CN203467072U - Device capable of moistening circuit board film body - Google Patents
Device capable of moistening circuit board film body Download PDFInfo
- Publication number
- CN203467072U CN203467072U CN201320473756.9U CN201320473756U CN203467072U CN 203467072 U CN203467072 U CN 203467072U CN 201320473756 U CN201320473756 U CN 201320473756U CN 203467072 U CN203467072 U CN 203467072U
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- CN
- China
- Prior art keywords
- lyosoption
- structural member
- circuit board
- jet pipe
- film body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Manufacturing Of Printed Wiring (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a device capable of moistening a circuit board film body. The device comprises an absorbable solvent structure part (4), and the absorbable solvent structure part is extruded to release a solvent to moisten the circuit board film body before the film is pressed. With the application of the device, the defects of open circuit due to poor adhesion of a dry film in the manufacturing process and the like can be effectively overcome, the once yield of a product is improved, meanwhile, the operation is regulated, and the field working environment is improved.
Description
Technical field
The utility model relates to the processing appurtenance of circuit board, specifically, relates to a kind of device of realizing the wet combining of circuit board film body.
Background technology
At present; in the course of processing of circuit board; especially flexible PCB; itself is thinner, when through film laminator press mold, often can exist factor due to the dry film of flexible PCB itself to cause it to adhere to the bad initiation problem of opening a way; make the breakage rate of product higher; operating personnel often need to do over again when processing, time and effort consuming, and had a strong impact on quality and efficiency that circuit board is produced in batches.
Utility model content
In order to overcome above-mentioned defect, the utility model provides a kind of device of realizing the wet combining of circuit board film body, and this device can effectively improve the defects such as open circuit of adhering to bad generation in processing procedure because of dry film, yield of improving product after implementing.
The utility model for the technical scheme that solves its technical problem and adopt is: a kind of device of realizing the wet combining of circuit board film body, comprising can lyosoption structural member, described can lyosoption structural member by the release solvent that is squeezed to press mold before circuit board film body soak.
As the utility model, further improve: described press mold is realized by film laminator, described film laminator comprises the first running roller and second running roller of relative motion, in described the first running roller and the second running roller, the end of at least one running roller is provided with the first drive unit, described end that can lyosoption structural member is provided with the second drive unit, and described the second drive unit is driven described in driving and can be rotated by lyosoption structural member by described the first drive unit.
As the utility model, further improve: described both sides that can lyosoption structural member are provided with respectively a jet pipe and a pressuring flat device axially parallel;
Describedly can lyosoption structural member comprise that first of relative motion can lyosoption structural member and second can lyosoption structural member, described the first drive unit is the first gear, described the second drive unit is the second gear, and described the second gear is arranged at described first rotationally can lyosoption structural member and second at least one end in can lyosoption structural member two structural members, described the second gear by with described the first meshed transmission gear;
Described jet pipe comprises the first jet pipe and the second jet pipe, described the first jet pipe and the second jet pipe be arranged at respectively axially parallel described first can lyosoption structural member and second can lyosoption structural member a side, and on described the first jet pipe and the second jet pipe, be respectively arranged with towards described first can lyosoption structural member and second can lyosoption structural member sidepiece nozzle;
Described pressuring flat device comprises that the first pressing bar and second flattens bar, described first flatten bar and second flatten bar be arranged at respectively axially parallel described first can lyosoption structural member and second can lyosoption structural member opposite side;
Described circuit board film body successively through between described the first jet pipe and the second jet pipe, first can lyosoption structural member and second can lyosoption structural member between and first flatten after bar and second flattens between bar and enter between described the first running roller and the second running roller and roll.
As the utility model, further improve: described circuit board film body can lyosoption structural member through described first and second can lyosoption structural member between time, by push described first can lyosoption structural member and second at least one in can lyosoption structural member can lyosoption structural member make its release solvent realize wetting to circuit board film body.
As the utility model, further improve: described the first jet pipe and the second jet pipe, described first can lyosoption structural member and second can lyosoption structural member and first flatten bar and second flatten bar parallel beneath be provided with a solvent receiving slit;
Described the first jet pipe and the second jet pipe, described first can lyosoption structural members and second can lyosoption structural member and first be flattened end that bar and second flattens bar and all by fixing fixture block, fix.
As the utility model, further improve: described first can lyosoption structural member and second can lyosoption structural member a pair of sponge wheel that is axially parallel, described solvent is water.
As the utility model, further improve: described circuit board film body is FPC circuit board.
The beneficial effects of the utility model are: first can can be pressed into circuit board in it and be realized and soaking by relative motion by lyosoption structural member by lyosoption structural member and second; By nozzle, spray solvent wetting to circuit board; The effect of pressuring flat device is to prevent the wetting rear perk of circuit board, hinders carrying out smoothly of press mold; The effect of solvent receiving slit be avoid the solvent of jet pipe ejection and can lyosoption structural member on solvent drippage ground, damage operating environment; By damping device wet circuit plate is set before film laminator press mold, effectively avoided circuit board because adhering to the open circuit problem of bad initiation, simultaneously also normative operation, improve work on the spot environment.
Accompanying drawing explanation
Fig. 1 is: jet pipe of the present utility model and location diagram that can lyosoption structural member.
Fig. 2 is: pressuring flat device of the present utility model and location diagram that can lyosoption structural member.
Embodiment
By reference to the accompanying drawings; the utility model is elaborated; but protection range of the present utility model is not limited to following embodiment, the simple equivalence of in every case being done with the utility model claim and description changes and modifies, within all still belonging to the utility model patent covering scope.
Please refer to shown in Fig. 1, the device of the circuit board the realized film body wet combining of the present embodiment, comprising can lyosoption structural member 4, can lyosoption structural member 4 by the release solvent that is squeezed to press mold before FPC circuit board film body soak, both sides that can lyosoption structural member 4 are provided with respectively a jet pipe 2 and a pressuring flat device 5 axially parallel: further, can lyosoption structural member 4 comprise that first of relative motion can lyosoption structural member 41 and second can lyosoption structural member 42, first can can be pressed into FPC circuit board in it and be realized and soaking by relative motion by lyosoption structural member 42 by lyosoption structural member 41 and second, further, in the present embodiment, first can adopt a pair of sponge of axially parallel to take turns by lyosoption structural member 42 by lyosoption structural member 41 and second, solvent adopts water,
Press mold is realized by film laminator, film laminator (not shown) comprises the first running roller and second running roller of relative motion, in the first running roller and the second running roller, the end of at least one running roller is provided with the first drive unit, end that can lyosoption structural member is provided with the second drive unit 1, the second drive unit 1 and is driven and driven and can rotate by lyosoption structural member 4 by the first drive unit.
The first drive unit is the first gear (not shown), the second drive unit 1 is the second gear 11,12, and the second gear 11,12 is arranged at first rotationally can lyosoption structural member 41 and second at least one end in can 42 liang of structural members of lyosoption structural member, the second gear 11,12 by with the first meshed transmission gear;
During practical operation, FPC circuit board film body successively through between the first jet pipe 21 and the second jet pipe 22, first can lyosoption structural member 41 and second can lyosoption structural member 42 between and first flatten after bar 51 and second flattens between bar 52 and enter between the first running roller and the second running roller and roll.
FPC circuit board film body can lyosoption structural member 41 through first and second can lyosoption structural member 42 between time, by push first can lyosoption structural member 41 and second at least one in can lyosoption structural member 42 can lyosoption structural member make its release solvent realize wetting to FPC circuit board film body.
The first jet pipe 21 and the second jet pipe 22, first can lyosoption structural member 41 and second can lyosoption structural member 42 and first flatten bar 51 and second flatten bar 52 parallel beneath be provided with a solvent receiving slit (not shown), the effect of solvent receiving slit be avoid the solvent of jet pipe ejection and can lyosoption structural member on solvent drippage ground, damage operating environment;
In the present embodiment, the first jet pipe 21 and the second jet pipe 22, first can lyosoption structural members 41 and second can lyosoption structural member 42 and first be flattened end that bar 51 and second flattens bar 52 and all by fixing fixture block 3, fix.In the present embodiment, FPC circuit board film body adopts the base material being bought directly from the market, its upper surface contains copper film, in actual production, on its surface, apply again one deck copper film, after damping device is wetting, by film laminator press mold, the object of film laminator press mold is to be pressed into one deck photosensitive material on its surface.This device can effectively improve the defects such as open circuit of adhering to bad generation in processing procedure because of dry film after implementing, yield of improving product, simultaneously also normative operation, improve work on the spot environment.
