CN203343811U - Cooling device of high-speed spindle - Google Patents
Cooling device of high-speed spindle Download PDFInfo
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- CN203343811U CN203343811U CN 201320444029 CN201320444029U CN203343811U CN 203343811 U CN203343811 U CN 203343811U CN 201320444029 CN201320444029 CN 201320444029 CN 201320444029 U CN201320444029 U CN 201320444029U CN 203343811 U CN203343811 U CN 203343811U
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- inner core
- semiconductor chilling
- chilling plate
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Abstract
The utility model provides a cooling device of a high-speed spindle, which belongs to the technical field of machinery and solves the problem that the cooling device of the existing spindle is not very ideal in cooling effect. The cooling device comprises an inner cylinder and an outer cylinder sleeved outside the inner cylinder, wherein a cooling passage for Freon to pass through is formed between the outer side wall of the inner cylinder and the inner side wall of the outer cylinder, and comprises an inlet and an outlet, a semiconductor chilling plate is arranged between the inner cylinder and the outer cylinder, the cold surface of the semiconductor chilling plate leans against the outer wall of the inner cylinder, and the hot surface of the semiconductor chilling plate is positioned in the cooling passage. The cooling device has the advantage of relatively ideal cooling effect, so that the high-speed spindle has a relatively long service life.
Description
Technical field
The utility model belongs to field of mechanical technique, relates to the cooling device of a kind of high-speed main spindle, particularly a kind of high-speed main spindle.
Background technology
High-speed main spindle typically refers to the motor that rotating speed surpasses 10000r/min.They have the following advantages: the one, and because rotating speed is high, so power of motor density is high, and the volume motor common much smaller than power can effectively be saved material.The 2nd, can be connected with prime mover, cancelled traditional reducing gear, transmission efficiency is high, and noise is little.The 3rd, because the high-speed main spindle rotary inertia is little, so dynamic response is fast.
Existing high-speed main spindle is mainly by the main shaft housing, adding cooling fluid, and constantly circulation, and heat is taken away, and carries out cooling.Its basic cooling route is: at first from main shaft cooling fluid temperature controller, flow out cooling fluid, through the water inlet near drive end bearing bracket, cooling fluid enters the periphery of front end bearing, to front end bearing, carries out cooling.Then flow to the stator of main shaft and rear end bearing and carry out coolingly, finally from delivery port, flow back to main shaft cooling fluid temperature controller and complete circulation.
Cooling device [the application number: 201120160016.0 of a kind of high-speed electric main shaft openly proposed as the Chinese patent literature data; Granted publication number: CN202106241U], comprise the sealed water jacket be nested with on the main shaft shell, spiral water channel and the cooling water recirculation system that is opened in the main shaft shell; Spiral water channel comprises the spiral water channel in left side that is positioned at main shaft shell left side, with the spiral water channel in right side that is positioned at main shaft shell right side, the spiral water channel in left side and the spiral water channel in right side are independent of one another, the water channel water inlet of the spiral water channel in left side is positioned at the left-hand end of main shaft shell, the water channel delivery port is positioned at the central sections of main shaft shell, the water channel water inlet of the spiral water channel in right side is positioned at the right-hand end of main shaft shell, the water channel delivery port is positioned at the central sections of main shaft shell, and the supply channel of cooling water recirculation system connects two water channel water inlets simultaneously; Cooling device also comprises semiconductor chilling plate and water-cooling pipe, the water-cooling pipe comprises cooling tube and heat accumulation section, one end of cooling tube is the cooling tube water inlet, the other end is the cooling tube delivery port, the cold junction of semiconductor chilling plate contacts with the central sections of main shaft shell, and hot junction contacts with the heat accumulation section of water-cooling pipe; Two water channel delivery ports connect the cooling tube water inlet simultaneously, and the cooling tube delivery port connects the water return pipeline of cooling water recirculation system.But because this cooling device adopts cooling water recirculation system, carry out the main shaft shell is carried out cooling, therefore, cooling effect is not very desirable.
