CN203465907U - Ultra-small dot spacing SMD (surface mount device) composite LED (light emitting diode) lamp - Google Patents
Ultra-small dot spacing SMD (surface mount device) composite LED (light emitting diode) lamp Download PDFInfo
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- CN203465907U CN203465907U CN201320529648.9U CN201320529648U CN203465907U CN 203465907 U CN203465907 U CN 203465907U CN 201320529648 U CN201320529648 U CN 201320529648U CN 203465907 U CN203465907 U CN 203465907U
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Abstract
The utility model discloses an ultra-small dot spacing SMD (surface mount device) composite LED (light emitting diode) lamp. A plurality of groups of LED pixel lamps are arrayed on the upper surface of a lamp body of the LED lamp, the lower surface of the lamp body is provided with a plurality of pins, the ultra-small dot spacing SMD composite LED lamp also comprises a driving unit, the pins are electrically connected with the driving unit, and the driving unit is also electrically connected with each group of LED pixel lamps. The ultra-small dot spacing SMD composite LED lamp adopting the technical scheme has the advantages that the self driving unit is adopted, so the number of the total pins arranged on an LED lamp board can be greatly reduced, the wiring difficulty and the wiring density are reduced, the smaller dot spacing can be realized, higher definition is realized, and the better display effect is reached.
Description
Technical field
The utility model relates to LED display technique field, is specifically related to a kind of extra small dot spacing SMD composite LED lamp.
Background technology
In recent years, the important media that LED display shows as a kind of information, appear in people's life more and more.LED display can show or loop play word, figure and image information in real time, to have that display mode is abundant, sight is strong, displaying contents is revised convenient, brightness is high, demonstrations is stable and the multiple advantage such as life-span length, is widely used in the numerous areas such as commercial advertisement, sports tournament and transport information report.
Along with social development, people are more and more higher to the requirement of display quality, so the sharpness of LED display also just need to improve constantly.Improve the sharpness of LED display, in general just need to make the pixel of LED display closeer, namely need the dot spacing between LED pixel lamp less.
The LED display of higher resolution is mostly used three-in-one as shown in Figures 1 and 2 bonded LED lamp at present, it generally comprises: lamp body 1, be arranged on four pins 3 of lamp body 1 lower surface, conventionally comprise each of three kinds of LED wafer of red, green, blue with the one group of LED pixel lamp 2(that is arranged on lamp body 1 upper surface), and be arranged on LED pixel lamp 2 shading hurdle around, and be filled in shading fence and cover the transparent encapsulation material (not marking in figure) of LED wafer.For the three-in-one bonded LED lamp shown in Fig. 1 and Fig. 2, the anode of its general red, green, blue LED wafer shares a pin, and negative electrode respectively accounts for a pin, thereby has four pins 3.Certainly, also there is the three-in-one bonded LED lamp of 6 pins 3, the anode of the LED wafer that it is green, blue is totally one pin 3, the anode of red LED wafer accounts for a pin 3, the negative electrode of red, green, blue LED wafer respectively accounts for a pin 3, so just have 6 pins 3, this kind of three-in-one bonded LED lamp is convenient to separately power supply, to save power consumption.
In recent years in order to realize higher sharpness, namely need the dot spacing that reaches less, there is LED module lamp as shown in Figure 3 and Figure 4, each module lamp comprises a plurality of LED pixel lamps, conventionally has the modular form of 2*2,4*4,8*8 equal-specification.Fig. 3 and the LED module lamp that Figure 4 shows that 4*4 specification, a side array of LED module lamp lamp body 1 has 4*4 group LED pixel lamp 2, and the edge of opposite side is provided with a plurality of pins 3.
As seen from Figure 4, the LED module lamp of a 4*4 specification, only has 20 pins, and 16 three-in-one bonded LED lamps as depicted in figs. 1 and 2 have 64 pins.Visible LED module lamp can greatly reduce the number of pin 3, therefore can reduce the cabling on LED lamp plate, thereby promotes completion rate and the cloth line mass of LED lamp plate, finally can accomplish less dot spacing, thereby have certain progress.
But well-known, a side of LED lamp plate is used for mounting LED lamp (three-in-one bonded LED lamp or LED module lamp), another side needs to mount the electron devices such as driving chip.When dot spacing hour, if use LED module lamp can greatly reduce the quantity of pin between LED lamp and lamp plate, but the pin of its corresponding driving chip does not reduce.Such as 16 three-in-one bonded LED lamps have 64 pins, after changing LED module lamp into, pin is reduced to 20, but two kinds of modes all need correspondingly to use three to drive chips, and each drives the pin number of chip is 25, the therefore pin number of corresponding driving chip or 75.Thereby IC (being mainly the to drive chip) quantity that continues to reduce on Shi， unit's display area when dot spacing can be a lot, even if use LED module lamp, so many driving chip is also difficult to plant, and will bring restriction to realizing less dot spacing like this.This is because the LED of extra small dot spacing shows module, LED pixel lamp in unit area increases, number and the cabling of the driving chip that will arrange in unit area all can increase, this will have a strong impact on the place and route of LED lamp plate, increase the number of plies of LED lamp plate, cause cost to increase, this is also the technical bottleneck that realizes less dot spacing simultaneously, these problems are difficult to further raising by the resolution that causes LED display, have a strong impact on the display quality of high definition LED display, seriously restricted development and the application of high definition LED display, therefore needed to improve.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of extra small dot spacing SMD(surface mount device) composite LED lamp, solve LED module lamp drive chip total pin number or more corresponding to it in prior art, cannot realize the problem of less dot spacing.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
An extra small dot spacing SMD composite LED lamp, its lamp body upper surface array has many group LED pixel lamps, and lamp body lower surface is provided with a plurality of pins; Described extra small dot spacing SMD composite LED lamp also comprises driver element, described pin and driver element electrical connection, and described driver element is also electrically connected with each group LED pixel lamp.
In preferred technical scheme, described driver element is for driving chip, and described lamp body lower surface is provided with and drives chip bonding pad group, and described driving chip attachment is at described driving chip bonding pad group place.
In further preferred technical scheme, described lamp body lower surface zone line local dent, is formed for the disposal area that drives chip is set, and described driving chip bonding pad group is arranged in described disposal area.
In preferred technical scheme, described driver element is for driving wafer; Described extra small dot spacing SMD composite LED lamp also comprises encapsulated layer; Described driving wafer is encapsulated in lamp body lower surface by described encapsulated layer.
The beneficial effects of the utility model are:
Adopted a kind of extra small dot spacing SMD composite LED lamp of technical solutions of the utility model, because it carries driver element, thereby can greatly reduce pin number total on LED lamp plate, reduce wiring difficulty and wiring density, thereby can realize less dot spacing, realize higher sharpness and reach better display effect.
Accompanying drawing explanation
Fig. 1 is the perspective view of existing three-in-one bonded LED lamp;
Fig. 2 is another perspective view of existing three-in-one bonded LED lamp;
Fig. 3 is the perspective view of existing LED module lamp;
Fig. 4 is another perspective view of existing LED module lamp;
Fig. 5 is the perspective view of extra small dot spacing SMD composite LED lamp in the utility model embodiment one (do not mount and drive chip);
Fig. 6 is the circuit theory diagrams of extra small dot spacing SMD composite LED lamp in the utility model embodiment one;
The perspective view of extra small dot spacing SMD composite LED lamp in Fig. 7 the utility model embodiment two (do not mount and drive chip);
In Fig. 8 the utility model embodiment three, extra small dot spacing SMD composite LED lamp dissects structural representation;
Below in conjunction with accompanying drawing, the utility model is described in further detail.
Embodiment
Embodiment mono-
The utility model embodiment is in order to overcome the problems of the prior art, realize less dot spacing, reach the higher sharpness that obtains, existing LED module lamp is improved, generally speaking exactly drive part is integrated in LED module lamp, form the module that lamp drives unification, i.e. extra small dot spacing SMD composite LED lamp of the present utility model.
As shown in Figure 5, its lamp body 1 upper surface array has many group LED pixel lamps 2 to a kind of extra small dot spacing SMD composite LED lamp that this embodiment provides, and lamp body 1 lower surface is provided with a plurality of pins 3.Be with the difference of existing LED module lamp, described extra small dot spacing SMD composite LED lamp also comprises driver element (not shown), described pin 3 and driver element electrical connection, and described driver element is also electrically connected with each group LED pixel lamp 2.
In this embodiment, particularly, described driver element is for driving chip (not shown), and described lamp body 1 lower surface is provided with and drives chip bonding pad group 4, and described driving chip attachment is at described driving chip bonding pad group 4 places.Can purchase so existing driving chip, be mounted on driving chip bonding pad group 4 places of lamp body 1 lower surface.
Adopt after this extra small dot spacing SMD composite LED lamp, do not need to arrange driving chip on LED lamp plate again, only various signals need be input to each pin 3 of extra small dot spacing SMD composite LED lamp, the quantity of therefore corresponding pin 3 can be seldom.
As shown in Figure 6, the LED dot matrix of a 4*4, comprises 16 three-in-one SMD LED pixel lamps, and each SMD LED comprises each, red, green, blue LED lamp.If adopt static scanning to show, the line pipe pin of all SMD LED lamps is directly met to VCC, tubulation pin is by driving the different passages of chip to drive, and drives these 16 SMD LED lamps to need 3 of the driving chips of 16 passages, drives respectively red, green, blue three-color LED.
For 4*4LED dot matrix above, if adopt common, single SMD LED lamp, only the pin of SMD LED lamp just has 64, also need on lamp plate, relative set drive 3 of chips in addition.Each drives chip to have 25 pins, altogether 75 pins.64 pins that add LED lamp, pin number reaches 139 more than.If adopt LED module lamp, the pin of 16 groups of LED pixel lamps reduces to 20 by 64, but drive IC is still wanted 75 pins, and pin number also has 95.
And adopt the extra small dot spacing SMD of the 4*4 specification composite LED lamp of this embodiment, also comprise 16 groups of LED pixel lamps 2, but because driver element has been integrated among module, each is organized LED pixel lamp 2 and in inside modules, has set up electrical connection with driver element, therefore the pin 3 externally connecting seldom, only have the capable driving voltage of LED lamp, the input of 3 color signals, 3 color signal output, drive part supply voltage, 3 electric current adjusting pins,, 3 clocks, a heat radiation ground, only has 16 external pins altogether.Compare and adopt 16 groups of independently schemes of SMD LED lamp, reduced by 123 pins; Compare and adopt LED module lamp and drive the separated scheme of chip, also reduced by 79 pins.Therefore, adopt the extra small dot spacing SMD composite LED lamp of this embodiment technical scheme, not only integrated level is high, and greatly reduced in unit area the number of pin between LED pixel lamp and LED lamp plate, reduced the line density of walking of LED lamp plate, can effectively improve completion rate and the cloth line mass of LED lamp plate, thereby can realize less dot spacing, greatly improve the display effect of LED, improve refresh rate and brightness.
Adopted a kind of extra small dot spacing SMD composite LED lamp of this embodiment technical scheme, because it carries driver element, thereby can greatly reduce pin number total on LED lamp plate, reduce wiring difficulty and wiring density, thereby can realize less dot spacing, realize higher sharpness and reach better display effect.
Embodiment bis-
A kind of extra small dot spacing SMD composite LED lamp that this embodiment provides as shown in Figure 7, the difference of itself and embodiment mono-is, the lower surface zone line local dent of lamp body 1, be formed for the disposal area 5 that drives chip is set, described driving chip bonding pad group 4 is arranged in described disposal area 5.
The object of doing is like this thinner in order to make lamp drive the thickness of extra small dot spacing SMD composite LED lamp of unification, and heat dispersion is more better.This kind of structure, the lower surface centre position that pin 3 is set at lamp body 1 has the disposal area 5 of a square groove shape, in groove, arrange and drive chip bonding pad group 4, driving chip is attached to this to be driven in chip bonding pad group 4, thereby on as the basis of embodiment mono-, can realize thinner thickness, thinner thickness itself is conducive to better heat radiation.
Embodiment tri-
As shown in Figure 8, the difference of itself and embodiment mono-and embodiment bis-is a kind of extra small dot spacing SMD composite LED lamp that this embodiment provides, and described driver element is for driving wafer 6; Described extra small dot spacing SMD composite LED lamp also comprises encapsulated layer 7; Described driving wafer 6 is encapsulated in lamp body 1 lower surface by described encapsulated layer 7.
Aforesaid driving chip is exactly packaged driving wafer 6 in fact.Because what use in this embodiment is to drive wafer 6, and driving wafer 6 can not be exposed in air, so also need encapsulating material to encapsulate it, drives the encapsulated layer 7 of wafer 6 to form parcel.The encapsulating material that the preferred heat dispersion of encapsulating material is good, so that drive wafer 6 heat radiations.This kind of mode can realize higher integrated level, further reduces volume and thickness, to reach less dot spacing.
Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, can also make some simple deduction or replace, all should be considered as belonging to protection domain of the present utility model.
Claims (4)
1. an extra small dot spacing SMD composite LED lamp, its lamp body upper surface array has many group LED pixel lamps, lamp body lower surface is provided with a plurality of pins, it is characterized in that, described extra small dot spacing SMD composite LED lamp also comprises driver element, described pin and driver element electrical connection, and described driver element is also electrically connected with each group LED pixel lamp.
2. a kind of extra small dot spacing SMD composite LED lamp as claimed in claim 1, is characterized in that, described driver element is for driving chip, and described lamp body lower surface is provided with and drives chip bonding pad group, and described driving chip attachment is at described driving chip bonding pad group place.
3. a kind of extra small dot spacing SMD composite LED lamp as claimed in claim 2, is characterized in that, described lamp body lower surface zone line local dent is formed for the disposal area that drives chip is set, and described driving chip bonding pad group is arranged in described disposal area.
4. a kind of extra small dot spacing SMD composite LED lamp as claimed in claim 1, is characterized in that, described driver element is for driving wafer; Described extra small dot spacing SMD composite LED lamp also comprises encapsulated layer; Described driving wafer is encapsulated in lamp body lower surface by described encapsulated layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320529648.9U CN203465907U (en) | 2013-08-28 | 2013-08-28 | Ultra-small dot spacing SMD (surface mount device) composite LED (light emitting diode) lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320529648.9U CN203465907U (en) | 2013-08-28 | 2013-08-28 | Ultra-small dot spacing SMD (surface mount device) composite LED (light emitting diode) lamp |
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| CN203465907U true CN203465907U (en) | 2014-03-05 |
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| CN201320529648.9U Expired - Fee Related CN203465907U (en) | 2013-08-28 | 2013-08-28 | Ultra-small dot spacing SMD (surface mount device) composite LED (light emitting diode) lamp |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474000A (en) * | 2013-08-28 | 2013-12-25 | 深圳市奥拓电子股份有限公司 | Super-small-point-interval SMD (surface mounted device) composited LED lamp |
| CN111383545A (en) * | 2018-12-27 | 2020-07-07 | 宏齐科技股份有限公司 | Lamp panel module for LED display screen |
-
2013
- 2013-08-28 CN CN201320529648.9U patent/CN203465907U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474000A (en) * | 2013-08-28 | 2013-12-25 | 深圳市奥拓电子股份有限公司 | Super-small-point-interval SMD (surface mounted device) composited LED lamp |
| CN111383545A (en) * | 2018-12-27 | 2020-07-07 | 宏齐科技股份有限公司 | Lamp panel module for LED display screen |
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Granted publication date: 20140305 |