CN203352943U - Circuit board and electronic assembly - Google Patents
Circuit board and electronic assembly Download PDFInfo
- Publication number
- CN203352943U CN203352943U CN 201320265608 CN201320265608U CN203352943U CN 203352943 U CN203352943 U CN 203352943U CN 201320265608 CN201320265608 CN 201320265608 CN 201320265608 U CN201320265608 U CN 201320265608U CN 203352943 U CN203352943 U CN 203352943U
- Authority
- CN
- China
- Prior art keywords
- those
- differential signal
- differential
- conductive
- signal pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000008054 signal transmission Effects 0.000 claims abstract description 136
- 230000005540 biological transmission Effects 0.000 claims abstract description 104
- 239000011469 building brick Substances 0.000 claims description 40
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000011514 reflex Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Dc Digital Transmission (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
The utility model discloses a circuit board and electronic component, this circuit board include a circuit pile structure, two first resistance pieces and two second resistance pieces. The signal transmission structure of the circuit stack structure comprises a pair of first differential signal paths and a pair of second differential signal paths. The first differential signal path is suitable for connecting a pair of first differential signal pins of an electric connector and a transmission chip. The second differential signal path is suitable for connecting a pair of second differential signal pins of the electric connector and the first differential signal path and is respectively provided with a connecting point. The first resistance pieces are respectively arranged on the first differential signal paths and between the connection point and a starting point of the first differential signal paths and a midpoint between the connection points. The second resistance pieces are respectively arranged on the second differential signal paths and between the connecting points and a starting point of the second differential signal paths and a midpoint between the connecting points.
Description
Technical field
The utility model relates to a kind of wiring board, and particularly relates to a kind of Electronic Assemblies of application circuit plate.
Background technology
USB 3.0(Universal Serial Bus3.0; USB3.0) be that a kind of from the signal transmission standard that USB2.0 developed out, its transmission rate can reach 5G bps, the transmission rate of traditional USB2.0 only has 480M bps.The USB3.0 electric connector is definite compatible in the USB2.0 electric connector at present, and meaning is that USB3.0 has adopted the electric connector structure identical with USB2.0, and has increased the pin of the several USB3.0 of being used to provide functions.Therefore, the USB3.0 electric connector replaces traditional USB2.0 electric connector gradually.
On the other hand, double-inserting type (2-way) USB3.0 socket connector can make general USB3.0 pin connector not be limited to single direction of insertion and improve practicality.Wherein, double-inserting type USB3.0 socket connector has the pin that two groups of transmission standards are USB3.0, making the wiring board that is provided with the double-inserting type socket connector need to possess than the more manufacturing cost of the wiring board that is applicable to general USB3.0 socket connector, is for example to increase the connectivity port of the transmission chip that circuit connects or increase connection wire etc.In addition, adjust configuration in order to reduce costs, the stable signal transmission after also needing to consider to adjust.
The utility model content
The purpose of this utility model is to provide a kind of wiring board, has preferably stable signal transmission and also can reduce cost of manufacture.
A purpose more of the present utility model is to provide a kind of electronic building brick, has stable signal transmission preferably and lower cost of manufacture.
For reaching above-mentioned purpose, the utility model proposes a kind of wiring board, be suitable for connecting an electric connector and a transmission chip.Wiring board comprises that a circuit folds structure, two first resistance units and two second resistance units.The folded structure of circuit comprises a signal transmission structure, is suitable for connecting pair of first differential signal pins and the pair of second differential signal pins of transmission chip and electric connector.Signal transmission structure comprises pair of first differential signal path and pair of second differential signal path.The first differential wave path is suitable for connecting the first differential signal pins and transmission chip.The second differential wave path is suitable for connecting the second differential signal pins, and is connected to respectively the first differential wave path and has respectively a tie point.The first resistance unit is separately positioned on the first differential wave path, and wherein each first resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively first differential wave path and corresponding each tie point.The second resistance unit is separately positioned on the second differential wave path, and wherein each second resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively second differential wave path and corresponding each tie point.
The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, this signal transmission structure comprises:
Should, to the first differential wave path, also comprise:
Two first connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the first differential signal pins; And
Two first cablings, be disposed at adjacent to each other this upper surface and be suitable for connecting this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And
Should, to the second differential wave path, also comprise:
Two second connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the second differential signal pins; And
Two second cablings, be configured in adjacent to each other this upper surface and this lower surface, and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.
The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.
The resistance value of those first resistance units and those the second resistance units is between 30 ohm (ohm, Ω) is to 180 ohm.
The utility model reintroduces a kind of electronic building brick, comprises a transmission chip, an electric connector and a wiring board.Electric connector has pair of first differential signal pins and pair of second differential signal pins.Wiring board comprises that a circuit folds structure, two first resistance units and two second resistance units.The folded structure of circuit comprises a signal transmission structure.Signal transmission structure comprises pair of first differential signal path and pair of second differential signal path.First differential wave Path Connection the first differential signal pins and transmission chip.Second differential wave Path Connection the second differential signal pins, and be connected to respectively the first differential wave path and there is respectively a tie point.The first resistance unit is separately positioned on the first differential wave path, and wherein each first resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively first differential wave path and corresponding each tie point.The second resistance unit is separately positioned on the second differential wave path, and wherein each second resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively second differential wave path and corresponding each tie point.
The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, this signal transmission structure comprises:
Should, to the first differential wave path, also comprise:
Two first connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the first differential signal pins; And
Two first cablings, be disposed at adjacent to each other this upper surface and connect this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And
Should, to the second differential wave path, also comprise:
Two second connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the second differential signal pins; And
Two second cablings, be configured in adjacent to each other this upper surface and this lower surface and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.
The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.
The resistance value of those first resistance units and those the second resistance units is between 30 ohm to 180 ohm.
