CN203433922U - Base metal electrode structure of electronic ceramic element - Google Patents
Base metal electrode structure of electronic ceramic element Download PDFInfo
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- CN203433922U CN203433922U CN201320268593.0U CN201320268593U CN203433922U CN 203433922 U CN203433922 U CN 203433922U CN 201320268593 U CN201320268593 U CN 201320268593U CN 203433922 U CN203433922 U CN 203433922U
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- base metal
- metal electrode
- electrode layer
- pin fixture
- hole
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- 239000010953 base metal Substances 0.000 title claims abstract description 135
- 239000000919 ceramic Substances 0.000 title claims abstract description 47
- 239000007772 electrode material Substances 0.000 claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 229910052782 aluminium Inorganic materials 0.000 claims description 53
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 53
- 239000004411 aluminium Substances 0.000 claims description 52
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 38
- 239000010949 copper Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 19
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 15
- 229910052725 zinc Inorganic materials 0.000 claims description 15
- 239000011701 zinc Substances 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 7
- 239000003985 ceramic capacitor Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 15
- 238000003466 welding Methods 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 4
- 238000007751 thermal spraying Methods 0.000 abstract 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 10
- 238000010030 laminating Methods 0.000 description 9
- 238000005507 spraying Methods 0.000 description 8
- 229910000838 Al alloy Inorganic materials 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- 239000007921 spray Substances 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- Coating By Spraying Or Casting (AREA)
Abstract
The utility model provides a base metal electrode structure of an electronic ceramic element. The base metal electrode structure comprises a first base metal electrode layer, a metal electrode leading-out part and a second base metal electrode layer, wherein the first base metal electrode layer covers two sides of an electronic ceramic body; the metal electrode leading-out part comprises a metal pin and a pin fixing member, and the pin fixing member is provided with at least one through hole; the pin fixing member is attached onto the first base metal electrode layer, the second base metal electrode layer covers at least one through hole of the pin fixing member, at least one through hole is filled by a base metal electrode material of the second base metal electrode layer, and the second base metal electrode layer is laminated with the first base metal electrode layer through the through hole. The pin can be fixed on the base metal electrode layer without the welding technology and only by adopting the thermal spraying technology. Compared with the existing welding method, the process flow for producing the base metal electrode structure is simplified, the production efficiency is improved, and the production cost is reduced.
Description
Technical field
The utility model relates to the technical field of the base metal electrode of electronic ceramic element, is specifically related to a kind of base metal electrode structure of electronic ceramic element.
Background technology
The electrode of existing electronic ceramic element generally adopts silver electrode material or copper electrode material.At present, rounded or the rectangle of the plane of conventional electronic ceramic element, on electronic ceramic body, be coated with silver electrode layer or copper electrode layer, and silver electrode material is expensive, the cost of copper electrode material is also higher, therefore, existing silver electrode or copper electrode do not meet the requirement of modern electronic technology to product high performance-price ratio.
In order to reduce the manufacturing cost of electronic ceramic element, the Chinese patent application (application number is 201320193964.3) that name is called " a kind of electronic ceramic element " discloses the electronic ceramic element that comprises aluminum bronze combination electrode, compare with use silver electrode or copper electrode, use base metal combination electrode makes to have reduced the cost of electrode material on the basis that keeps electrode function, improves the cost performance of the electronic ceramic element of producing.
The deficiency that existing base metal combination electrode exists is: contact conductor need be welded on the base metal electrode layer of combination electrode, and long electrode lead-in wire connection service time is insecure easily to come off, and adopts welding manner can reduce production efficiency, improves production cost.
Utility model content
The utility model provides a kind of base metal electrode structure of electronic ceramic element, has solved the technical problem that adopts plasma spray technology can be connected and fixed electrode lead-out part part without welding.