Summary of the invention
The purpose of this utility model is to have the problems referred to above for existing technology, has proposed the comparatively desirable life-span that makes high-speed main spindle of a kind of cooling effect cooling device of long fast main shaft.
The purpose of this utility model can realize by following technical proposal: the cooling device of high-speed main spindle, the urceolus that comprises inner core and be set in the inner core outside, form the cooling duct of flowing through for freon between the lateral wall of described inner core and the madial wall of described urceolus, described cooling duct comprises import and outlet, it is characterized in that, be provided with semiconductor chilling plate between described inner core and described urceolus, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate reclines mutually with the outer wall of described inner core, and the hot side of described semiconductor chilling plate is positioned at described cooling duct.
This high-speed electric expreess locomotive in use, high-speed main spindle rotates the heat produced and is delivered on the inwall of inner core, the liquid freon cooling duct of flowing through, take away the heat on inner tank theca, make in inner core to remain on lower temperature, owing to reclining mutually with the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate on the outer wall of inner core, therefore again the outer wall of inner core is carried out to absorbing and cooling temperature by semiconductor chilling plate, liquid freon drives the heat of the hot side of semiconductor chilling plate simultaneously, make the refrigeration work of semiconductor chilling plate more smooth and easy, make the temperature of huyashi-chuuka (cold chinese-style noodles) lower, dual-cooled cooling by liquid freon and semiconductor chilling plate, make the temperature of the lubricating oil in the inner core of high-speed main spindle lower, avoided the drying of lubricating oil, prevent the suitable bad of parts such as coil in the inner core of this high-speed electric expreess locomotive simultaneously, improve the service life of this high-speed main spindle.
In the cooling device of above-mentioned high-speed main spindle, the lateral surface of described inner core is provided with groove, and the degree of depth of described groove is greater than the thickness of described semiconductor chilling plate, described semiconductor chilling plate and described groove are complementary and described semiconductor chilling plate is embedded in described groove.By semiconductor chilling plate is embedded in the groove of inner core lateral surface, realize the location mutually of semiconductor chilling plate and inner core, have advantages of that location is comparatively convenient and reliable.
In the cooling device of above-mentioned high-speed main spindle, described cooling duct is evenly distributed on the outer wall of described inner core.Cooling duct is distributed on the outer wall of inner core, makes cooling duct and inner core have larger contact area, makes liquid freon can carry out preferably cooling heat dissipation to inner core.
In the cooling device of above-mentioned high-speed main spindle, the cambered surface of the radian of the curved and described semiconductor chilling plate of described semiconductor chilling plate and the lateral wall of described inner core is complementary.The cambered surface of the lateral wall of the curved and inner core of semiconductor chilling plate is complementary, and the lateral wall of semiconductor chilling plate and inner core can be fitted closely, has advantages of and can dispel the heat preferably.
In the cooling device of above-mentioned high-speed main spindle, between described semiconductor chilling plate and described inner core, by securing member, be connected mutually.Securing member adopts screw, has connection for convenience and connects comparatively firmly advantage.As another kind of mode, semiconductor chilling plate also can adopt the mode of glue adhesion, with the lateral wall of inner core, is connected.
In the cooling device of above-mentioned high-speed main spindle, described urceolus adopts stainless steel material to make.Stainless steel has high strength, high-wearing feature and corrosion resistance, makes to adopt the urceolus that stainless steel is made to have advantages of longer service life.
In the cooling device of above-mentioned high-speed main spindle, this cooling device also comprises compressor, and described compressor comprises outlet side and inlet end, and described outlet side is connected with described import, and described inlet end is connected with described outlet.Pass through compressor, gas freon is compressed into to high-pressure liquid freon, by its outlet side, with import, be connected, liquid freon is transported to cooling duct, the cooling heat dissipation of realization to inner core, liquid freon is taken away on the hot side of semiconductor chilling plate simultaneously, after absorbing heat, liquid freon vaporizes, form the gaseous fluorine Leon, for compressor compresses, above-mentioned periodic duty, realization is cooling to high-speed main spindle, adopt freon as cooling agent, the maturation that possesses skills and cooling effect be advantage preferably.
In the cooling device of above-mentioned high-speed main spindle, also be provided with Pressure gauge on described compressor.Observe compressor by the pressure size after the refrigerating gas compression by Pressure gauge, there is use advantage comparatively easily.
In the cooling device of above-mentioned high-speed main spindle, also be provided with thermometer on described compressor.By the set temperature table, can observe compressor by the temperature after the refrigerating gas compression, there is use advantage comparatively easily.
Compared with prior art, the cooling device of this high-speed main spindle has the following advantages:
1, by the dual-cooled cooling of liquid freon and semiconductor chilling plate, make the temperature of the lubricating oil in the inner core of high-speed main spindle lower, avoid the drying of lubricating oil, prevented the suitable bad of parts such as coil in the inner core of this high-speed electric expreess locomotive, the service life of improving this high-speed main spindle simultaneously;
2, by liquid freon, the hot side to semiconductor chilling plate is dispelled the heat, and makes the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate better to inner core, advance the shape cooling heat dissipation, makes the cooling effect of semiconductor chilling plate better;
3, cooling duct is distributed on the outer wall of inner core in the shape of a spiral, makes cooling duct and inner core have larger contact area, makes liquid freon can carry out preferably cooling heat dissipation to inner core;
4, vaporize after absorbing heat by liquid freon, form the gaseous fluorine Leon, for the compressor compression, form liquid freon, realize the circulating cooling to high-speed main spindle, adopt freon as cooling agent, the maturation that possesses skills and cooling effect be advantage preferably.
The accompanying drawing explanation
Fig. 1 is embodiment mono-partial sectional view of the cooling device of this high-speed main spindle.
Fig. 2 is embodiment mono-cross-sectional schematic of the cooling device of this high-speed main spindle.
Fig. 3 is a plurality of use view with high-speed electric expreess locomotive of this cooling device.
Fig. 4 is the perspective view of semiconductor chilling plate of embodiment bis-of the cooling device of this high-speed main spindle.
In figure, 1, inner core; 1a, groove; 2, urceolus; 3, cooling duct; 3a, import; 3b, outlet; 4, semiconductor chilling plate; 4a, huyashi-chuuka (cold chinese-style noodles); 4b, hot side; 5, compressor; 6, Pressure gauge; 7, thermometer.
The specific embodiment
Be below specific embodiment of the utility model by reference to the accompanying drawings, the technical solution of the utility model is further described, but the utility model be not limited to these embodiment.
As shown in Fig. 1 to 2, the cooling device of high-speed main spindle, comprise inner core 1 and be set in its urceolus 2 that adopts stainless steel material to make of inner core 1 outside.Stainless steel has high strength, high-wearing feature and corrosion resistance, makes to adopt the urceolus 2 that stainless steel is made to have advantages of longer service life.
Have the cooling duct 3 of flowing through for freon between the madial wall of the lateral wall of inner core 1 and described urceolus 2, cooling duct 3 in the shape of a spiral and be evenly distributed on the outer wall of inner core 1.Cooling duct 3 comprises import 3a and outlet 3b.Cooling duct 3 is distributed on the outer wall of inner core 1 in the shape of a spiral, makes cooling duct 3 and inner core 1 have larger contact area, makes liquid freon can carry out preferably cooling heat dissipation to inner core 1.Cooling duct 3 can be arranged to two, and is symmetricly set on inner core 1 lateral wall.
Also be provided with semiconductor chilling plate 4 between inner core 1 and urceolus 2, the lateral surface of inner core 1 is provided with groove 1a, semiconductor chilling plate 4 is complementary with groove 1a and the degree of depth of groove 1a is greater than the thickness of semiconductor chilling plate 4, semiconductor chilling plate 4 is embedded in groove 1a, the huyashi-chuuka (cold chinese-style noodles) 4a of semiconductor chilling plate 4 reclines mutually with the lateral wall of inner core 1, and the hot side 4b of semiconductor chilling plate 4 is positioned at cooling duct 3.By semiconductor chilling plate 4 is embedded in the groove 1a of inner core 1 lateral surface, realize the location mutually of semiconductor chilling plate 4 and inner core 1, have advantages of that location is comparatively convenient and reliable.
As another kind of mode, between semiconductor chilling plate 4 and inner core 1, by securing member, be connected mutually.Securing member can adopt screw, has connection for convenience and connects comparatively firmly advantage.As another kind of mode, semiconductor chilling plate 4 also can adopt the mode of glue adhesion, with the lateral wall of inner core 1, is connected.
This cooling device also comprises compressor 5, and compressor 5 comprises outlet side and inlet end, and outlet side is connected with import 3a, and inlet end is connected with described outlet 3b.Compressor 5 is provided with Pressure gauge 6 and thermometer 7.Observe compressor 5 by the pressure size after the refrigerating gas compression by Pressure gauge 6, by set temperature table 7, can observe compressor 5 by the temperature after the refrigerating gas compression, there is use advantage comparatively easily.
This high-speed electric expreess locomotive in use, by compressor 5, gas freon is compressed into to high-pressure liquid freon, by its outlet side and import 3a, liquid freon is transported to cooling duct 3, the cooling heat dissipation of realization to inner core 1, liquid freon is taken away on the hot side 4b of semiconductor chilling plate 4 simultaneously, make the refrigeration work of semiconductor chilling plate 4 more smooth and easy, make the temperature of huyashi-chuuka (cold chinese-style noodles) 4a lower, after absorbing heat, liquid freon vaporizes, form the gaseous fluorine Leon, for compressor 5 compressions, above-mentioned periodic duty, realization is cooling to high-speed main spindle, adopt freon as cooling agent, the maturation that possesses skills and cooling effect be advantage preferably.Dual-cooled cooling by liquid freon and semiconductor chilling plate 4, make the temperature of the lubricating oil in the inner core 1 of high-speed main spindle lower, avoid the drying of lubricating oil, prevented the suitable bad of parts such as coil in the inner core 1 of this high-speed electric expreess locomotive, the service life of improving this high-speed main spindle simultaneously.
As shown in Figure 3, a plurality of import 3a with high-speed electric expreess locomotive of this cooling device are in series successively with outlet 3b, the import 3a of first cooling duct 3 is connected with the outlet side of compressor 5, the outlet 3b of the cooling duct 3 of last is connected with the inlet end of compressor 5, while using a compressor 5 to reach, a plurality of cooling devices carry out work, there is advantage simple in structure, easily manufactured.
Embodiment bis-
The present embodiment is basic identical with structure and the principle of embodiment mono-, and different place is: as shown in Figure 4, the cambered surface of the radian of the curved and semiconductor chilling plate 4 of semiconductor chilling plate 4 and the lateral wall of inner core 1 is complementary.The cambered surface of the lateral wall of the curved and inner core 1 of semiconductor chilling plate 4 is complementary, and semiconductor chilling plate 4 and the lateral wall of inner core 1 can be fitted closely, has advantages of and can dispel the heat preferably.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various modifications or supplements or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present utility model or surmount the defined scope of appended claims.
Although this paper has more been used the terms such as inner core 1, groove 1a, urceolus 2, cooling duct 3, import 3a, outlet 3b, semiconductor chilling plate 4, huyashi-chuuka (cold chinese-style noodles) 4a, hot side 4b, compressor 5, Pressure gauge 6, thermometer 7, do not get rid of the possibility of using other term.Using these terms is only in order to describe more easily and explain essence of the present utility model; They are construed to any additional restriction is all contrary with the utility model spirit.
