CN203387598U - Camera module optical sensing assembly and camera module - Google Patents
Camera module optical sensing assembly and camera module Download PDFInfo
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- CN203387598U CN203387598U CN201320477197.9U CN201320477197U CN203387598U CN 203387598 U CN203387598 U CN 203387598U CN 201320477197 U CN201320477197 U CN 201320477197U CN 203387598 U CN203387598 U CN 203387598U
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- camera module
- sensitive chip
- filter
- circuit board
- sensory package
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Abstract
A camera module optical sensing assembly and a camera module are provided. A circuit board is fixedly arranged at the second connection terminal of a support. An optical sensor comprises a photosensitive chip and a light filter. The photosensitive chip is electrically connected with the circuit board. The photosensitive chip comprises a first light reception face. The light filter is arranged on the first light reception face of the photosensitive chip. Since the light filter is directly arranged on the first light reception face of the photosensitive chip without designing specific support based on the dimension of the light filter, mold-making cost and mold-making precision requirement of the support are reduced, and production efficiency is improved.
Description
Technical field
The utility model relates to the camera work field, particularly relates to a kind of camera module light sensory package and camera module.
Background technology
Along with popularizing of the electronic product camera functions such as mobile phone, computer, also more and more higher to the requirement of pickup quality, the camera module with automatic focusing function has effectively improved pickup quality.Camera module with automatic focusing function comprises camera lens, voice coil motor assembly (Voice Coil Motor, VCM), filter, sensitive chip, circuit board etc., be provided with the driving chip on circuit board, drive chip to be connected with voice coil motor assembly by two ports of circuit board, control voice coil motor assembly work.
The automatic focusing function principle of camera module is: the light that camera lens is shining into is received by sensitive chip after filter filters, the intensity output drive signal of the light that drives chip to receive according to sensitive chip, control voice coil motor assembly and rotate camera lens, realize focusing automatically.
Traditional camera module with automatic focusing function is that sensitive chip is fixed on circuit board, and filter is bonded on support by glue, then circuit board is fixedly connected with voice coil motor assembly by support.This assembling mode need to design for different filters specific support, offers a glue groove and come glue coating with fixing filter on support, and support die sinking cost and die sinking required precision are high, and production efficiency is low.
The utility model content
Based on this, be necessary to provide camera module light sensory package and the camera module that a kind of support die sinking cost is low, the die sinking required precision is low.
A kind of camera module light sensory package comprises: support, comprise the first link for being connected with the voice coil motor assembly of camera module, and the second link be oppositely arranged with described the first link; Circuit board, be fixedly installed on the second link of described support; Described support and described circuit board are connected to form cavity; Optical sensor, be positioned at described cavity and be fixedly connected with described circuit board; Described optical sensor comprises sensitive chip and filter, and described sensitive chip is electrically connected to described circuit board, and described sensitive chip comprises the first light receiving surface, and described filter is arranged at the first light receiving surface of described sensitive chip.
In embodiment, described filter laminating is fixing, or Electrostatic Absorption is fixed in the first light receiving surface of described sensitive chip therein.
In embodiment, described filter comprises the infrared absorption filter photosphere therein, and the first colored filter be connected with described infrared absorption filter photosphere; Described the first colored filter is connected with described sensitive chip away from a side of described infrared absorption filter photosphere.
In embodiment, described infrared absorption filter photosphere comprises the infrared filtering film therein, and the residuite layer be connected with described infrared filtering film; Described residuite layer is connected with described the first colored filter away from a side of described infrared filtering film.
In embodiment, described infrared filtering film is infrared cut-off light filtering films or smalt filter coating therein.
In embodiment, described sensitive chip comprises the second light receiving surface that relatively described the first light receiving surface arranges therein, and described optical sensor comprises the second colored filter, and described the second colored filter is arranged at the second light receiving surface of described sensitive chip.
In embodiment, described optical sensor comprises transparent substrate layer therein, and described transparent substrate layer is arranged at the side of described the second colored filter away from described sensitive chip.
In embodiment, described sensitive chip is the CMOS sensitive chip therein.
In embodiment, described sensitive chip is electrically connected to described circuit board by gold thread therein.