The utility model proposes again a kind of wiring board, is suitable for connecting an electric connector and a transmission chip.Wiring board comprises that a circuit folds structure, two pairs of the first resistance units and two pairs of the second resistance units.The folded structure of circuit comprises a first signal transmission structure and a secondary signal transmission structure.The first signal transmission structure is suitable for connecting pair of first differential signal pins and the pair of second differential signal pins of transmission chip and electric connector, and the secondary signal transmission structure is suitable for connecting another pair of first differential signal pins and the another pair of second differential signal pins of transmission chip and electric connector.Each signal transmission structure comprises pair of first differential signal path and pair of second differential signal path.The first differential wave path is suitable for connecting the first corresponding differential signal pins and transmission chip.The second differential wave path is suitable for connecting the second corresponding differential signal pins, and is connected to respectively the first differential wave path and has respectively a tie point.The first resistance unit is separately positioned on the first differential wave path, and wherein each first resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively first differential wave path and corresponding each tie point.The second resistance unit is separately positioned on the second differential wave path, and wherein each second resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively second differential wave path and corresponding each tie point.
The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, respectively this signal transmission structure comprises:
Should, to the first differential wave path, also comprise:
Two first connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the first differential signal pins; And
Two first cablings, be disposed at adjacent to each other this upper surface and be suitable for connecting this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And
Should, to the second differential wave path, also comprise:
Two second connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the second differential signal pins; And
Two second cablings, be configured in adjacent to each other this upper surface and this lower surface and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.
The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.
The resistance value of those first resistance units and those the second resistance units is between 30 ohm to 180 ohm.
This first signal transmission structure is suitable for connecting two groups of USB 3.0 frameworks (Universal Serial Bus3.0; The USB3.0 framework) a pair of transmission (Transmitting) the differential signal pins T in
x +and T
x -with the transmission differential signal, and this secondary signal transmission structure is suitable for connecting a pair of reception (Receiving) the differential signal pins R in two groups of USB3.0 frameworks
x +and R
x -with the transmission differential signal.
The folded structure of this circuit also comprises the 3rd signal transmission structure, be suitable for this transmission chip and the not only pair of first differential signal pins that is connected this electric connector and but also pair of second differential signal pins, the 3rd signal transmission structure comprises:
The pair of first differential signal path, being suitable for connecting should be to the first differential signal pins and this transmission chip, and two first resistance units are separately positioned on those the first differential wave paths, wherein respectively this first resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this first differential wave path and corresponding respectively between the mid point between this tie point; And
The pair of second differential signal path, being suitable for connecting should be to the second differential signal pins, and be connected to respectively this first differential wave path is had respectively to a tie point, and two second resistance units are separately positioned on those the second differential wave paths, wherein respectively this second resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this second differential wave path and corresponding respectively between the mid point between this tie point.
The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, the 3rd signal transmission structure comprises:
Should, to the first differential wave path, also comprise:
Two first connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the first differential signal pins; And
Two first cablings, be disposed at adjacent to each other this upper surface and be suitable for connecting this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And
Should, to the second differential wave path, also comprise:
Two second connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the second differential signal pins; And
Two second cablings, be configured in adjacent to each other this upper surface and this lower surface and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.
The 3rd signal transmission structure is suitable for connecting two groups of a pair of transmission/reception differential signal pins D that support USB1.0 framework or USB2.0 framework
+and D
-with the transmission differential signal.
The utility model also proposes a kind of electronic building brick, comprises a transmission chip, an electric connector and a wiring board.Electric connector has two pairs of the first differential signal pins and two pairs of the second differential signal pins.Wiring board comprises that a circuit folds structure, two pairs of the first resistance units and two pairs of the second resistance units.The folded structure of circuit comprises a first signal transmission structure and a secondary signal transmission structure.The first signal transmission structure connects pair of first differential signal pins and the pair of second differential signal pins of transmission chip and electric connector, and the secondary signal transmission structure connects another pair of first differential signal pins and the another pair of second differential signal pins of transmission chip and electric connector.Each signal transmission structure comprises pair of first differential signal path and pair of second differential signal path.The first differential signal pins and transmission chip that the first differential wave Path Connection is corresponding.The second differential signal pins that the second differential wave Path Connection is corresponding, and be connected to respectively the first differential wave path and there is respectively a tie point.The first resistance unit is separately positioned on the first differential wave path, and wherein each first resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively first differential wave path and corresponding each tie point.The second resistance unit is separately positioned on the second differential wave path, and wherein each second resistance unit is between the mid point between the starting point in each tie point of correspondence and corresponding respectively second differential wave path and corresponding each tie point.
The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, respectively this signal transmission structure comprises:
Should, to the first differential wave path, also comprise:
Two first connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the first differential signal pins; And
Two first cablings, be disposed at adjacent to each other this upper surface and connect this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And
Should, to the second differential wave path, also comprise:
Two second connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the second differential signal pins; And
Two second cablings, be configured in adjacent to each other this upper surface and this lower surface and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.
The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.
The resistance value of those first resistance units and those the second resistance units is between 30 ohm to 180 ohm.
What connect this first signal transmission structure should and should be respectively a pair of transmission differential signal pins T in the USB3.0 framework to the second differential signal pins to the first differential signal pins
x +and T
x -, and connect should and being somebody's turn to do the first differential signal pins of this secondary signal transmission structure, to the second differential signal pins, be respectively a pair of reception differential signal pins R in the USB3.0 framework
x +and R
x -.
The folded structure of this circuit also comprises one the 3rd signal transmission structure, connect this transmission chip and this electric connector not only pair of first differential signal pins and but also pair of second differential signal pins, the 3rd signal transmission structure comprises:
The pair of first differential signal path, connecting should be to the first differential signal pins and this transmission chip, and two first resistance units are separately positioned on those the first differential wave paths, wherein respectively this first resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this first differential wave path and corresponding respectively between the mid point between this tie point; And
The pair of second differential signal path, connecting should be to the second differential signal pins, and be connected to respectively this first differential wave path is had respectively to a tie point, and two second resistance units are separately positioned on those the second differential wave paths, wherein respectively this second resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this second differential wave path and corresponding respectively between the mid point between this tie point.
The folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, the 3rd signal transmission structure comprises:
Should, to the first differential wave path, also comprise:
Two first connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the first differential signal pins; And
Two first cablings, be disposed at adjacent to each other this upper surface and connect this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And
Should, to the second differential wave path, also comprise:
Two second connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the second differential signal pins; And
Two second cablings, be configured in adjacent to each other this upper surface and this lower surface and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.
What connect the 3rd signal transmission structure should be to support a pair of transmission/reception differential signal pins D of USB1.0 framework or USB2.0 framework with being somebody's turn to do the second differential signal pins to the first differential signal pins
+and D
-.
Based on above-mentioned, the utility model has the advantage of, the electronic building brick of a kind of wiring board with this circuit board of application is provided, wherein the first differential wave Path Connection of signal transmission structure is to transmitting chip, and the second differential wave path is connected to respectively the first corresponding differential wave path and has tie point.Each resistance unit is arranged on each corresponding differential wave path, and between the mid point between the starting point in each tie point of correspondence and corresponding each differential wave path and corresponding each tie point.Accordingly, the wiring board of electronic building brick can connect the electric connector with two groups of identical differential signal pins and have lower cost of manufacture, and wiring board has preferably stable signal transmission via resistance unit is set.For above-mentioned feature and advantage of the present utility model can be become apparent, special embodiment below, and coordinate appended accompanying drawing to be described in detail below.
The accompanying drawing explanation
Fig. 1 is the conspectus of the electronic building brick of the utility model one embodiment;
Fig. 2 is the local line schematic diagram of the electronic building brick of Fig. 1;
Fig. 3 is the stereogram of the electric connector of Fig. 1;
Fig. 4 is the front view of the electric connector of Fig. 3;
Fig. 5 is the partial schematic diagram of the electronic building brick of Fig. 1;
Fig. 6 is the end view of the electronic building brick of Fig. 5;
Fig. 7 is the differential mode usefulness figure that the electronic building brick of Fig. 1 does not have resistance unit;
Fig. 8 is the differential mode usefulness figure of the electronic building brick of Fig. 1.
The main element symbol description
100: electronic building brick
110: the transmission chip
110a: connectivity port
120: electric connector
122,124: pin
122a, 122b, 122c: the first differential signal pins
124a, 124b, 124c: the second differential signal pins
126: metal shell
128: insulating base frame
1000: wiring board
1100: circuit is folded structure
1110: the first signal transmission structure
1112a: the first connection pad
1112b: the second connection pad
1114a: the first cabling
1114b: the second cabling
1116a: the first conductive through hole
1116b: the second conductive through hole
1120: the secondary signal transmission structure
1130: the three signal transmission structures
1210,1220,1230: the first resistance units
1310,1320,1330: the second resistance units
C1, C2, C3: tie point
M1, M2: mid point
O1, O2: starting point
P11, P12, P13: the first differential wave path
P21, P22, P23: the second differential wave path
S1: upper surface
S2: lower surface
Embodiment
Fig. 1 is the conspectus of the electronic building brick of the utility model one embodiment.Please refer to Fig. 1, in the present embodiment, electronic building brick 100 comprises transmission chip 110, electric connector 120 and wiring board 1000.Transmission chip 110 is arranged at wiring board 1000 with electric connector 120.Wiring board 1000 comprises the folded structure of circuit 1100, three pairs of the first resistance units 1210 and 1220 and 1230 and three pairs of the second resistance units 1310 and 1320 and 1330.
In the present embodiment, the folded structure 1100 of circuit comprises first signal transmission structure 1110, secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130, and electric connector 120 has three couples of the first differential signal pins 122a and 122b and 122c and three couples of the second differential signal pins 124a and 124b and 124c.
The pair of first differential signal pins 122a of first signal transmission structure 1110 electrical connectors 120 and pair of second differential signal pins 124a and transmission chip 110.Similarly, the another pair of first differential signal pins 122b of secondary signal transmission structure 1120 electrical connectors 120 and another pair of second differential signal pins 124b and transmission chip 110, and the pair of first differential signal pins 122c of the 3rd signal transmission structure 1130 electrical connectors 120 and and pair of second differential signal pins 124c and transmission chip 110.
In other words, first signal transmission structure 1110, secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130 are connected to transmission chip 110 with signal transmission by three couple of electric connector 120 the first differential signal pins 122a and 122b and 122c and three couples of the second differential signal pins 124a and 124b and 124c respectively.Though these three signal transmission structures 1110 and 1120 and 1130 have similar structure and configuration mode, have different transmission modes.Yet the present invention does not limit transmission mode, structure and the configuration mode of these three signal transmission structures 1110 and 1120 and 1130.
Fig. 2 is the local line schematic diagram of the electronic building brick of Fig. 1.For making accompanying drawing clearer, Fig. 2 illustrates first signal transmission structure 1110 in Fig. 1 and omits and illustrate secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130, and structure and the configuration mode of secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130, can be with reference to structure and the configuration mode of the first signal transmission structure 1110 of figure 2.
Please also refer to Fig. 1 and Fig. 2, in the present embodiment, first signal transmission structure 1110 comprises pair of first differential signal path P 11 and pair of second differential signal path P 21.That of the first differential wave path P 11 connection correspondences is to the first differential signal pins 122a and transmission chip 110.The second differential wave path P 21 connects corresponding that to the second differential signal pins 124a, and is connected to respectively the first differential wave path P 11 and has respectively tie point C1.Similarly, secondary signal transmission structure 1120 comprises pair of first differential signal path P 12 and pair of second differential signal path P 22.That of the first differential wave path P 12 connection correspondences is to the first differential signal pins 122b and transmission chip 110.The second differential wave path P 22 connects corresponding that to the second differential signal pins 124b, and is connected to respectively the first differential wave path P 12 and has respectively tie point C2.The 3rd signal transmission structure 1130 comprises pair of first differential signal path P 13 and pair of second differential signal path P 23.That of the first differential wave path P 13 connection correspondences is to the first differential signal pins 122c and transmission chip 110.The second differential wave path P 23 connects corresponding that to the second differential signal pins 124c, and is connected to respectively the first differential wave path P 13 and has respectively tie point C3.
Hence one can see that, with first signal transmission structure 1110, first signal transmission structure 1110 has the first paired differential wave path P 11 and the second paired differential wave path P 21, and the first differential wave path P 11 and the second differential wave path P 21 are connected to each other by tie point C1, and then the first paired differential signal pins 122a and the second differential signal pins 124a are connected to transmission chip 110.Similarly, secondary signal transmission structure 1120 also has identical composition and configuration mode with the 3rd signal transmission structure 1130.
