral air flow spout of stack shell, the air-flow that the plurality of spiral air flow spout sprays can be rotated around the central shaft of stack shell, produce spiral air flow in the same way, this spiral air flow converges near the central shaft of described stack shell;
The side of the close wide mouth end of described stack shell comprises that at least one is for to the inner jet tonifying Qi air-flow spout of stack shell, and the intersection point of the axially-extending line of described tonifying Qi air-flow spout and the central shaft of described stack shell is at the spout of each spiral air flow spout group between the subpoint on this central shaft.
2. the lock of the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine as claimed in claim 1, is characterized in that: the xsect of described stack shell is for circular.
3. the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine as claimed in claim 1 is locked, it is characterized in that: described a plurality of spiral air flow spouts are divided into a plurality of spiral air flow spout groups, each spiral air flow spout group is comprised of at least one spout being positioned on the same xsect of this stack shell.
4. the lock of the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine as claimed in claim 3, is characterized in that: the spout of same spiral air flow spout group is uniformly distributed on the xsect of described stack shell.
5. the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine as claimed in claim 3 is locked, it is characterized in that: described each spiral air flow spout direction is all towards the inside of stack shell, and described in each axially-extending line of spiral air flow spout and the intersection point of described stack shell side in this spout with along between next adjacent ports of jet direction.
6. the lock of the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine as claimed in claim 3, is characterized in that: adjacent spiral air flow spout group or its subpoint at central shaft distribute in the central axis direction equal intervals of described stack shell.
7. the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine as claimed in claim 3 lock, is characterized in that: the subpoint of the spout of the axially-extending line of described tonifying Qi air-flow spout and the intersection point of the central shaft of described stack shell and the spiral air flow spout group of the most close described tonifying Qi air-flow spout on described central shaft overlaps.
8. the lock of the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine as claimed in claim 1, is characterized in that: described tonifying Qi air-flow spout is more than one, and is equidistantly arranged on the xsect of described stack shell.
9. the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine as described in any one in claim 1 to 8 lock, is characterized in that: the jet velocity of the spout of each spiral air flow spout group is: more larger away from the jet velocity of the spout of described slot end.
10. the lock of the spiral air flow dynamic gas for extreme ultraviolet photolithographic machine as described in any one in claim 1 to 8, is characterized in that: described gas is for being dried without assorted hydrogen, helium, argon gas, nitrogen or their two kinds/multiple mixed gass.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320482568.2U CN203480207U (en) | 2013-08-08 | 2013-08-08 | Spiral airflow dynamic gas lock for extreme ultraviolet lithography machine |
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|---|---|---|---|
| CN201320482568.2U CN203480207U (en) | 2013-08-08 | 2013-08-08 | Spiral airflow dynamic gas lock for extreme ultraviolet lithography machine |
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| CN203480207U true CN203480207U (en) | 2014-03-12 |
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| CN201320482568.2U Expired - Lifetime CN203480207U (en) | 2013-08-08 | 2013-08-08 | Spiral airflow dynamic gas lock for extreme ultraviolet lithography machine |
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| Country | Link |
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| CN (1) | CN203480207U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103365119A (en) * | 2013-08-08 | 2013-10-23 | 中国科学院光电研究院 | Dynamic gas lock for spiral gas flow |
| CN104597115A (en) * | 2015-02-12 | 2015-05-06 | 中国科学院光电研究院 | Vacuum acquisition device for EUV irradiation material test system and corresponding test method |
| CN106094444A (en) * | 2016-06-03 | 2016-11-09 | 中国科学院光电研究院 | A kind of dynamic gas for extreme ultra violet lithography is locked |
| CN114698216A (en) * | 2021-03-04 | 2022-07-01 | 台湾积体电路制造股份有限公司 | Extreme ultraviolet source, method for improving asymmetric deposition, and radiation source |
-
2013
- 2013-08-08 CN CN201320482568.2U patent/CN203480207U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103365119A (en) * | 2013-08-08 | 2013-10-23 | 中国科学院光电研究院 | Dynamic gas lock for spiral gas flow |
| CN104597115A (en) * | 2015-02-12 | 2015-05-06 | 中国科学院光电研究院 | Vacuum acquisition device for EUV irradiation material test system and corresponding test method |
| CN104597115B (en) * | 2015-02-12 | 2019-03-19 | 中国科学院光电研究院 | The vacuum acquirement device and corresponding detection method of test system for extreme ultraviolet radiation material |
| CN106094444A (en) * | 2016-06-03 | 2016-11-09 | 中国科学院光电研究院 | A kind of dynamic gas for extreme ultra violet lithography is locked |
| CN106094444B (en) * | 2016-06-03 | 2017-11-10 | 中国科学院光电研究院 | A kind of dynamic gas for extreme ultra violet lithography is locked |
| CN114698216A (en) * | 2021-03-04 | 2022-07-01 | 台湾积体电路制造股份有限公司 | Extreme ultraviolet source, method for improving asymmetric deposition, and radiation source |
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Effective date of registration: 20200825 Address after: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Patentee after: Institute of Microelectronics of the Chinese Academy of Sciences Address before: 100190, No. 19 West Fourth Ring Road, Beijing, Haidian District Patentee before: Aerospace Information Research Institute,Chinese Academy of Sciences Effective date of registration: 20200825 Address after: 100190, No. 19 West Fourth Ring Road, Beijing, Haidian District Patentee after: Aerospace Information Research Institute,Chinese Academy of Sciences Address before: 100094, No. 9 Deng Nan Road, Beijing, Haidian District Patentee before: Academy of Opto-Electronics, Chinese Academy of Sciences |
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Granted publication date: 20140312 |