CN203466189U

CN203466189U - Micro-size SMD LED light

Info

Publication number: CN203466189U
Application number: CN201320519913.5U
Authority: CN
Inventors: 沈毅; 吴振志; 田景松; 刘玲; 吴涵渠
Original assignee: Shenzhen Aoto Electronics Co Ltd
Current assignee: Shenzhen Aoto Electronics Co Ltd
Priority date: 2013-08-23
Filing date: 2013-08-23
Publication date: 2014-03-05
Anticipated expiration: 2023-08-23

Abstract

The utility model discloses a micro-size SMD LED light which comprises a substrate, an LED light-emitting wafer, and a packaging layer. The LED light-emitting wafer is disposed at a side of the substrate and is sealed between the substrate and the transparent packaging layer. The peripheral edge of the outer light-emitting surface of the packaging layer is provided with a shading frame. According to the utility model, the peripheral edge of the outer light-emitting surface of the packaging layer is provided with the shading frame, thereby effectively improving the contrast ratio of an LED display screen, and achieving higher definition and better display effect.

Description

A kind of microsize LED SMD lamp

Technical field

The utility model relates to LED Display Technique field, is specifically related to a kind of microsize LED SMD lamp.

Background technology

LED display technology development in recent years is rapid, but the basis of LED display is LED lamp.In order to improve the contrast of LED display, people designed a lot of ways in the past, and one of them is exactly to set up shading fence in the luminescence chip periphery of LED lamp.The overall dimension of this type of LED lamp need to be greater than 2mm conventionally, and its shading fence is generally plastic material, directly bonding after injection moulding or injection mo(u)lding or press together, and increases the contrast of LED display.

But along with the development of LED Display Technique, people require more and more higher to the display effect of LED display.The LED display that had occurred in the last few years extra small dot spacing, it adopts microsize bonded LED lamp as shown in Figure 1, and the overall dimension of such microsize bonded LED lamp is less than 2mm conventionally, Figure 1 shows that the microsize bonded LED lamp of dot spacing 1mm.Due to small-sized; cannot be difficult in other words make the shading fence of plastic material; therefore common its substrate 10 1 sides of such microsize bonded LED lamp are provided with three LED luminescent wafers 11 of red, green, blue, and the peripheral directly encapsulated layer 12 of pressing one deck all-transparents of luminescent wafer 11 plays the effect of protection and bright dipping.This kind of microsize bonded LED lamp, because encapsulated layer 12 whole surfaces, outside are exiting surface 121, effectively the surrounding of exiting surface does not arrange dark border, thereby the LED display contrast of making is poor, needs to improve.

Summary of the invention

Technical problem to be solved in the utility model is to provide a kind of microsize LED SMD lamp, in solution prior art, outside the transparent encapsulated layer of microsize LED SMD lamp, whole surface is exiting surface, effectively the surrounding of exiting surface does not arrange dark border, thereby the poor problem of LED display contrast of making.

For solving the problems of the technologies described above, the utility model adopts following technical scheme:

A microsize LED SMD lamp, comprising: substrate, LED luminescent wafer and encapsulated layer, and described LED luminescent wafer is arranged on a side of substrate, and LED luminescent wafer is sealed between substrate and transparent described encapsulated layer; Outside described encapsulated layer, the edge of exiting surface is provided with luminous edge.

In preferred technical scheme, described luminous edge is that silk screen printing process is printed the complete black light shield layer forming.

In preferred technical scheme, described luminous edge is the complete black light shield layer that the edge of laser radium carving carbonization technique exiting surface outside described encapsulated layer forms.

The beneficial effects of the utility model are:

Adopted a kind of microsize LED SMD lamp of technical solutions of the utility model, because the edge of exiting surface outside encapsulated layer is provided with luminous edge, thereby can effectively improve the contrast of LED display, realize higher definition and reach better display effect.

Accompanying drawing explanation

Fig. 1 is the perspective view of existing microsize LED SMD lamp;

Fig. 2 is the perspective view of microsize LED SMD lamp in the utility model embodiment one;

Fig. 3 is the front view of microsize LED SMD lamp in the utility model embodiment one;

Fig. 4 is the structural representation of microsize LED SMD lamp before not cutting in a plurality of the utility model embodiments one;

Below in conjunction with accompanying drawing, the utility model is described in further detail.

Embodiment

Embodiment mono-

A kind of microsize LED SMD lamp that this embodiment provides as shown in Figures 2 and 3, comprise: substrate 10, LED luminescent wafer 11 and encapsulated layer 12, described LED luminescent wafer 11 is arranged on a side of substrate 10, and LED luminescent wafer 11 is sealed between substrate 10 and transparent described encapsulated layer 12. be with the difference of prior art, the edge of described encapsulated layer 12 outside exiting surfaces 121 is provided with luminous edge 13.

Adopted a kind of microsize LED SMD lamp of the utility model embodiment technical scheme, because the edge of encapsulated layer 12 outside exiting surfaces 121 is provided with luminous edge 13, thereby can effectively improve the contrast of LED display, realize higher definition and reach better display effect.

In preferred technical scheme, the complete black light shield layer that described luminous edge 13 forms for silk screen printing process printing.During making, can first make the microsize LED SMD lamp of justifying as shown in Figure 4, be convenient to like this make and silk-screen luminous edge, finally adopt the mode of laser cutting to cut open, form the microsize LED SMD lamp of this embodiment one by one.

Embodiment bis-

Microsize LED SMD lamp provided in the present embodiment, be with the difference of embodiment mono-, described luminous edge 13 is for adopting laser radium carving carbonization technique, the complete black light shield layer forming in the edge of described encapsulated layer 12 outside exiting surfaces 121, luminous edge 13 sizes that this kind of mode forms are more accurate, and can not increase the thickness of microsize LED SMD lamp.

It should be noted that, the production method of luminous edge 13 is not limited to aforementioned two kinds, such as also can directly printing or dust, forms luminous edge 13, can also by frock, electroplate out the luminous edge 13 of black, can also go out dark border 13 by chemical corrosion; So long as in the edge of the transparent encapsulated layer 12 outside exiting surfaces 121 of minute sized LED SMD lamp, form dark border 13, all should be within protection range of the present utility model.

Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.

Claims

1. a microsize LED SMD lamp, comprise: substrate, LED luminescent wafer and encapsulated layer, described LED luminescent wafer is arranged on a side of substrate, and LED luminescent wafer is sealed between substrate and transparent described encapsulated layer, it is characterized in that, the edge of exiting surface is provided with luminous edge outside described encapsulated layer.

2. a kind of microsize LED SMD lamp as claimed in claim 1, is characterized in that, described luminous edge is that silk screen printing process is printed the complete black light shield layer forming.

3. a kind of microsize LED SMD lamp as claimed in claim 1, is characterized in that, described luminous edge is the complete black light shield layer that the edge of laser radium carving carbonization technique exiting surface outside described encapsulated layer forms.