CN203325895U - Highly reliable rectification module - Google Patents
Highly reliable rectification module Download PDFInfo
- Publication number
- CN203325895U CN203325895U CN2013203612049U CN201320361204U CN203325895U CN 203325895 U CN203325895 U CN 203325895U CN 2013203612049 U CN2013203612049 U CN 2013203612049U CN 201320361204 U CN201320361204 U CN 201320361204U CN 203325895 U CN203325895 U CN 203325895U
- Authority
- CN
- China
- Prior art keywords
- copper
- extraction electrode
- highly reliable
- rectification module
- clad plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000605 extraction Methods 0.000 claims abstract description 35
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 239000000919 ceramic Substances 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/3701—Shape
- H01L2224/37011—Shape comprising apertures or cavities
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
Abstract
Provided is a highly reliable rectification module. The highly reliable rectification module comprises a ceramic copper-clad plate, extraction electrodes, copper connection plates, a connecting bridge and diode chips, wherein the ceramic copper-clad plate is disposed on a copper base plate, and the extraction electrodes, the copper connection plates, the connecting bridge and the diode chips are connected according to a rectification circuit and are disposed on the ceramic copper-clad plate. The highly reliable rectification module is characterized in that through holes are respectively arranged on extraction electrode bottom solder surfaces soldered with the top faces of the diode chips and the vertical side surfaces of the packaging portions at the lower portions of the extraction electrodes. The highly reliable rectification module improves the soldering quality of the extraction electrodes and the top faces of the diode chips and also the mechanical strength of the connection between the packaging portions at the lower portions of the extraction electrodes and epoxy resins, and has high reliability.
Description
Technical field
The utility model relates to a kind of semiconductor device, particularly a kind of highly reliable rectification module.
Background technology
In a kind of rectification module formed by extraction electrode, copper connecting plate, crossover, diode chip for backlight unit, ceramic copper-clad plate and copper soleplate of prior art, after the extraction electrode welding of its diode chip for backlight unit end face welding, also have the following problem that affects product reliability: 1. the solder side of its extraction electrode bottom there will be the bond pad locations shift phenomenon when welding, and is difficult to timely discovery; 2. during solder paste melts, its gas is difficult to distribute, and easily causes solder side to produce the welding cavitation.3. after its extraction electrode bottom packed part solidifies by epoxy encapsulation, the mechanical strength that epoxy resin and this extraction electrode join is desirable not enough, make this extraction electrode outer end be subject to External Force Acting when larger, easily diode chip for backlight unit and ceramic copper-clad plate are directly caused damage.
Summary of the invention
The product reliability problem that affects that the utility model exists for solving above-mentioned prior art rectification module, provide a kind of improved highly reliable rectification module, and product reliability is improved.
A kind of highly reliable rectification module described in the utility model, comprise the ceramic copper-clad plate of being located on copper soleplate, with be located at ceramic copper-clad plate on the extraction electrode, copper connecting plate, crossover and the diode chip for backlight unit that by rectification circuit, are connected, it is characterized in that: in the extraction electrode bottom solder side of described and the welding of diode chip for backlight unit end face and in the vertical side of extraction electrode bottom packed part, be respectively equipped with through hole.
Through hole in the solder side of described extraction electrode bottom and the vertical side of extraction electrode bottom packed part is circular hole.Circular hole processing is more convenient, and effect is better.
Useful technique effect of the present utility model is: it can improve the mechanical strength that the welding quality of extraction electrode and diode chip for backlight unit end face and extraction electrode bottom packed part and epoxy resin are joined, and product reliability is improved.
The accompanying drawing explanation
The structural representation that Fig. 1 is the utility model embodiment.
The electrical block diagram that Fig. 2 is the utility model embodiment.
Embodiment
Accompanying drawing marking explanation: extraction electrode 1, through hole (2,6), diode chip for backlight unit 3, ceramic copper-clad plate 4, copper soleplate 5, copper connecting plate 7, crossover 8.
As Figure 1-Figure 2, a kind of highly reliable rectification module, comprise the ceramic copper-clad plate 4 of being located on copper soleplate 5, with be located at ceramic copper-clad plate 4 on the extraction electrode 1, copper connecting plate 7, crossover 8 and the diode chip for backlight unit 3 that by rectification circuit, are connected, be respectively equipped with through hole (2,6) in the extraction electrode 1 bottom solder side of described and diode chip for backlight unit 3 end faces welding and in the vertical side of extraction electrode bottom packed part.
Be provided with two diode chip for backlight unit 3 in the present embodiment, in the extraction electrode 1 bottom solder side of these two diode chip for backlight unit, 3 end face welding and in the vertical side of extraction electrode bottom packed part, be respectively equipped with through hole (2,6).And two through hole (2,6) is circular hole.This circular hole (2,6) is processed more convenient, and effect is better.Certainly, two through hole (2,6) also can be processed as other shape through holes.
During the utility model application, through hole in its extraction electrode bottom solder side, can make the solder side of extraction electrode bottom occur that when welding bond pad locations is offset and can finds in time and correct, and while making the solder side solder paste melts, gas is distributed from this hole, avoid welding cavitation and occur, the soldering reliability between the solder side of its extraction electrode bottom and diode chip for backlight unit 3 is improved like this.And, after outputing through hole in the vertical side of extraction electrode bottom packed part, the epoxy resin of encapsulation is by this through hole of filling, thereby the mechanical strength that extraction electrode bottom packed part and epoxy resin are joined strengthens, and reliability strengthens.Therefore, the utility model reliability is high.
Should be understood that: above-described embodiment is just to explanation of the present utility model, and any innovation and creation that do not exceed in the utility model connotation scope, within all falling into protection range of the present utility model.
Claims (2)
1. a highly reliable rectification module, comprise the ceramic copper-clad plate of being located on copper soleplate, with be located at ceramic copper-clad plate on the extraction electrode, copper connecting plate, crossover and the diode chip for backlight unit that by rectification circuit, are connected, it is characterized in that: in the extraction electrode bottom solder side of described and the welding of diode chip for backlight unit end face and in the vertical side of extraction electrode bottom packed part, be respectively equipped with through hole.
2. a kind of highly reliable rectification module according to claim 1 is characterized in that: in the solder side of described extraction electrode bottom and the through hole in the vertical side of extraction electrode bottom packed part be circular hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203612049U CN203325895U (en) | 2013-06-24 | 2013-06-24 | Highly reliable rectification module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203612049U CN203325895U (en) | 2013-06-24 | 2013-06-24 | Highly reliable rectification module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203325895U true CN203325895U (en) | 2013-12-04 |
Family
ID=49665204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203612049U Expired - Fee Related CN203325895U (en) | 2013-06-24 | 2013-06-24 | Highly reliable rectification module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203325895U (en) |
-
2013
- 2013-06-24 CN CN2013203612049U patent/CN203325895U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131204 |
|
| CU01 | Correction of utility model | ||
| CU01 | Correction of utility model |
Correction item: Termination upon expiration of patent Correct: Revocation of Patent Expiration and Termination False: Expiration and Termination of 39 Volume 2801 Patent on July 11, 2023 Number: 28-01 Volume: 39 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131204 |