CN203340402U - Structure for strengthening surface contract strength of electronic circuit - Google Patents
Structure for strengthening surface contract strength of electronic circuit Download PDFInfo
- Publication number
- CN203340402U CN203340402U CN2013203020510U CN201320302051U CN203340402U CN 203340402 U CN203340402 U CN 203340402U CN 2013203020510 U CN2013203020510 U CN 2013203020510U CN 201320302051 U CN201320302051 U CN 201320302051U CN 203340402 U CN203340402 U CN 203340402U
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- Prior art keywords
- electronic circuit
- circuit body
- conductive
- reinforcement
- surface contact
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Abstract
The utility model discloses a structure for strengthening the surface contract strength of an electronic circuit. The structure is used in communication products. The structure comprises an electronic circuit body and strengthening materials evenly coating the electronic circuit body. The electronic circuit body is connected with a main board through the strengthening materials. The strengthening materials of the structure for strengthening the surface contract strength of the electronic circuit can be metal sheets, conductive double sticky tape and conductive glue respectively. The strengthening materials can also be in the mode of combining the metal sheets and the conductive double sticky tape, conductive glue or combining the metal sheets and the conductive glue. The metal sheets are fixedly connected with the electronic circuit body through the conductive double sticky tape or the conductive glue. Therefore, the electronic circuit body is not damaged when connected with other parts. Meanwhile, the contact stability of the structure is greatly improved.
Description
Technical field
The utility model relates to the communications field, relates in particular to a kind of structure of strengthening electronic circuit Surface Contact intensity.
Background technology
Along with developing rapidly of the communication technology, renewal for antenna part is very rapid, from external to built-in, wherein, metal elastic chip antenna, FPC/PCB antenna, printed antenna and LDS(Laser Direct structuring, laser direct forming) preparation of antenna is more and more.The particularly fast development of radio communication in recent years, mobile terminal occupies very large leading position.Especially mobile terminal to miniaturization, intelligent fast-developing, and has become of crucial importance as the communication antenna of mobile terminal progressively.
In current mobile terminal product, circuit (the PPA particularly made at printing bat printing electrically conductive ink, Pad Print Antenna) in making, the material of the electronic circuit used is generally Nano Silver and makes, because this material is softer, the electronic circuit of its making is easily damaged when the contact point with on Mobile terminal main board contacts, thereby cause the contact between electronic circuit and mainboard to be lost efficacy.
Yet, in the conventional products of prior art, the problem lost efficacy for solving this contact of circuit (PPA) that the bat printing electrically conductive ink makes, generally in this kind of way of contact, to adopt soft conductive material to connect, such as with conducting foam, both being fixedly connected with, yet, the damage of electronic circuit when although this connected mode can avoid both to contact, but after the conducting foam connection, contact resistance is larger each other, and electrical property is unstable, be unfavorable for the transmitting of signal of communication.
Therefore, be necessary to propose a kind of structure of strengthening electronic circuit Surface Contact intensity, solve a series of impacts that produce because of the electronic circuit loose contact in prior art.
The utility model content
In order to overcome the defect of prior art, it is simple that the utility model aims to provide a kind of manufacture craft, and conductivity is well strengthened the structure of electronic circuit Surface Contact intensity.
To achieve these goals, the utility model provides a kind of structure of strengthening electronic circuit Surface Contact intensity, the structure of this reinforcement electronic circuit Surface Contact intensity comprises electronic circuit body and the reinforcement material of uniform fold on described electronic circuit body, by described reinforcement material, the structure of described reinforcement electronic circuit Surface Contact intensity is connected with other parts.
Preferably, between described electronic circuit body and described electric conducting material, be provided with the conduction attachment, make by this conduction attachment, described electronic circuit body and described reinforcement material to be connected as one.