In order to solve the problems of the technologies described above, technical solution adopted in the utility model is:
The utility model provides a kind of base metal electrode structure of electronic ceramic element, and described electronic ceramic element comprises electronic ceramic body and base metal electrode structure, and its key is:
Described base metal electrode structure comprises the first base metal electrode layer, metal electrode leads component and the second base metal electrode layer;
Described the first base metal electrode layer covers the two sides of described electronic ceramic body;
Described metal electrode leads component comprises metal pins and pin fixture, on described pin fixture, is provided with at least one through hole;
Described pin fixture abuts on described the first base metal electrode layer, at least at least one through hole of described pin fixture, be coated with the second base metal electrode layer, and the base metal electrode material of described the second base metal electrode layer is filled described a plurality of through holes, by described through hole and described the first base metal electrode layer, fits.
Like this, described the second base metal electrode layer forms at least one spike structure by described at least one through hole, described spike structure and described the first base metal electrode layer laminating, thereby described pin fixture is fixed between the first base metal electrode layer and the second base metal electrode layer, has therefore realized without welding and pin can be fixed on base metal electrode layer.
Further, the coverage of described the second base metal electrode layer from only covering at least one through hole of described pin fixture to the described pin fixture of whole coverings and described the first base metal electrode layer.
Further, described pin fixture is Metal Flake structure, and at least one through hole of described pin fixture is arranged on the optional position on described pin fixture.
Further, while being provided with a through hole on described pin fixture, described through hole is arranged on the center of described pin fixture; While being provided with plural through hole on described pin fixture, described plural through hole is symmetricly set on described pin fixture.
Further, described pin fixture is the circulus of middle part hollow out, on described pin fixture, is provided with plural through hole, and described plural through hole is symmetricly set on described pin fixture.
Further, described the first base metal electrode layer adopts aluminium electrode material, and described the second base metal electrode layer also adopts aluminium electrode material, or adopts copper electrode material, zinc electrode material, nickel electrode material or tin electrode material;
Like this, described copper electrode layer, zinc oxide electrode layer, nickel electrode layer or tin electrode layer form at least one spike structure by described at least one through hole, as fastener, zinc nail, nickel nail or tin tack, described spike structure and the laminating of described aluminium electrode layer, thereby described pin fixture is fixed between aluminium electrode layer and copper electrode layer, aluminium electrode layer and zinc oxide electrode layer, aluminium electrode layer and nickel electrode layer or aluminium electrode layer and tin electrode layer, has therefore realized without welding and pin can be fixed on electrode layer.
Described aluminium electrode material can be fine aluminium, can be also al-rich alloy, and described al-rich alloy is that aluminium content accounts for more than 40% aluminium alloy; Copper electrode material can be fine copper, can be also Cu rich alloy, and described Cu rich alloy is that copper content accounts for more than 40% copper alloy; Zinc electrode material can be pure zinc, can be also rich kirsite, and described rich kirsite is that zinc content accounts for more than 40% kirsite; Nickel electrode material can be pure nickel, can be also rich nickel alloy, and described rich nickel alloy is that nickel content accounts for more than 40% nickel alloy; Tin electrode material can be pure tin, can be also rich ashbury metal, and described rich ashbury metal is that tin content accounts for more than 40% ashbury metal.
Further, described electronic ceramic element is any one in piezo-resistance, thermistor, gas sensing resistance, piezoelectric element, humistor, ceramic capacitor;
The shape of described electronic ceramic body can be but is not limited to annular or the cylindrical or taper of circle or rectangle or tubular shape.
The utility model is by making the second base metal electrode layer form base metal spike structure in the through hole of pin fixture, pin fixture is fixed between the first base metal electrode layer and the second base metal electrode layer, therefore realized without welding and only adopted plasma spray technology pin can be fixed on base metal electrode layer, compare with existing welding manner, simplified the process flow of producing base metal electrode structure, thereby, enhance productivity, reduce production costs.