Claims (9)
1. the cooling device of high-speed main spindle, the urceolus (2) that comprises inner core (1) and be set in described inner core (1) outside, it is characterized in that, form the cooling duct (3) of flowing through for freon between the madial wall of the lateral wall of described inner core (1) and described urceolus (2), described cooling duct (3) comprises import (3a) and outlet (3b), be provided with semiconductor chilling plate (4) between described inner core (1) and described urceolus (2), the huyashi-chuuka (cold chinese-style noodles) (4a) of described semiconductor chilling plate (4) reclines mutually with the lateral wall of described inner core (1), the hot side (4b) of described semiconductor chilling plate (4) is positioned at described cooling duct (3).
2. the cooling device of high-speed main spindle according to claim 1, it is characterized in that, the lateral surface of described inner core (1) is provided with groove (1a), and the degree of depth of described groove (1a) is greater than the thickness of described semiconductor chilling plate (4), described semiconductor chilling plate (4) is complementary with described groove (1a) and described semiconductor chilling plate (4) is embedded in described groove (1a).
3. the cooling device of high-speed main spindle according to claim 1, is characterized in that, described cooling duct (3) are evenly distributed on the outer wall of described inner core (1).
4. the cooling device of high-speed main spindle according to claim 1, is characterized in that, the cambered surface of the radian of the curved and described semiconductor chilling plate (4) of described semiconductor chilling plate (4) and the lateral wall of described inner core (1) is complementary.
5. according to the cooling device of claim 1 or 2 or 3 or 4 described high-speed main spindles, it is characterized in that, be connected mutually by securing member between described semiconductor chilling plate (4) and described inner core (1).
6. according to the cooling device of claim 1 or 2 or 3 or 4 described high-speed main spindles, it is characterized in that, described urceolus (2) adopts stainless steel material to make.
7. according to the cooling device of claim 1 or 2 or 3 or 4 described high-speed main spindles, it is characterized in that, this cooling device also comprises compressor (5), described compressor (5) comprises outlet side and inlet end, described outlet side is connected with described import (3a), and described inlet end is connected with described outlet (3b).
8. the cooling device of high-speed main spindle according to claim 7, is characterized in that, described compressor (5) is provided with Pressure gauge (6).
9. the cooling device of high-speed main spindle according to claim 7, is characterized in that, described compressor (5) is provided with thermometer (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320444029 CN203343811U (en) | 2013-07-23 | 2013-07-23 | Cooling device of high-speed spindle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320444029 CN203343811U (en) | 2013-07-23 | 2013-07-23 | Cooling device of high-speed spindle |
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| Publication Number | Publication Date |
|---|---|
| CN203343811U true CN203343811U (en) | 2013-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320444029 Expired - Fee Related CN203343811U (en) | 2013-07-23 | 2013-07-23 | Cooling device of high-speed spindle |
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| CN (1) | CN203343811U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103341785A (en) * | 2013-07-23 | 2013-10-09 | 高泉正 | High-speed main shaft cooling device |
| CN110270880A (en) * | 2019-07-09 | 2019-09-24 | 浙江合丰数控机床有限公司 | Main shaft cooling device for numerically controlled lathe |
-
2013
- 2013-07-23 CN CN 201320444029 patent/CN203343811U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103341785A (en) * | 2013-07-23 | 2013-10-09 | 高泉正 | High-speed main shaft cooling device |
| CN103341785B (en) * | 2013-07-23 | 2015-11-25 | 高泉正 | The cooling device of high-speed main spindle |
| CN110270880A (en) * | 2019-07-09 | 2019-09-24 | 浙江合丰数控机床有限公司 | Main shaft cooling device for numerically controlled lathe |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131218 Termination date: 20200723 |
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| CF01 | Termination of patent right due to non-payment of annual fee |