CN203269792U - Glass substrate etching equipment for liquid crystal display - Google Patents

Glass substrate etching equipment for liquid crystal display Download PDF

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Publication number
CN203269792U
CN203269792U CN 201320297560 CN201320297560U CN203269792U CN 203269792 U CN203269792 U CN 203269792U CN 201320297560 CN201320297560 CN 201320297560 CN 201320297560 U CN201320297560 U CN 201320297560U CN 203269792 U CN203269792 U CN 203269792U
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CN
China
Prior art keywords
etching
chamber
glass substrate
pod apertures
casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201320297560
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Chinese (zh)
Inventor
陈必盛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UNITECH OPTRONICS TECHNOLOGY (HUBEI) CO., LTD.
Original Assignee
UNITECH OPTRONICS TECHNOLOGY (HUBEI) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN 201320297560 priority Critical patent/CN203269792U/en
Application granted granted Critical
Publication of CN203269792U publication Critical patent/CN203269792U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses glass substrate etching equipment for a liquid crystal display. The glass substrate etching equipment is characterized in that an etching box is internally provided with an etching chamber, a buffering chamber and propping shoulders, wherein at least two liquid inlet pipes are assembled at the bottom of the buffering chamber, an upper guide plate and a lower guide plate are assembled between the etching chamber and the buffering chamber, the diameter of each upper guide hole of the upper guide plate is smaller than that of each lower guide hole of the lower guide plate, and a fixed support frame and an ultrasonic vibration plate are arranged in the etching chamber. The buffering chamber plays a buffering role, wherein the upper guide plate and the lower guide plate are used for carrying out secondary guide treatment on an etching agent in the etching chamber, and the etching agent is finally divided into multiple strands of fine etching agent currents by the upper guide holes and then uniformly and stably enters the etching chamber. According to the glass substrate etching equipment disclosed by the utility model, reaction dregs obtained after the surface of the glass substrate is etched can be taken away and cleaned away in an ultrasonic cleaning manner, so that on the one hand, the eddy current can be avoided and the etching quality is improved, and on the other hand, the thinning speed during etching can be accelerated and the etching efficiency is improved.

Description

A kind of LCD glass substrate etching machines
Technical field
The utility model relates to the etching machines technical field, relates in particular to a kind of LCD glass substrate etching machines.
Background technology
Prior art generally adopts pickling process and spray to send the glass substrate of processing and manufacturing liquid-crystal display, and wherein, the advantage that pickling process is simple due to equipment and cost is low is widely used in the glass substrate processing and manufacturing of liquid-crystal display.
In the process of the glass substrate that utilizes pickling process processing and manufacturing liquid-crystal display, etching reagent flows and etching glass substrate in casing, wherein, under etching reagent can drench from the top of casing, also can be from the bottom input of casing; For etching reagent for the structure formation of bottom half input, because etching reagent directly passes into inside to casing by one or more entrance, etching reagent flows rapidly and easily produces eddy current in the inside of casing, and then causes the flow velocity of box house different positions different so that affect the consistence of reaction efficiency and the etching quality of same batch of glass substrate.
In addition, the reaction residues that produces when making glass substrate etching can be pulled away quickly, and when glass substrate was carried out the etching operation, the inside of casing also passed into air simultaneously; Can the air that pass into be distributed in equably box house and evenly in each glass substrate contact, can produce material impact for etching efficiency.
Summary of the invention
The purpose of this utility model is to provide a kind of LCD glass substrate etching machines for the deficiencies in the prior art, can effectively avoid eddy current on the impact of glass substrate etching quality, and then can effectively improve the etching quality of glass substrate; In addition, it can also be taken away the reaction residues after the glass baseplate surface etching rapidly, namely can accelerate glass substrate etching thinning speed and improve etching efficiency.
For achieving the above object, the utility model is achieved through the following technical solutions.
a kind of LCD glass substrate etching machines, comprise the etching casing, the inside of etching casing forms etching chamber, the inside of etching casing forms buffer chamber in the below of etching chamber, the inside of etching casing is provided with between etching chamber and buffer chamber and helps to shoulder heavy thing, the bottom of buffer chamber is fitted with that at least two liquid outlets with the circulation pump housing are connected and supplies with the liquid-inlet pipe of etching reagent toward cushion chamber falls, be equiped with stacked on top of one another and spaced apart baffle upper plate and chin spoiler between etching chamber and buffer chamber, chin spoiler is erected on the upper surface of shoulder block, baffle upper plate is positioned at the top of chin spoiler, chin spoiler offers the lower pod apertures that runs through fully up and down and be evenly distributed, baffle upper plate offers the upper pod apertures that runs through fully up and down and be evenly distributed, upper pod apertures and lower pod apertures are respectively circular port, the diameter of upper pod apertures descends the diameter of pod apertures little, etching chamber is equiped with in the top of baffle upper plate for the fixing support rack of fixed support glass substrate to be etched and the ultrasonic vibration plate that is electrically connected to ultrasonic generator.
Wherein, described fixing support rack includes the fixed support cross bar that horizontal cross is arranged, the fixed support cross bar offers and is along its length even spaced apart support slot.
Wherein, the upper end of described etching casing is fitted with the upflow tube that is communicated with described etching chamber.
The beneficial effects of the utility model are: a kind of LCD glass substrate etching machines described in the utility model, the inside of its etching casing arranges etching chamber, buffer chamber and helps to shoulder heavy thing, the bottom of buffer chamber is equipped with at least two liquid-inlet pipes, installing baffle upper plate and chin spoiler between etching chamber and buffer chamber, the diameter of the upper pod apertures of baffle upper plate is little than the diameter of the lower pod apertures of chin spoiler, installing fixing support rack and ultrasonic vibration plate in etching chamber.During work, etching reagent inputs to cushion chamber falls via liquid-inlet pipe, and buffer chamber can play shock absorption; The etching reagent that enters to cushion chamber falls is successively via lower pod apertures and upper pod apertures and enter in etching chamber and the glass substrate in etching chamber is carried out etch processes; The utility model carries out the processing of secondary water conservancy diversion by chin spoiler and baffle upper plate to the etching reagent that enters in etching chamber, because upper pod apertures descends the diameter of pod apertures little, etching reagent is finally entered in etching chamber by the upper pod apertures of baffle upper plate with being divided into the tiny etchant stream of multiply and uniform and stable; In addition, in etching thinning process, the reaction residues of the mode of the utility model by ultrasonic cleaning after with the glass baseplate surface etching taken away and washed.Design by said structure, the utility model can avoid eddy current on the impact of glass substrate etching quality on the one hand effectively, and then can effectively improve the etching quality of glass substrate; Take away rapidly reaction residues by the mode of ultrasonic cleaning on the other hand and accelerate glass substrate etching thinning speed, and then improving etching efficiency.
Description of drawings
The below utilizes accompanying drawing that the utility model is further detailed, but the embodiment in accompanying drawing does not consist of any restriction of the present utility model.
Fig. 1 is structural representation of the present utility model.
Include in Fig. 1:
1---etching casing 11---etching chamber
12---buffer chamber 13---are helped to shoulder heavy thing
2---liquid-inlet pipe 3---baffle upper plate
31---upper pod apertures 4---chin spoiler
41---lower pod apertures 5---fixing support rack
51---fixed support cross bar 511---support slot
6---ultrasonic vibration plate 7---ultrasonic generator
8---upflow tube 9---glass substrate.
Embodiment
Below in conjunction with concrete embodiment, the utility model is described.
as shown in Figure 1, a kind of LCD glass substrate etching machines, comprise etching casing 1, the inside of etching casing 1 forms etching chamber 11, the inside of etching casing 1 forms buffer chamber 12 in the below of etching chamber 11, the inside of etching casing 1 is provided with between etching chamber 11 and buffer chamber 12 and helps to shoulder heavy thing 13, the bottom of buffer chamber 12 is fitted with that at least two liquid outlets with the circulation pump housing are connected and toward the liquid-inlet pipe 2 of the interior supply etching reagent of buffer chamber 12, be equiped with stacked on top of one another and spaced apart baffle upper plate 3 and chin spoiler 4 between etching chamber 11 and buffer chamber 12, chin spoiler 4 is erected on the upper surface of shoulder block, baffle upper plate 3 is positioned at the top of chin spoiler 4, chin spoiler 4 offers the lower pod apertures 41 that runs through fully up and down and be evenly distributed, baffle upper plate 3 offers the upper pod apertures 31 that runs through fully up and down and be evenly distributed, upper pod apertures 31 and lower pod apertures 41 are respectively circular port, the diameter of upper pod apertures 31 descends the diameter of pod apertures 41 little, etching chamber 11 is equiped with in the top of baffle upper plate 3 for the fixing support rack 5 of fixed support glass substrate 9 to be etched and the ultrasonic vibration plate 6 that is electrically connected to ultrasonic generator 7.
In the utility model working process, the circulation pump housing inputs to etching reagent in the buffer chamber 12 of etching casing 1 by liquid-inlet pipe 2, and buffer chamber 12 can be carried out shock absorption to the etching reagent that enters wherein; Enter to etching reagents in buffer chamber 12 and flow into again space between baffle upper plate 3 and chin spoiler 4 via the lower pod apertures 41 of chin spoiler 4, and carry out etch processes finally by being entered to by the upper pod apertures 31 of baffle upper plate 3 in etching chamber 11 and to etching chamber 11 interior glass substrates 9; The utility model carries out the processing of secondary water conservancy diversion by the etching reagent that chin spoiler 4 and 3 pairs of baffle upper plates enter in etching chamber 11, because upper pod apertures 31 descends the diameter of pod apertures 41 little, etching reagent is finally entered in etching chamber 11 by the upper pod apertures 31 of baffle upper plate 3 with being divided into the tiny etchant stream of multiply and uniform and stable.
Need further to explain, in etching reagent carries out the process of etching thinning to glass substrate 9, ultrasonic generator 7 is switched on and is driven ultrasonic vibration plate 6 vibration, and namely the reaction residues of the mode of the utility model by ultrasonic cleaning after with glass substrate 9 surface etchings taken away and washed.
Design by said structure, the utility model can avoid eddy current on the impact of glass substrate 9 etching qualities on the one hand effectively, and then can effectively improve the etching quality of glass substrate 9; Take away rapidly reaction residues by the mode of ultrasonic cleaning on the other hand and accelerate glass substrate 9 etching thinning speed, and then improve etching efficiency.
As preferred embodiment, fixing support rack 5 includes the fixed support cross bar 51 that horizontal cross is arranged, fixed support cross bar 51 offers and is along its length even spaced apart support slot 511; Wherein, support slot 511 is complementary with the thickness of glass substrate 9, and then stably holds fixing glass substrate 9.
Further, the upper end of etching casing 1 is fitted with the upflow tube 8 that is communicated with etching chamber 11; When the liquid in etching chamber 11 reached the height of upflow tube 8, unnecessary liquid overflowed via upflow tube 8.
Above content is only preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.