A kind of camera module, comprise camera lens, and be connected, control with described camera lens the voice coil motor assembly that described camera lens rotates, and also comprises above-mentioned any one camera module light sensory package, and described voice coil motor assembly is fixedly connected with the first link of described support.
Above-mentioned camera module light sensory package and camera module, circuit board is fixedly installed on the second link of support, and optical sensor comprises sensitive chip and filter, and sensitive chip is electrically connected to circuit board, sensitive chip comprises the first light receiving surface, and filter is arranged at the first light receiving surface of sensitive chip.Because filter directly is arranged at the first light receiving surface of sensitive chip, without the specific support of the size design according to filter, reduced support die sinking cost and die sinking required precision, improved production efficiency.
The accompanying drawing explanation
The sectional structure chart that Fig. 1 is camera module light sensory package in an embodiment;
The structure chart that Fig. 2 is optical sensor in an embodiment;
The structure chart that Fig. 3 is optical sensor in another embodiment.
Embodiment
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail.A lot of details have been set forth in the following description so that fully understand the utility model.But the utility model can be implemented much to be different from alternate manner described here, those skilled in the art can be in the situation that do similar improvement without prejudice to the utility model intension, so the utility model is not subject to the restriction of following public concrete enforcement.
It should be noted that, when element is called as " being fixed in " another element, can directly can there be element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may have centering elements simultaneously.
Unless otherwise defined, all technology that this paper is used are identical with the implication that belongs to the common understanding of those skilled in the art of the present utility model with scientific terminology.The term used in specification of the present utility model herein, just in order to describe the purpose of specific embodiment, is not intended to be restriction the utility model.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
A kind of camera module light sensory package, as shown in Figure 1, camera module light sensory package comprises support 110, circuit board 120 and optical sensor 130.
As shown in Figure 2, filter 132 can comprise infrared absorption filter photosphere 133 and the first colored filter 134.Infrared absorption filter photosphere 133 is connected with the first colored filter 134, and the first colored filter 134 is connected with sensitive chip 131 away from a side of infrared absorption filter photosphere 133.
Infrared absorption filter photosphere 133, for filtering the infrared light of incident light, is avoided affecting imaging effect because infrared ray disturbs.The first colored filter 134 comprises red (red, R) filter unit, green (green, G) filter unit and indigo plant (blue, the B) filter unit of some periodic arrangement, for making incident light, is transformed into monochromatic light, realizes filtering functions.Be appreciated that filter 132 also can not comprise infrared absorption filter photosphere 133.
Continuation is with reference to Fig. 2, and infrared absorption filter photosphere 133 specifically can comprise infrared filtering film 135 and residuite layer 136.Infrared filtering film 135 is connected with residuite layer 136, and residuite layer 136 is connected with the first colored filter 134 away from a side of infrared filtering film 135.
Above-mentioned camera module light sensory package, circuit board 120 is fixedly installed on the second link of support 110, optical sensor 130 comprises sensitive chip 131 and filter 132, sensitive chip 131 is electrically connected to circuit board 120, sensitive chip 131 comprises the first light receiving surface, and filter 132 is arranged at the first light receiving surface of sensitive chip 131.Because filter 132 directly is arranged at the first light receiving surface of sensitive chip 131, without the specific support 110 of the size design according to filter 132, reduced support 110 die sinking costs and die sinking required precision, improved production efficiency.Filter 132 directly is arranged to the first light receiving surface of sensitive chip 131, also can avoids the particles such as dust to be bonded at the first light receiving surface of sensitive chip 131, and affect the image effect of camera module.
In embodiment, as shown in Figure 3, sensitive chip 131 comprises the second light receiving surface that relative the first light receiving surface arranges therein, and sensitive chip 131 is the double-sided light sensitive chip.Optical sensor 130 comprises that the second colored filter 137, the second colored filters 137 are arranged at the second light receiving surface of sensitive chip 131.The second colored filter 137 equally also comprises red (red, R) filter unit, green (green, G) filter unit and indigo plant (blue, the B) filter unit of some periodic arrangement, for making incident light, is transformed into monochromatic light, realizes filtering functions.
Continuation is with reference to Fig. 3, optical sensor 130 also can comprise transparent substrate layer 138, transparent substrate layer 138 is arranged at the side of the second colored filter 137 away from sensitive chip 131, and transparent substrate layer 138 can improve the hardness of optical sensor 130, makes not cracky of optical sensor 130.Transparent substrate layer 138 can be glass material, can be also plastic material, and in the present embodiment, transparent substrate layer 138 is the glass baseplate layer, easy to make and cost is low.