Accompanying drawing explanation
Fig. 1-1 is the front view of the base metal electrode structure of the utility model embodiment mono-;
Fig. 1-2 is the cutaway view of the base metal electrode structure of the utility model embodiment mono-;
Fig. 2-1 is the front view of the base metal electrode structure of the utility model embodiment bis-;
Fig. 2-2 are the cutaway view of the base metal electrode structure of the utility model embodiment bis-;
Fig. 3-1 is the front view of the base metal electrode structure of the utility model embodiment tri-;
Fig. 3-2 are the cutaway view of the base metal electrode structure of the utility model embodiment tri-;
Fig. 4-1 is the front view of the base metal electrode structure of the utility model embodiment tetra-;
Fig. 4-2 are the cutaway view of the base metal electrode structure of the utility model embodiment tetra-;
Fig. 5-1 is the front view of the base metal electrode structure of the utility model embodiment five;
Fig. 5-2 are the cutaway view of the base metal electrode structure of the utility model embodiment five;
Fig. 6-1 is the front view of the base metal electrode structure of the utility model embodiment five;
Fig. 6-2 are the cutaway view of the base metal electrode structure of the utility model embodiment five.
Embodiment
Below in conjunction with accompanying drawing, specifically illustrate execution mode of the present utility model, accompanying drawing is only for reference and use is described, does not form the restriction to the utility model scope of patent protection.
The execution mode of the base metal electrode structure of the electronic ceramic element that the utility model provides describes by following examples:
embodiment 1:
In the present embodiment, as Figure 1-1, the base metal electrode structure of a kind of electronic ceramic element that the utility model provides comprises the first base metal electrode layer 1, metal electrode leads component 2 and the second base metal electrode layer 3; Described electronic ceramic element comprises electronic ceramic body and described base metal electrode structure; In the present embodiment, described electronic ceramic body is electronic ceramic chip.
Described the first base metal electrode layer 1 covers the two sides of described electronic ceramic body;
Described metal electrode leads component 2 comprises metal pins 21 and pin fixture 22, is provided with at least one through hole 221 on described pin fixture 22;
As shown in Figure 1-2, described pin fixture 22 abuts on described the first base metal electrode layer 1, at least at least one through hole 221 of described pin fixture 22, be coated with the second base metal electrode layer 3, and the base metal electrode material of described the second base metal electrode layer 3 is filled described a plurality of through holes 221, by described through hole 221 and described the first base metal electrode layer 1 laminating.
Like this, described the second base metal electrode layer 3 forms at least one spike structure 222 by described at least one through hole 221, described spike structure 222 and described the first base metal electrode layer 1 laminating, thereby described pin fixture 22 is fixed between the first base metal electrode layer 1 and the second base metal electrode layer 3, has therefore realized without welding and pin can be fixed on base metal electrode layer.
In the present embodiment, described the second base metal electrode layer 3 all covers described pin fixture 22 and described the first base metal electrode layer 1.
In the present embodiment, described metal pins 21 is Metal Flake structure or metal lead wire; In the present embodiment, described metal pins 21 is Metal Flake structure; The Metal Flake structure that described pin fixture 22 also can have any shape, the area of described pin fixture 22 is less than or equal to the area of described the first base metal electrode layer; In the present embodiment, described pin fixture 22 is rectangular metal sheet, be connected with described metal pins 21, and can be integrally formed.
In the present embodiment, at least one through hole 221 of described pin fixture 22 is arranged on the optional position on described pin fixture 22.
Adopt spraying technology to prepare the base metal electrode structure of above-mentioned electronic ceramic element, preparation section step is:
First, on the two sides of described electronic ceramic body, spray the first base metal material, form the first base metal electrode layer 1; Secondly, the pin fixture 22 of described metal electrode leads component 2 is abutted on described the first base metal electrode layer 1; Finally, at least at least one through hole 221 of described pin fixture 22, spray the second base metal material, form the second base metal electrode layer 3.
In prior art, adopt spraying technology to prepare after base metal combination electrode, also need electrode lead-out part part to be welded on electrode layer, therefore, compared with prior art, simplified the process flow of producing base metal electrode structure, enhance productivity, reduce production costs.
In the present embodiment, described the first base metal electrode layer adopts aluminium electrode material, and described the second base metal electrode layer also adopts aluminium electrode material; Wherein, described aluminium electrode material can be fine aluminium, can be also al-rich alloy, and described al-rich alloy is that aluminium content accounts for more than 40% aluminium alloy.
Like this, described the second aluminium electrode layer 3 forms at least one aluminium nail 222 by described at least one through hole 221, described aluminium nail 222 and described the first aluminium electrode layer 1 laminating, thereby described pin fixture 22 is fixed between the first aluminium electrode layer 1 and the second aluminium electrode layer 3, has therefore realized and without welding, adopted spraying technology pin can be fixed on electrode layer.
The base metal electrode structure of the electronic ceramic element that the utility model provides is applicable to following any one electronic ceramic element: piezo-resistance, thermistor, gas sensing resistance, piezoelectric element, humistor, ceramic capacitor etc.;
The shape of described electronic ceramic body can be but is not limited to annular or the cylindrical or taper of circle or rectangle or tubular shape.
embodiment 2:
The difference of the present embodiment and embodiment 1 is only:
As shown in Fig. 2-1, described the second base metal electrode layer 3 only covers at least one through hole 221 of described pin fixture 22, and described the second base metal electrode layer 3 is included at least one the second base metal electrode cover part covering at least one through hole 221 of described pin fixture 22.
In the present embodiment, described the first base metal electrode layer 1 adopts aluminium electrode material, and described the second base metal electrode layer 3 adopts copper electrode material; Wherein, described aluminium electrode material can be fine aluminium, can be also that aluminium content accounts for more than 40% aluminium alloy, and described copper electrode material can be fine copper, can be also Cu rich alloy, and described Cu rich alloy is that copper content accounts for more than 40% copper alloy.
Like this, as shown in Fig. 2-2, described copper electrode layer 3 forms at least one fastener 222 by described at least one through hole 221, described fastener 222 and described aluminium electrode layer 1 laminating, thereby described pin fixture 22 is fixed between aluminium electrode layer 1 and copper electrode layer 3, has therefore realized and without welding, adopted spraying technology pin can be fixed on electrode layer.
embodiment 3:
The difference of the present embodiment and embodiment 1 is only:
As shown in Fig. 3-1, described pin fixture is circular metal sheet structure, is provided with a through hole 221 on described pin fixture 22, and described through hole 221 is arranged on the center of described pin fixture 22;
Described the second base metal electrode layer 3 has covered described pin fixture 22, but does not cover other parts of the first base metal electrode layer 1.In the present embodiment, the area of described pin fixture 22 is less than the area of described the first base metal electrode layer 1.
In the present embodiment, described the first base metal electrode layer 1 adopts aluminium electrode material, and described the second base metal electrode layer 3 adopts zinc electrode material; Wherein, described aluminium electrode material can be fine aluminium, can be also that aluminium content accounts for more than 40% aluminium alloy, and described zinc electrode material can be pure zinc, can be also rich kirsite, and described rich kirsite is that zinc content accounts for more than 40% kirsite.
Like this, as shown in Fig. 3-2, described zinc oxide electrode layer 3 forms a zinc nail 222 by a described through hole 221, described zinc nail 222 and described aluminium electrode layer 1 laminating, thereby described pin fixture 22 is fixed between aluminium electrode layer 1 and zinc oxide electrode layer 3, has therefore realized and without welding, adopted spraying technology pin can be fixed on electrode layer.
embodiment 4:
The difference of the present embodiment and embodiment 1 is only:
As shown in Fig. 4-1, on described pin fixture 22, be provided with plural through hole, described plural through hole is symmetricly set on described pin fixture 22.In the present embodiment, on described pin fixture 22, be provided with four through holes.
