CN203323217U - Embedded type floor heating board - Google Patents
Embedded type floor heating board Download PDFInfo
- Publication number
- CN203323217U CN203323217U CN2013204205232U CN201320420523U CN203323217U CN 203323217 U CN203323217 U CN 203323217U CN 2013204205232 U CN2013204205232 U CN 2013204205232U CN 201320420523 U CN201320420523 U CN 201320420523U CN 203323217 U CN203323217 U CN 203323217U
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- CN
- China
- Prior art keywords
- floor heating
- personality board
- positioning support
- plate body
- support bracer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Floor Finish (AREA)
Abstract
The utility model discloses an embedded type floor heating board. The embedded type floor heating board comprises a board body and further comprises a positioning supporting block protruding out of the board body, and the positioning supporting block and the board body are formed integrally and made of polystyrene or polyvinyl plastics. The embedded type floor heating board has the advantages of being low in manufacturing cost, convenient to install and good in floor heating heat dissipation effect. Investment is saved by above 20% than that in the traditional technology.
Description
Technical field
The utility model relates to technical field of buildings, especially relates to a kind of embedded floor heating personality board.
Background technology
Floor heating is the abbreviation of floor panel heating, is to take whole ground as radiator, and by the heating agent in the flooring radiation layer, the whole ground of homogeneous heating, utilize the make progress rule of radiation of the accumulation of heat on ground self and heat to be conducted from the bottom to top, reaches the purpose of heating.The thermograde that the low-temperature ground heating agent successively decreases to head gradually at indoor formation sole, thus give the warm cool comfort of pin.The underground heat radiant heating from bottom to top each layer structure respectively: concrete layer (being generally reinforced concrete floor), thermal insulation layer (foamed polystyrene board, be used for completely cutting off the heat going down, also can adopt foam concrete, the upper reflectance coating that applies, stop downward radiation to be conducted heat), steel wire (hot pipeline regularly, the homogeneous radiation heat, avoid the local temperature too high), floor heating pipeline, packed layer (adopt pea gravel concrete to cast, play even accumulation of heat effect), pavement and barrier material (such as timber floor, ceramic tile etc.).Ground heater laying complex process, cost are high.
Publication number is that CN101055100, application title are to disclose a kind of improved floor heating device in the application for a patent for invention of " a kind of floor heating device ", this device comprises zone of heating upper strata, zone of heating lower floor, heat carrier and heating tank, heat pipe is laid in two heating tanks in zone of heating, heat conductive rod is squeezed in below by heat pipe, be placed between two zones of heating the groove age of a draught animal correspondence on upper and lower zone of heating.During use, according to floor area, zone of heating lower floor is laid on the ground, heat pipe is laid in the heating tank of zone of heating lower floor, heat conductive rod is heated pipe and is squeezed in below, and then adds the zone of heating upper strata, the age of a draught animal of corresponding good upper and lower heating tank.By the heat radiation of the hot water in heat pipe radiation, complete the process of ground heating.This device, by the design of zone of heating, has completed the quick location and installation of heat pipe and heat conductive rod, but has the poor shortcoming of radiating effect.
Publication number be CN102061795, title be in the application for a patent for invention of " floor heating module ", disclose a kind of as the floor tile free splicing, lay floor heating module easily, it comprises water pipe, wire netting, heat-insulation layer and the concrete layer be fixed together, water pipe is in the inside of floor heating module, heat-insulation layer is laid in the water pipe below, water pipe top covering metal net, concrete layer is positioned at the outermost layer of floor heating module, and wire netting is copper mesh.The defect of this device is very obvious, and at first the slitless connection of water pipe is exactly an insoluble problem, and secondly, metal copper mesh cost is high.
Summary of the invention
The purpose of this utility model is to overcome the shortcoming existed in prior art, a kind of embedded floor heating personality board is provided, this personality board adopts modular organization, the purpose of utilizing its surperficial upper protruding block to reach accurately, locate fast and install, the technical scheme adopted is: a kind of embedded floor heating personality board, comprise plate body, it is characterized in that: described personality board also comprises the positioning support bracer that is raised in plate body, described positioning support bracer and described plate body are made into integration, and material therefor is polystyrene or vinyon.