Claims (3)

1. LCD glass substrate etching machines, it is characterized in that: comprise etching casing (1), the inside of etching casing (1) forms etching chamber (11), the inside of etching casing (1) forms buffer chamber (12) in the below of etching chamber (11), the inside of etching casing (1) is provided with help to shoulder heavy thing (13) between etching chamber (11) and buffer chamber (12), the bottom of buffer chamber (12) is fitted with that at least two liquid outlets with the circulation pump housing are connected and supplies with the liquid-inlet pipe (2) of etching reagent in the buffer chamber (12), be equiped with stacked on top of one another and spaced apart baffle upper plate (3) and chin spoiler (4) between etching chamber (11) and buffer chamber (12), chin spoiler (4) is erected on the upper surface of shoulder block, baffle upper plate (3) is positioned at the top of chin spoiler (4), chin spoiler (4) offers the lower pod apertures (41) that runs through fully up and down and be evenly distributed, baffle upper plate (3) offers the upper pod apertures (31) that runs through fully up and down and be evenly distributed, upper pod apertures (31) and lower pod apertures (41) are respectively circular port, the diameter of upper pod apertures (31) descends the diameter of pod apertures (41) little, etching chamber (11) is equiped with in the top of baffle upper plate (3) for the fixing support rack (5) of fixed support glass substrate to be etched (9) and the ultrasonic vibration plate (6) that is electrically connected to ultrasonic generator (7).
2. a kind of LCD glass substrate etching machines according to claim 1, it is characterized in that: described fixing support rack (5) includes the fixed support cross bar (51) that horizontal cross is arranged, fixed support cross bar (51) offers and is along its length even spaced apart support slot (511).
3. a kind of LCD glass substrate etching machines according to claim 2, it is characterized in that: the upper end of described etching casing (1) is fitted with the upflow tube (8) that is communicated with described etching chamber (11).
CN 201320297560 2013-05-28 2013-05-28 Glass substrate etching equipment for liquid crystal display Expired - Fee Related CN203269792U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320297560 CN203269792U (en) 2013-05-28 2013-05-28 Glass substrate etching equipment for liquid crystal display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320297560 CN203269792U (en) 2013-05-28 2013-05-28 Glass substrate etching equipment for liquid crystal display

Publications (1)

Publication Number Publication Date
CN203269792U true CN203269792U (en) 2013-11-06

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Family Applications (1)

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CN 201320297560 Expired - Fee Related CN203269792U (en) 2013-05-28 2013-05-28 Glass substrate etching equipment for liquid crystal display

Country Status (1)

Country Link
CN (1) CN203269792U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105293938A (en) * 2015-11-30 2016-02-03 吕建平 Ultrasonic frosting device and operation process thereof
CN110565170A (en) * 2019-08-30 2019-12-13 西安奕斯伟硅片技术有限公司 etching device and method
CN112387732A (en) * 2020-10-26 2021-02-23 成都晓桥科技有限公司 Preprocessing system for manufacturing touch panel

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105293938A (en) * 2015-11-30 2016-02-03 吕建平 Ultrasonic frosting device and operation process thereof
CN110565170A (en) * 2019-08-30 2019-12-13 西安奕斯伟硅片技术有限公司 etching device and method
CN112387732A (en) * 2020-10-26 2021-02-23 成都晓桥科技有限公司 Preprocessing system for manufacturing touch panel
CN112387732B (en) * 2020-10-26 2021-10-22 深圳市泰源兴光电科技有限公司 Preprocessing system for manufacturing touch panel

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: HUBEI UNITECH OPTRONICS TECHNOLOGY CO., LTD.

Free format text: FORMER NAME: HUBEI UNITECH OPTRONICS TECHNOLOGY LTD.

CP03 Change of name, title or address

Address after: The North Industrial Park of Xiaogan city in 432500 Hubei County of Yunmeng province Hubei optoelectronic technology Limited by Share Ltd Unocal

Patentee after: UNITECH OPTRONICS TECHNOLOGY (HUBEI) CO., LTD.

Address before: The North Industrial Park of Xiaogan city in 432500 Hubei County of Yunmeng province Hubei youniko Photoelectric Technology Co Ltd

Patentee before: Unitech Optronics Technology (Hubei) Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131106

Termination date: 20160528