CN203331493U - High-heat-conductivity aluminum-based copper-clad plate - Google Patents
High-heat-conductivity aluminum-based copper-clad plate Download PDFInfo
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- CN203331493U CN203331493U CN2013203210252U CN201320321025U CN203331493U CN 203331493 U CN203331493 U CN 203331493U CN 2013203210252 U CN2013203210252 U CN 2013203210252U CN 201320321025 U CN201320321025 U CN 201320321025U CN 203331493 U CN203331493 U CN 203331493U
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- aluminum
- copper
- based copper
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Abstract
The utility model relates to a high-heat-conductivity aluminum-based copper-clad plate. The high-heat-conductivity aluminum-based copper-clad plate is characterized by comprising a copper foil (1) and an aluminum plate (4), wherein the copper foil (1) and the aluminum plate (4) are bonded together by a heat-conduction glue layer (2); oxidized layers (3) are arranged on the upper and lower surfaces of the aluminum plate (4); the heat-conduction glue layer (2) adopts boron nitride heat-conduction glue. According to the high-heat-conductivity aluminum-based copper-clad plate, the aluminum plate is subjected to oxidization treatment so that the heat resistance is improved; the boron nitride heat-conduction glue is used as a bonding layer so that the heat-conduction performance is high. The high-heat-conductivity aluminum-based copper-clad plate is light and thin, is good in heat radiation performance and is particularly suitable for an LED (Light Emitting Diode) light-emitting field.
Description
Technical field
The utility model relates to a kind of copper-clad plate, relates in particular to the aluminium base copper-clad plate of a kind of high-termal conductivity.
Background technology
Copper-clad plate, being again copper-clad laminate, is the extremely important basic material of printed circuit board, the printed circuit board of various multi-form, difference in functionalitys, be all on copper-clad laminate, processed selectively, the operation such as etching, boring and copper facing, make different printed circuits.Copper-clad laminate is as the baseplate material in the printed circuit board manufacture, printed circuit board is mainly played to interconnection, insulation and support, transmission speed, energy loss and characteristic impedance etc. to signal in circuit have a great impact, therefore, the processability in the performance of printed circuit board, quality, manufacture, manufacture level, manufacturing cost and long-term reliability and stability depend on copper-clad laminate to a great extent.
Develop rapidly along with electron trade, the volume size of electronic product is more and more less, power is increasing, solve the problem of heat radiation referred a new height, this is the huge challenge to the electronics industry design, especially LED illumination aspect, problem is particularly outstanding.Conventional thickness of copper-clad plate is thick, and thermal diffusivity is bad, can't adapt to the development trend of electronics industry.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, provides that a kind of thermal diffusivity is good, the aluminium base copper-clad plate of the high-termal conductivity of thin thickness.
The purpose of this utility model is achieved in that
The aluminium base copper-clad plate of a kind of high-termal conductivity, it comprises Copper Foil and aluminium sheet, and described Copper Foil and aluminium sheet are bonded together by the heat conduction glue-line, and described aluminium sheet upper and lower surface is provided with oxide layer, and described heat conduction glue-line adopts the boron nitride heat-conducting glue.
Characteristics of the present utility model are:
The aluminium base copper-clad plate of the utility model high-termal conductivity, the employing aluminium sheet is substrate, good heat dissipation effect is processed aluminium plate oxidation, and its heat resistance is improved, and adopts the boron nitride heat-conducting glue as tack coat, has high thermal conductivity.The utility model product is frivolous, and excellent radiation performance is particularly useful for the luminous field of LED.
The accompanying drawing explanation
The section structure schematic diagram that Fig. 1 is the aluminium base copper-clad plate of the utility model high-termal conductivity.
In figure:
The 1--Copper Foil;
2-heat conduction glue-line;
3-oxide layer;
4-aluminium sheet.
The specific embodiment
Referring to Fig. 1, the aluminium base copper-clad plate of the high-termal conductivity that the utility model relates to, it comprises Copper Foil 1 and aluminium sheet 4, described Copper Foil 1 and aluminium sheet 4 are bonded together by heat conduction glue-line 2, described aluminium sheet 4 upper and lower surfaces are provided with oxide layer 3, and described heat conduction glue-line 2 adopts the boron nitride heat-conducting glue.
During preparation, at first cutting aluminum plate is become to certain size, be immersed in aqueous slkali and remove surperficial greasy dirt and surface of aluminum plate is carried out to roughening treatment, then washed; With oxidation solution, oxidation processes is carried out in its surface again, make the upper and lower surface of aluminium sheet form oxide layer, then coupling agent is washed, coated to the aluminium sheet after oxidation and dry; Finally adopt the boron nitride heat-conducting glue that the aluminium sheet after Copper Foil and oxidation processes is combined with each other.
The boron nitride heat-conducting glue, the heat conductivility excellence, applicable high power device heat radiation, compare with common Heat Conduction Material under the same terms, can make device temperature low more than 20 ℃.
Claims (1)
1. the aluminium base copper-clad plate of high-termal conductivity, it is characterized in that: it comprises Copper Foil (1) and aluminium sheet (4), described Copper Foil (1) and aluminium sheet (4) are bonded together by heat conduction glue-line (2), described aluminium sheet (4) upper and lower surface is provided with oxide layer (3), and described heat conduction glue-line (2) adopts the boron nitride heat-conducting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203210252U CN203331493U (en) | 2013-06-05 | 2013-06-05 | High-heat-conductivity aluminum-based copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203210252U CN203331493U (en) | 2013-06-05 | 2013-06-05 | High-heat-conductivity aluminum-based copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203331493U true CN203331493U (en) | 2013-12-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203210252U Expired - Fee Related CN203331493U (en) | 2013-06-05 | 2013-06-05 | High-heat-conductivity aluminum-based copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203331493U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105172259A (en) * | 2015-08-11 | 2015-12-23 | 深圳长宝覆铜板科技有限公司 | Preparation method of high heat dissipation aluminum based copper clad laminate |
| CN112277406A (en) * | 2020-10-29 | 2021-01-29 | 河南省科学院应用物理研究所有限公司 | High-reliability aluminum-based copper-clad plate and preparation method thereof |
-
2013
- 2013-06-05 CN CN2013203210252U patent/CN203331493U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105172259A (en) * | 2015-08-11 | 2015-12-23 | 深圳长宝覆铜板科技有限公司 | Preparation method of high heat dissipation aluminum based copper clad laminate |
| CN112277406A (en) * | 2020-10-29 | 2021-01-29 | 河南省科学院应用物理研究所有限公司 | High-reliability aluminum-based copper-clad plate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131211 Termination date: 20160605 |