In addition, the utility model also provides a kind of camera module, can be applicable to the electronic products such as mobile phone, computer.Camera module comprises camera lens and voice coil motor assembly, also comprises above-mentioned camera module light sensory package.The voice coil motor assembly connection lens, rotate for controlling camera lens, carries out automatic focusing.Voice coil motor assembly is fixedly connected with the first link of support.
Voice coil motor assembly specifically can comprise voice coil motor body and shell, and shell is coated on the voice coil motor body, for the protection of the voice coil motor body.Be appreciated that voice coil motor assembly also can only include the voice coil motor body.Support can be bonding by adhesive and voice coil motor assembly, also can with voice coil motor assembly, be connected by engaging or other fixed forms.
Above-mentioned camera module, because filter directly is arranged at the first light receiving surface of sensitive chip, with traditional camera module, compare, design specific support without the size according to filter, reduce support die sinking cost and die sinking required precision, improved production efficiency.Filter directly is arranged to the first light receiving surface of sensitive chip, also can avoids the particles such as dust to be bonded at the first light receiving surface of sensitive chip, and affect the image effect of camera module.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. a camera module light sensory package, is characterized in that, comprising:
Support, comprise the first link for being connected with the voice coil motor assembly of camera module, and the second link be oppositely arranged with described the first link;
Circuit board, be fixedly installed on the second link of described support; Described support and described circuit board are connected to form cavity;
Optical sensor, be positioned at described cavity and be fixedly connected with described circuit board; Described optical sensor comprises sensitive chip and filter, and described sensitive chip is electrically connected to described circuit board, and described sensitive chip comprises the first light receiving surface, and described filter is arranged at the first light receiving surface of described sensitive chip.
2. camera module light sensory package according to claim 1, is characterized in that, described filter laminating is fixing, or Electrostatic Absorption is fixed in the first light receiving surface of described sensitive chip.
3. camera module light sensory package according to claim 1, is characterized in that, described filter comprises the infrared absorption filter photosphere, and the first colored filter be connected with described infrared absorption filter photosphere; Described the first colored filter is connected with described sensitive chip away from a side of described infrared absorption filter photosphere.
4. camera module light sensory package according to claim 3, is characterized in that, described infrared absorption filter photosphere comprises the infrared filtering film, and the residuite layer be connected with described infrared filtering film; Described residuite layer is connected with described the first colored filter away from a side of described infrared filtering film.
5. camera module light sensory package according to claim 4, is characterized in that, described infrared filtering film is infrared cut-off light filtering films or smalt filter coating.
6. camera module light sensory package according to claim 1, it is characterized in that, described sensitive chip comprises the second light receiving surface that relatively described the first light receiving surface arranges, described optical sensor comprises the second colored filter, and described the second colored filter is arranged at the second light receiving surface of described sensitive chip.
7. camera module light sensory package according to claim 6, is characterized in that, described optical sensor comprises transparent substrate layer, and described transparent substrate layer is arranged at the side of described the second colored filter away from described sensitive chip.
8. camera module light sensory package according to claim 1, is characterized in that, described sensitive chip is the CMOS sensitive chip.
9. according to the described camera module light of claim 1 to 8 any one sensory package, it is characterized in that, described sensitive chip is electrically connected to described circuit board by gold thread.