Claims (6)
1. can realize a device for circuit board film body wet combining, it is characterized in that:
Comprising can lyosoption structural member (4), described can lyosoption structural member by the release solvent that is squeezed to press mold before circuit board film body soak;
Described press mold is realized by film laminator, described film laminator comprises the first running roller and second running roller of relative motion, in described the first running roller and the second running roller, the end of at least one running roller is provided with the first drive unit, described end that can lyosoption structural member is provided with the second drive unit (1), and described the second drive unit is driven described in driving and can be rotated by lyosoption structural member by described the first drive unit.
2. the device of realizing the wet combining of circuit board film body according to claim 1, is characterized in that:
Described both sides that can lyosoption structural member are provided with respectively a jet pipe (2) and a pressuring flat device (5) axially parallel;
Describedly can lyosoption structural member comprise that first of relative motion can lyosoption structural member (41) and second can lyosoption structural member (42), described the first drive unit is the first gear, described the second drive unit is the second gear, and described the second gear is arranged at described first rotationally can lyosoption structural member and second at least one end in can lyosoption structural member two structural members, described the second gear by with described the first meshed transmission gear;
Described jet pipe comprises the first jet pipe (21) and the second jet pipe (22), described the first jet pipe and the second jet pipe be arranged at respectively axially parallel described first can lyosoption structural member and second can lyosoption structural member a side, and on described the first jet pipe and the second jet pipe, be respectively arranged with towards described first can lyosoption structural member and second can lyosoption structural member sidepiece nozzle;
Described pressuring flat device comprises that the first pressing bar (51) and second flattens bar (52), described first flatten bar and second flatten bar be arranged at respectively axially parallel described first can lyosoption structural member and second can lyosoption structural member opposite side;
Described circuit board film body successively through between described the first jet pipe and the second jet pipe, first can lyosoption structural member and second can lyosoption structural member between and first flatten after bar and second flattens between bar and enter between described the first running roller and the second running roller and roll.
3. the device of realizing the wet combining of circuit board film body according to claim 2, is characterized in that:
Described circuit board film body can lyosoption structural member through described first and second can lyosoption structural member between time, by push described first can lyosoption structural member and second at least one in can lyosoption structural member can lyosoption structural member make its release solvent realize wetting to circuit board film body.
4. the device of realizing the wet combining of circuit board film body according to claim 2, is characterized in that:
Described the first jet pipe and the second jet pipe, described first can lyosoption structural member and second can lyosoption structural member and first flatten bar and second flatten bar parallel beneath be provided with a solvent receiving slit;
Described the first jet pipe and the second jet pipe, described first can lyosoption structural members and second can lyosoption structural member and first be flattened end that bar and second flattens bar and all by fixing fixture block (3), fix.
5. according to the device of the arbitrary described circuit board realized film body wet combining of claim 1-4, it is characterized in that:
Described first can lyosoption structural member and second can lyosoption structural member a pair of sponge wheel that is axially parallel, described solvent is water.
6. according to the device of the arbitrary described circuit board realized film body wet combining of claim 1-4, it is characterized in that: described circuit board film body is FPC circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320473756.9U CN203467072U (en) | 2013-08-05 | 2013-08-05 | Device capable of moistening circuit board film body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320473756.9U CN203467072U (en) | 2013-08-05 | 2013-08-05 | Device capable of moistening circuit board film body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203467072U true CN203467072U (en) | 2014-03-05 |
Family
ID=50179406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320473756.9U Expired - Fee Related CN203467072U (en) | 2013-08-05 | 2013-08-05 | Device capable of moistening circuit board film body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203467072U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103391683A (en) * | 2013-08-05 | 2013-11-13 | 江苏华神电子有限公司 | Device capable of moistening circuit board film body |
| CN105712108A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Transfer device, film laminator and wet film lamination method |
-
2013
- 2013-08-05 CN CN201320473756.9U patent/CN203467072U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103391683A (en) * | 2013-08-05 | 2013-11-13 | 江苏华神电子有限公司 | Device capable of moistening circuit board film body |
| CN103391683B (en) * | 2013-08-05 | 2016-04-06 | 昆山市华新电路板有限公司 | Can the device of realizing circuit plate film body wet combining |
| CN105712108A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Transfer device, film laminator and wet film lamination method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140305 Termination date: 20170805 |
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| CF01 | Termination of patent right due to non-payment of annual fee |