In the present embodiment, described the first base metal electrode layer 1 adopts aluminium electrode material, and described the second base metal electrode layer 3 adopts nickel electrode material; Wherein, described aluminium electrode material can be fine aluminium, can be also that aluminium content accounts for more than 40% aluminium alloy, and described nickel electrode material can be pure nickel, can be also rich nickel alloy, and described rich nickel alloy is that nickel content accounts for more than 40% nickel alloy.
Like this, as shown in Fig. 4-2, described nickel electrode layer 3 forms four nickel nails 222 by described four through holes 221, described nickel nail 222 and described aluminium electrode layer 1 laminating, thereby described pin fixture 22 is fixed between aluminium electrode layer 1 and nickel electrode layer 3, has therefore realized and without welding, adopted spraying technology pin can be fixed on electrode layer.
embodiment 5:
The difference of the present embodiment and embodiment 4 is only:
As shown in Fig. 5-1, described pin fixture 22 is the circulus of middle part hollow out, on described pin fixture 22, is provided with plural through hole, and described plural through hole is symmetricly set on described pin fixture 22.In the present embodiment, on described pin fixture 22, be provided with eight through holes.
In the present embodiment, described the first base metal electrode layer 1 adopts aluminium electrode material, and described the second base metal electrode layer 3 adopts tin electrode material; Wherein, described aluminium electrode material can be fine aluminium, can be also al-rich alloy, described al-rich alloy is that aluminium content accounts for more than 40% aluminium alloy, described tin electrode material can be pure tin, can be also rich ashbury metal, and described rich ashbury metal is that tin content accounts for more than 40% ashbury metal.
Like this, as shown in Fig. 5-2, described tin electrode layer 3 forms eight tin tacks 222 by described eight through holes 221, described tin tack 222 and described aluminium electrode layer 1 laminating, thereby described pin fixture 22 is fixed between aluminium electrode layer 1 and tin electrode layer 3, has therefore realized and without welding, adopted spraying technology pin can be fixed on electrode layer.
embodiment 6:
The difference of the present embodiment and embodiment 3 is only:
As in Figure 6-1, described metal pins 21 is metal lead wire, and described pin fixture 22 is bullion laminated structure, or described metal pins 21 and described pin fixture 22 are metal lead wire;
Identical with embodiment 3, described the second base metal electrode layer 3 has covered described pin fixture 22, but does not cover other parts of the first base metal electrode layer 1.In the present embodiment, the area of described pin fixture 22 is less than the area of described the first base metal electrode layer 1.
The present embodiment also can be identical with embodiment 1, and described the second base metal electrode layer 3 covers described pin fixture 22 and the first base metal electrode layer 1 comprehensively.
Like this, as shown in Fig. 6-2, described pin fixture 22 is fixed between aluminium electrode layer 1 and zinc oxide electrode layer 3, has therefore realized and without welding, has adopted spraying technology pin can be fixed on electrode layer.
In above-described embodiment 1-6; described the first base metal electrode layer adopts aluminium electrode material; described the second base metal electrode layer all can adopt aluminium electrode material, copper electrode material, zinc electrode material, nickel electrode material or tin electrode material; each embodiment is only for reference and use is described, does not form the restriction to the utility model scope of patent protection.
In above-described embodiment and accompanying drawing, the base metal electrode structure of electronic ceramic body one side has only been described, the base metal electrode structure on electronic ceramic body two sides can be the same or different, for example, base metal electrode structure as described in Example 1 can be set in the one side of electronic ceramic body, and at another side, base metal electrode structure be as described in Example 5 set.
Above disclosed is only preferred embodiment of the present utility model, can not limit rights protection scope of the present utility model with this, and the equivalent variations of therefore doing according to the utility model claim, still belongs to the scope that the utility model is contained.
Claims (7)
1. a base metal electrode structure for electronic ceramic element, described electronic ceramic element comprises electronic ceramic body and base metal electrode structure, it is characterized in that:
Described base metal electrode structure comprises the first base metal electrode layer, metal electrode leads component and the second base metal electrode layer;
Described the first base metal electrode layer covers the two sides of described electronic ceramic body;
Described metal electrode leads component comprises metal pins and pin fixture, on described pin fixture, is provided with at least one through hole;
Described pin fixture abuts on described the first base metal electrode layer, at least at least one through hole of described pin fixture, be coated with the second base metal electrode layer, and the base metal electrode material of described the second base metal electrode layer is filled described at least one through hole, by described through hole and described the first base metal electrode layer, fits.
2. the base metal electrode structure of electronic ceramic element according to claim 1, is characterized in that: the coverage of described the second base metal electrode layer from only covering at least one through hole of described pin fixture to the described pin fixture of whole coverings and described the first base metal electrode layer.
3. the base metal electrode structure of electronic ceramic element according to claim 1, is characterized in that: described pin fixture is Metal Flake structure, and at least one through hole of described pin fixture is arranged on the optional position on described pin fixture.
4. the base metal electrode structure of electronic ceramic element according to claim 3, is characterized in that: while being provided with a through hole on described pin fixture, described through hole is arranged on the center of described pin fixture; While being provided with plural through hole on described pin fixture, described plural through hole is symmetricly set on described pin fixture.
5. the base metal electrode structure of electronic ceramic element according to claim 4, it is characterized in that: described pin fixture is the circulus of middle part hollow out, on described pin fixture, be provided with plural through hole, described plural through hole is symmetricly set on described pin fixture.
6. according to the base metal electrode structure of the electronic ceramic element described in any one in aforementioned claim, it is characterized in that:
Described the first base metal electrode layer adopts aluminium electrode material, and described the second base metal electrode layer also adopts aluminium electrode material, or adopts copper electrode material, zinc electrode material, nickel electrode material or tin electrode material;
Described aluminium electrode material can be fine aluminium, can be also al-rich alloy; Copper electrode material can be fine copper, can be also Cu rich alloy; Zinc electrode material can be pure zinc, can be also rich kirsite; Nickel electrode material can be pure nickel, can be also rich nickel alloy; Tin electrode material can be pure tin, can be also rich ashbury metal.
7. the base metal electrode structure of a kind of electronic ceramic element according to claim 1, is characterized in that:
Described electronic ceramic element is any one in piezo-resistance, thermistor, gas sensing resistance, piezoelectric element, humistor, ceramic capacitor;
The shape of described electronic ceramic body can be but is not limited to annular or the cylindrical or taper of circle or rectangle or tubular shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201320268593.0U CN203433922U (en) | 2013-05-16 | 2013-05-16 | Base metal electrode structure of electronic ceramic element |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201320268593.0U CN203433922U (en) | 2013-05-16 | 2013-05-16 | Base metal electrode structure of electronic ceramic element |
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| CN203433922U true CN203433922U (en) | 2014-02-12 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111292961A (en) * | 2019-11-08 | 2020-06-16 | 鞍山厚德科技有限公司 | Coating packaged surface-mounted electronic ceramic component |
| CN113921278A (en) * | 2021-06-30 | 2022-01-11 | 湖州新江浩电子有限公司 | Novel film capacitor with non-destructive electrode leading-out mode and manufacturing method thereof |
-
2013
- 2013-05-16 CN CN201320268593.0U patent/CN203433922U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111292961A (en) * | 2019-11-08 | 2020-06-16 | 鞍山厚德科技有限公司 | Coating packaged surface-mounted electronic ceramic component |
| CN113921278A (en) * | 2021-06-30 | 2022-01-11 | 湖州新江浩电子有限公司 | Novel film capacitor with non-destructive electrode leading-out mode and manufacturing method thereof |
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