Technical characterictic of the present utility model also has: have on described personality board on the one side of positioning support bracer and scribble reflective heat-insulation paint.
Technical characterictic of the present utility model also has: described positioning support bracer comprises the diamond block group, and described diamond block group comprises the triangle locating piece, and the floor heating pipeline is between described triangle locating piece.
Technical characterictic of the present utility model also has: described positioning support bracer also comprises arc piece group, and described arc piece group comprises the circular arc locating piece, and the floor heating pipeline is between adjacent two circular arc locating pieces.
Technical characterictic of the present utility model also has: described positioning support bracer also comprises little arc piece group, and described little arc piece group comprises little arc piece, and the floor heating pipeline is between adjacent two little arc pieces.
Technical characterictic of the present utility model also has: described plate body be in square, rectangle or regular hexagon any one.
Technical characterictic of the present utility model also has: described plate body is square, and the described foursquare length of side is 1000mm.
Technical characterictic of the present utility model also has: described positioning support bracer exceeds described plate body 20-25mm.This floor heating personality board is by the aluminium-making mould moulding.
The beneficial effects of the utility model are: 1) the utility model discloses a kind of floor heating personality board, this plate adopts polystyrene or polyethylene foam to make, during use, the floor heating pipeline is embedded between the positioning support bracer on personality board, realized that by the positioning support bracer point of floor heating pipeline fixes, convenient, quick, accurate positioning are installed, with low cost; 2) use this personality board to complete the installation of floor heating, compared to conventional art, at first, saved the operation of on-the-spot fluting during installation, time saving and energy saving; Secondly, because this personality board surface has protruding positioning support bracer, therefore can save one deck bar-mat reinforcement; Again, due to the reflective heat-insulation paint needs that surface uniformity dispels the heat fully contentedly of plate face precoating, therefore without re-laying the aluminium foil thermal isolation film; 3) this personality board have cheap, convenient, the effective advantage of ground-heating radiation are installed, than conventional art, reduce investment outlay more than 20%.
The accompanying drawing explanation
Accompanying drawing 1 is the utility model embodiment mono-structural representation, accompanying drawing 2 is accompanying drawing 1 scheme of installations, accompanying drawing 3 is embodiment bis-structural representations, accompanying drawing 4 is accompanying drawing 3 scheme of installations, accompanying drawing 5 is embodiment tri-structural representations, accompanying drawing 6 is accompanying drawing 5 scheme of installations, and accompanying drawing 7 is embodiment tri-structural representations, and the present embodiment is the square floor heating personality board that the length of side is 1000mm.Wherein 1 is plate body, the 2nd, and diamond block group, the 3rd, arc piece group, the 4th, little arc piece group, the 5th, floor heating pipeline.
The specific embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present utility model is described.The utility model discloses a kind of embedded floor heating personality board, this kind of personality board adopts polystyrene or vinyon is one-body molded makes, concrete structure is: this plate comprises plate body 1, be provided with the positioning support bracer that is raised in plate body 1 on plate body 1, have on this personality board on the one side of positioning support bracer and scribble reflective heat-insulation paint.Plate body be in square, rectangle or regular hexagon any one.
Embodiment mono-: in the present embodiment, the positioning support bracer comprises diamond block group 2 and arc piece group 3, the diamond block group comprises the triangle locating piece, spacing between the triangle locating piece is floor heating pipe linear diameter size, this triangle locating piece is generally selected right angle equilateral triangle locating piece, and floor heating pipeline 5 is installed between the triangle locating piece.Arc piece group 3 comprises the circular arc locating piece, the diameter that between adjacent circular arc locating piece, spacing is floor heating pipeline 5, and floor heating pipeline 5 is installed between adjacent two circular arc locating pieces.
Embodiment bis-: the difference of the present embodiment and embodiment mono-has been to save the small embossment on the circular arc locating piece, and all the other structures are identical, and its positioning support bracer also comprises diamond block group 2 and arc piece group 3.
Embodiment tri-: in the present embodiment, the positioning support bracer comprises diamond block group 2 and little arc piece group 4, the diamond block group comprises the triangle locating piece, spacing between the triangle locating piece is floor heating pipe linear diameter size, this triangle locating piece is generally selected right angle equilateral triangle locating piece, and floor heating pipeline 5 is installed between the triangle locating piece.Little arc piece group 4 comprises little arc piece, the diameter that between adjacent little arc piece, spacing is floor heating pipeline 5, and the floor heating pipeline is arranged between adjacent two little arc pieces.
This embodiment compares with embodiment mono-and embodiment bis-, and it has further reduced the contact area between positioning support bracer and floor heating pipeline, thereby makes the radiating effect of floor heating pipeline better.
The personality board disclosed in accompanying drawing 7 is square, and its length of side is 1000mm, and the outstanding high position of positioning support bracer is controlled between 20-25mm.
This personality board placement rule, the spacing in the same size, after installing, the personality board contacted with floor heating pipeline point type does not affect the radiating effect of floor heating fully.Form of construction work has been saved bar-mat reinforcement and aluminium foil thermal insulation layer compared to traditional approach, and cost is low, construction is convenient.
Certainly; above-mentioned explanation is not limitation of the utility model; the utility model also is not limited only to above-mentioned giving an example, and the variation that those skilled in the art make in essential scope of the present utility model, remodeling, interpolation or replacement, also belong to protection domain of the present utility model.
Claims (8)
1. an embedded floor heating personality board, comprise plate body, it is characterized in that: described personality board also comprises the positioning support bracer that is raised in plate body, and described positioning support bracer and described plate body are made into integration, and material therefor is polystyrene or vinyon.
2. according to embedded floor heating personality board claimed in claim 1, it is characterized in that: have on described personality board on the one side of positioning support bracer and scribble reflective heat-insulation paint.
3. according to the described embedded floor heating personality board of claim 1 or 2, it is characterized in that: described positioning support bracer comprises the diamond block group, and described diamond block group comprises the triangle locating piece, and the floor heating pipeline is between described triangle locating piece.
4. according to embedded floor heating personality board claimed in claim 3, it is characterized in that: described positioning support bracer also comprises arc piece group, and described arc piece group comprises the circular arc locating piece, and the floor heating pipeline is between adjacent two circular arc locating pieces.
5. according to embedded floor heating personality board claimed in claim 3, it is characterized in that: described positioning support bracer also comprises little arc piece group, and described little arc piece group comprises little arc piece, and the floor heating pipeline is between adjacent two little arc pieces.
6. according to the described embedded floor heating personality board of claim 1 or 2, it is characterized in that: described plate body in square, rectangle or regular hexagon any one.
7. according to embedded floor heating personality board claimed in claim 6, it is characterized in that: described plate body is square, and the described foursquare length of side is 1000mm.
8. according to embedded floor heating personality board claimed in claim 6, it is characterized in that: described positioning support bracer exceeds described plate body 20-25mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013204205232U CN203323217U (en) | 2013-07-08 | 2013-07-08 | Embedded type floor heating board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013204205232U CN203323217U (en) | 2013-07-08 | 2013-07-08 | Embedded type floor heating board |
Publications (1)
Publication Number | Publication Date |
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CN203323217U true CN203323217U (en) | 2013-12-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2013204205232U Expired - Fee Related CN203323217U (en) | 2013-07-08 | 2013-07-08 | Embedded type floor heating board |
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CN (1) | CN203323217U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104553557A (en) * | 2015-01-22 | 2015-04-29 | 赵延明 | Full-automatic engraving device of floor heating module |
CN109826461A (en) * | 2019-02-26 | 2019-05-31 | 重庆水利电力职业技术学院 | A kind of green people place groups of building using solar energy |
-
2013
- 2013-07-08 CN CN2013204205232U patent/CN203323217U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104553557A (en) * | 2015-01-22 | 2015-04-29 | 赵延明 | Full-automatic engraving device of floor heating module |
CN109826461A (en) * | 2019-02-26 | 2019-05-31 | 重庆水利电力职业技术学院 | A kind of green people place groups of building using solar energy |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131204 Termination date: 20170708 |