Preferably, described electronic circuit body is the circuit (PPA) that Laser Direct Deposition (LDS) circuit, flexible circuit board or bat printing electrically conductive ink are made, and described reinforcement material is sheet metal, and described conduction attachment is conductive glue or conductive double-sided tape.
Preferably, described sheet metal is stainless steel substrates, copper sheet or other conductive metal sheets, making does not need other material between described electronic circuit body and described sheet metal, directly by electronic circuit body and sheet metal, connect, by solidifying of electronic circuit body, described sheet metal and described electronic circuit bulk junction are combined, and do not use conductive glue or conductive double-sided tape to connect.
Preferably, described electronic circuit body is the circuit (PPA) that Laser Direct Deposition (LDS) circuit, flexible circuit board or bat printing electrically conductive ink are made, described reinforcement material is conductive glue or conductive double-sided tape, evenly be coated on described electronic circuit body by described conducting resinl, and form one with described electronic circuit body.
Preferably, described electronic circuit body is the circuit that the bat printing electrically conductive ink is made, described electric conducting material is sheet metal, the circuit that described sheet metal and described bat printing electrically conductive ink are made that solidifies of the circuit body of directly making by described bat printing electrically conductive ink combines, and does not use conductive tape or conductive glue to connect the circuit that described sheet metal and described bat printing electrically conductive ink are made.
Compared with prior art, the beneficial effects of the utility model are as follows:
1, the utility model is by adopting electronic circuit body and reinforcement material to be integrated as the structure of the reinforcement electronic circuit Surface Contact intensity of one, electronic circuit is connected with miscellaneous part, not only can avoid the electronic circuit made because of Nano Silver with shell foot on mainboard or play when pin is connected easily damaging, and promote the stability of the structure of this reinforcement electronic circuit Surface Contact intensity.
2, the manufacture craft of the structure of reinforcement electronic circuit Surface Contact intensity of the present utility model is simple, has greatly reduced the unnecessary step in the fabrication processing, has reduced the conductive resistance of contact-making surface, has improved contact performance in use simultaneously.
The accompanying drawing explanation
Fig. 1 is the structural representation that the utility model the first is strengthened electronic circuit Surface Contact intensity;
Fig. 2 is the structural representation that the utility model the second is strengthened electronic circuit Surface Contact intensity;
The structural representation that Fig. 3 is the third reinforcement electronic circuit Surface Contact intensity of the utility model.
The symbol list:
The 1-sheet metal, 2-conductive glue or conductive double-sided tape, 3-electronic circuit body.
embodiment:
Referring to the accompanying drawing that the utility model embodiment is shown, hereinafter will describe in more detail the utility model.Yet the utility model can be with realizations such as multi-form, specifications, and should not be construed as the restriction of the embodiment be subject in this proposition.On the contrary, it is abundant and complete open in order to reach proposing these embodiment, and makes more relevant those skilled in the art person understand scope of the present utility model fully.In these accompanying drawings, for clearly visible, may zoom in or out relative size.
As shown in Figure 1, the first that the utility model provides is strengthened the structure of electronic circuit Surface Contact intensity, for a communication product, this structure comprises electronic circuit body 3, conductive glue or conductive double-sided tape 2 and sheet metal 1, wherein this electronic circuit body 3 is a kind of printed electronic circuit, comprises the circuit (PPA) that Laser Direct Deposition (LDS) circuit, flexible circuit board or bat printing electrically conductive ink are made; Conductive glue or conductive double-sided tape 2 are the reinforcement material that electric conductivity is good; This sheet metal 1 is toughness electric conducting material preferably, comprises stainless steel substrates, copper sheet or the good sheet metal of other conductivity; This electronic circuit body 3 makes to be connected and fixed the formation one with sheet metal 1 between the two by conductive glue or conductive double-sided tape 2, thereby electronic circuit body 3 is connected with bullet pin or shell foot on mainboard, avoids the damage of electronic circuit body 3.