Accordingly, first signal transmission structure 1110, secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130 can reduce and be connected the required material of transmission chip 110 and reduce cost of manufacture, and can improve the configuration degree of a plurality of differential waves path in fixed range, for example that to use the transmission chip 110 of a connectivity port 110a(accompanying drawing of transmission chip 110 be that to have two connectivity port 110a be example, but the present invention is not as restriction) two group of pins 122 that can electrical connectors 120, 124, and then the quantity of 110 electric connectors 120 that can connect of increase single transmission chip.
Fig. 3 is the stereogram of the electric connector of Fig. 1.Fig. 4 is the front view of the electric connector of Fig. 3.Please refer to Fig. 1 to Fig. 4, in the present embodiment, electric connector 120 is USB 3.0(Universal Serial Bus3.0, USB3.0 for double-inserting type (2-way) and transmission standard) the model socket connector that is Standard-A.In brief, it is USB3.0 and pin connector (not illustrating) that model is Standard-A that electric connector 120 can connect general common transmission standard, and pin connector, still inserting and electrical connectors 120 after the axis Rotate 180 degree corresponding to electric connector 120, makes electric connector 120 not be limited to single direction of insertion and improves practicality.
Therefore, electric connector 120 need to be than the many group of pins of general USB3.0Standard-A socket connector.This two group of pins 122 and 124 be located on the insulating base frame 128 of connection metal housing 126 and respectively position upper row and the lower row of insulating base frame 128.When pin connector is for example while with front, inserting electric connector 120, upper row's pin 122 of pin connector electrical connectors 120.When pin connector is for example reverse side to differ 180 degree with front while inserting electric connector 120, lower row's pin 124 of pin connector electrical connectors 120.
Hence one can see that, and this two group of pins 122 and 124 has identical composition.Therefore, when pin connector electrical connectors 120, electric connector 120 is via the wherein action of a group of pins 122 or 124 execution signal transmissions, no matter and which group of pins of pin connector electrical connectors 120 can have identical function.
In the present embodiment, upper row's pin 122 comprises that aforesaid three couples of the first differential signal pins 122a and 122b and 122c and other pins are for example power pin or ground connection pin, and lower row's pin 124 comprises that aforesaid three couples of the second differential signal pins 124a and 124b and 124c and other pins are for example power pin or ground connection pin.For making accompanying drawing clearer, omit illustrating of other above-mentioned pins in diagram.Know this operator and can these other pins be disposed to suitable position according to actual service condition.
Three couples, the first differential signal pins 122a of upper row's pin 122 and 122b and 122c are respectively a pair of transmission (Transmitting) the differential signal pins T in the USB3.0 framework
x +and T
x -, a pair of reception (Receiving) differential signal pins R
x +and R
x -and a pair of transmission/reception differential signal pins D that supports USB1.0 framework or USB2.0 framework
+and D
-.Three couples, the second differential signal pins 124a of lower row's pin 124 and 124b and 124c are respectively a pair of transmission differential signal pins T in the USB3.0 framework
x +and T
x -, a pair of reception differential signal pins R
x +and R
x -and a pair of transmission/reception differential signal pins D that supports USB1.0 framework or USB2.0 framework
+and D
-.
In the present embodiment, wiring board 1000 is suitable for connecting the electric connector 120 that transmission standard is USB3.0.Wherein, first signal transmission structure 1110 is suitable for connecting a pair of transmission differential signal pins T in two groups of USB3.0 frameworks
x +and T
x -, secondary signal transmission structure 1120 is suitable for connecting a pair of reception differential signal pins R in two groups of USB3.0 frameworks
x +and R
x -, and the 3rd signal transmission structure 1130 is suitable for connecting two groups of a pair of transmission/reception differential signal pins D that support USB1.0 framework or USB2.0 framework
+and D
-.
Hence one can see that, aforesaid these three signal transmission structures 1110 can have different transmission modes from 1120 and 1130, for example, for example, but the first differential wave path of each signal transmission structure (being first signal transmission structure 1110) (being the first differential wave path P 11) for example, has identical transmission mode with the second differential wave path (being the second differential wave path P 21), and be suitable for connecting two pairs of differential signal pins with identical traffic pattern.Therefore, electric connector 120 energy connection line plates 1000, and by signal transmission structure 1110 and 1120 and 1130 transmission differential signals.
The the first differential signal pins 122a and the second differential signal pins 124a that connect first signal transmission structure 1110 are a pair of transmission differential signal pins T in the USB3.0 framework
x +and T
x -, the first differential signal pins 122b and the second differential signal pins 124b that connect secondary signal transmission structure 1120 are a pair of reception differential signal pins R in the USB3.0 framework
x +and R
x -, and connect the first differential signal pins 122c of the 3rd signal transmission structure 1130 and a pair of transmission/reception differential signal pins D that the second differential signal pins 124c is support USB1.0 framework or USB2.0 framework
+and D
-.
In brief, the differential signal pins that there is the identical traffic pattern in the upper row's pin 122 in each signal transmission structure 1110 and 1120 and 1130 while electrical connectors 120 and lower row's pin 124.Therefore, no matter upper row's pin 122 or lower row's pin 124 of pin connector electrical connectors 120, signal can transfer to transmission chip 110 via these signal transmission structures 1110 and 1120 and 1130.
On the other hand, please also refer to Fig. 1 and Fig. 2, in the present embodiment, three couples, first resistance unit 1210 of wiring board 1000 and 1220 and 1230 and three pairs of the second resistance units 1310 and 1320 and 1330 are separately positioned in first signal transmission structure 1110, secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130 of the folded structure 1100 of circuit, that is signal transmission structure 1110 and 1120 and 1130 is connected respectively corresponding a pair of the first resistance unit 1210 and 1220 and 1230 and corresponding a pair of the second resistance unit 1310 and 1320 and 1330.
Take connect first signal transmission structure 1110 this to the first resistance unit 1210, with this, to the second resistance unit 1310, be example, this is separately positioned on the first differential wave path P 11 the first resistance unit 1210, wherein each first resistance unit 1210 is between the mid point M1 between the starting point O1 of each tie point C1 of correspondence and corresponding respectively first differential wave path P 11 and corresponding each tie point C1, and this is separately positioned on the second differential wave path P 21 the second resistance unit 1310, wherein each second resistance unit 1310 is between the mid point M2 between the starting point O2 of each tie point C1 of correspondence and corresponding respectively second differential wave path P 21 and corresponding each tie point C1.
Also say further, each first resistance unit 1210 is between between each tie point C1 of correspondence and corresponding each mid point M1 and contiguous corresponding tie point C1, and each second resistance unit 1310 is between tie point C1 corresponding to vicinity also between each tie point C1 of correspondence and corresponding each mid point M2.Via on each differential wave path, resistance unit being set, can avoiding signal from the differential wave path transmission that is connected to another differential wave path and be reflected back former differential signal path and affect the intensity that high-frequency signal transfers to the transmission chip.
Particularly, take first signal transmission structure 1110 as example, when pin connector electrical connectors 120, first signal transmission structure 1110 only carrys out signal transmission by one of them of the first differential wave path P 11 or the second differential wave path P 21.Because the first differential wave path P 11 is connected via tie point C1 with the second differential wave path P 21, when signal via the first differential wave path P 11 while being transmitted, part signal may transfer to untapped the second differential wave path P 21 through tie point C1 the time, and this part signal can be reflected back the first differential wave path P 11 via tie point C1 again, and then the intensity of attenuates high frequency signals, and make to transfer to the signal strength signal intensity of transmission chip 110 not in accepting scope.
Therefore, by the first differential wave path P 11 with the first corresponding resistance unit 1210 and the second resistance unit 1310 are set on the second differential wave path P 21, can make the part signal that transfers to untapped differential wave path reduce volume reflection by the first resistance unit 1210 and the second resistance unit 1310 weakening signal strength signal intensities before the differential wave path in being reflected back use, to avoid the signal transmitted in impact differential wave path in use.
In addition, make the first resistance unit 1210 and the contiguous tie point C1 of the second resistance unit 1310, can make part signal can weaken signal value via the first resistance unit 1210 and the second resistance unit 1310 after by tie point C1, transferring to untapped differential wave path and reduce volume reflection, to avoid part signal not yet to be transferred to resistance unit, with regard to producing reflex, affect signal strength signal intensity.Although the signal that socket connector transmits by electric connector 120 is also because resistance unit produces loss, the signal strength signal intensity that transfers to transmission chip 110 is still enough.
In addition, secondary signal transmission structure 1120 has identical configuration mode and function with the 3rd signal transmission structure 1130 with first signal transmission structure 1110.That is, via on the first differential wave path P 12 and P13 and the second differential wave path P 22 and P23, the first corresponding resistance unit 1220 and the 1230 and second resistance unit 1320 and 1330 being set respectively, the differential wave path that also can reduce in use is affected.This part can, with reference to the description of aforesaid relevant first signal transmission structure 1110, not added to repeat at this.
Fig. 5 is the partial schematic diagram of the electronic building brick of Fig. 1.For making accompanying drawing clearer, Fig. 5 illustrates first signal transmission structure 1110 and corresponding the first differential signal pins 122a and the second differential signal pins 124a, and omit, illustrates pin that secondary signal transmission structure 1120 is corresponding with it with the 3rd signal transmission structure 1130 and the body of electric connector 120.Wherein, structure and the configuration mode of secondary signal transmission structure 1120 and the 3rd signal transmission structure 1130, can be with reference to structure and the configuration mode of the first signal transmission structure 1110 of figure 5.
Please refer to Fig. 5, in the present embodiment, the embodiment of electronic building brick 100 is as following: the folded structure 1100 of circuit has upper surface S1 and with respect to the lower surface S2 of upper surface S1.First signal transmission structure 1110 comprises pair of first differential signal path P 11 and pair of second differential signal path P 21.This comprises two first connection pad 1112a, two first cabling 1114a and two first conductive through hole 1116a to the first differential wave path P 11, and this comprises two second connection pad 1112b, two second cabling 1114b and two second conductive through hole 1116b to the second differential wave path P 21.
Particularly, two first connection pad 1112a are disposed at adjacent to each other the side of upper surface S1 and connect corresponding that to the first differential signal pins 122a.Two first cabling 1114a are disposed at adjacent to each other upper surface S1 and connect respectively transmission chip 110 from the first connection pad 1112a through running through circuit to fold two first conductive through hole 1116a of structure 1100.
On the other hand, two second connection pad 1112b are disposed at adjacent to each other the side of upper surface S1 and connect corresponding that to the second differential signal pins 124a.Two second cabling 1114b are configured in upper surface S1 and lower surface S2 adjacent to each other, and extend to lower surface S2 by upper surface S1 through the two second conductive through hole 1116b that run through the folded structure 1100 of circuit from the second connection pad 1112b respectively, and be connected to the first cabling 1114a by lower surface S2 through the first conductive through hole 1116a respectively.Therefore, the tie point C1 of aforesaid the first differential wave path P 11 is positioned at the first conductive through hole 1116a.
In addition, two the first resistance units 1210 are positioned at upper surface S1 and are arranged at respectively the first cabling 1114a, and each first resistance unit 1210 is between each first conductive through hole 1116a of correspondence and corresponding respectively first connection pad 1112a and corresponding respectively between the mid point between first conductive through hole 1116a.Two the second resistance units 1310 are positioned at lower surface S2 and are arranged at respectively the second cabling 1114b, and each second resistance unit 1310 is between each first conductive through hole 1116a of correspondence and corresponding respectively second connection pad 1112b and corresponding respectively between the mid point between first conductive through hole 1116a.
Fig. 6 is the end view of the electronic building brick of Fig. 5.Please refer to Fig. 5 and Fig. 6, in the present embodiment, the first resistance unit 1210 is overlapped in the second resistance unit 1310 in the orthographic projection of lower surface S2 accordingly in the orthographic projection of upper surface S1, but the present invention is not as restriction.In addition, the first resistance unit 1210 and the second resistance unit 1310 can be for example that the mode of welding is arranged on the first cabling 1114a and the second cabling 1114b accordingly, but the present invention does not limit the set-up mode of the first resistance unit 1210 and the second resistance unit 1310.
