CN203423216U - COB packaging LED - Google Patents
COB packaging LED Download PDFInfo
- Publication number
- CN203423216U CN203423216U CN201320538915.9U CN201320538915U CN203423216U CN 203423216 U CN203423216 U CN 203423216U CN 201320538915 U CN201320538915 U CN 201320538915U CN 203423216 U CN203423216 U CN 203423216U
- Authority
- CN
- China
- Prior art keywords
- box dam
- led
- dam
- welding
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000006071 cream Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 8
- 229910052573 porcelain Inorganic materials 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 5
- 238000000605 extraction Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Images
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- Led Device Packages (AREA)
Abstract
The utility model aims to provide a COB packaging LED and can further reduce an LED light emitting area and improve a light distribution effect through a dam on a basis of solution of a welding problem. The COB packaging LED comprises a base board provided with the dam, wherein a portion of the base in a dam groove is provided with multiple chips and welding discs. The COB packaging LED is characterized in that the multiple chips are arranged along a length direction of the dam groove, and the welding discs are arranged at two sides in a length direction of the dam groove and/or between adjacent chips. According to the COB packaging LED, by changing positions of the welding discs, an operation space of a porcelain nozzle of a welding machine is improved, so a problem of interference of the porcelain nozzle of the welding machine and the dam in a welding process is solved, a silver-plating layer is further arranged to improve LED light emitting efficiency, and a great popularization value is realized.
Description
Technical field
The utility model belongs to LED technical field, specially refers to a kind of COB packaged LED.
Background technology
As Fig. 1, shown in 2, at present, consider LED light source light-emitting area size issue, the general rectangle box dam (2) that adopts FR4 material to make that is provided with on the copper base (1) of COB packaged LED, in rectangle box dam (2), be provided with pad (3) and chip (4), wherein pad (3) is arranged on the inner long edge position, both sides of box dam (2), gap between pad (3) and box dam (2) is 0.1mm, because the inside dimension of box dam (2) is less, therefore this layout can cause bonding equipment porcelain mouth and box dam (2) interference when welding chip (4) and pad (3) in actual package process, thereby affect bonding wire quality, and cause LED light-emitting area large, luminous intensity distribution area is large, difficult design, be unfavorable for car light and the pairing of car load vehicle.In view of above reason, in some LED encapsulation, just cancelled box dam structure.In cancellation original substrate, after box dam structure, although can solve bonding wire problem, brought other problem points.In a fluorescent glue process, owing to there is no the fixing of box dam structure, can cause a glue amount inhomogeneous, glue moulding consistency poor (being that light source luminescent face size is inconsistent), can cause occurring problems in optical application, such as: after luminous intensity distribution, easily produce obvious dispersion phenomenon, can not reach best light distribution effect etc.
Summary of the invention
The purpose of this utility model is to propose a kind of COB packaged LED, solving on the basis of bonding wire problem, can by box dam, dwindle the light-emitting area of LED chip, improves light distribution effect.
COB packaged LED of the present utility model comprises the substrate that is provided with box dam, substrate in described box dam groove is provided with several chips and pad, key is that described several chips arrange along the length direction of box dam groove, and described pad is arranged between the both sides and/or adjacent chips of length direction of box dam groove.
Compare with traditional COB packaged LED, the utility model is arranged at pad between the both sides and/or adjacent chips of length direction of box dam groove, not only can greatly reduce light source luminescent area, also expand the operating space of the porcelain mouth of bonding equipment, thereby solved the problem that bonding equipment porcelain mouth and box dam are interfered in pad welding process.
Further, described box dam is metal stamping formed, and box dam is welded on substrate surface by tin cream, so just can make box dam bonding firmly, is difficult for mobile.Meanwhile, in a glue process, just can control well the light-emitting area size of LED, promote LED homogeneity of product.
Further, the surface of described box dam is provided with silver coating; Substrate and pad in described box dam groove are equipped with silver coating, have so not only solved pad problem of oxidation, and the blue light of die bottom surface and side can reflect away by silver coating, have increased LED light extraction efficiency.
