CN203340403U - A circuit board - Google Patents
A circuit board Download PDFInfo
- Publication number
- CN203340403U CN203340403U CN2013203412574U CN201320341257U CN203340403U CN 203340403 U CN203340403 U CN 203340403U CN 2013203412574 U CN2013203412574 U CN 2013203412574U CN 201320341257 U CN201320341257 U CN 201320341257U CN 203340403 U CN203340403 U CN 203340403U
- Authority
- CN
- China
- Prior art keywords
- heat conductive
- insulating layer
- conductive insulating
- layer
- circuit layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a circuit board comprising a bottom substrate (1), a heat conductive insulating layer (2), and a circuit layer (3). The top surface of the bottom substrate (1) is covered with the heat conductive insulating layer (2). The top surface of the heat conductive insulating layer (2) is covered with the circuit layer. The circuit board is characterized in that the mutually-contacted part of the circuit layer (3) and the heat conductive insulating layer (2) is embedded in the heat conductive insulating layer (2), that the bottom substrate (1) and the heat conductive insulating layer (2) are connected by soldering, and that the heat conductive insulating layer (2) and the circuit layer (3) are connected by soldering. The circuit board has characteristics of simple structure, a reliable function, and low cost.
Description
Technical field
The utility model relates to the wiring board field, relates in particular to a kind of wiring board.
Background technology
Continuous development along with information technology, electronic product has become the indispensable part of people's daily life, people to the individual requirement of electronic product also in continuous increase, electronic product generally all can use wiring board, but the heat dissipation problem of wiring board is a more scabrous problem always.Because original wiring board does not possess the heat conduction separator, therefore in use the easy excess Temperature due to wiring board causes damage of product, and life of product is reduced, and increases user's trouble and cost.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of simple in structure, reliable in function and lower-cost wiring board.
For solving the problems of the technologies described above, the utility model provides a kind of wiring board, comprise bottom substrate, heat conductive insulating layer and circuit layer, the bottom substrate upper surface is coated with the heat conductive insulating layer, heat conductive insulating layer upper surface is coated with circuit layer, what described circuit layer and heat conductive insulating layer were in contact with one another is partially submerged in the heat conductive insulating layer, and described bottom substrate and heat conductive insulating layer are by being welded to connect, and described heat conductive insulating layer and circuit layer are by being welded to connect.
Further, described bottom substrate, heat conductive insulating layer and circuit layer are made one by welding.
Further, described heat conductive insulating layer thickness is 0.2-0.5cm.
Further, described circuit layer is made by Copper Foil.
More progressive, described circuit layer thickness is 0.1-0.3cm.
Compared with prior art, the beneficial effects of the utility model are:
The utility model is simple in structure, reliable in function and cost lower.
The accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Number in the figure:
1-bottom substrate, 2-heat conductive insulating layer, 3-circuit layer.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further details
Shown in Figure 1, a kind of wiring board, comprise bottom substrate 1, heat conductive insulating layer 2 and circuit layer 3, bottom substrate 1 upper surface is coated with heat conductive insulating layer 2, heat conductive insulating layer upper surface is coated with circuit layer 3, described circuit layer 3 and being partially submerged in heat conductive insulating layer 2 that heat conductive insulating layer 2 is in contact with one another, described bottom substrate 1 is with heat conductive insulating layer 2 by being welded to connect, and described heat conductive insulating layer 2 and circuit layer 3 are by being welded to connect.
Described bottom substrate 1, heat conductive insulating layer 2 are made one with circuit layer 3 by welding.
Described heat conductive insulating layer 2 thickness are 0.2-0.5cm.
Described circuit layer 3 is made by Copper Foil.
Described circuit layer 3 thickness are 0.1-0.3cm.
To sum up, the utility model is simple in structure, reliable in function and cost lower.
The foregoing is only better embodiment of the present utility model; protection range of the present utility model is not limited with above-mentioned execution mode; in every case the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or is changed, and all should include in the protection range of putting down in writing in claims.
Claims (5)
1. a wiring board, comprise bottom substrate (1), heat conductive insulating layer (2) and circuit layer (3), bottom substrate (1) upper surface is coated with heat conductive insulating layer (2), heat conductive insulating layer upper surface is coated with circuit layer (3), it is characterized in that: described circuit layer (3) and being partially submerged in heat conductive insulating layer (2) that heat conductive insulating layer (2) is in contact with one another, described bottom substrate (1) is with heat conductive insulating layer (2) by being welded to connect, and described heat conductive insulating layer (2) and circuit layer (3) are by being welded to connect.
2. a kind of wiring board according to claim 1 is characterized in that: described bottom substrate (1), heat conductive insulating layer (2) are made one with circuit layer (3) by welding.
3. a kind of wiring board according to claim 1, it is characterized in that: described heat conductive insulating layer (2) thickness is 0.2-0.5cm.
4. a kind of wiring board according to claim 1, it is characterized in that: described circuit layer (3) is made by Copper Foil.
5. a kind of wiring board according to claim 1, it is characterized in that: described circuit layer (3) thickness is 0.1-0.3cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203412574U CN203340403U (en) | 2013-06-15 | 2013-06-15 | A circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203412574U CN203340403U (en) | 2013-06-15 | 2013-06-15 | A circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203340403U true CN203340403U (en) | 2013-12-11 |
Family
ID=49709053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203412574U Expired - Fee Related CN203340403U (en) | 2013-06-15 | 2013-06-15 | A circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203340403U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298244A (en) * | 2013-06-15 | 2013-09-11 | 鑫茂电子（昆山）有限公司 | Circuit board |
-
2013
- 2013-06-15 CN CN2013203412574U patent/CN203340403U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298244A (en) * | 2013-06-15 | 2013-09-11 | 鑫茂电子（昆山）有限公司 | Circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131211 Termination date: 20180615 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |