CN203333790U - Circuit board gold plating hanging basket - Google Patents
Circuit board gold plating hanging basket Download PDFInfo
- Publication number
- CN203333790U CN203333790U CN2013204466586U CN201320446658U CN203333790U CN 203333790 U CN203333790 U CN 203333790U CN 2013204466586 U CN2013204466586 U CN 2013204466586U CN 201320446658 U CN201320446658 U CN 201320446658U CN 203333790 U CN203333790 U CN 203333790U
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- CN
- China
- Prior art keywords
- holes
- circuit board
- wiring
- gold plating
- sheer pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a circuit board gold plating hanging basket which comprises a hanging tool. A bolt is arranged on the hanging tool, a frame is arranged below the hanging tool, a plurality of upper transverse rods are transversely arranged on the top of the frame at even space, each upper transverse rod is provided with a plurality of through holes, lower transverse rods arranged in the longitudinal direction are arranged on positions, corresponding to the through holes, of the bottom of the frame, a plurality of through holes are formed in positions, corresponding to the upper transverse rods, of the lower transverse rods, and Teflon lines are inserted in the through holes in a penetrating mode. The circuit board gold plating hanging basket has the advantages of being simple in structure, easy to manufacture, and capable of effectively improving production efficiency, preventing gold salt waste, avoiding plate laminating and reducing waste.
Description
Technical field
The utility model relates to the PCB auxiliary means, specifically refers to that a kind of wiring boardization gold extension is blue.
Background technology
Electron trade, the PCB model is of a size of the master with short run, multiple jigsaw, changes gold thread and adopts at present the threading mode to carry out link plate, at four angles of wiring board, respectively select a hole to wear the Teflon line, between plate and plate, use the PP pearl to separate mode and carry out link plate, threading length consuming time, efficiency are low, and the wiring board of different sizes needs independent threading link plate, there is limitation, and the not reproducible use of Teflon line, waste is serious, adopts the threading mode simultaneously, plate easily swings in liquid medicine, easily causes the lamination problem.
The utility model content
The purpose of this utility model be to provide a kind of efficiency high, cut the waste and avoid the wiring boardization gold of lamination to hang blue.
To achieve these goals, the utility model is designed a kind of wiring boardization gold and is hung blue, comprise hanger, hanger is provided with bolt, and the hanger below is provided with framework, and described frame roof equidistantly is provided with some transversely arranged cross tubes, each cross tube is provided with some through holes, the base of frame position corresponding with through hole is provided with the sheer pole of longitudinally arranging, the sheer pole position corresponding with cross tube is provided with some through holes, is interspersed with the Teflon line in through hole.
Described Teflon line passes formation U-lag shape isolated column along the through hole of cross tube, sheer pole, adjacent sheer pole, adjacent cross tube successively, the pcb board of the compatible different size of isolated column energy, only pcb board need be inserted in U-lag shape isolated column and get final product, put the plate Simple fast.
Described framework is provided with encapsulate, prevents the golden salt of gold waste.
The utility model wiring boardization gold is hung blue beneficial effect: several U-lag shape isolated columns that adopt the Teflon line to form through the upper, lower horizontal bar, the pcb board of the compatible different size of isolated column energy, only pcb board need be inserted in U-lag shape isolated column and get final product, put the plate Simple fast, production efficiency is high and can avoid lamination, framework is provided with encapsulate, prevent the golden salt of gold waste, Teflon line smooth surface, cause impression can to the plate face, and can repeatedly reuse, cut the waste.
the accompanying drawing explanation:
Fig. 1 is that the utility model wiring boardization gold is hung blue schematic perspective view;
Fig. 2 is the schematic diagram of cross tube in Fig. 1.
Embodiment
For the ease of those skilled in the art's understanding, below in conjunction with specific embodiment and accompanying drawing, structural principle of the present utility model is described in further detail.
As Fig. 1, shown in Fig. 2, a kind of wiring boardization gold is hung blue, comprise hanger 4, hanger 4 is provided with bolt 3, hanger 4 belows are provided with framework 2, described framework 2 tops equidistantly are provided with some transversely arranged cross tubes 1, each cross tube 1 is provided with some through holes 8, the position corresponding with through hole 8, framework 2 bottoms is provided with the sheer pole 6 of longitudinally arranging, sheer pole 6 position corresponding with cross tube 1 is provided with some through holes 8, be interspersed with Teflon line 5 in through hole 8, described Teflon line 5 is successively along cross tube 1, sheer pole 6, adjacent sheer pole 6, through hole on adjacent cross tube 1 is through forming U-lag shape isolated column 7, plate is inserted one by one in isolated column 7 and gets final product, after plate is laid, to hang on being put into of indigo plant gold thread cross bar, tight a bolt 3, to hang on being fixed on of indigo plant gold thread cross bar, described framework 2 is provided with encapsulate, prevent the golden salt of gold waste.
The utility model wiring boardization gold is hung blue several U-lag shape isolated columns that adopt the Teflon line to form through the upper, lower horizontal bar, the pcb board of the compatible different size of isolated column energy, only pcb board need be inserted in U-lag shape isolated column and get final product, put the plate Simple fast, production efficiency is high and can avoid lamination, framework is provided with encapsulate, prevent the golden salt of gold waste, Teflon line smooth surface, cause impression can to the plate face, and can repeatedly reuse, cut the waste.
Foregoing, be only preferred embodiment of the present utility model, and not for limiting embodiment of the present utility model, those skilled in the art are according to design of the present utility model, and the appropriate adaptation of having done or modification, all should be within protection domain of the present utility model.
Claims (3)
1. a wiring boardization gold is hung blue, comprise hanger (4), hanger (4) is provided with bolt (3), hanger (4) below is provided with framework (2), it is characterized in that: described framework (2) top equidistantly is provided with some transversely arranged cross tubes (1), each cross tube (1) is provided with some through holes (8), the position corresponding with through hole (8), framework (2) bottom is provided with the sheer pole (6) of longitudinally arranging, sheer pole (6) position corresponding with cross tube (1) is provided with some through holes (8), is interspersed with Teflon line (5) in through hole (8).
2. wiring boardization gold according to claim 1 is hung blue, it is characterized in that: described Teflon line (5) passes and forms U-lag shape isolated column (7) along the through hole (8) on cross tube (1), sheer pole (6), adjacent sheer pole (6), adjacent cross tube (1) successively.
3. wiring boardization gold according to claim 2 is hung blue, and it is characterized in that: described framework (2) is provided with encapsulate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013204466586U CN203333790U (en) | 2013-07-25 | 2013-07-25 | Circuit board gold plating hanging basket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013204466586U CN203333790U (en) | 2013-07-25 | 2013-07-25 | Circuit board gold plating hanging basket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203333790U true CN203333790U (en) | 2013-12-11 |
Family
ID=49702476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013204466586U Expired - Fee Related CN203333790U (en) | 2013-07-25 | 2013-07-25 | Circuit board gold plating hanging basket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203333790U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517353A (en) * | 2015-11-30 | 2016-04-20 | 北大方正集团有限公司 | Hanging basket and manufacture method of circuit board |
| CN106245101A (en) * | 2016-09-09 | 2016-12-21 | 景旺电子科技(龙川)有限公司 | A kind of turmeric hanger |
| CN110740584A (en) * | 2019-10-12 | 2020-01-31 | 西安金百泽电路科技有限公司 | method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel |
-
2013
- 2013-07-25 CN CN2013204466586U patent/CN203333790U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517353A (en) * | 2015-11-30 | 2016-04-20 | 北大方正集团有限公司 | Hanging basket and manufacture method of circuit board |
| CN105517353B (en) * | 2015-11-30 | 2018-08-07 | 北大方正集团有限公司 | The production method of Hanging Basket and wiring board |
| CN106245101A (en) * | 2016-09-09 | 2016-12-21 | 景旺电子科技(龙川)有限公司 | A kind of turmeric hanger |
| CN110740584A (en) * | 2019-10-12 | 2020-01-31 | 西安金百泽电路科技有限公司 | method for preparing gold immersion of ultra-long and ultra-thin polyimide single panel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131211 Termination date: 20180725 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |