CN203457484U - Liquid cooling radiator - Google Patents
Liquid cooling radiator Download PDFInfo
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- CN203457484U CN203457484U CN201320566835.4U CN201320566835U CN203457484U CN 203457484 U CN203457484 U CN 203457484U CN 201320566835 U CN201320566835 U CN 201320566835U CN 203457484 U CN203457484 U CN 203457484U
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- liquid cooling
- radiator
- sealing ring
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Abstract
The utility model discloses a liquid cooling radiator. The liquid cooling radiator comprises a substrate, a cover plate, a diamond-like carbon film and a sealing ring, the substrate and/or the cover plate are/is provided with an internal flow channel, the diamond-like carbon film covers the surface of the internal flow channel of the substrate and/or the cover plate of the liquid cooling radiator, the sealing ring is arranged between the substrate and the cover plate, the substrate and the cover plate are sealed in a fastening manner, and the substrate, the sealing ring and the cover plate are sealed in a fastening manner via screws or bolts. According to the liquid cooling radiator, an anticorrosion method of separation of water and power is adopted by the internal flow channel, a layer of the diamond0like carbon film covers the surface of the internal flow channel of the substrate and/or the cover plate of the liquid cooling radiator by the adoption of ion plating technology, the sealing ring is arranged between the substrate and the cover plate, and then the substrate, the sealing ring and the cover plate are sealed in a fastening manner. The liquid cooling radiator is advantageous in that the separation of water and power is achieved, the corrosion resistant and washing resistant performances of the internal flow channel of the radiator are improved, the radiation performance of the radiator is improved, flow resistance is reduced, and the liquid cooling radiator has good application prospect.
Description
Technical field
The utility model relates to liquid cooling heat radiator field, and especially a kind of inner flow passage adopts the liquid cooling heat radiator of water power isolation anti-corrosion method.
Background technology
Electric power semiconductor element is generally comprised of substrate and cover plate with liquid cooling heat radiator, and its inside is processed with runner.In use, cooling fluid can wash away runner wall while flowing in inner flow passage, and if in cooling liquid, have impurity, impurity may react with radiator base material, thereby electrochemical corrosion occurs.Therefore,, for guaranteeing the reliability of radiator, general inner flow passage need to carry out preservative treatment.Conventional anti-corrosion method mainly contains anodic oxidation at present, chromate chemistry transforms two kinds.
But the thermal conductivity of anodic oxidation and chromate chemistry conversion film layer is low, although rete is very thin, still can reduce to a certain extent the heat dispersion of cooled plate.And chromate chemistry conversion film layer can be in cold situation, take chromate as main chemicals hybrid reaction is at aluminium surface production one deck dense oxidation film, but chromate chemistry conversion film layer hardness is not high, resistance to erosion not, and rete is conducting film, if while being applied with large electric current on radiator, may making the cooling fluid generation electrolysis in inner flow passage, thereby corrode.
And in commercial Application, a kind of novel hard lubricating function film---DLC film (diamond-like carbon films, diamond-like carbon film), the performance with a series of excellences, as high rigidity, high-wearing feature, high heat conductance, high resistivity, good optical transparence, chemical inertness etc., the fields such as machinery, electronics, optics, calorifics, acoustics, medical science have been widely used at present.Anti-corrosion characteristic in view of its good characteristic and liquid cooling heat radiator inner flow passage, is applied on liquid cooling heat radiator, for solving water power isolation and the inner flow passage Anticorrosion of radiator.
Through retrieval, in prior art, application number a kind of processing method of liquid-cooling anti-corrosion radiator that has been 200910311960.9 disclosure of the invention, has mainly solved liquid cooling heat radiator cooling duct in prior art and has been difficult to carry out complete anti-corrosion treatment and the poor problem of anticorrosion ability.The present invention is by processing in cover plate inner side for docking the vent rib top of vent rib bottom inside radiator body, adopt hard anodize technique to carry out anti-corrosion treatment, then unified preliminary treatment solder side, finally gets up to realize the cold complete anticorrosion of removing passage of liquid cooling heat radiator by radiator body and cover plate vacuum welding.Liquid cooling heat radiator corrosion resistance Qiang， of the present invention manufacturing process is simple, and operation is easily gone, and production technology cost is low.Application number is that 200710156606.4 invention relates to a kind of novel liquid cooling heat radiator for semiconductor device, its composition comprises radiator box body, inner chamber on described box body is equipped with a groups of fins being comprised of several fin, described fin is " U " template, described " U " template upper punch is pressed with several equally distributed slotted holes, and the both sides of plate and slotted hole adjacent respectively punching press have opening.This radiator is for alternately stacking several fin a positive and a negative together and form, make in liquid process step by step, liquid constantly carries out shunting the most up and down, liquid flow is even and sufficient large area contacts and fixed volume uninterrupted has determined radiating effect, has greatly promoted heat radiation power density.The present invention is for semiconductor device heat radiation.Application number is radiating block and the manufacture method thereof that 201310005082.4 inventive embodiments discloses a kind of liquid-cooling type cpu heat, the radiating block of this liquid-cooling type cpu heat comprises having the substrate of end face and bottom surface and be located at the fins group of described substrate for dispelling the heat, described substrate top surface middle part is provided with to the groove sinking into, described fins group is arranged in parallel and forms from the outwardly directed fin in the diapire vertical diapire ground of described groove by multi-disc, the apical margin middle part of some fins of described fins group or all fin is also provided with breach, each breach is common to be formed one and connects continuously several or whole guiding gutters on the top of fins.The method of manufacturing the radiating block of described liquid-cooling type cpu heat comprises makes semi-finished product radiating block, making guiding gutter, making groove, making fin and radiating block forming step.The radiating block of this liquid-cooling type cpu heat has promoted heat conduction and the heat dispersion of radiating block.Liquid cooling heat radiator of the prior art is not all to adopt diamond-like-carbon membrane technology above, cannot isolate by water power, and its heat dispersion and antiseptic property are subject to certain limitation, need further to be improved.
Utility model content
Technical problem to be solved in the utility model is, a kind of liquid cooling heat radiator is provided, and by adopting the anti-corrosion method of water power isolation, can solve water power isolation and the inner flow passage Anticorrosion of liquid cooling heat radiator, heat dispersion and the antiseptic property of raising liquid cooling heat radiator.
The technical solution of the utility model is: described liquid cooling heat radiator, comprises substrate, cover plate, diamond-like carbon film and sealing ring; Described substrate and/or cover plate are provided with inner flow passage, and described diamond-like carbon film covers the inner flow passage surface of liquid cooling heat radiator substrate and/or cover plate; Described sealing ring is arranged between substrate and cover plate, and substrate and cover plate fit sealing can pass through screw or bolt by substrate, sealing ring and cover plate fit sealing.The thickness of described diamond-like carbon film is 0.2 to 1.2 μ m.Described inner flow passage is the groove of offering on substrate and/or cover plate.
Inner flow passage of the present utility model adopts the anti-corrosion method of water power isolation, utilize ion plating technology at inner flow passage surface coverage one deck diamond-like carbon film of liquid cooling heat radiator substrate and/or cover plate, between substrate and cover plate, sealing ring is installed, then fit sealing.
In the anti-corrosion method of above-mentioned water power isolation, described electroplating technology comprises hallow cathode deposition, HCD, hot cathode ion plating, arc ion plating, activated reactive evaporation, radio-frequency (RF) ion plating, direct-current discharge ion plating.
The manufacture method of above-mentioned liquid cooling heat radiator, comprises the steps:
A, manufacture substrate and cover plate are slotted on substrate and/or cover plate, process inner flow passage;
B, utilize ion plating technology at inner flow passage surface coverage one deck diamond-like carbon film of liquid cooling heat radiator substrate and/or cover plate;
C, between substrate and cover plate, install sealing ring;
D, by substrate, sealing ring and cover plate fit sealing, complete the manufacture of liquid cooling heat radiator.
In the manufacture method of above-mentioned liquid cooling heat radiator, described electroplating technology also comprises hallow cathode deposition, HCD, hot cathode ion plating, arc ion plating, activated reactive evaporation, radio-frequency (RF) ion plating, direct-current discharge ion plating.