10. a camera module, comprise camera lens, and be connected, control with described camera lens the voice coil motor assembly that described camera lens rotates, it is characterized in that, also comprise camera module light sensory package as described as claim 1 to 9 any one, described voice coil motor assembly is fixedly connected with the first link of described support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320477197.9U CN203387598U (en) | 2013-08-06 | 2013-08-06 | Camera module optical sensing assembly and camera module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320477197.9U CN203387598U (en) | 2013-08-06 | 2013-08-06 | Camera module optical sensing assembly and camera module |
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| CN203387598U true CN203387598U (en) | 2014-01-08 |
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| CN201320477197.9U Expired - Fee Related CN203387598U (en) | 2013-08-06 | 2013-08-06 | Camera module optical sensing assembly and camera module |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103887928A (en) * | 2014-03-28 | 2014-06-25 | 宜兴市贵鑫磁电高科技有限公司 | Voice coil motor with position sensor carrier |
| CN104064576A (en) * | 2014-07-08 | 2014-09-24 | 江苏金成光电科技有限公司 | Packaging method for mobile phone camera shooting module |
| CN106303169A (en) * | 2015-05-28 | 2017-01-04 | 宁波舜宇光电信息有限公司 | Ultra-thin photographic head module and manufacture method thereof |
| CN106454053A (en) * | 2016-11-22 | 2017-02-22 | 宁波舜宇光电信息有限公司 | Camera module used for iris recognition and equipment thereof |
| CN109218582A (en) * | 2018-09-29 | 2019-01-15 | Oppo广东移动通信有限公司 | Mould group and preparation method thereof, camera and electronic device |
| CN109246348A (en) * | 2018-11-05 | 2019-01-18 | 中芯集成电路（宁波）有限公司 | Lens module and its packaging method, electronic equipment |
| CN112217969A (en) * | 2016-04-07 | 2021-01-12 | 宁波舜宇光电信息有限公司 | Photosensitive device with reinforced circuit board, array camera module and manufacturing method thereof |
| CN112346164A (en) * | 2020-11-10 | 2021-02-09 | Oppo广东移动通信有限公司 | Electronic device, imaging apparatus, and optical filter thereof |
| CN112468617A (en) * | 2020-11-10 | 2021-03-09 | Oppo广东移动通信有限公司 | Image sensing module, camera module and electronic equipment |
| WO2022127658A1 (en) * | 2020-12-15 | 2022-06-23 | 维沃移动通信有限公司 | Photographic module, and electronic device |
-
2013
- 2013-08-06 CN CN201320477197.9U patent/CN203387598U/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103887928B (en) * | 2014-03-28 | 2016-08-17 | 宜兴市贵鑫磁电高科技有限公司 | It is provided with the voice coil motor of position sensor carrier |
| CN103887928A (en) * | 2014-03-28 | 2014-06-25 | 宜兴市贵鑫磁电高科技有限公司 | Voice coil motor with position sensor carrier |
| CN104064576A (en) * | 2014-07-08 | 2014-09-24 | 江苏金成光电科技有限公司 | Packaging method for mobile phone camera shooting module |
| CN106303169B (en) * | 2015-05-28 | 2021-08-10 | 宁波舜宇光电信息有限公司 | Ultrathin camera module and manufacturing method thereof |
| CN106303169A (en) * | 2015-05-28 | 2017-01-04 | 宁波舜宇光电信息有限公司 | Ultra-thin photographic head module and manufacture method thereof |
| CN112217969A (en) * | 2016-04-07 | 2021-01-12 | 宁波舜宇光电信息有限公司 | Photosensitive device with reinforced circuit board, array camera module and manufacturing method thereof |
| CN106454053A (en) * | 2016-11-22 | 2017-02-22 | 宁波舜宇光电信息有限公司 | Camera module used for iris recognition and equipment thereof |
| CN109218582A (en) * | 2018-09-29 | 2019-01-15 | Oppo广东移动通信有限公司 | Mould group and preparation method thereof, camera and electronic device |
| CN109246348A (en) * | 2018-11-05 | 2019-01-18 | 中芯集成电路（宁波）有限公司 | Lens module and its packaging method, electronic equipment |
| CN109246348B (en) * | 2018-11-05 | 2021-10-19 | 中芯集成电路（宁波）有限公司 | Lens module, packaging method thereof and electronic equipment |
| CN112468617A (en) * | 2020-11-10 | 2021-03-09 | Oppo广东移动通信有限公司 | Image sensing module, camera module and electronic equipment |
| CN112346164A (en) * | 2020-11-10 | 2021-02-09 | Oppo广东移动通信有限公司 | Electronic device, imaging apparatus, and optical filter thereof |
| CN112468617B (en) * | 2020-11-10 | 2023-03-24 | Oppo广东移动通信有限公司 | Electronic device |
| WO2022127658A1 (en) * | 2020-12-15 | 2022-06-23 | 维沃移动通信有限公司 | Photographic module, and electronic device |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140108 Termination date: 20180806 |
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| CF01 | Termination of patent right due to non-payment of annual fee |