Via such configuration, can make 1310 of part the second cabling 1114b and the second resistance units improve the free space of the folded structure 1100 of circuit at lower surface S2.Yet, in other embodiments, the first cabling 1114a and the second cabling 1114b and the first resistance unit 1210 and the second resistance unit 1310 also can be arranged at the upper surface S1 of the folded structure 1100 of circuit simultaneously and omit conductive through hole is set, and the present invention does not limit the configuration mode of these cablings and resistance unit.
In addition, in the present embodiment, these to the first resistance unit 1210 and 1220 and 1230 and these resistance values to the second resistance unit 1310 and 1320 and 1330 between 30 ohm to 180 ohm.The first resistance unit 1210 can have different resistance values from the second resistance unit 1310.Accordingly, wiring board 1000 can be for example the transmission mode of connected differential signal pins and adjust the resistance value of each first resistance unit 1210 and each the second resistance unit 1310 according to demand, excessive or too small and cause loss excessive or affect signal transmission efficiency to avoid resistance value.
Fig. 7 is the differential mode usefulness figure that the electronic building brick of Fig. 1 does not have resistance unit.Fig. 8 is the differential mode usefulness figure of the electronic building brick of Fig. 1.Fig. 7 illustrates the usefulness figure of the electronic building brick without the first resistance unit 1210 and the 1220 and 1230 and second resistance unit 1310 and 1320 and 1330, and Fig. 8 illustrates the usefulness figure of the electronic building brick 100 with the first resistance unit 1210 and the 1220 and 1230 and second resistance unit 1310 and 1320 and 1330 of the present embodiment.In addition, in Fig. 8, the resistance value of the first resistance unit 1210 and the 1220 and 1230 and second resistance unit 1310 and 1320 and 1330 is 90 ohm.
Please refer to Fig. 7 and Fig. 8, consume (return loss) Sdd11 that returns of these two cases is compared with intervention consume (insertion loss) Sdd12.In the case of resistance unit is not set, although it is less with the summation loss that gets involved consume Sdd12 to return to consume Sdd11, can produces short circuit and can't carry out the signal transmission when frequency is 1.7GHz, 4.4GHz and 7.6GHz.In addition, return to consume Sdd11 larger with the fluctuation that gets involved consume Sdd12, that is transmission stability is not high.
Otherwise, in the case that resistance unit is set of the present embodiment, although be subject to the impact of resistance unit, make the initial summation loss of returning to consume Sdd11 and intervention consume Sdd12 larger, the signal transmission can not be subject to the impact of signal reflex, therefore can not produce short circuit.In addition, return to consume Sdd11 less with the fluctuation that gets involved consume Sdd12, there is higher stability.Accordingly, electronic building brick 100 has preferably stable signal transmission.
In sum, the utility model provides the electronic building brick of a kind of wiring board with this circuit board of application, wherein the first differential wave Path Connection of signal transmission structure is to transmitting chip, and the second differential wave path is connected to respectively the first corresponding differential wave path and has tie point.Each resistance unit is arranged on each corresponding differential wave path, and between the mid point between the starting point in each tie point of correspondence and corresponding each differential wave path and corresponding each tie point.Accordingly, the wiring board of electronic building brick can connect the electric connector with two groups of identical differential signal pins and have lower cost of manufacture by reducing the required material of signal transmission, and wiring board can have via resistance unit is set preferably stable signal transmission.
Claims (24)
1. a wiring board, be suitable for connecting an electric connector and a transmission chip, it is characterized in that, this wiring board comprises:
Circuit is folded structure, comprising:
Signal transmission structure, be suitable for connecting pair of first differential signal pins and the pair of second differential signal pins of this transmission chip and this electric connector, and this signal transmission structure comprises:
The pair of first differential signal path, being suitable for connecting should be to the first differential signal pins and this transmission chip; And
The pair of second differential signal path, being suitable for connecting should be to the second differential signal pins, and is connected to respectively this first differential wave path is had respectively to a tie point;
Two first resistance units, be separately positioned on this on the first differential wave path, wherein respectively this first resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this first differential wave path and corresponding respectively between the mid point between this tie point; And
Two second resistance units, be separately positioned on this on the second differential wave path, wherein respectively this second resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this second differential wave path and corresponding respectively between the mid point between this tie point.
2. wiring board as claimed in claim 1, is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, this signal transmission structure comprises:
Should, to the first differential wave path, also comprise:
Two first connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the first differential signal pins; And
Two first cablings, be disposed at adjacent to each other this upper surface and be suitable for connecting this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And
Should, to the second differential wave path, also comprise:
Two second connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the second differential signal pins; And
Two second cablings, be configured in adjacent to each other this upper surface and this lower surface, and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.
3. wiring board as claimed in claim 1, it is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.
4. wiring board as claimed in claim 1, is characterized in that, the resistance value of those first resistance units and those the second resistance units is between 30 ohm to 180 ohm.
5. an electronic building brick, is characterized in that, this electronic building brick comprises:
The transmission chip;
Electric connector, have pair of first differential signal pins and pair of second differential signal pins; And
Wiring board comprises:
Circuit is folded structure, comprising:
Signal transmission structure comprises:
The pair of first differential signal path, connecting should be to the first differential signal pins and this transmission chip; And
The pair of second differential signal path, connecting should be to the second differential signal pins, and is connected to respectively this first differential wave path is had respectively to a tie point;
Two first resistance units, be separately positioned on this on the first differential wave path, wherein respectively this first resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this first differential wave path and corresponding respectively between the mid point between this tie point; And
Two second resistance units, be separately positioned on this on the second differential wave path, wherein respectively this second resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this second differential wave path and corresponding respectively between the mid point between this tie point.
6. electronic building brick as claimed in claim 5, is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, this signal transmission structure comprises:
Should, to the first differential wave path, also comprise:
Two first connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the first differential signal pins; And
Two first cablings, be disposed at adjacent to each other this upper surface and connect this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And
Should, to the second differential wave path, also comprise:
Two second connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the second differential signal pins; And
Two second cablings, be configured in adjacent to each other this upper surface and this lower surface and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.
7. electronic building brick as claimed in claim 5, it is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.
8. electronic building brick as claimed in claim 5, is characterized in that, the resistance value of those first resistance units and those the second resistance units is between 30 ohm to 180 ohm.
9. a wiring board, be suitable for connecting an electric connector and a transmission chip, it is characterized in that, this wiring board comprises:
Circuit is folded structure, comprising:
First signal transmission structure and secondary signal transmission structure, this first signal transmission structure is suitable for connecting pair of first differential signal pins and the pair of second differential signal pins of this transmission chip and this electric connector, and this secondary signal transmission structure is suitable for connecting another pair of first differential signal pins and the another pair of second differential signal pins of this transmission chip and this electric connector, respectively this signal transmission structure comprises:
The pair of first differential signal path, be suitable for connecting corresponding being somebody's turn to do the first differential signal pins and this transmission chip; And
The pair of second differential signal path, be suitable for connecting corresponding should be to the second differential signal pins, and be connected to respectively this first differential wave path had respectively to a tie point;
Two pairs of the first resistance units, be separately positioned on those the first differential wave paths, wherein respectively this first resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this first differential wave path and corresponding respectively between the mid point between this tie point; And
Two pairs of the second resistance units, be separately positioned on those the second differential wave paths, wherein respectively this second resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this second differential wave path and corresponding respectively between the mid point between this tie point.
10. wiring board as claimed in claim 9, is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, respectively this signal transmission structure comprises:
Should, to the first differential wave path, also comprise:
Two first connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the first differential signal pins; And
Two first cablings, be disposed at adjacent to each other this upper surface and be suitable for connecting this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And
Should, to the second differential wave path, also comprise:
Two second connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the second differential signal pins; And
Two second cablings, be configured in adjacent to each other this upper surface and this lower surface and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.
11. wiring board as claimed in claim 9, it is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.
12. wiring board as claimed in claim 9, is characterized in that, the resistance value of those first resistance units and those the second resistance units is between 30 ohm to 180 ohm.
13. wiring board as claimed in claim 9, is characterized in that, this first signal transmission structure is suitable for connecting a pair of transmission differential signal pins T in two groups of USB 3.0 frameworks
x +and T
x -with the transmission differential signal, and this secondary signal transmission structure is suitable for connecting a pair of reception (Receiving) the differential signal pins R in two groups of USB3.0 frameworks
x +and R
x -with the transmission differential signal.
14. wiring board as claimed in claim 9, it is characterized in that, the folded structure of this circuit also comprises the 3rd signal transmission structure, be suitable for this transmission chip and the not only pair of first differential signal pins that is connected this electric connector and but also pair of second differential signal pins, the 3rd signal transmission structure comprises:
The pair of first differential signal path, being suitable for connecting should be to the first differential signal pins and this transmission chip, and two first resistance units are separately positioned on those the first differential wave paths, wherein respectively this first resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this first differential wave path and corresponding respectively between the mid point between this tie point; And
The pair of second differential signal path, being suitable for connecting should be to the second differential signal pins, and be connected to respectively this first differential wave path is had respectively to a tie point, and two second resistance units are separately positioned on those the second differential wave paths, wherein respectively this second resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this second differential wave path and corresponding respectively between the mid point between this tie point.
15. wiring board as claimed in claim 14, is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, the 3rd signal transmission structure comprises:
Should, to the first differential wave path, also comprise:
Two first connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the first differential signal pins; And
Two first cablings, be disposed at adjacent to each other this upper surface and be suitable for connecting this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And
Should, to the second differential wave path, also comprise:
Two second connection pads, being disposed at adjacent to each other a side of this upper surface and being suitable for connection should be to the second differential signal pins; And
Two second cablings, be configured in adjacent to each other this upper surface and this lower surface and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.
16. wiring board as claimed in claim 14, is characterized in that, the 3rd signal transmission structure is suitable for connecting two groups of a pair of transmission/reception differential signal pins D that support USB1.0 framework or USB2.0 framework
+and D
-with the transmission differential signal.
17. an electronic building brick, is characterized in that, this electronic building brick comprises:
The transmission chip;
Electric connector, have two pairs of the first differential signal pins and two pairs of the second differential signal pins; And
Wiring board comprises:
Circuit is folded structure, comprising:
First signal transmission structure and secondary signal transmission structure, this first signal transmission structure connects pair of first differential signal pins and the pair of second differential signal pins of this transmission chip and this electric connector, and this secondary signal transmission structure connects another pair of first differential signal pins and the another pair of second differential signal pins of this transmission chip and this electric connector, respectively this signal transmission structure comprises:
The pair of first differential signal path, connect corresponding being somebody's turn to do the first differential signal pins and this transmission chip; And
The pair of second differential signal path, connect corresponding should be to the second differential signal pins, and be connected to respectively this first differential wave path had respectively to a tie point;
Two pairs of the first resistance units, be separately positioned on those the first differential wave paths, wherein respectively this first resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this first differential wave path and corresponding respectively between the mid point between this tie point; And
Two pairs of the second resistance units, be separately positioned on those the second differential wave paths, wherein respectively this second resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this second differential wave path and corresponding respectively between the mid point between this tie point.
18. electronic building brick as claimed in claim 17, is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, respectively this signal transmission structure comprises:
Should, to the first differential wave path, also comprise:
Two first connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the first differential signal pins; And
Two first cablings, be disposed at adjacent to each other this upper surface and connect this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And
Should, to the second differential wave path, also comprise:
Two second connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the second differential signal pins; And
Two second cablings, be configured in adjacent to each other this upper surface and this lower surface and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.
19. electronic building brick as claimed in claim 17, it is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, those first resistance units are overlapped in those second resistance units in the orthographic projection of this lower surface accordingly in the orthographic projection of this upper surface.
20. electronic building brick as claimed in claim 17, is characterized in that, the resistance value of those first resistance units and those the second resistance units is between 30 ohm to 180 ohm.
21. electronic building brick as claimed in claim 17, is characterized in that, what connect this first signal transmission structure should and should be respectively a pair of transmission differential signal pins T in the USB3.0 framework to the second differential signal pins to the first differential signal pins
x +and T
x -, and connect should and being somebody's turn to do the first differential signal pins of this secondary signal transmission structure, to the second differential signal pins, be respectively a pair of reception differential signal pins R in the USB3.0 framework
x +and R
x -.
22. electronic building brick as claimed in claim 17, it is characterized in that, the folded structure of this circuit also comprises one the 3rd signal transmission structure, connect this transmission chip and this electric connector not only pair of first differential signal pins and but also pair of second differential signal pins, the 3rd signal transmission structure comprises:
The pair of first differential signal path, connecting should be to the first differential signal pins and this transmission chip, and two first resistance units are separately positioned on those the first differential wave paths, wherein respectively this first resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this first differential wave path and corresponding respectively between the mid point between this tie point; And
The pair of second differential signal path, connecting should be to the second differential signal pins, and be connected to respectively this first differential wave path is had respectively to a tie point, and two second resistance units are separately positioned on those the second differential wave paths, wherein respectively this second resistance unit between the starting point in respectively this tie point of correspondence and corresponding respectively this second differential wave path and corresponding respectively between the mid point between this tie point.
23. electronic building brick as claimed in claim 22, is characterized in that, the folded structure of this circuit has a upper surface and, with respect to a lower surface of this upper surface, the 3rd signal transmission structure comprises:
Should, to the first differential wave path, also comprise:
Two first connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the first differential signal pins; And
Two first cablings, be disposed at adjacent to each other this upper surface and connect this transmission chip from those first connection pads through running through this circuit to fold two first conductive through holes of structure respectively, and those first resistance units are positioned at this upper surface be arranged at respectively those the first cablings, and respectively this first resistance unit between respectively this first conductive through hole of correspondence and corresponding respectively this first connection pad and corresponding respectively between the mid point between this first conductive through hole; And
Should, to the second differential wave path, also comprise:
Two second connection pads, being disposed at adjacent to each other a side of this upper surface and connecting should be to the second differential signal pins; And
Two second cablings, be configured in adjacent to each other this upper surface and this lower surface and extend to this lower surface by this upper surface through two second conductive through holes that run through the folded structure of this circuit from those second connection pads respectively, and be connected to those the first cablings by this lower surface through those first conductive through holes respectively, and those tie points are positioned at those the first conductive through holes, wherein those second resistance units are positioned at this lower surface and are arranged at respectively those the second cablings, and respectively this second resistance unit is between respectively this first conductive through hole of correspondence and corresponding respectively this second connection pad and corresponding respectively between the mid point between this first conductive through hole.
24. electronic building brick as claimed in claim 22, it is characterized in that, what connect the 3rd signal transmission structure should be to support a pair of transmission/reception differential signal pins D of USB1.0 framework or USB2.0 framework with being somebody's turn to do the second differential signal pins to the first differential signal pins
+and D
-.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261692397P | 2012-08-23 | 2012-08-23 | |
US61/692,397 | 2012-08-23 | ||
TW101221650 | 2012-11-08 | ||
TW101221650U TWM451693U (en) | 2012-08-23 | 2012-11-08 | Circuit board and electric assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203352943U true CN203352943U (en) | 2013-12-18 |
Family
ID=48801986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201320265608 Expired - Lifetime CN203352943U (en) | 2012-08-23 | 2013-05-16 | Circuit board and electronic assembly |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN203352943U (en) |
TW (1) | TWM451693U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104134918A (en) * | 2014-07-29 | 2014-11-05 | 浪潮电子信息产业股份有限公司 | Method for changing characteristic impedance of signal transmission link |
CN107359439A (en) * | 2017-06-08 | 2017-11-17 | 上海天马微电子有限公司 | Circuit board connector and electronic device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI553977B (en) * | 2015-09-02 | 2016-10-11 | 威盛電子股份有限公司 | Paddle card and plug-cable assembly |
-
2012
- 2012-11-08 TW TW101221650U patent/TWM451693U/en not_active IP Right Cessation
-
2013
- 2013-05-16 CN CN 201320265608 patent/CN203352943U/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104134918A (en) * | 2014-07-29 | 2014-11-05 | 浪潮电子信息产业股份有限公司 | Method for changing characteristic impedance of signal transmission link |
CN107359439A (en) * | 2017-06-08 | 2017-11-17 | 上海天马微电子有限公司 | Circuit board connector and electronic device |
CN107359439B (en) * | 2017-06-08 | 2019-07-26 | 上海天马微电子有限公司 | Circuit board connector and electronic device |
Also Published As
Publication number | Publication date |
---|---|
TWM451693U (en) | 2013-04-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201207652Y (en) | Network interface circuit and electric connector having the circuit | |
CN203026652U (en) | Cable connector assembly | |
CN203352943U (en) | Circuit board and electronic assembly | |
CN107482331A (en) | The high-speed electrical connectors that Surface Mount is installed between a kind of parallel pcb board | |
CN106911023A (en) | The electric connector of high transfer rate between a kind of parallel-plate | |
CN204333327U (en) | Electronic card coupler and Kato thereof | |
CN102969624A (en) | Connector and electronic device | |
CN101494335B (en) | Electric connector assembly with antenna function | |
TWM588381U (en) | Electrical connector | |
CN101383464B (en) | Electric connector component | |
CN204720596U (en) | Connector construction | |
CN104485532A (en) | Electronic card connector and card tray thereof | |
TW201414116A (en) | Pin structure of RJ connector, RJ connector module and RJ connector system using the same | |
CN202977782U (en) | Switching card | |
CN204793516U (en) | Cable structure | |
CN102044812A (en) | Radio frequency connector, base station and method for transmitting radio frequency signal | |
CN204929408U (en) | Circuit board reaches wireless transceiver including this circuit board | |
CN101494343B (en) | Electric connector assembly with antenna function | |
CN205029138U (en) | Miniature high speed connector subassembly | |
CN201226401Y (en) | Communication filtering socket | |
CN102625965B (en) | PCB board connector and PCB board connecting structure | |
CN201629473U (en) | Electric connector | |
CN104882702B (en) | The structure-improved of 2 in 1 connector | |
CN201365033Y (en) | eSATA connector with low thickness | |
CN2938461Y (en) | Signal interconnection device and signal interconnection system of printed circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191121 Address after: Chinese Taiwan New Taipei City Patentee after: Weifeng Electronics Co.,Ltd. Address before: Chinese Taiwan New Taipei City Patentee before: VIA TECHNOLOGIES, Inc. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20131218 |