The utility model utilizes ion plating technology at inner flow passage surface coverage one deck diamond-like carbon film of radiator base plate and/or cover plate, between substrate and cover plate, sealing ring is installed, then with bolted sealing, thereby produce water power, isolate and the good liquid cooling heat radiator of antiseptic property.
Compare with traditional radiator, advantage of the present utility model is:
1), due to the high resistivity of diamond-like carbon film, be applied in electric semiconductor liquid cooling heat radiator and can accomplish water power isolation, and antiseptic effect is outstanding;
2) thermal conductivity due to diamond-like carbon film high (be about copper 6 times), thermal coefficient of expansion is little, and the anticorrosion rete of liquid cooling heat radiator inside can improve the heat dispersion of radiator;
3) because diamond-like carbon film has high hardness (have and approach adamantine high rigidity, its hardness is about HVl000～8000) and excellent wear resistance, improved the corrosion-resistant and flushing resistance of radiator inner flow passage;
4) coefficient of friction due to diamond-like carbon film low (0.005 ~ 0.02), surface is very level and smooth, and roughness can reach Ra0.01um, can reduce the flow resistance of radiator runner.
Accompanying drawing explanation
Fig. 1 is the liquid cooling heat radiator outline drawing in the utility model;
Fig. 2 is the decomposition texture schematic diagram of the liquid cooling heat radiator in the utility model.
In figure: 1, substrate; 2, sealing ring; 3, cover plate; 4, screw; 5, inner flow passage.
Embodiment
As depicted in figs. 1 and 2, described liquid cooling heat radiator, comprises substrate 1, cover plate 3, diamond-like carbon film and sealing ring 2; Described substrate 1 and/or cover plate 3 are provided with inner flow passage 5, and described diamond-like carbon film covers inner flow passage 5 surfaces of liquid cooling heat radiator substrate 1 and/or cover plate 3; Described sealing ring 2 is arranged between substrate 1 and cover plate 3, by screw 4 or bolt by substrate 1, sealing ring 2 and cover plate 3 fit sealings.The thickness of described diamond-like carbon film is 0.8 μ m.
It is cooling that above-mentioned liquid cooling heat radiator can be used for the liquid cooling of the cooling thyristor of power industry or IGCT device.In view of there is temperature instability in diamond-like carbon film, should not adopt welding procedure (as vacuum brazing, friction stir welding, argon arc welding etc.), therefore adopt and slot on substrate and/or cover plate, utilize ion plating at the substrate of radiator and/or the inner flow passage surface attachment diamond-like carbon film of cover plate, then place suitable sealing ring, then seal with screw fastening.
For the anticorrosion of power industry liquid cooling heat radiator and hot property requirement, in the situation that do not change the actual heat of heat pipe, pass effect and radiator integral heat dispersion, a kind of water power isolation and corrosion-resistant process are proposed, utilize ion plating technology to adhere to diamond-like carbon film on the substrate of liquid cooling heat radiator and/or cover plate, then by screw and sealing ring, seal assembling.The anti-corrosion method of described water power isolation, is mainly used in inner flow passage and adopts water power isolation corrosion-resistant liquid cooling heat radiator, and also can be used for it similarly needs on corrosion-resistant product.The anti-corrosion method of described water power isolation, utilizes ion plating technology at inner flow passage surface coverage one deck diamond-like carbon film of liquid cooling heat radiator substrate and/or cover plate, between substrate 1 and cover plate 3, sealing ring 2 is installed, and then uses screw 4 fit sealings.
In the anti-corrosion method of above-mentioned water power isolation, the ion plating technology of diamond-like carbon film comprises hallow cathode deposition, HCD, hot cathode ion plating, arc ion plating, activated reactive evaporation, radio-frequency (RF) ion plating, direct-current discharge ion plating etc.During ion plating, various gas discharges are introduced to vapour deposition, a branch of Ar ion beam sputtering solid graphite target that ion source produces forms carbon ion and is deposited on matrix (substrate of radiator and/or cover plate), the film that another beam ion bundle bombardment is being grown simultaneously, make to occur between deposited carbon-containing particle and bombarding ion series of physical chemical action, thereby form diamond-like carbon film on collective surface.
The anti-corrosion method of above-mentioned water power isolation can be accomplished water power isolation, improves the corrosion-resistant and flushing resistance of radiator inner flow passage, and can improve the heat dispersion of radiator and reduce flow resistance, on liquid cooling heat radiator, has a good application prospect.
The manufacture method of above-mentioned liquid cooling heat radiator, comprises the steps:
A, manufacture substrate and cover plate are slotted on substrate and/or cover plate, process inner flow passage;
B, utilize ion plating technology at inner flow passage surface coverage one deck diamond-like carbon film of liquid cooling heat radiator substrate and/or cover plate;
C, between substrate and cover plate, install sealing ring;
D, by substrate, sealing ring and cover plate fit sealing, complete the manufacture of liquid cooling heat radiator.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within being all included in protection range of the present utility model.
Claims (4)
1. a liquid cooling heat radiator, comprises substrate (1) and cover plate (3), and described substrate (1) and/or cover plate (3) are provided with inner flow passage (5), it is characterized in that: described liquid cooling heat radiator also comprises diamond-like carbon film and sealing ring (2); Described diamond-like carbon film covers inner flow passage (5) surface of liquid cooling heat radiator substrate (1) and/or cover plate (3); Described sealing ring (2) is arranged between substrate (1) and cover plate (3), substrate (1) and cover plate (3) fit sealing.
2. liquid cooling heat radiator according to claim 1, is characterized in that: by screw (4) or bolt by substrate (1), sealing ring (2) and cover plate (3) fit sealing.
3. liquid cooling heat radiator according to claim 1, is characterized in that: the thickness of described diamond-like carbon film is 0.2 to 1.2 μ m.
4. liquid cooling heat radiator according to claim 1, is characterized in that: described inner flow passage is the groove of offering on substrate and/or cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320566835.4U CN203457484U (en) | 2013-09-13 | 2013-09-13 | Liquid cooling radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320566835.4U CN203457484U (en) | 2013-09-13 | 2013-09-13 | Liquid cooling radiator |
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| Publication Number | Publication Date |
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| CN203457484U true CN203457484U (en) | 2014-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320566835.4U Expired - Lifetime CN203457484U (en) | 2013-09-13 | 2013-09-13 | Liquid cooling radiator |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456702A (en) * | 2013-09-13 | 2013-12-18 | 株洲南车奇宏散热技术有限公司 | Corrosion preventing method with water and electricity separated and liquid cooling radiator |
| CN104976597A (en) * | 2014-04-10 | 2015-10-14 | 株式会社唻迪克世 | Led lamp heat radiation structure using mechanical alloying method and manufacturing method thereof |
| CN107105605A (en) * | 2017-05-26 | 2017-08-29 | 爱克奇换热技术（太仓）有限公司 | A kind of radiating water cooling board and preparation method thereof |
-
2013
- 2013-09-13 CN CN201320566835.4U patent/CN203457484U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456702A (en) * | 2013-09-13 | 2013-12-18 | 株洲南车奇宏散热技术有限公司 | Corrosion preventing method with water and electricity separated and liquid cooling radiator |
| CN104976597A (en) * | 2014-04-10 | 2015-10-14 | 株式会社唻迪克世 | Led lamp heat radiation structure using mechanical alloying method and manufacturing method thereof |
| CN107105605A (en) * | 2017-05-26 | 2017-08-29 | 爱克奇换热技术（太仓）有限公司 | A kind of radiating water cooling board and preparation method thereof |
| CN107105605B (en) * | 2017-05-26 | 2019-08-06 | 爱克奇换热技术（太仓）有限公司 | A kind of radiating water cooling board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Zhuzhou Lukou Town Tree Hill 412007 in Hunan city of Zhuzhou Province Patentee after: ZHUZHOU CRRC QIHONG COOLING TECHNOLOGY CO.,LTD. Address before: Zhuzhou Lukou Town Tree Hill 412007 in Hunan city of Zhuzhou Province Patentee before: ZHUZHOU CSR QIHONG COOLING TECHNOLOGY CO.,LTD. |
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| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140226 |
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| CX01 | Expiry of patent term |