Wherein, the concrete steps of manufacture method of structure that have the reinforcement electronic circuit Surface Contact intensity of 1 three layers of electronic circuit body 3, conductive glue or conductive double-sided tape 2 and sheet metals comprise:
1) provide an electronic circuit body 3;
2) surface at electronic circuit body 3 by sheet metal 1 uniform fold, and by conductive glue or conductive double-sided tape 2, the two contact-making surface of sheet metal 1 and electronic circuit body 3 is connected and fixed, thereby make electronic circuit body 3, conductive glue or conductive double-sided tape 2 and sheet metal 1 form one, form the structure of this reinforcement electronic circuit Surface Contact intensity.
Embodiment 2
As shown in Figure 2, the second provided for the utility model is strengthened the structure of electronic circuit Surface Contact intensity, this reinforcement structure comprises electronic circuit body 3 and conductive glue or conductive double-sided tape 2, wherein this electronic circuit body 3 is printed electronic circuit, comprise the circuit (PPA) that Laser Direct Deposition (LDS) circuit, flexible circuit board or bat printing electrically conductive ink are made, conductive glue or conductive double-sided tape 2 are the electric conducting material that electric conductivity is good; By by conductive glue or conductive double-sided tape 2 uniform folds on the surface of electronic circuit body 3, make both solidify to form one, thus by electronic circuit body 3 with shell foot on mainboard or play pin and be connected, and avoid the damage of electronic circuit body 3.
Wherein, the concrete steps of manufacture method that have a structure of the two-layer reinforcement electronic circuit Surface Contact intensity of electronic circuit body 3 and conductive glue or conductive double-sided tape 2 comprise:
1) provide an electronic circuit body 3;
2) conductive glue or conductive double-sided tape 2 evenly are coated in to the surface of electronic circuit body 3, by conductive glue or conductive double-sided tape 2 and electronic circuit body 3 curing moldings, connect as one, form the structure of this reinforcement electronic circuit Surface Contact intensity.
Embodiment 3
As shown in Figure 3, the utility model proposes the structure that the third strengthens electronic circuit Surface Contact intensity, for a communication product, this reinforcement structure comprises electronic circuit body 3 and sheet metal 1, wherein, this electronic circuit body 3 is printed electronic circuit, or the circuit (PPA) made of bat printing electrically conductive ink, sheet metal 1 is toughness electric conducting material preferably, is stainless steel substrates, copper sheet or the good sheet metal of other electric conductivities; Because the electronic circuit body 3 that Nano Silver is made is softer, and before its electronic circuit body 3 is uncured, by the sheet metal uniform fold on electronic circuit body 3, through overcuring, make both in conjunction with forming one, thereby realize that electronic circuit body 3 other components and parts connect, and avoid the damage of electronic circuit body 3.
Wherein, the concrete steps of manufacture method that have a structure of both reinforcement electronic circuit Surface Contact intensity of forming of electronic circuit body 3 and sheet metal 1 comprise:
1) provide an electronic circuit body 3;
2) by sheet metal 1 uniform fold on the electronic circuit body 3 of unfashioned printing, through overbaking, solidify, when electronic circuit body 3 is solidified with sheet metal 1 in conjunction with the formation one, form the structure of this reinforcement electronic circuit Surface Contact intensity.
While strengthening structure and the shell foot on mainboard of electronic circuit Surface Contact intensity and playing pin interconnecting by above three kinds, all can avoid the damage because of the electronic circuit of Nano Silver making, improving product quality and application reliability.
In addition, we it should further be appreciated that, the utility model is not as limit, the utility model relate to about the sheet metal that mutually combines with electronic circuit and conducting resinl not as limit, the present embodiment only is to provide a preferred materials, can also with other conductive metallic material or conducting resinl realize with the coating of printed electronic circuit be fixedly connected with, can realize and satisfactory electrical conductivity after shell foot on mainboard and bullet pin are connected, avoid occurring the problem of loose contact; And the Nano Silver that the making material of the electronic circuit the utility model proposes does not propose with this embodiment is limited, the circuit (PPA) that the bat printing conduction the utility model proposes is made is a preferred embodiment, can also make material by other printing, itself and conductive metal sheet and conductive glue or conductive double sided adhesive tape are mutually permanently connected, thereby avoid the damage of electronic circuit.