COB packaged LED of the present utility model is by the position of change pad, increased the operating space of the porcelain mouth of bonding equipment, thereby solved the problem that in welding process, bonding equipment porcelain mouth and box dam are interfered, and promoted LED light extraction efficiency by silver coating is set, there is good promotional value.
Accompanying drawing explanation
Fig. 1 is the structural representation of COB packaged LED of the prior art.
Fig. 2 is the structural representation of the box dam part in Fig. 1.
Fig. 3 is the structural representation of COB packaged LED of the present utility model.
Fig. 4 is the structural representation of the box dam part in Fig. 2.
Embodiment
Contrast accompanying drawing below, by the description to embodiment, embodiment of the present utility model is described in further detail as the effect of the mutual alignment between the shape of each related member, structure, each several part and annexation, each several part and operation principle etc.
Embodiment 1:
As shown in Figure 3,4, the COB packaged LED of the present embodiment comprises the substrate 1 that is provided with box dam 2, substrate 1 in described box dam 2 grooves is provided with several chips 4 and pad 3, key is that described several chips 4 arrange along the length direction of box dam 2 grooves, and described pad 3 is arranged between the both sides and/or adjacent chips 4 of length direction of box dam 2 grooves.
Four LED chips 4 of take are example: on four horizontal substrates 1 that are arranged in box dam 2 grooves in one line of LED chip 4, (along the length direction of box dam 2 grooves, arrange) wherein series connection between LED chip 4 between two, two groups of LED chip 4 parallel connections.Pad 3 is arranged on the both sides of the length direction of box dam 2 grooves, is also arranged between LED chip parallel with one another 4 simultaneously.So not only meet 4 liang of strings of LED chip two circuit design requirement also, greatly dwindled the light-emitting area of LED luminescence chip 4, and can solve bonding equipment porcelain mouth and box dam 2 interference problems in pad 3 welding processes simultaneously.
The surface of box dam 2 is provided with silver coating; Substrate 1 and pad 3 in described box dam 2 grooves are equipped with silver coating, have so not only solved pad 3 problem of oxidation, and the blue light of chip 4 bottom surfaces and side can reflect away by silver coating, have increased LED light extraction efficiency.According to measuring and calculating, the LED of the present embodiment is under specified 1400mA electric current, and highlight flux can reach 670LM, well beyond existing LED.
Claims (4)
1. a COB packaged LED, comprise the substrate that is provided with box dam, substrate in described box dam groove is provided with several chips and pad, it is characterized in that described several chips arrange along the length direction of box dam groove, described pad is arranged between the both sides and/or adjacent chips of length direction of box dam groove.
2. COB packaged LED according to claim 1, is characterized in that described box dam is metal stamping formed, and box dam is welded on substrate surface by tin cream.
3. COB packaged LED according to claim 2, is characterized in that the surface of described box dam is provided with silver coating.
4. according to the COB packaged LED described in claim 1 or 2 or 3, it is characterized in that substrate and the pad in described box dam groove is equipped with silver coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320538915.9U CN203423216U (en) | 2013-09-02 | 2013-09-02 | COB packaging LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320538915.9U CN203423216U (en) | 2013-09-02 | 2013-09-02 | COB packaging LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203423216U true CN203423216U (en) | 2014-02-05 |
Family
ID=50022306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320538915.9U Expired - Lifetime CN203423216U (en) | 2013-09-02 | 2013-09-02 | COB packaging LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203423216U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104064665A (en) * | 2014-07-16 | 2014-09-24 | 广东威创视讯科技股份有限公司 | Bonding pad design structure based on LEDs |
-
2013
- 2013-09-02 CN CN201320538915.9U patent/CN203423216U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104064665A (en) * | 2014-07-16 | 2014-09-24 | 广东威创视讯科技股份有限公司 | Bonding pad design structure based on LEDs |
| CN104064665B (en) * | 2014-07-16 | 2018-01-23 | 广东威创视讯科技股份有限公司 | A kind of LED-based pad design structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140205 |