Obviously, those skilled in the art can carry out various changes and distortion and not break away from spirit and scope of the present utility model the utility model.Like this, if these modifications of the present utility model and distortion belong in the scope of the utility model claim and equivalent technologies thereof, the utility model also is intended to comprise these changes interior.
Claims (6)
1. a structure of strengthening electronic circuit Surface Contact intensity, is characterized in that, the structure of described reinforcement electronic circuit Surface Contact intensity comprises the electronic circuit body and covers the reinforcement material on described electronic circuit body.
2. the structure of reinforcement electronic circuit Surface Contact intensity according to claim 1, is characterized in that, between described electronic circuit body and described reinforcement material, is provided with the conduction attachment.
3. the structure of reinforcement electronic circuit Surface Contact intensity according to claim 2, it is characterized in that, described electronic circuit body is the circuit that Laser Direct Deposition circuit, flexible circuit board or bat printing electrically conductive ink are made, described reinforcement material is sheet metal, and described conduction attachment is conductive glue or conductive double-sided tape.
4. the structure of reinforcement electronic circuit Surface Contact intensity according to claim 3, is characterized in that, described sheet metal is stainless steel substrates, copper sheet or other conductive metal sheet.
5. the structure of reinforcement electronic circuit Surface Contact intensity according to claim 1, it is characterized in that, described electronic circuit body is the circuit that Laser Direct Deposition circuit, flexible circuit board or bat printing electrically conductive ink are made, described reinforcement material is conductive glue or conductive double-sided tape, described conductive glue or conductive double-sided tape evenly are coated on described electronic circuit body, and form one with described electronic circuit body.
6. the structure of reinforcement electronic circuit Surface Contact intensity according to claim 1, it is characterized in that, described electronic circuit body is the circuit that the bat printing electrically conductive ink is made, described electric conducting material is sheet metal, the circuit that described sheet metal and described bat printing electrically conductive ink are made that solidifies of the circuit body of directly making by described bat printing electrically conductive ink combines, and does not use conductive tape or conductive glue to connect the circuit that described sheet metal and described bat printing electrically conductive ink are made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203020510U CN203340402U (en) | 2013-05-29 | 2013-05-29 | Structure for strengthening surface contract strength of electronic circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203020510U CN203340402U (en) | 2013-05-29 | 2013-05-29 | Structure for strengthening surface contract strength of electronic circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203340402U true CN203340402U (en) | 2013-12-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203020510U Expired - Fee Related CN203340402U (en) | 2013-05-29 | 2013-05-29 | Structure for strengthening surface contract strength of electronic circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203340402U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103327731A (en) * | 2013-05-29 | 2013-09-25 | 上海安费诺永亿通讯电子有限公司 | Structure for strengthening surface contract strength of electronic circuit |
| CN106842775A (en) * | 2017-02-20 | 2017-06-13 | 维沃移动通信有限公司 | A kind of electronic equipment |
-
2013
- 2013-05-29 CN CN2013203020510U patent/CN203340402U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103327731A (en) * | 2013-05-29 | 2013-09-25 | 上海安费诺永亿通讯电子有限公司 | Structure for strengthening surface contract strength of electronic circuit |
| CN103327731B (en) * | 2013-05-29 | 2017-03-29 | 上海安费诺永亿通讯电子有限公司 | A kind of structure for strengthening electronic circuit surface contact strength |
| CN106842775A (en) * | 2017-02-20 | 2017-06-13 | 维沃移动通信有限公司 | A kind of electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131211 Termination date: 20170529 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |